STPS20L15D/G ® LOW DROP OR-ing POWER SCHOTTKY DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 20 A VRRM 15 V Tj (max) 125°C VF (max) 0.33 V K FEATURES AND BENEFITS n n n K VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK SIZE REVERSE VOLTAGE SUITED TO OR-ing OF 3V, 5V and 12V RAILS AVALANCHE CAPABILITY SPECIFIED A A NC K DESCRIPTION D2PAK STPS20L15G TO-220AC STPS20L15D Packaged in TO-220AC or D2PAK, this device is especially intended for use as an OR-ing diode in fault tolerant power supply equipments. ABSOLUTE RATINGS (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage Parameter 15 V IF(RMS) RMS forward current 30 A IF(AV) Average forward current Tc = 115°C δ = 1 20 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 310 A IRRM Repetitive peak reverse current tp = 2 µs F = 1kHz 2 A IRSM Non repetitive peak reverse current tp = 100 µs 3 A PARM Repetitive peak avalanche power tp = 1µs 13500 W - 65 to + 150 °C 125 °C 10000 V/µs Tstg Tj dV/dt * : Storage temperature range Tj = 25°C Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) THERMAL RESISTANCES Symbol Rth (j-c) Parameter Junction to case July 2003 - Ed: 3B Value Unit 1.6 °C/W 1/5 STPS20L15D/G STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions Tests Conditions Min. Typ. Max. Unit 6 mA IR * Reverse leakage current Tj = 25°C VR = 15V Tj = 100°C VR = 15V VF * Forward voltage drop Tj = 25°C IF = 19 A 0.41 Tj = 25°C IF = 40 A 0.52 Tj = 125°C IF = 19 A 0.28 0.33 Tj = 125°C IF = 40 A 0.42 0.50 200 500 V * tp = 380 µs, δ < 2% Pulse test : To evaluate the maximum conduction losses use the following equation : P = 0.18 x IF(AV) + 8.10-3 x IF2(RMS) Fig. 1: Average forward power dissipation versus Fig. 2: Average forward current versus ambient average forward current. temperature ( δ = 1). 8 PF(av)(W) δ = 0.1 7 δ = 0.05 δ = 0.5 δ = 0.2 δ=1 6 5 4 3 T 2 1 0 δ=tp/T IF(av) (A) 0 2 4 6 8 10 12 14 16 18 tp 20 22 Fig. 3: Normalized avalanche power derating versus pulse duration. 22 20 18 16 14 12 10 8 6 4 2 0 IF(av)(A) Rth(j-a)=Rth(j -c) T δ=tp/T 0 Tamb(°C) tp 25 50 75 100 125 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 Rth(j-a)=15°C/W Rth(j-a)=35°C/W 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 1 0 10 100 0 1000 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). 25 50 75 100 125 Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IM(A) 250 1.0 200 0.8 150 0.6 δ = 0.5 Tc=50°C 100 0.4 δ = 0.2 T Tc=75°C 50 IM 0.2 t 2/5 1E-2 δ = 0.1 tp (s) Tc=110°C t(s) δ=0.5 0 1E-3 150 Single pulse 1E-1 1E+0 0.0 1.0E-4 1.0E-3 1.0E-2 δ=tp/T 1.0E-1 tp 1.0E+0 STPS20L15D/G Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 5E+2 IR(mA) C(nF) 5.0 F=1MHz Tj=25°C Tj=100°C 1E+2 1.0 1E+1 Tj=25°C 1E+0 1E-1 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). VR(V) VR(V) 0 2 4 6 8 10 12 14 16 Fig. 9: Forward voltage drop versus forward current (typical values). 0.1 1 5 10 20 Fig. 10: Forward voltage drop versus forward current (maximum values). IFM(A) 200 200.0 2 IFM(A) Tj=100°C 100.0 100 Tj=125°C 10.0 Tj=75°C 10 Tj=25°C 1.0 VFM(V) 0.1 0 0.2 0.4 0.6 0.8 1 1 1.2 1.4 1.6 VFM(V) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS20L15G only) Rth(j-a) (°C/W) 80 70 60 50 40 30 20 10 0 S(Cu) (cm²) 0 4 8 12 16 20 24 28 32 36 40 3/5 STPS20L15D/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. Millimeters Min. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 4/5 A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0° 8° Inches Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0° 8° STPS20L15D/G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. Min. A H2 C L5 L7 ØI L6 L2 D L9 F1 L4 M F E G n n 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 4.95 5.15 10.00 10.40 16.40 typ. 13.00 14.00 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.194 0.202 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 Marking Package Weight Base qty Delivery mode STPS20L15D STPS20L15D TO-220AC STPS20L15G-TR n A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I Max. Inches Ordering type STPS20L15G n Millimeters STPS20L15G STPS20L15G 1.86 g. 50 Tube 2 1.48g. 50 Tube 2 1.48 g. 1000 Tape and reel D PAK D PAK Cooling method: by conduction (C) Recommended torque value: 0.55 m.N Maximum torque value: 0.7 m.N Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5