STMICROELECTRONICS M3004LAB1

M3004LAB1
M3004LD
REMOTE CONTROL TRANSMITTER
..
.
.
.
.
..
..
FLASHED OR MODULATED TRANSMISSION
7 SUB-SYSTEM ADDRESSES
UP TO 64 COMMANDS PER SUB-SYSTEM
ADDRESS
HIGH-CURRENT REMOTE OUTPUT AT
VDD = 6V (– IOH = 80mA)
LOW NUMBER OF ADDITIONAL COMPONENTS
KEY RELEASE DETECTION BY TOGGLE
BITS
VERY LOW STAND-BY CURRENT (< 2µA)
OPERATIONAL CURRENT < 1mA AT 6V
SUPPLY
SUPPLY VOLTAGE RANGE 2 TO 6.5V
CERAMIC RESONATOR CONTROLLED
FREQUENCY (typ. 450kHz)
DIP20
(Plastic Package)
ORDER CODE : M3004LAB1
SO20
(Plastic Package)
ORDER CODE : M3004LD
DESCRIPTION
The M3004LAB1/M3004LD transmitter IC are designed for infrared remote control systems. It has
a total of 448 commands which are divided into 7
sub-system groups with 64 commands each. The
sub-system code may be selected by a press button, a slider switch or hard wired.
The M3004LAB1/M3004LD generate the pattern
for driving the output stage. These patterns are
pulse distance coded. The pulses are infrared
flashes or modulated. The transmission mode is
defined in conjunction with the sub-system address. Modulated pulses allow receivers with narrow-band preamplifiers for improved noise
rejection to be used. Flashed pulses require a
wide-band preamplifier within the receiver.
June 1992
REMO
1
20
VDD
SEN 6N
2
19
DRV 6N
SEN 5N
3
18
DRV 6N
SEN 4N
4
17
DRV 6N
SEN 3N
5
16
DRV 6N
SEN 2N
6
15
DRV 6N
SEN 1N
7
14
DRV 6N
SEN 0N
8
13
DRV 6N
ADRM
9
12
OSC OUT
10
11
OSC IN
VSS
3004L-01.EPS
PIN CONNECTIONS
1/10
M3004LAB1 - M3004LD
BLOCK DIAGRAM
DRV OUTPUTS
0N 1N 2N 3N 4N 5N 6N
0N
S 1N
E
N 2N
KEYBOARD
SCAN
I 3N
N
P 4N
U
T
S 5N
PULSE
DISTANCE
MODULATOR
REMO
OUTPUT
6N
VDD
OSCILLATOR
VSS
OSCI
OSCO
INPUTS AND OUTPUTS
Key matrix inputs and outputs (DRV0N to
DRV6N and SEN0N to SEN6N)
The transmitter keyboard is arranged as a scanned
matrix. The matrix consists of 7 driver outputs and
7 sense inputs as shown in Figure 1. The driver
outputs DRV0N to DRV6N are open drain N-channel tran-sistors and they are conductive in the
stand-by mode. The 7 sense inputs (SEN0N to
SEN6N) enable the generation of 56 command
codes. With 2 external diodes all 64 commands are
addressable. The sense inputs have P-channel
pull-up transistors so that they are HIGH until they
are pulled LOW by connecting them to an output
via a key depression to initiate a code transmission.
ADDRESS MODE INPUT (ADRM)
The sub-system address and the transmission
mode are defined by connecting the ADRM input
to one or more driver outputs (DRV0N to DRV6N)
of the key matrix. If more than one driver is connected to ADRM, they must be decoupled by diode s. This allows the definition of seven
sub-system addresses as shown in table 3. If driver
DRV6N is connected to ADRM, the data output
2/10
CONTROL
LOGIC
format of REMO is modulated or if not connected,
flashed.
