STW81100 MULTI-BAND RF FREQUENCY SYNTHESIZER WITH INTEGRATED VCOS DATASHEET 1 ■ ■ Features Figure 1. Package Integer-N Frequency Synthesizer Dual differential integrated VCOs with automatic center frequency calibration: – Direct Output: 3280 – 3900 MHz 3800 – 4400 MHz – Internal divider by 2: 1640 – 1950 MHz 1900 – 2200 MHz VFQFPN28 Table 1. Order Codes Part Number – Internal divider by 4: 820 – 975 MHz 950 – 1100 MHz ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 2 Fast lock time: 150µs Dual modulus prescaler (64/65) and 2 programmable counters to achieve a feedback division ratio from 4096 to 32767. Programmable reference frequency divider (9 bits) Phase frequency comparator and charge pump Programmable charge pump current Digital Lock Detector I2C bus interface with 3 bit programmable address (1100A2A1A0) 3.3V Power Supply Power down mode Small size exposed pad VFQFPN28 package 5x5x1.0mm Process: BICMOS 0.35µm SiGe Description The STMicroelectronics STW81100 is an integrated RF synthesizer and voltage controlled oscilla- April 2005 Package STW81100AT VFQFPN28 STW81100ATR VFQFPN28 in Tape & Reel tors (VCOs). Showing high performance, high integration, low power, and multi-band performances, STW81100 is a low cost one chip alternative to discrete PLL and VCOs solutions. STW81100 includes an Integer-N frequency synthesizer and two fully integrated VCOs featuring low phase noise performance and a noise floor of -153dBc/Hz. The combination of wide frequency range VCOs (thanks to center-frequency calibration over 32 sub-bands) and multiple output options (direct output, divided by 2 or divided by 4) allows to cover the 820MHz-1100MHz, the 1640MHz-2200MHz and the 3280MHz-4400MHz bands. The STW81100 is designed with STMicroelectronics advanced 0.35µm SiGe process. 3 ■ ■ Applications Cellular 3G Infrastructure Equipment Other Wireless Communication Systems Rev. 2 1/23 STW81100 Figure 2. Block Diagram REXT V SS_ PLL V DD_ PLL REF_ IN OUT BUF N O UT BUF P VDD_OUTBUF VSS_OUTBUF BUF DIV2 BUF VSS_DIV4 VCO BUF DIV4 BUF VDD_DIV4 VSS_CP VDD_DIV2 REF Divider DIV2 DIV4 VSS_DIV2 VDD_CP P F D VDD_BUFVCO VSS_BUFVCO DN VCO Divider BUF EXTVCO_INP UP C P ICP LOCK_DET EXT VCO BUF EXTVCO_INN ATPGON I²C BUS VDD_VCO1 VCO BUFF SCL SDA ADD0 ADD1 VSS_VCO1 ADD2 VCO Calibrator VDD_VCO2 VDD_I2C VSS_VCO2 VSS_I2C VDD_ESD VSS_ESD EX T_PD TEST2 T EST 1 VCTRL VDD_I2C EXT_PD SDA SC L ADD0 ADD1 AD D2 Figure 3. Pin Connections VDD_VCO1 ATPGON VDD_DIV2 VDD_BUFVCO EXTVCO_INP VDD_OUTBUF QFN 28 OUTBUFP LOCK_DET TEST2 TEST1 VDD_VCO2 VDD_CP REF_IN REXT VDD_DIV4 I CP VDD_PLL VCTRL OUTBUFN VDD_ESD 2/23 EXTVCO_INN STW81100 Table 2. Pin Description Pin No Name Description Observations 1 VDD_VCO1 VCO power supply 2 VDD_DIV2 Divider by 2 power supply 3 VDD_OUTBUF Output buffer power supply 4 OUTBUFP LO buffer positive output Open collector 5 OUTBUFN LO buffer negative output Open collector 6 VDD_DIV4 Divider by 4 power supply 7 VDD_VCO2 VCO power supply 8 VDD_ESD 9 VCTRL 10 ICP 11 REXT 12 VDD_CP 13 TEST1 14 LOCK_DET 15 ESD positive rail power supply VCO control voltage PLL charge pump output External resistance connection for PLL charge pump Power supply for charge pump Test input 1 Used only for testing purpose Lock detector CMOS Output TEST2 Test input 2 Used only for testing purpose 16 REF_IN Reference frequency input 17 VDD_PLL 18 EXTVCO_INN External VCO negative input 19 EXTVCO_INP External VCO positive input 20 VDD_BUFVCO VCO buffer power supply 21 ATPGON SCAN mode activated 22 VDD_I2C I2C bus power supply 23 EXT_PD Power down hardware CMOS Input 24 SDA I2CBUS data line CMOS Bidir Schmitt triggered 25 SCL I2CBUS clock line CMOS Input 26 ADD0 I2CBUS address select pin CMOS Input 27 ADD1 I2CBUS address select pin CMOS Input 28 ADD2 I2CBUS address select pin CMOS Input PLL digital power supply 3/23 STW81100 Table 3. Absolute Maximum Ratings Symbol Parameter Values Unit