STMICROELECTRONICS STPS20L15D_03

STPS20L15D/G
®
LOW DROP OR-ing POWER SCHOTTKY DIODE
MAIN PRODUCT CHARACTERISTICS
IF(AV)
20 A
VRRM
15 V
Tj (max)
125°C
VF (max)
0.33 V
K
FEATURES AND BENEFITS
n
n
n
K
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK SIZE
REVERSE VOLTAGE SUITED TO OR-ing OF 3V,
5V and 12V RAILS
AVALANCHE CAPABILITY SPECIFIED
A
A
NC
K
DESCRIPTION
D2PAK
STPS20L15G
TO-220AC
STPS20L15D
Packaged in TO-220AC or D2PAK, this device is
especially intended for use as an OR-ing diode in
fault tolerant power supply equipments.
ABSOLUTE RATINGS (limiting values)
Symbol
Value
Unit
VRRM
Repetitive peak reverse voltage
Parameter
15
V
IF(RMS)
RMS forward current
30
A
IF(AV)
Average forward current
Tc = 115°C δ = 1
20
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
310
A
IRRM
Repetitive peak reverse current
tp = 2 µs F = 1kHz
2
A
IRSM
Non repetitive peak reverse current
tp = 100 µs
3
A
PARM
Repetitive peak avalanche power
tp = 1µs
13500
W
- 65 to + 150
°C
125
°C
10000
V/µs
Tstg
Tj
dV/dt
* :
Storage temperature range
Tj = 25°C
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Junction to case
July 2003 - Ed: 3B
Value
Unit
1.6
°C/W
1/5
STPS20L15D/G
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
Tests Conditions
Min.
Typ.
Max.
Unit
6
mA
IR *
Reverse leakage
current
Tj = 25°C
VR = 15V
Tj = 100°C
VR = 15V
VF *
Forward voltage drop
Tj = 25°C
IF = 19 A
0.41
Tj = 25°C
IF = 40 A
0.52
Tj = 125°C
IF = 19 A
0.28
0.33
Tj = 125°C
IF = 40 A
0.42
0.50
200
500
V
* tp = 380 µs, δ < 2%
Pulse test :
To evaluate the maximum conduction losses use the following equation :
P = 0.18 x IF(AV) + 8.10-3 x IF2(RMS)
Fig. 1: Average forward power dissipation versus
Fig. 2: Average forward current versus ambient
average forward current.
temperature ( δ = 1).
8
PF(av)(W)
δ = 0.1
7
δ = 0.05
δ = 0.5
δ = 0.2
δ=1
6
5
4
3
T
2
1
0
δ=tp/T
IF(av) (A)
0
2
4
6
8
10
12
14
16
18
tp
20
22
Fig. 3: Normalized avalanche power derating
versus pulse duration.
22
20
18
16
14
12
10
8
6
4
2
0
IF(av)(A)
Rth(j-a)=Rth(j -c)
T
δ=tp/T
0
Tamb(°C)
tp
25
50
75
100
125
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
Rth(j-a)=15°C/W
Rth(j-a)=35°C/W
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
1
0
10
100
0
1000
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).
25
50
75
100
125
Fig. 6: Relative variation of thermal impedance
junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
IM(A)
250
1.0
200
0.8
150
0.6
δ = 0.5
Tc=50°C
100
0.4
δ = 0.2
T
Tc=75°C
50
IM
0.2
t
2/5
1E-2
δ = 0.1
tp (s)
Tc=110°C
t(s)
δ=0.5
0
1E-3
150
Single pulse
1E-1
1E+0
0.0
1.0E-4
1.0E-3
1.0E-2
δ=tp/T
1.0E-1
tp
1.0E+0
STPS20L15D/G
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
5E+2
IR(mA)
C(nF)
5.0
F=1MHz
Tj=25°C
Tj=100°C
1E+2
1.0
1E+1
Tj=25°C
1E+0
1E-1
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
VR(V)
VR(V)
0
2
4
6
8
10
12
14
16
Fig. 9: Forward voltage drop versus forward
current (typical values).
0.1
1
5
10
20
Fig. 10: Forward voltage drop versus forward
current (maximum values).
IFM(A)
200
200.0
2
IFM(A)
Tj=100°C
100.0
100
Tj=125°C
10.0
Tj=75°C
10
Tj=25°C
1.0
VFM(V)
0.1
0
0.2
0.4
0.6
0.8
1
1
1.2
1.4
1.6
VFM(V)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Fig. 11: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 µm).
(STPS20L15G only)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
S(Cu) (cm²)
0
4
8
12
16
20
24
28
32
36
40
3/5
STPS20L15D/G
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
REF.
Millimeters
Min.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
4/5
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
Max.
4.40
4.60
2.49
2.69
0.03
0.23
0.70
0.93
1.14
1.70
0.45
0.60
1.23
1.36
8.95
9.35
10.00
10.40
4.88
5.28
15.00
15.85
1.27
1.40
1.40
1.75
2.40
3.20
0.40 typ.
0°
8°
Inches
Min.
Max.
0.173
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.045
0.067
0.017
0.024
0.048
0.054
0.352
0.368
0.393
0.409
0.192
0.208
0.590
0.624
0.050
0.055
0.055
0.069
0.094
0.126
0.016 typ.
0°
8°
STPS20L15D/G
PACKAGE MECHANICAL DATA
TO-220AC
DIMENSIONS
REF.
Min.
A
H2
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
M
F
E
G
n
n
4.40
4.60
1.23
1.32
2.40
2.72
0.49
0.70
0.61
0.88
1.14
1.70
4.95
5.15
10.00
10.40
16.40 typ.
13.00
14.00
2.65
2.95
15.25
15.75
6.20
6.60
3.50
3.93
2.6 typ.
3.75
3.85
Min.
Max.
0.173
0.181
0.048
0.051
0.094
0.107
0.019
0.027
0.024
0.034
0.044
0.066
0.194
0.202
0.393
0.409
0.645 typ.
0.511
0.551
0.104
0.116
0.600
0.620
0.244
0.259
0.137
0.154
0.102 typ.
0.147
0.151
Marking
Package
Weight
Base qty
Delivery mode
STPS20L15D
STPS20L15D
TO-220AC
STPS20L15G-TR
n
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
Max.
Inches
Ordering type
STPS20L15G
n
Millimeters
STPS20L15G
STPS20L15G
1.86 g.
50
Tube
2
1.48g.
50
Tube
2
1.48 g.
1000
Tape and reel
D PAK
D PAK
Cooling method: by conduction (C)
Recommended torque value: 0.55 m.N
Maximum torque value: 0.7 m.N
Epoxy meets UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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