The ADRM input has switched pull-up and pulldown loads. In the stand-by mode only the pulldown device is active. Whether ADRM is open
(sub-system address 0, flashed mode) or connected to the driver outputs, this input is LOW and
will not cause unwanted dissipation. When the
transmitter becomes active by pressing a key, the
pull-down device is switched off and the pull-up
device is switched on, so that the applied driver
signals are sensed for the decoding of the sub-system address and the mode of transmission.
The arrangement of the sub-system address coding is such that only the driver DRVnM with the
highest number (n) defines the sub-system address, e.g. if drivers DRV2N and DRV4N are connected to ADRM, only DRV4N will define the
sub-system address. This option can be used in
systems requiring more than one sub-system address. The transmitter may be hard-wired for subsystem address 2 by connectingDRV1N to ADRM.
If now DRV3N is added to ADRM by a key or a
switch, the transmitted sub-system address
changes to 4. A change of the sub-system address
will not start a transmission.
3004L-02.EPS
ADRM
M3004LAB1 - M3004LD
REMOTE CONTROL SIGNAL OUTPUT (REMO)
The REMO signal output stage is a push-pull type.
In the HIGH state, a bipolar emitter-follower allows
a high output current. The timing of the data output
format is listed in tables 1 and 2. The information is
defined by the distance tb between the leading
edges of the flashed pulses or the first edge of the
modulated pulses (see Figure 3). The format of the
output data is given in Figures 2 and 3. The data
word starts with two toggle bits T1 and T0, followed
by three bits for defining the sub-system address
S2, S1 and S0, and six bits F, E, D, C, B and A which
are defined by the selected key.
In the modulated transmission mode the first toggle
bit is replaced by a constant reference time bit
(REF). This can be used as a reference time for the
decoding sequence. The toggle bits function is an
indication for the decoder that the next instruction
has to be considered as a new command. The
codes for the sub-system address and the selected
key are given in tables 3 and 4.
The REMO output is protected against ”Lock-up”,
i.e. the length of an output pulse is limited to < 1ms,
even if the oscillator stops during an output pulse.
This avoids the rapid discharge of the battery that
would otherwise be caused by the continuous activation of the LED.
OSCILLATOR INPUT / OUTPUT
(OSCI and OSCO)
The external components must be connected to
these pins when using an oscillator with a ceramic
resonator. The oscillator frequency may vary between 350kHz and 600kHz as defined by the resonator.
FUNCTIONAL DESCRIPTION
Keyboard operation
In the stand -by mode all drivers (DRV0N to
DRV6N) are on (low impedance to VSS). Whenever
a key is pressed, one or more of the sense inputs
(SENnN) are tied to ground. This will start the
power-up sequence. First the oscillator is activated
and after the debounce time tDB (see Figure 4) the
output drivers (DRV0N to DRV6N) become active
successively.
Within the first scan cycle the transmission mode,
the applied sub-system address and the selected
command code are sensed and loaded into an
internal data latch.
In contrast to the command code, the sub-system
is sensed only within the first scan cycle. If the
applied sub-system address is changed while the
command key is pressed, the transmitted sub-system address is not altered.
In a multiple key stroke sequence (see Figure 5)
the command code is always altered in accordance
with the sensed key.
MULTIPLE KEY-STROKE PROTECTION
The keyboard is protected against multiple keystrokes. If more than one key is pressed at the
same time, the circuit will not generatea new output
at REMO (see Figure 5). In case of a multiple
key-stroke, the scan repetition rate is increased to
detect the release of a key as soon as possible.
There are two restrictions caused by the special
structure of the keyboard matrix :
- The keys switching to ground (code numbers 7,
15, 23, 31, 39, 47, 55 and 63) and the keys
connectedto SEN5N and SEN6N are not covered
completely by the multiple key protection. If one
sense input is switched to ground, further keys on
the same sense line are ignored, i.e. the command code corresponding to ”key to ground” is
transmitted.
- SEN5N and SEN6N are not protected against
multiple keystroke on the same driver line, because this condition has been used for the definition of additional codes (code number 56 to 63).
OUTPUT SEQUENCE (data format)
The output operation will start when the selected
code is found. A burst of pulses, including the
latched address and command codes,is generated
at the output REMO as long as a key is pressed.
