SEMTECH UCLAMP0506A

uClamp0506A
μClampTM
5-Line ESD protection Array
PROTECTION PRODUCTS - MicroClampTM
Description
Features
The μClampTM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.9mm2 of PCB area and will protect up to five lines.
They are bidirectional devices and may be used on lines
where the signal polarities swing above and below ground.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
These devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small SC89
package makes them ideal for use in portable electronics such as cell phones, PDAs, notebook computers, and
digital cameras.
‹ Transient protection for data lines to
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IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Protects five bidirectional I/O lines
1.7 x 1.7 x 0.6mm
Ultra-small SC-89 package (1.7
0.6mm)
2
requires less than 2.9mm of PCB area
Working voltage: 5V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SC-89 (SOT-666) package
RoHS / WEEE Compliant
Molding compound flammability rating: UL 94V-0
Marking : Marking Code and pin 1 indicator
Weight: 2.9mg (typical)
Packaging : Tape and Reel per EIA 481
Applications
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Dimensions
Cellular Handsets and Accessories
Cordless Phones
Notebooks and Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Schematic & PIN Configuration
1.70
0.50
1.25
1.70
0.30
0.60
Maximum Dimensions (mm)
Revision 03/21/07
SC-89 (Top View)
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uClamp0506A
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
100
Watts
Maximum Peak Pulse Current ( tp = 8/20μs)
Ip p
7
Amps
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
V PP
+/- 20
+/- 12
kV
Lead Soldering Temperature
TL
260 (10 sec.)
°C
Operating Temperature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
5
V
7.8
9
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
0.100
1
μA
Reverse Leakage Current
IR
VRWM = 3V, T=25°C
0.050
0.500
μA
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20μs
9
V
Clamp ing Voltage
VC
IPP = 7A, tp = 8/20μs
12
V
Junction Cap acitance
Cj
Between I/O Pins and
Gnd
VR = 0V, f = 1MHz
40
pF
© 2007 Semtech Corp.
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μClamp0506A
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
100
% of Rated Power or I PP
Peak Pulse Power - P PP (kW)
90
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (μs)
Clamping Voltage vs. Peak Pulse Current
Junction Capacitance vs. Reverse Voltage
25
14
Capacitance - Cj (pF)
Clamping Voltage - VC (V)
24
12
10
Waveform
Parameters:
tr = 8μs
td = 20μs
8
1
2
3
4
5
6
7
22
21
20
19
18
6
0
23
f = 1 MHz
17
8
0
Peak Pulse Current - IPP (A)
1
2
3
Reverse Voltage - VR (V)
4
5
Insertion Loss S21
CH1S21 LOG
. 030MHz
START
© 2007 Semtech Corp.
6 dB /REF 0 dB
STOP3000.000000MHz
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uClamp0506A
PROTECTION PRODUCTS
Typical Characteristics (Con’t.)
ESD Clamping
(+8kV Contact per IEC 61000-4-2)
© 2007 Semtech Corp.
ESD Clamping
(-8kV Contact per IEC 61000-4-2)
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μClamp0506A
PROTECTION PRODUCTS
Applications Information
Circuit Diagram
Device Connection for Protection of Five Data Lines
These devices are designed to protect up to five
biidirectional data lines. The device is connected as
follows:
1
3
4
5
6
1. Bidirectional protection of five I/O lines is achieved
by connecting pins 1, 3, 4, 5, and 6 to the data
lines. Pin 2 is connected to ground. The ground
connection should be made directly to the ground
plane for best results. The path length is kept as
short as possible to reduce the effects of parasitic
inductance in the board traces.
2
Circuit Board Layout Recommendations for Suppression of ESD.
Protection of Five Bidirectional Lines
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
© 2007 Semtech Corp.
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uClamp0506A
PROTECTION PRODUCTS
Typical Applications
uClamp0506A
© 2007 Semtech Corp.
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μClamp0506A
PROTECTION PRODUCTS
Outline Drawing - SC-89
D
A
D
N
E/2
E1
E
L
2
1
e
c
Nxb
B
aaa
C A-B D
A
DIM
A
b
c
D
E
E1
e
L
L1
N
aaa
C
L1
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.019
.024
.005
.012
.003
.007
.059 .063 .067
.061 .063 .067
.043 .047 .049
.020 BSC
.003 .008 .012
.003 .006 .008
6
.004
0.50
0.60
0.15
0.30
0.10
0.18
1.50 1.60 1.70
1.55 1.60 1.70
1.10 1.20 1.25
0.50 BSC
0.10 0.20 0.30
0.10 0.15 0.20
6
0.10
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern - SC89
X
Y
Z
C
DIM
C
P
G
X
Y
Z
G
Y
DIMENSIONS
INCHES
MILLIMETERS
(.057)
.020
.024
.012
.033
.090
(1.45)
0.50
0.60
0.30
0.85
2.30
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2007 Semtech Corp.
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uClamp0506A
PROTECTION PRODUCTS
Marking Code
Ordering Information
X
Part Number
Working
Voltage
uClamp 0506A.TCT
5V
Device Qty per
Marking
Reel
X
3,000
Reel
Size
7 Inch
MicroClamp, uClamp and μClamp are trademarks of
Semtech Corporation
Note:
(1) Device is symmetrical so there is no pin 1 identifier
(2) Lead finish is matte tin
Tape and Reel Specification
X
X
X
Tape Specifications and Device Orientation
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2007 Semtech Corp.
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