STMICROELECTRONICS STP80NF55L-08

STP80NF55L-08
STB80NF55L-08
N-CHANNEL 55V - 0.0065Ω - 80A - TO-220/D2PAK
STripFET™ II POWER MOSFET
PRELIMINARY DATA
TYPE
VDSS
RDS(on)
ID
STP80NF55L-08
STB80NF55L-08
55 V
55 V
0.008Ω
0.008Ω
80 A
80 A
■
■
■
TYPICAL RDS(on) = 0.0065Ω
LOW THRESHOLD DRIVE
LOGIC LEVEL DEVICE
3
1
3
1
2
D2PAK
TO-220
DESCRIPTION
This Power Mosfet is the latest development of
STMicroelectronics unique “Single Feature
Size™” strip-based process. The resulting transistor shows extremely high packing density for
low on-resistance, rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ SOLENOID AND RELAY DRIVERS
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ DC-DC CONVERTERS
■ AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
VDS
VDGR
Value
Unit
Drain-source Voltage (VGS = 0)
Parameter
55
V
Drain-gate Voltage (RGS = 20 kΩ)
55
V
± 16
V
80
A
VGS
Gate- source Voltage
ID (1)
Drain Current (continuos) at TC = 25°C
ID (1)
Drain Current (continuos) at TC = 100°C
80
A
IDM ()
Drain Current (pulsed)
320
A
Total Dissipation at TC = 25°C
300
W
Derating Factor
2
W/°C
Peak Diode Recovery voltage slope
15
V/ns
Single Pulse Avalanche Energy
870
mJ
–55 to 175
°C
175
°C
PTOT
dv/dt (2)
EAS(3)
Tstg
Tj
Storage Temperature
Max. Operating Junction Temperature
(● ) Pulse width limited by safe operating area
April 2003
(1) Current Limited by Package
(2) ISD ≤80A, di/dt ≤500A/µs, VDD =40V Tj ≤ TJMAX.
(3) Starting Tj=25°C, ID=40A, VDD=40V
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STP80NF55L-08
THERMAL DATA
Rthj-case
Thermal Resistance Junction-case Max
0.5
°C/W
Rthj-amb
Thermal Resistance Junction-ambient Max
62.5
°C/W
Maximum Lead Temperature For Soldering Purpose
300
°C
Tl
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
V(BR)DSS
IDSS
IGSS
Parameter
Test Conditions
Min.
Typ.
Max.
55
Unit
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
V
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
1
µA
VDS = Max Rating, TC = 125 °C
10
µA
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16V
±100
nA
Max.
Unit
ON (1)
Symbol
Parameter
Test Conditions
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
RDS(on)
Static Drain-source On
Resistance
VGS = 10 V, ID = 40 A
VGS = 5 V, ID = 40 A
Min.
1
Typ.
1.6
2.5
V
0.0065
0.008
0.008
0.01
Ω
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
2/8
Parameter
gfs
Forward Transconductance
Ciss
Input Capacitance
Coss
Crss
Test Conditions
VDS =15V , ID =40 A
Min.
150
S
4350
pF
Output Capacitance
800
pF
Reverse Transfer
Capacitance
260
pF
VDS = 25V, f = 1 MHz, VGS = 0
STP80NF55L-08
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol
td(on)
tr
Qg
Qgs
Qgd
Parameter
Turn-on Delay Time
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Test Conditions
Min.
VDD = 27V, ID = 40A
RG = 4.7Ω VGS = 4.5V
(see test circuit, Figure 3)
VDD = 27.5 V, ID = 80A,
VGS = 4.5V
Typ.
Max.
Unit
35
ns
145
ns
75
20
30
100
nC
nC
nC
Typ.
Max.
Unit
SWITCHING OFF
Symbol
td(off)
tf
Parameter
Turn-off-Delay Time
Fall Time
Test Conditions
Min.
VDD = 27V, ID = 40A,
RG = 4.7Ω, VGS = 4.5V
(see test circuit, Figure 3)
85
65
ns
ns
SOURCE DRAIN DIODE
Symbol
ISD
ISDM (2)
VSD (2)
trr
Qrr
IRRM
Parameter
Test Conditions
Max.
Unit
Source-drain Current
80
A
Source-drain Current (pulsed)
320
A
Forward On Voltage
ISD = 80A, VGS = 0
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 80A, di/dt = 100A/µs,
VDD = 20V, Tj = 150°C
(see test circuit, Figure 5)
Min.
Typ.
1.5
85
280
6.5
V
ns
nC
A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3/8
STP80NF55L-08
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
4/8
STP80NF55L-08
TO-220 MECHANICAL DATA
DIM.
A
mm.
MIN.
TYP
4.40
inch
MAX.
MIN.
4.60
0.173
TYP.
MAX.
0.181
b
0.61
0.88
0.024
0.034
b1
1.15
1.70
0.045
0.066
c
0.49
0.70
0.019
0.027
D
15.25
15.75
0.60
0.620
E
10
10.40
0.393
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.244
0.256
J1
2.40
2.72
0.094
0.107
L
13
14
0.511
0.551
L1
3.50
3.93
0.137
0.154
L20
16.40
L30
28.90
0.645
1.137
øP
3.75
3.85
0.147
0.151
Q
2.65
2.95
0.104
0.116
5/8
STP80NF55L-08
D2PAK MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
D1
E
8
0.315
10
E1
10.4
0.393
8.5
0.334
G
4.88
5.28
0.192
0.208
L
15
15.85
0.590
0.625
L2
1.27
1.4
0.050
0.055
L3
1.4
1.75
0.055
0.068
M
2.4
3.2
0.094
0.126
R
0.015
0º
4º
3
V2
0.4
6/8
1
STP80NF55L-08
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
DIM.
mm
inch
MIN.
MAX.
MIN.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
MAX.
MIN.
330
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
inch
MAX.
12.992
0.059
13.2
0.504 0.520
26.4
0.960 1.039
0795
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
MAX.
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
R
50
1.574
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
0.075 0.082
0.933 0.956
* on sales type
7/8
STP80NF55L-08
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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