SDC15 TVS Diode Array for ESD Protection of 12V Data & Power Lines PROTECTION PRODUCTS Description Features The SDC15 transient voltage suppressor (TVS) is designed to protect components which are connected to data and transmission lines from voltage surges caused by ESD (electrostatic discharge), EFT (electrical fast transients), and lightning. u 300 watts peak pulse power (tp = 8/20µs) u 40 watts peak pulse power (tp = 10/1000µs) u Transient protection for data & power lines to TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The dual-junction common-cathode design allows the user to protect one data or power line operating at +/-12 volts. The low profile SOT23 package allows flexibility in the design of crowded circuit boards. u u u u u IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (1.2/50µs) Protects one bidirectional line Low clamping voltage Low leakage current High surge capability Solid-state silicon avalanche technology Mechanical Characteristics u u u u The SDC15 TVS will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, Human Body Model for air and contact discharge. JEDEC SOT23 package Molding compound flammability rating: UL 94V-0 Marking : DC15 Packaging : Tape and Reel per EIA 481 Applications u u u u u u Circuit Diagram RS-232 Data Lines Portable Electronics Industrial Controls Set-Top Box Servers, Notebook, and Desktop PC 12V DC Supply Protection Schematic & PIN Configuration SOT23 (Top View) Revision 9/2000 1 www.semtech.com SDC15 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbo l Value Units Peak Pulse Pow er (tp = 8/20µ s) Pp k 300 Watts Peak Pulse Current (tp = 8/20µ s) I PP 10 A IFSMAX 4 A Th ermal Resistance, Junction to A mb ient qJA 556 °C/W Lead Sold ering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C N on-Rep etitive Peak Forw ard Current (tp =100us) Storage Temp erature Electrical Characteristics SDC15 Par ame te r Reverse Stand -Off Voltage Reverse Breakd ow n Voltage Symbo l Co nd itio ns Minimum V RWM Typ ical Maximum Units 12.8 V 16.4 V V BR It= 1mA , Betw een Pin 1 & 2 (each d irection) Reverse Leakage Current IR V RWM = 12.8V, T=25°C Betw een Pin 1 & 2 (each d irection) 100 nA Forw ard Voltage VF IF= 100mA , Pin 1 to 3 and Pi n 2 t o 3 1.3 V 12 mV /°C Temp erature Coefficient of V BR aV B R 14.3 Clamp ing Voltage VC IPP = 1.9A , tp = 10/10000µ s Betw een Pin 1 & 2 (each d irection) 21.2 V Junction Cap acitance Cj V R = 0V, f = 1MHz Pi n 1 t o 2 120 pF ã 2000 Semtech Corp. 2 www.semtech.com SDC15 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 Peak Pulse Power - PPP (kW) 100 % of Rated Power or I PP 90 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0 0.1 1 10 100 25 1000 Pulse Duration - tp (µ s) Pulse Waveform 75 100 125 150 Clamping Voltage vs. Peak Pulse Current 25 110 90 80 70 e 60 Clamping Voltage - VC (V) Waveform Parameters: tr = 8µs td = 20µs 100 Percent of IPP 50 Ambient Temperature - TA (oC) -t 50 40 td = IPP/2 30 20 Bidirectional (Pin 1 to 2) 20 15 Waveform Parameters: tr = 8µs td = 20µs 10 0 10 0 5 10 15 20 25 1 30 2 3 4 5 6 7 8 9 10 11 12 Peak Pulse Current - IPP (A) Time (µs) Forward Voltage vs. Forward Current 3 Forward Voltage - V F (V) 2.5 2 1.5 1 Waveform Parameters: tr = 8µs td = 20µs 0.5 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Forward Current - IF (A) ã 2000 Semtech Corp. 3 www.semtech.com SDC15 PROTECTION PRODUCTS Applications Information Device Schematic & Pin Configuration Device Connection for Protection of One Data Line The SDC15 is designed to protect one data or I/O line operating at +/- 12 volts. Connection options are as follows: l l Common mode protection: Pin 1 is connected to the data line and pin 2 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. Differential protection: Pin 1 is connected to one line and pin 2 is connected to the second line. Pin 3 is not connected. RS-232 Transceiver Protection Example Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended: l l l l l l Place the SDC15 near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SDC15 and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. ã 2000 Semtech Corp. 4 www.semtech.com SDC15 PROTECTION PRODUCTS Outline Drawing - SOT23 Land Pattern - SOT23 Note 1 : Grid placement courtyard is 8 x 8 elements (4mm x 4mm) in accordance with the international grid detailed in IEC Publication 97. ã 2000 Semtech Corp. 5 www.semtech.com SDC15 PROTECTION PRODUCTS Ordering Information Par t Numbe r Wo r king Vo ltage Qty p e r R e e l R e e l Size SDC15.TC 12.8V 3,000 7 Inch SDC15.TG 12.8V 10,000 13 Inch Contact Information Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804 ã 2000 Semtech Corp. 6 www.semtech.com