SMF05C TVS Diode Array For ESD and Latch-Up Protection PRELIMINARY PROTECTION PRODUCTS Description Features The SMF series TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. They are designed for use in applications where board space is at a premium. Each device will protect up to five lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SMF series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small SC70 package makes them ideal for use in portable electronics such as cell phones, PDAs, notebook computers, and digital cameras. u ESD protection for data lines to u u u u u u Mechanical Characteristics u u u u 3 u u u u u u u u Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 4 5 6 1 6 2 5 3 4 SC70-6L (Top View) 2 Revision 9/2000 EIAJ SC70-6L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications Circuit Diagram 1 IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) Small package for use in portable electronics Protects five I/O lines Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology 1 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbo l Value Units Peak Pulse Pow er (tp = 8/20ms) Pp k 100 Watts Peak Pulse Current (tp = 8/20ms) I PP 8 A ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) V ESD 20 15 kV Lead Soldering Temp erature TL 260 (10 seconds) o Op erating Temp erature TJ -55 to +125 o TSTG -55 to +150 o Storage Temp erature C C C Electrical Characteristics SMF05C Par ame te r Symbo l Co nd itio ns Minimum Typ ical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdow n Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 5 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 8A, tp = 8/20µs 12.5 V Junction Cap acitance Cj VR = 0V, f = 1MHz 130 pF ã 2000 Semtech Corp. 2 6 V www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or I PP Peak Pulse Power - PPP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Clamping Voltage vs. Peak Pulse Current Junction Capacitance vs. Reverse Voltage 140 9 8 120 Capacitance (pF) 7 Vclamp (V) 6 5 4 Waveform Parameters: tr = 8µs td = 20µs 3 2 100 80 60 40 20 1 0 0 0 2 4 6 8 0 10 1 2 3 4 5 6 Reverse Voltage (V) Ipp(A) ESD Clamping Characteristics (8kV Contact Discharge per IEC 61000-4-2) ã 2000 Semtech Corp. 3 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection for Protection of Five Data Lines SMF05C Circuit Diagram The SMF05C is designed to protect up to five unidirectional data lines. The device is connected as follows: 1 3 4 5 6 1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. 2 Circuit Board Layout Recommendations for Suppression of ESD. Protection of Five Unidirectional Lines Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: l Place the SMF05C near the input terminals or connectors to restrict transient coupling. l Minimize the path length between the SMSxxC and the protected line. l Minimize all conductive loops including power and ground loops. l The ESD transient return path to ground should be kept as short as possible. l Never run critical signals near board edges. l Use ground planes whenever possible. ã 2000 Semtech Corp. 4 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Typical Applications ã 2000 Semtech Corp. 5 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SC70-6L Land Pattern - SC70-6L ã 2000 Semtech Corp. 6 www.semtech.com SMF05C PRELIMINARY PROTECTION PRODUCTS Marking Codes Par t Numbe r Mar king Co d e SMF05C F5C Note: (1) Pin 1 Identified with a dot Ordering Information Par t Numbe r Wo r king Vo ltage Qty p e r R e e l R e e l Size SMF05C.TC 5V 3,000 7 Inch SMF05C.TG 5V 10,000 13 Inch Contact Information Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804 ã 2000 Semtech Corp. 7 www.semtech.com