SEMTECH SMF05C

SMF05C
TVS Diode Array
For ESD and Latch-Up Protection
PRELIMINARY
PROTECTION PRODUCTS
Description
Features
The SMF series TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD
and other voltage-induced transient events. They are
designed for use in applications where board space is at
a premium. Each device will protect up to five lines. They
are unidirectional devices and may be used on lines where
the signal polarities are above ground.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
The SMF series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small
SC70 package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras.
u ESD protection for data lines to
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Mechanical Characteristics
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Cellular Handsets & Accessories
Cordless Phones
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Schematic & PIN Configuration
4
5
6
1
6
2
5
3
4
SC70-6L (Top View)
2
Revision 9/2000
EIAJ SC70-6L package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
Applications
Circuit Diagram
1
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
Small package for use in portable electronics
Protects five I/O lines
Working voltage: 5V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
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SMF05C
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbo l
Value
Units
Peak Pulse Pow er (tp = 8/20ms)
Pp k
100
Watts
Peak Pulse Current (tp = 8/20ms)
I PP
8
A
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
V ESD
20
15
kV
Lead Soldering Temp erature
TL
260 (10 seconds)
o
Op erating Temp erature
TJ
-55 to +125
o
TSTG
-55 to +150
o
Storage Temp erature
C
C
C
Electrical Characteristics
SMF05C
Par ame te r
Symbo l
Co nd itio ns
Minimum
Typ ical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
5
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µs
9.8
V
Clamp ing Voltage
VC
IPP = 8A, tp = 8/20µs
12.5
V
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
130
pF
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SMF05C
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
90
% of Rated Power or I PP
Peak Pulse Power - PPP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
Clamping Voltage vs. Peak Pulse Current
Junction Capacitance vs. Reverse Voltage
140
9
8
120
Capacitance (pF)
7
Vclamp (V)
6
5
4
Waveform
Parameters:
tr = 8µs
td = 20µs
3
2
100
80
60
40
20
1
0
0
0
2
4
6
8
0
10
1
2
3
4
5
6
Reverse Voltage (V)
Ipp(A)
ESD Clamping Characteristics
(8kV Contact Discharge per IEC 61000-4-2)
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SMF05C
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Five Data Lines
SMF05C Circuit Diagram
The SMF05C is designed to protect up to five unidirectional data lines. The device is connected as follows:
1
3
4
5
6
1. Unidirectional protection of five I/O lines is
achieved by connecting pins 1, 3, 4, 5 and 6 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
2
Circuit Board Layout Recommendations for Suppression of ESD.
Protection of Five Unidirectional Lines
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
l Place the SMF05C near the input terminals or
connectors to restrict transient coupling.
l Minimize the path length between the SMSxxC and
the protected line.
l Minimize all conductive loops including power and
ground loops.
l The ESD transient return path to ground should be
kept as short as possible.
l Never run critical signals near board edges.
l Use ground planes whenever possible.
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SMF05C
PRELIMINARY
PROTECTION PRODUCTS
Typical Applications
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SMF05C
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SC70-6L
Land Pattern - SC70-6L
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SMF05C
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
Par t Numbe r
Mar king
Co d e
SMF05C
F5C
Note:
(1) Pin 1 Identified with a dot
Ordering Information
Par t Numbe r
Wo r king
Vo ltage
Qty p e r R e e l
R e e l Size
SMF05C.TC
5V
3,000
7 Inch
SMF05C.TG
5V
10,000
13 Inch
Contact Information
Semtech Corporation
Protection Products Division
652 Mitchell Rd., Newbury Park, CA 91320
Phone: (805)498-2111 FAX (805)498-3804
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