The format of the output pulse train is given in
Figures 2 and 3. The operation is terminated by
releasing the key or if more than one key is pressed
at the same time. Once a sequence is started, the
transmitted data words will always be completed
after the key is released.
The toggle bits T0 and T1 are incremented if the
key is released for a minimum time tREL (see Figure 4). The toggle bits remain unchanged within a
multiple key-stroke sequence.
3/10
M3004LAB1 - M3004LD
TO (ms)
tP (µs)
Flashed
2.53
8.8
-
-
-
121
Modulated
2.53
-
26.4
17.6
8.8
121
fOSC
tM (µs)
tML (µs)
455kHz
tOSC = 2.2µs
tP
4 x tOSC
Flashed Pulse Width
tM
12 x tOSC
Modulation Period
tML
8 x tOSC
Modulation Period Low
tMH
4 x tOSC
Modulation Period High
tW
55296 x tOSC
Word Distance
TO
1152 x tOSC
Basic Unit of Pulse Distance
tMH (µs)
tW (ms)
3004L-02.TBL
Mode
3004L-01.TBL
Table 1 : Pulse Train Timing
The following number of pulses may be selected by Metal option : N = 8, 12, 16.
Note : The different dividing ratio for TO and tW between flash mode and carrier mode is obtained by changing the modulo of a particular divider from divide by 3 during flash mode to divide by 4 during carrier mode. This allows the use of a 600kHz ceramic resonator during carrier mode to obtain a better noise immunity for the receiver without a significant change in TO and tW. For first samples, the
correct divider ration is obtained by a metal mask option. For final parts, this is automatically done together with the selection of
flash-/carrier mode.
Table 2 : Pulse Train Separation (tb)
Code
tb
Logic ”0”
2 x TO
3 x TO
Toggle Bit Time
2 x TO or 3 x TO
Reference Time
3 x TO
Table 3 : Transmission Mode and Sub-system
Adress Selection.
The sub-system address and the transmission
mode are defined by connecting the ADRM input
to one or more driver outputs (DRV0N To DRV6N)
of the key matrix. If more than one driver is connected to ADRM, they must be decoupled by diodes.
Sub-system Address
Driver DRVnN for n =
#
S2
S1
S0
0
1
2
3
4
5
F
L
A
S
H
E
D
0
1
2
3
4
5
6
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
O
X
X
X
X
X
O
X
X
X
X
O
X
X
X
O
X
X
O
X
O
M
O
D
U
L
A
T
E
D
0
1
2
3
4
5
6
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
O
X
X
X
X
X
O= connected to ADRM
blank= not connected to ADRM
X = don’t care
4/10
O
X
X
X
X
O
X
X
X
O
X
X
O
X
O
6
O
O
O
O
O
O
O
3004L-04.TBL
Mode
3004L-03.TBL
Logic ”1”
M3004LAB1 - M3004LD
Table 4 : Key Codes
F
E
D
C
B
A
Matrix
Position
SEN0N
SEN0N
SEN0N
SEN0N
SEN0N
SEN0N
SEN0N
SEN0N
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
2
3
4
5
6
7
SEN1N
SEN2N
SEN3N
SEN4N
SEN5N
SEN6N
SEN5N and SEN6N
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
DRV0N
DRV1N
DRV2N
DRV3N
DRV4N
DRV5N
DRV6N
VSS
*
*
*
*
*
*
*
*
**
Code
Matrix
Sense
**
**
**
**
**
*
**
8 to 15
16 to 23
24 to 31
32 to 39
40 to 47
48 to 55
56 to 63
3004L-05.TBL
Matrix
Drive
The complete matrix drive as shown above for SEN0N is also applicable for the matrix sense inputs SEN1N to SEN6N and the combined
SEN5/SEN6N.
The C, B and A codes are identical to SEN0N as given above.
