uClamp0506P µClampTM 6-Line ESD protection Array PROTECTION PRODUCTS - MicroClampTM Description Features The µClampTM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed for use in applications where board space is at a premium. Each device requires less than 2.6mm2 of PCB area and will protect up to six lines. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The uClamp0506P is in a 6-pin, RoHS/WEEE compliant, SLP1616P6 package. It measures 1.6 x 1.6 x 0.60mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size, low capacitance, and high ESD surge capability makes them ideal for use in portable electronics such as cell phones, PDAs, notebook computers, and digital cameras. Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Protects six I/O lines 1.6 x 1.6 x 0.6mm Ultra-small package (1.6 0.6mm) requires 2 less than 2.6mm of PCB area Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology Mechanical Characteristics SLP1616P6 6L package RoHS/WEEE Compliant Nominal Dimensions: 1.6 x 1.6 x 0.60 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking: 0506P Packaging: Tape and Reel per EIA 481 Applications Circuit Diagram Cellular Handsets and Accessories Cordless Phones Personal Digital Assistants (PDAs) Portable Instrumentation Digital Cameras Peripherals MP3 Players PIN Configuration 1.6 1 2 3 4 5 6 1 1.6 6 0.5 0.6 Center Pad Revision 04/17/2007 SLP1616P6 (Bottom View) Nominal Dimensions in mm 1 www.semtech.com uClamp0506P PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 100 Watts Maximum Peak Pulse Current ( tp = 8/20µs) Ip p 7 Amps ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) V PP +/- 20 +/- 12 kV Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 1 µA Reverse Leakage Current IR VRWM = 3V, T=25°C 0.500 µA Clamping Voltage VC IPP = 1A, tp = 8/20µs Any I/O to Ground Pad 10 V Clamping Voltage VC IPP = 1A, tp = 8/20µs I/O to I/O 11 V Clamping Voltage VC IPP = 7A, tp = 8/20µs Any I/O to Ground Pad 12 V Clamping Voltage VC IPP = 7A, tp = 8/20µs I/O to I/O 12 V Junction Capacitance Cj Between I/O Pins and Gnd VR = 0V, f = 1MHz 60 75 pF Junction Capacitance Cj Between I/O Pins and I/O Pins VR = 0V, f = 1MHz 30 40 pF 2007 Semtech Corp. 2 6 V www.semtech.com µClamp0506P PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or I PP Peak Pulse Power - P PP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 Clamping Voltage vs. Peak Pulse Current 100 125 150 Forward Voltage vs. Peak Pulse Current 2.5 12 11 Waveform Parameters: tr = 8µs td = 20µs Line to Line 10 2 9 Forward Voltage - VF (V) Clamping Voltage - Vc (V) 75 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) 8 7 Line to Gnd 6 5 4 3 Waveform Parameters: tr = 8µs td = 20µs 2 1 1.5 1 0.5 0 0 0 0 1 2 3 4 5 Peak Pulse Current - IPP (A) 6 7 8 1 2 3 4 5 6 7 8 9 10 11 12 Forward Current - IF (A) Normalized Capacitance vs. Reverse Voltage ESD Clamping (+8kV Contact per IEC 61000-4-2) 1 CJ(VR) / CJ(VR=0) 0.9 0.8 0.7 0.6 f = 1 MHz 0.5 0 1 2 3 Reverse Voltage - VR (V) 4 5 Note: Data is taken with a 10x attenuator 2007 Semtech Corp. 3 www.semtech.com uClamp0506P PROTECTION PRODUCTS ESD Clamping (-8kV Contact per IEC 61000-4-2) Note: Data is taken with a 10x attenuator 2007 Semtech Corp. 4 www.semtech.com µClamp0506P PROTECTION PRODUCTS Applications Information Circuit Diagram Device Connection for Protection of Five Data Lines These devices can be configured to protect up to 6 unidirectional data lines or 5 bidirectional lines. The device is connected as follows: 1 2 4 3 5 6 1. Protection of six I/O lines is achieved by connecting pins 1, 2, 3, 4, 5, and 6 to the data lines. The center tab is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Center Pad 2. Bidirectional protection of five I/O lines is achieved by connecting and five pins data lines. The remaining pin is connected to ground. The center pad is not connected. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Pin Conf iguration (T op Side Vie w) Configuration (Top View) 1 2 Circuit Board Layout Recommendations for Suppression of ESD. 3 Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. 2007 Semtech Corp. 5 6 Gnd 5 4 Pin Identification 1, 2, 3, 4, 5, 6 Input/Output Lines Center Tab Ground www.semtech.com uClamp0506P PROTECTION PRODUCTS Applications Information - Spice Model uClamp0506P Spice Model Table 1 - uClamp0506P Spice Parameters 2007 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 7.82E-15 BV Volt 7.03 VJ Volt 0.73 RS Ohm 0.211 IB V Amp 1.0E-3 CJO Farad 59E-12 TT sec 2.541E-9 M -- 0.25 N -- 1.1 EG eV 1.11 6 www.semtech.com µClamp0506P PROTECTION PRODUCTS Outline Drawing - SLP1616P6 A B D PIN 1 INDICATOR (LASER MARK) D1 1 2 LxN E DIM A A1 A2 b D D1 E E1 e L N aaa bbb E/2 E1 N bxN A SEATING PLANE aaa C A2 bbb e D/2 C A1 C A B DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.00 .001 .002 (.006) .007 .010 .012 .059 .063 .067 .041 .047 .051 .059 .063 .067 .010 .016 .020 .020 BSC .013 .013 .016 6 .003 .004 0.50 0.58 0.65 0.00 0.03 0.05 (0.15) 0.20 0.25 0.30 1.50 1.60 1.70 1.05 1.20 1.30 1.50 1.60 1.70 0.25 0.40 0.50 0.50 BSC 0.25 0.33 0.40 6 0.08 0.10 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1616P6 P X DIMENSIONS Z F G DIM B C P F G X Y Z (C) Y INCHES .051 .060 .020 .018 .035 .012 .025 .085 MILLIMETERS 1.30 1.52 0.50 0.45 0.89 0.30 0.63 2.15 B NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET 2007 Semtech Corp. 7 www.semtech.com uClamp0506P PROTECTION PRODUCTS Marking Code Ordering Information 0506P Part Number Lead Finish Qty per Reel R eel Size uClamp 0506P.TCT Pb Free 3,000 7 Inch MicroClamp and uClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Device Orientation in Tape A0 1.78 +/-0.05 mm Tape Width 8 mm B0 K0 1.78 +/-0.05 mm B, (Max) D 4.2 mm 1.5 + 0.1 mm - 0.0 mm ) 0.69 +/-0.05 mm D1 E 0.5 mm ±0.05 1.750±.10 mm F 3.5±0.05 mm K (MAX) P P0 P2 2.4 mm 4.0±0.1 mm 4.0±0.1 mm 2.0±0.05 mm T(MAX) 0.4 mm W 8.0 mm + 0.3 mm - 0.1 mm Contact Information for Semtech International AG Taiw an Branch Korea Branch Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Semtech Sw itz erland GmbH Japan Branch Tel: 81-3-6408-0950 Fax: 81-3-6408-0951 Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 2007 Semtech Corp. 8 Shanghai Office www.semtech.com