STMICROELECTRONICS STW6NB90

STW6NB90
®
N - CHANNEL 900V - 1.7Ω - 6.3A - TO-247
PowerMESH MOSFET
PRELIMINARY DATA
TYPE
STW6NB90
■
■
■
■
■
V DSS
R DS(on)
ID
900 V
<2Ω
6.3 A
TYPICAL RDS(on) = 1.7 Ω
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
DESCRIPTION
Using the latest high voltage MESH OVERLAY
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest RDS(on) per area, exceptional avalanche
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
3
2
1
TO-247
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
SWITCH MODE POWER SUPPLIES (SMPS)
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
■ HIGH CURRENT, HIGH SPEED SWITCHING
■
ABSOLUTE MAXIMUM RATINGS
Symbol
V DS
V DGR
V GS
Value
Unit
Drain-source Voltage (V GS = 0)
Parameter
900
V
Drain- gate Voltage (R GS = 20 kΩ)
900
V
± 30
V
6.3
A
4
A
25
A
Gate-source Voltage
o
ID
Drain Current (continuous) at T c = 25 C
ID
Drain Current (continuous) at T c = 100 o C
I DM (•)
P tot
dv/dt(1 )
Tstg
Tj
Drain Current (pulsed)
o
Total Dissipation at T c = 25 C
160
W
Derating Factor
1.28
W/ o C
4
V/ns
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
(•) Pulse width limited by safe operating area
February 1999
-65 to 150
o
C
150
o
C
( 1) ISD ≤ 6A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
1/5
STW6NB90
THERMAL DATA
R thj-case
Rthj-amb
R thc-sink
Tl
Thermal Resistance Junction-case
Max
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
o
0.78
30
0.1
300
C/W
oC/W
o
C/W
o
C
Max Value
Unit
AVALANCHE CHARACTERISTICS
Symbol
Parameter
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T j max)
6.3
A
E AS
Single Pulse Avalanche Energy
(starting T j = 25 o C, I D = I AR , V DD = 50 V)
700
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbol
V (BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Conditions
I D = 250 µA
Zero Gate Voltage
V DS = Max Rating
Drain Current (V GS = 0) V DS = Max Rating
IGSS
Gate-body Leakage
Current (V DS = 0)
Typ.
Max.
900
V GS = 0
I DSS
Min.
Unit
V
T c = 100 o C
V GS = ± 30 V
1
50
µA
µA
± 100
nA
ON (∗)
Symbol
Parameter
Test Conditions
V GS(th)
Gate Threshold
Voltage
V DS = V GS
I D = 250 µA
R DS(on)
Static Drain-source On
Resistance
V GS = 10V
I D =3 A
I D(on)
On State Drain Current V DS > I D(on) x R DS(on)max
V GS = 10 V
Min.
Typ.
Max.
Unit
3
4
5
V
1.7
2
Ω
6.3
A
DYNAMIC
Symbol
g fs (∗)
C iss
C oss
C rss
2/5
Parameter
Test Conditions
Forward
Transconductance
V DS > I D(on) x R DS(on)max
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
f = 1 MHz
ID = 3 A
V GS = 0
Min.
Typ.
Max.
Unit
1.5
6
S
1400
160
18
pF
pF
pF
STW6NB90
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t d(on)
tr
Turn-on delay Time
Rise Time
V DD = 450 V ID = 3 A
VGS = 10 V
R G = 4.7 Ω
(see test circuit, figure 3)
20
10
Qg
Q gs
Q gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 720 V
R G = 4.7 Ω
40
15
15
55
nC
nC
nC
Typ.
Max.
Unit
ID =6 A V GS = 10 V
VGS = 10 V
ns
ns
SWITCHING OFF
Symbol
tr(Voff)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Conditions
Min.
V DD = 720 V ID = 6 A
R G = 4.7 Ω V GS = 10 V
(see test circuit, figure 5)
ns
ns
ns
15
15
25
SOURCE DRAIN DIODE
Symbol
ISD
I SDM (•)
V SD (∗)
t rr
Q rr
I RRM
Parameter
Test Conditions
Min.
Typ.
Source-drain Current
Source-drain Current
(pulsed)
Forward On Voltage
I SD = 6 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 6 A di/dt = 100 A/µs
V DD = 100 V
T j = 150 o C
(see test circuit, figure 5)
V GS = 0
Max.
Unit
6.3
25
A
A
1.6
V
650
ns
4.6
µC
14
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
3/5
STW6NB90
TO-247 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
4.7
5.3
0.185
0.209
D
2.2
2.6
0.087
0.102
E
0.4
0.8
0.016
0.031
F
1
1.4
0.039
0.055
F3
2
2.4
0.079
0.094
F4
3
3.4
0.118
0.134
G
10.9
0.429
H
15.3
15.9
0.602
0.626
L
19.7
20.3
0.776
0.779
L3
14.2
14.8
0.559
0.413
L4
34.6
1.362
L5
5.5
0.217
0.582
M
2
3
0.079
0.118
Dia
3.55
3.65
0.140
0.144
P025P
4/5
STW6NB90
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 1999 STMicroelectronics – Printed in Italy – All Rights Reserved
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