ABSOLUTE MAXIMUM RATINGS
Parameter
Value
Supply Voltage Range
Unit
- 0.3 to + 7
V
VI
Input Voltage Range
- 0.3 to (VDD + 0.3)
V
VO
Output Voltage Range
- 0.3 to (VDD + 0.3)
V
VDD
±I
- I (REMO) M
D.C. Current into Any Input or Output
Max. 10
mA
Peak REMO Output Current during 10µs, Duty Factor = 1%
Max. 300
mA
Max. 200
mW
o
Ptot
Power Dissipation per Package for TA = - 20 to + 70 C
Tstg
Storage Temperature Range
- 55 to + 125
o
C
TA
Operating Ambient Temperature Range
- 20 to + 70
o
C
3004L-06.TBL
Symbol
ELECTRICAL CHARACTERISTICS
VSS = 0V, TA = 25oC (unless otherwise specified)
Symbol
Parameter
Test Conditions
o
VDD
Supply Voltage
TA = 0 to + 70 C
IDD
Supply Current
•
Active fOSC = 455kHz
REMO,Output unload
•
Inactive (stand-by mode) VDD = 6V
fOSC
Oscill. Frequency
VDD = 2 to 6.5V (cer resonator)
Min.
Typ.
2
0.25
1.0
VDD = 3V
VDD = 6V
350
Max.
Unit
6.5
V
0.5
2
mA
mA
2
µA
600
kHz
0.3 x VDD
V
KEYBOARD MATRIX - Inputs SE0N to SEN6N
VIL
Input Voltage Low
VDD = 2 to 6.5V
VIH
Input Voltage High
VDD = 2 to 6.5V
- II
Input Current
VDD = 2V, VI = 0V
VDD = 6.5V, VI = 0V
Input Leakage Current
VDD = 6.5V, VI = VDD
II
0.7 x VDD
10
100
V
100
600
µA
µA
1
µA
VOL
Output Voltage ”ON”
VDD = 2V, IO = 0.1mA
VDD = 6.5V, IO = 2.5mA
0.3
0.6
V
V
IO
Output Current ”OFF”
VDD = 6.5V, VO = 11V
10
µA
5/10
3004L-07.TBL
KEYBOARD MATRIX - Outputs DRV0N to DRV6N
M3004LAB1 - M3004LD
ELECTRICAL CHARACTERISTICS
VSS = 0V, TA = 25oC (unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
0.3 x VDD
V
CONTROL INPUT ADRM
VIL
Input Voltage Low
VIH
Input Voltage High
IIL
Input Current Low
(switched P and N
channel pull-up/pull down)
Pull-up Act. Oper. Condition, VIN = VSS
VDD = 2V
VDD = 6.5V
10
100
100
600
µA
µA
Input Current High
(switched P and N
channel pull-up/pull down)
Pull-down Act. Stand-by Cond.,VIN = VDD
VDD = 2V
VDD = 6.5V
10
100
100
600
µA
µA
60
80
IIH
0.7 x VDD
V
DATA OUTPUT REMO
- IOH
Output Current High
VDD = 2V, V OH = 0.8V
VDD = 6.5V, V OH = 5V
IOL
Output Current Low
VDD = 2V, V OL = 0.4V
VDD = 6.5V, V OL = 0.4V
tOH
Pulse Length
VDD = 6.5V, Oscill. Stopped
mA
mA
0.6
0.6
mA
mA
1
mS
5
7
µA
µA
II
Input Current
VDD = 2V
VDD = 6.5V, OSC1 at VDD
5
VDD - 0.8
VOH
Output Voltage high
VDD = 6.5V, - IOL = 0.1mA
VOL
Output Voltage Low
VDD = 6.5V, I OH = 0.1mA
V
0.7
V
3004L-08.TBL
OSCILLATOR
13
SEN0N
7
0
8
23
16
31
24
39
32
47
40
55
48
63
56
SEN2N
SEN3N*
SEN4N*
16
17
18
DRV6N
DRV5N
DRV4N
DRV3N*
15
19
20
8
7
REMO
6
1
M3004LAB1
M3004LD
5
4
SEN5N
3
SEN6N
VD D
10
VSS
2
9
ADRM
11
OSCI
12
OSCO
3004L-03.EPS
15
SEN1N
14
DRV2N*
DRV1N
DRV0N
Figure 1 : Typical Application
6/10
M3004LAB1 - M3004LD
Figure 2 : Data Format of REMO Output; REF = Reference Time; T0 and T1 = Toggle bits; S0, S1 and
S2 = System address; A, B, C, D, E and F = Command bits.
