STMICROELECTRONICS STTH8L06FP

STTH8L06
®
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
8A
VRRM
600 V
IR (max)
200 µA
Tj
175°C
VF (typ)
0.85 V
K
trr (typ)
75 ns
TO-220AC
STTH8L06D
K
A
A
K
TO-220FPAC
STTH8L06FP
FEATURES AND BENEFITS
■
■
■
■
Ultrafast switching
Low reverse recovery current
Low thermal resistance
Reduces switching and conduction losses
K
A
K
TO-220AC Insulated
STTH8L06DI
DESCRIPTION
The STTH8L06, which is using ST Turbo2 600V
technology, is specially suited as boost diode in
discontinuous or critical mode power factor
corrections.
The device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.
A
NC
D2PAK
STTH8L06G
Table 2: Order Codes
Part Number
STTH8L06D
STTH8L06FP
STTH8L06DI
STTH8L06DIRG
STTH8L06G
STTH8L06G-TR
Marking
STTH8L06D
STTH8L06FP
STTH8L06DI
STTH8L06DI
STTH8L06G
STTH8L06G
Table 3: Absolute Ratings (limiting values)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IFSM
TO-220AC / TO-220FPAC
TO-220AC Ins.
Average forward current TO-220AC
Tc = 150°C
δ = 0.5
TO-220FPAC
Tc = 125°C
TO-220AC Ins.
Tc = 135°C
Surge non repetitive forward current
tp = 10ms sinusoidal
Tstg
Storage temperature range
IF(RMS)
IF(AV)
Tj
RMS forward voltage
Maximum operating junction temperature
October 2004
REV. 3
Value
600
Unit
V
30
24
8
A
A
120
A
-65 to + 175
°C
175
°C
1/8
STTH8L06
Table 4: Thermal Resistance
Symbol
Rth(j-c)
Parameter
Junction to case
Value (max).
Unit
2.5
°C/W
TO-220AC / D2PAK
TO-220FPAC
5
TO-220AC Ins.
4
Table 5: Static Electrical Characteristics
Symbol
IR
Parameter
Test conditions
Reverse leakage current Tj = 25°C
Min.
Typ
Forward voltage drop
Unit
8
µA
VR = VRRM
Tj = 150°C
VF
Max.
Tj = 25°C
16
200
IF = 8A
1.3
Tj = 150°C
0.85
V
1.05
2
To evaluate the conduction losses use the following equation: P = 0.89 x IF(AV) + 0.022 IF (RMS)
Table 6: Dynamic Characteristics
Symbol
Parameter
Test conditions
trr
Reverse recovery
time
Tj = 25°C
IF = 1A dIF/dt = 50 A/µs VR =30V
tfr
Forward recovery
time
Tj = 25°C
IF = 8A
dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
VFP
Forward recovery
voltage
IF = 8A
Figure 1: Conduction losses versus average
current
Min. Typ Max. Unit
75
dIF/dt = 100 A/µs
105
ns
150
ns
6
V
Figure 2: Forward voltage drop versus forward
current
IFM(A)
P(W)
100.0
11
δ = 0.1
δ = 0.05
10
δ = 0.2
δ = 0.5
Tj=150°C
(maximum values)
9
δ=1
10.0
7
Tj=25°C
(maximum values)
Tj=150°C
(typical values)
8
6
5
4
1.0
3
T
2
1
IF(AV)(A)
δ=tp/T
0
0
2/8
2
4
6
8
VFM(V)
tp
0.1
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
STTH8L06
Figure 3: Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220FPAC)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration (TO-220AC, TO-220AC Ins., D2PAK)
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
T
0.2
0.1
tp(s)
1.E-02
T
0.1
δ=tp/T
0.0
1.E-03
Single pulse
0.2
Single pulse
1.E-01
tp
1.E+00
tp(s)
1.E+01
Figure 5: Peak reverse recovery current versus
dIF/dt (typical values)
1.E-03
tp
1.E-01
1.E+00
trr(ns)
1000
VR=400V
Tj=125°C
13
1.E-02
Figure 6: Reverse recovery time versus dIF/dt
(typical values)
IRM(A)
14
δ=tp/T
0.0
VR=400V
Tj=125°C
900
IF=2 x IF(AV)
12
800
11
IF=IF(AV)
10
700
IF=0.5 x IF(AV)
9
600
8
7
IF=2 x IF(AV)
500
IF=0.25 x IF(AV)
6
IF=IF(AV)
400
5
4
300
3
200
IF=0.5 x IF(AV)
2
1
100
dIF/dt(A/µs)
0
dIF/dt(A/µs)
0
0
20
40
60
80
100
120
140
160
180
200
Figure 7: Reverse recovery charges versus dIF/dt
(typical values)
0
20
40
60
80
100
120
140
160
180
200
Figure 8: Softness factor versus dIF/dt (typical
values)
Qrr(nC)
S factor
1000
2.0
VR=400V
Tj=125°C
900
IF=2 x IF(AV)
