uClamp0506P

uClamp0506P
µClampTM
6-Line ESD protection Array
PROTECTION PRODUCTS - MicroClampTM
Description
Features
The µClampTM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.6mm2 of PCB area and will protect up to six lines.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
The uClamp0506P is in a 6-pin, RoHS/WEEE compliant,
SLP1616P6 package. It measures 1.6 x 1.6 x 0.60mm.
The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. They may be used to meet the
ESD immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). The combination of
small size, low capacitance, and high ESD surge capability makes them ideal for use in portable electronics such
as cell phones, PDAs, notebook computers, and digital
cameras.
‹ Transient protection for data lines to
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IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Protects six I/O lines
1.6 x 1.6 x 0.6mm
Ultra-small package (1.6
0.6mm) requires
2
less than 2.6mm of PCB area
Working voltage: 5V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
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‹
‹
‹
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SLP1616P6 6L package
RoHS/WEEE Compliant
Nominal Dimensions: 1.6 x 1.6 x 0.60 mm
Lead Finish: NiPd
Molding compound flammability rating: UL 94V-0
Marking: 0506P
Packaging: Tape and Reel per EIA 481
Applications
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Circuit Diagram
Cellular Handsets and Accessories
Cordless Phones
Personal Digital Assistants (PDAs)
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
PIN Configuration
1.6
1
2
3
4
5
6
1
1.6
6
0.5
0.6
Center Pad
Revision 10/18/05
SLP1616P6 (Bottom View)
Nominal Dimensions in mm
1
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uClamp0506P
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Pp k
100
Watts
Maximum Peak Pulse Current ( tp = 8/20µs)
Ip p
7
Amps
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
V PP
+/- 20
+/- 12
kV
Lead Soldering Temperature
TL
260 (10 sec.)
°C
Operating Temperature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
1
µA
Reverse Leakage Current
IR
VRWM = 3V, T=25°C
0.500
µA
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
Any I/O to Ground Pad
9
V
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
I/O to I/O
10
V
Clamping Voltage
VC
IPP = 7A, tp = 8/20µs
Any I/O to Ground Pad
11
V
Clamping Voltage
VC
IPP = 7A, tp = 8/20µs
I/O to I/O
12
V
Junction Capacitance
Cj
Between I/O Pins and
Gnd
VR = 0V, f = 1MHz
60
75
pF
Junction Capacitance
Cj
Between I/O Pins and
I/O Pins
VR = 0V, f = 1MHz
30
40
pF
 2005 Semtech Corp.
2
6
V
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µClamp0506P
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
90
% of Rated Power or I PP
Peak Pulse Power - P PP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
Clamping Voltage vs. Peak Pulse Current
100
125
150
Forward Voltage vs. Peak Pulse Current
2.5
12
11
Waveform
Parameters:
tr = 8µs
td = 20µs
Line to Line
10
2
9
Forward Voltage - VF (V)
Clamping Voltage - Vc (V)
75
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
8
7
Line to Gnd
6
5
4
3
Waveform
Parameters:
tr = 8µs
td = 20µs
2
1
1.5
1
0.5
0
0
0
0
1
2
3
4
5
Peak Pulse Current - IPP (A)
6
7
8
1
2
3
4
5
6
7
8
9
10
11
12
Forward Current - IF (A)
Junction Capacitance vs. Reverse Voltage
ESD Clamping
(+8kV Contact per IEC 61000-4-2)
1
CJ(VR) / CJ(VR=0)
0.9
0.8
0.7
0.6
f = 1 MHz
0.5
0
1
 2005 Semtech Corp.
2
3
Reverse Voltage - VR (V)
4
5
3
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uClamp0506P
PROTECTION PRODUCTS
Applications Information
Circuit Diagram
Device Connection for Protection of Five Data Lines
These devices can be configured to protect up to 6
unidirectional data lines or 5 bidirectional lines. The
device is connected as follows:
1
2
4
3
5
6
1. Protection of six I/O lines is achieved by connecting
pins 1, 2, 3, 4, 5, and 6 to the data lines. The
center tab is connected to ground. The ground
connection should be made directly to the ground
plane for best results. The path length is kept as
short as possible to reduce the effects of parasitic
inductance in the board traces.
Center Pad
2. Bidirectional protection of five I/O lines is achieved
by connecting and five pins data lines. The remaining pin is connected to ground. The center pad is
not connected. The ground connection should be
made directly to the ground plane for best results.
The path length is kept as short as possible to
reduce the effects of parasitic inductance in the
board traces.
Pin Conf
iguration (T
op Side Vie
w)
Configuration
(Top
View)
1
2
Circuit Board Layout Recommendations for Suppression of ESD.
3
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
 2005 Semtech Corp.
4
6
Gnd
5
4
Pin
Identification
1, 2, 3, 4, 5, 6
Input/Output Lines
Center Tab
Ground
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µClamp0506P
PROTECTION PRODUCTS
Applications Information - Spice Model
uClamp0506P Spice Model
Table 1 - uClamp0506P Spice Parameters
 2005 Semtech Corp.
Parameter
Unit
D1 (T VS)
IS
Amp
7.82E-15
BV
Volt
7.03
VJ
Volt
0.73
RS
Ohm
0.211
IB V
Amp
1.0E-3
CJO
Farad
59E-12
TT
sec
2.541E-9
M
--
0.25
N
--
1.1
EG
eV
1.11
5
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uClamp0506P
PROTECTION PRODUCTS
Outline Drawing - SLP1616P6
A
D
B
DIMENSIONS
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
A1
C
D1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
.020 .023 .026
- .001 .002
(.006)
.007 .010 .012
.079 .083 .087
.061 .067 .071
.059 .063 .067
.010 .016 .020
.020 BSC
.011 .013 .015
6
.003
.004
0.50 0.58 0.65
0.00 .003 0.05
(0.15)
0.20 0.25 0.30
2.00 2.10 2.20
1.55 1.70 1.80
1.50 1.60 1.70
0.25 0.40 0.50
0.50 BSC
0.28 0.33 0.38
6
0.08
0.10
1 2
LxN
E/2
E1
N
bxN
bbb
e
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1616P6
P
X
DIMENSIONS
Z
F
G
DIM
B
C
P
F
G
X
Y
Z
(C)
Y
INCHES
.051
.060
.020
.018
.035
.012
.025
.085
MILLIMETERS
1.30
1.52
0.50
0.45
0.89
0.30
0.63
2.15
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
 2005 Semtech Corp.
6
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µClamp0506P
PROTECTION PRODUCTS
Marking Code
Ordering Information
0506P
Part Number
Lead
Finish
Qty per
Reel
R eel Size
uClamp 0506P.TCT
Pb Free
3,000
7 Inch
MicroClamp and uClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1
Device Orientation in Tape
A0
1.78 +/-0.05 mm
B0
K0
1.78 +/-0.05 mm
Tape
Width
B, (Max)
D
8 mm
4.2 mm
1.5 + 0.1 mm
- 0.0 mm )
0.69 +/-0.05 mm
D1
E
0.5 mm
±0.05
1.750±.10
mm
F
K
(MAX)
P
P0
P2
T(MAX)
3.5±0.05
mm
2.4 mm
4.0±0.1
mm
4.0±0.1
mm
2.0±0.05
mm
0.4 mm
W
8.0 mm
+ 0.3 mm
- 0.1 mm
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2005 Semtech Corp.
7
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