STMICROELECTRONICS STPS5H100B-TR

STPS5H100B/-1
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
K
IF(AV)
5A
VRRM
100 V
Tj (max)
175 °C
VF (max)
0.61 V
A
NC
DPAK
STPS5H100B
FEATURES AND BENEFITS
NEGLIGIBLE SWITCHING LOSSES
HIGH JUNCTION TEMPERATURE CAPABILITY
LOW LEAKAGE CURRENT
GOOD TRADE OFF BETWEEN LEAKAGE
CURRENT AND FORWARD VOLTAGE DROP
AVALANCHE RATED
K
DESCRIPTION
A
Schottky barrier rectifier designed for high frequency miniature Switched Mode Power Supplies such as adaptators and on board DC to
DC converters.
K
NC
IPAK
STPS5H100B-1
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
100
V
IF(RMS)
RMS forward current
10
A
IF(AV)
Average forward current
Tc = 165°C δ = 0.5
5
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
75
A
IRRM
Repetitive peak reverse current
tp = 2 µs square F = 1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
2
A
Tstg
Storage temperature range
- 65 to + 175
°C
175
°C
10000
V/µs
Tj
dV/dt
* :
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dPtot
1
<
thermal runaway condition for a diode on its own heatsink
Rth(j−a)
dTj
July 1999 - Ed: 4B
1/5
STPS5H100B/-1
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Junction to case
Value
Unit
2.5
°C/W
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests Conditions
IR *
Reverse leakage current
Tj = 25°C
Min.
Pulse test :
Forward voltage drop
Max.
Unit
3.5
µA
4.5
mA
0.73
V
VR = VRRM
Tj = 125°C
VF **
Typ.
1.3
Tj = 25°C
IF = 5 A
Tj = 125°C
IF = 5 A
Tj = 25°C
IF = 10 A
Tj = 125°C
IF = 10 A
0.57
0.61
0.85
0.66
0.71
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.51 x IF(AV) + 0.02 x IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
IF(av)(A)
PF(av)(W)
4.0
3.5
3.0
δ = 0.1
δ = 0.2
6
δ = 0.5
Rth(j-a)=Rth(j-c)
5
δ = 0.05
2.5
4
δ=1
Rth(j-a)=80°C/W
3
2.0
1.5
2
T
T
1.0
0.5
IF(av) (A)
δ=tp/T
tp
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
2/5
1
0
0
δ=tp/T
tp
20
40
Tamb(°C)
60
80
100
120
140
160
180
STPS5H100B/-1
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
120
110
100
90
80
70
60
50
40
30
IM
20
10
0
1E-3
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0
0.8
Tc=50°C
0.6
Tc=75°C
0.4
δ = 0.5
δ = 0.2
δ = 0.1
Tc=125°C
t
T
0.2
Single pulse
t(s)
δ=0.5
tp(s)
1E-2
1E-1
1E+0
Fig. 5: Reverse leakage current versus reverse
voltage applied.
0.0
1E-3
1E-2
δ=tp/T
tp
1E-1
1E+0
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
IR(µA)
C(pF)
5E+3
1000
1E+3
F=1MHz
Tj=25°C
Tj=125°C
1E+2
1E+1
100
1E+0
Tj=25°C
1E-1
1E-2
VR(V)
VR(V)
0
10
20
30
40
50
10
60
70
80
90 100
Fig. 7: Forward voltage drop versus forward current (maximum values).
100
Rth(j-a) (°C/W)
100
90
80
70
60
50
40
30
20
10
0
Tj=125°C
10.0
Tj=25°C
1.0
VFM(V)
0.2
10
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm)
(DPAK).
IFM(A)
50.0
0.1
0.0
1
0.4
0.6
0.8
1.0
1.2
1.4
1.6
S(Cu) (cm²)
0
2
4
6
8
10
12
14
16
18
20
3/5
STPS5H100B/-1
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
Millimeters
Min.
A
A1
A2
B
B2
C
C2
D
E
G
H
L2
L4
V2
FOOT PRINT (in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3
4/5
2.3
Max
2.20
2.40
0.90
1.10
0.03
0.23
0.64
0.90
5.20
5.40
0.45
0.60
0.48
0.60
6.00
6.20
6.40
6.60
4.40
4.60
9.35
10.10
0.80 typ.
0.60
1.00
0°
8°
Inches
Min.
Max.
0.086
0.094
0.035
0.043
0.001
0.009
0.025
0.035
0.204
0.212
0.017
0.023
0.018
0.023
0.236
0.244
0.251
0.259
0.173
0.181
0.368
0.397
0.031 typ.
0.023
0.039
0°
8°
STPS5H100B/-1
PACKAGE MECHANICAL DATA
IPAK
DIMENSIONS
REF.
A
E
C2
B2
L2
D
H
L
L1
B3
B6
A1
B
V1
B5
C
G
A3
A
A1
A3
B
B2
B3
B5
B6
C
C2
D
E
G
H
L
L1
L2
V1
Millimeters
Inches
Min.
Typ. Max.
Min.
Typ. Max.
2.2
0.9
0.7
0.64
5.2
2.4
1.1
1.3
0.9
5.4
0.85
0.086
0.035
0.027
0.025
0.204
0.094
0.043
0.051
0.035
0.212
0.033
0.3
0.45
0.48
6
6.4
4.4
15.9
9
0.8
0.8
10°
0.035
0.95
0.6
0.6
6.2
6.6
4.6
16.3
9.4
1.2
1
0.017
0.019
0.236
0.252
0.173
0.626
0.354
0.031
0.037
0.023
0.023
0.244
0.260
0.181
0.641
0.370
0.047
0.031 0.039
10°
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS5H100B
S5H100
DPAK
0.30g
75
Tube
STPS5H100B-TR
S5H100
DPAK
0.30g
2500
Tape & reel
STPS5H100B-1
S5H100
IPAK
0.35g
75
Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
5/5