IF≤2 x IF(AV)
VR=400V
Tj=125°C
1.8
800
1.6
IF=IF(AV)
700
1.4
600
1.2
IF=0.5 x IF(AV)
500
1.0
400
0.8
300
0.6
200
0.4
100
0.2
dIF/dt(A/µs)
dIF/dt(A/µs)
0.0
0
0
20
40
60
80
100
120
140
160
180
200
0
25
50
75
100
125
150
175
200
3/8
STTH8L06
Figure 9: Relative variations of dynamic
parameters versus junction temperature
Figure 10: Transient peak forward voltage
versus dIF/dt
VFP(V)
1.25
7
S factor
IF=IF(AV)
Tj=125°C
6
1.00
5
IRM
0.75
4
QRR
0.50
3
IF≤ 2 x IF(AV)
VR=400V
Reference: Tj=125°C
0.25
2
1
Tj(°C)
dIF/dt(A/µs)
0.00
25
50
75
100
125
0
0
Figure 11: Forward recovery time versus dIF/dt
(typical values)
20
40
60
80
100
120
140
160
180
200
Figure 12: Junction capacitance versus
reverse voltage applied (typical values)
tfr(ns)
C(pF)
300
1000
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
250
F=1MHz
VOSC=30mVRMS
Tj=25°C
200
100
150
100
10
50
dIF/dt(A/µs)
0
20
40
60
80
100
120
140
160
180
200
Figure 13: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, eCU=35µm) (D2PAK)
Rth(j-a)(°C/W)
70
60
50
40
30
20
10
S(Cu)(cm²)
0
0
4/8
VR(V)
1
0
5
10
15
20
25
30
35
40
1
10
100
1000
STTH8L06
Figure 14: D2PAK Package Mechanical Data
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
2.49
2.69
0.098
0.106
0.03
0.23
0.001
0.009
0.70
0.93
0.027
0.037
1.14
1.70
0.045
0.067
0.45
0.60
0.017
0.024
1.23
1.36
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
0.050
0.055
1.40
1.75
0.055
0.069
2.40
3.20
0.094
0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
Figure 15: D2PAK Foot Print Dimensions
(in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
5/8
STTH8L06
Figure 16: TO-220FPAC Package Mechanical Data
REF.
A
H
A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L6
L7
Dia.
B
Dia
L6
L2
L7
L3
L5
D
F1
L4
F
E
G1
G
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.4
4.6
0.173
0.181
2.5
2.7
0.098
0.106
2.5
2.75
0.098
0.108
0.45
0.70
0.017
0.027
0.75
1
0.030
0.039
1.15
1.70
0.045
0.067
1.15
1.70
0.045
0.067
4.95
5.20
0.195
0.204
2.40
2.70
0.094
0.106
10
10.4
0.393
0.409
16 Typ.
0.63 Typ.
28.6
30.6
1.126
1.204
9.8
10.6
0.385
0.417
15.9
16.4
0.626
0.645
9.00
9.30
0.354
0.366
3
3.20
0.118
0.126
Figure 17: TO-220AC Insulated Package Mechanical Data
REF.
H2
A
C
L5
L7
ØI
L6
L2
D
L9
F1
M
F
E
G
6/8
L4
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
13.00
14.00
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
STTH8L06
Figure 18: TO-220AC Package Mechanical Data
H2
REF.
A
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
M
F
E
G
A
C
D
E
F
F1
G
H2
L2
L4
L5
L6
L7
L9
M
Diam. I
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
10.00
10.40
0.393
0.409
16.40 typ.
0.645 typ.
13.00
14.00
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
Table 7: Ordering Information
■
■
■
■
Ordering type
STTH8L06D
STTH8L06FP
STTH8L06DI
STTH8L06DIRG
STTH8L06G
Marking
STTH8L06D
STTH8L06FP
STTH8L06DI
STTH8L06DI
STTH8L06G
Package
TO-220AC
TO-220FPAC
TO-220AC Ins.
TO-220AC Ins
D2PAK
Weight
1.90 g
1.70 g
1.86 g
1.86 g
1.48 g
STTH8L06G-TR
STTH8L06G
D2PAK
1.48 g
Base qty Delivery mode
50
Tube
50
Tube
250
Box
50
Tube
50
Tube
1000
Tape & reel
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 m.N. (TO-220FPAC) / 0.55 m.N. (TO-220AC)
Maximum torque value: 1.0 m.N. (TO-220FPAC) / 0.70 m.N. (TO-220AC)
Table 8: Revision History
Date
Nov-2002
18-Oct-2004
Revision
2A
3
Description of Changes
Last issue
TO-220AC Insulated and D2PAK packages added
7/8
STTH8L06
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
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