(a) flashed mode : transmission with 2 toggle bits and 3 address bits, followed by 6 command bits (pulses are flashed)
(b) modulated mode : transmission with reference time, 1 toggle bit and 3 address bits, followed by 6 command bits (pulses are modulated)
tw
a)
REMO
H
L
bit
T1
T0
S2
S1
S0
F
E
D
C
B
A
T1
data
0
1
0
1
0
1
0
0
1
0
0
0
tw
b)
H
L
bit
Ref
data
T0
S2
S1
S0
F
E
D
C
B
A
T1
1
0
1
0
1
0
0
1
0
0
0
3004L-04.EPS
REMO
Figure 3 : REMO Output Waveform
(a) flashed pulse
(b) modulated pulse [ tPW = (5 x tM ) + tMH) ]
a)
tp
tb
b)
t ML
tM
t pw
3004L-05.EPS
t MH
tb
7/10
M3004LAB1 - M3004LD
Figure 4 : Single Key - Stroke Sequence.
Debounce time : tDB = 4 to 9 x TO
Start time : tST = 5 to 10 x TO
Minimum release time : tREL = TO
key bouncing
t REL
closed
REV
released
new key
scan
off
DRVnN
on
t DB
scan
scan
tW
new word
H
REMO
L
H
OSCO
3004L-06.EPS
t ST
OSCILLATOR ACTIVE
L
Figure 5 : Multiple Key-Stroke Sequence.
Scan rate multiple key-stroke : tSM = 8 to 10 x TO
key bouncing
KEY A
closed
released
KEY B
closed
released
key A decoded as HIGH
key A decoded as LOW
scan
scan
scan
DRVnN off
on
t SH
tW
t ST
REMO H
L
t ST
OSCO
8/10
H
L
word key A
t DB
word key B
word key A
OSCILLATOR ACTIVE
3004L-07.EPS
t DB
M3004LAB1 - M3004LD
I
b1
L
a1
PACKAGE MECHANICAL DATA
20 PINS - PLASTIC DIP
B
b
e
E
Z
Z
e3
D
11
1
10
a1
B
b
b1
D
E
e
e3
F
i
L
Z
Min.
0.254
1.39
Millimeters
Typ.
Max.
1.65
0.45
0.25
Min.
0.010
0.055
Inches
Typ.
Max.
0.065
0.018
0.010
25.4
8.5
2.54
22.86
1.000
0.335
0.100
0.900
7.1
3.93
3.3
0.280
0.155
DIP20.TBL
Dimensions
PM-DIP20.EPS
F
20
0.130
1.34
0.053
9/10
M3004LAB1 - M3004LD
PACKAGE MECHANICAL DATA
20 PINS - PLASTIC MICROPACKAGE
L
s
b1
e
a1
b
A
a2
C
c1
e3
E
D
M
11
1
10
Dimensions
Millimeters
Typ.
0.1
0.35
0.23
Max.
2.65
0.2
2.45
0.49
0.32
Min.
Inches
Typ.
0.004
0.014
0.009
0.5
Max.
0.104
0.008
0.096
0.019
0.013
0.020
45o (typ.)
12.6
10
13.0
10.65
0.496
0.394
1.27
11.43
7.4
0.5
0.510
0.419
0.050
0.450
7.6
1.27
0.75
0.291
0.020
0.300
0.050
0.030
8o (max.)
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
10/10
SO20L.TBL
A
a1
a2
b
b1
C
c1
D
E
e
e3
F
L
M
S
Min.
PM-SO20L.EPS
F
20