AVCC Analog Supply voltage 0 to 4.6 V DVCC Digital Supply voltage 0 to 4.6 V Tstg Storage temperature +150 °C ESD Electrical Static Discharge - HBM - CDM-JEDEC Standard 2 0.5 KV Table 4. Operating Conditions Symbol Parameter Test conditions Min Typ Max Unit AVCC Analog Supply voltage 3.0 3.3 3.6 V DVCC Digital Supply voltage 3.0 3.3 3.6 V ICC Current Consumption 100 mA 85 °C 125 °C Tamb Operating ambient temperature Tj Maximum junction temperature Rth j-a -40 Junction to ambient package thermal resistance Multilayer JEDEC board 35 °C/W Table 5. Digital Logic Level Symbol 4 Parameter Vil Low level input voltage Vih High level input voltage Vhyst Schmitt trigger hysteresis Vol Low level output voltage Voh High level output voltage Test conditions Min Typ Max Unit 0.2*Vdd V 0.8*Vdd V 0.8 V 0.4 0.85*Vdd V V Electrical Characteristcs All Electrical Specifications are intended at 3.3V supply voltage. Table 6. Electrical Characteristcs Symbol Parameter Test Condition Min Typ Max Units Reference input frequency 10 19.2 100 MHz Reference input sensitivity 0.35 1 1.5 Vpeak fcomp Comparison frequency 200 400 10000 KHz fstep Frequency step LO direct output 200 400 10000 KHz LO with Divider by 2 100 200 5000 KHz LO with Divider by 4 50 100 2500 KHz REFERENCE fref 4/23 STW81100 Table 6. Electrical Characteristcs (continued) CHARGE PUMP Symbol ICP VOCP Parameter ICP sink/source1 Test Condition Typ 3bit programmable Output voltage compliance range Spurious2,3 Min 0.4 Max Units 4 mA Vdd-0.3 V Direct Output -65 -54 dBc Divider by 2 -70 -60 dBc Divider by 4 -70 -66 dBc VCOs KvcoA KvcoB Sub-Band 00000 85 105 135 MHz/V Sub-Band 01111 55 70 95 MHz/V Sub-Band 11111 35 50 65 MHz/V Sub-Band 00000 60 75 100 MHz/V Sub-Band 01111 35 45 60 MHz/V Sub-Band 11111 20 25 35 MHz/V VCOA Pushing3 7 10 MHz/V VCOB Pushing3 9 14 MHz/V 3 V -20 dBc VCOA sensitivity3 VCOB sensitivity3 VCO control voltage 0.4 LO Harmonic Spurious VCO current consumption 25 mA VCO buffer consumption 15 mA IDIV2 DIVIDER by 2 consumption 18 mA IDIV4 DIVIDER by 4 consumption 14 mA 0 dBm LO OUTPUT BUFFER POUT Output level RL Return Loss Matched to 50ohm 15 dB Current Consumption DIV4 Buff 26 mA DIV2 Buff 23 mA Direct Output 37 mA ILOBUF EXTERNAL VCO (Test purpose only) fINVCO PIN VINDC IEXTBUF Frequency range Input level DC Input level Current Consumption VCO Internal Buffer 3.28 4.4 GHz 0 +6 dBm 2 V 15 mA 5/23 STW81100 Table 6. Electrical Characteristcs (continued) PLL MISCELLANEUS IPLL tLOCK Current Consumption Input Buffer, Prescaler, Digital Dividers, misc 10 mA Lock up time 40 KHz PLL bandwidth; within 1 ppm of frequency error 150 µs Notes: 1. : see relationship between ICP and REXT in the Circuit Description section (Charge Pump) 2. : Comparison frequency leakage (400KHz) and harmonics 3. : Guaranteed by design and characterization. Table 7. Phase Noise Performance1) Parameter In Band Phase Noise – Closed Test Condition Normalized In Band Phase Noise Floor In Band Phase Noise Floor Direct Output In Band Phase Noise Floor Divider by 2 Min Typ Max Units Loop2) ICP=2mA, PLL BW = 50KHz; including reference clock contribution In Band Phase Noise Floor Divider by 4 -212 dBc/Hz -212+20log(N)+10log(fcomp) dBc/Hz -218+20log(N)+10log(fcomp) dBc/Hz -224+20log(N)+10log(fcomp) dBc/Hz -39 -37 dBc -38 -36 dBc -56 -53 dBc/Hz PLL Integrated Phase Noise with Divider by 2 Integrated Phase Noise (single sided) 400Hz to 4MHz Integrated Phase Noise (single sided) 100Hz to 25MHz ICP = 4mA, fcomp = 400KHz (N = 10000), PLL BW = 15KHz VCO A Direct (3280MHz-3900MHz) – Open Loop Phase Noise @ 1 KHz Phase Noise @ 10 KHz -83 -82 dBc/Hz Phase Noise @ 100 KHz -105 -102 dBc/Hz Phase Noise @ 1 MHz -128 -125 dBc/Hz Phase Noise @ 10 MHz -148 -145 dBc/Hz Phase Noise @ 40 MHz -156 -153 dBc/Hz -55 -52 dBc/Hz VCO B Direct (3800MHz-4400MHz) – Open Loop Phase Noise @ 1 KHz Phase Noise @ 10 KHz -82 -79 dBc/Hz Phase Noise @ 100 KHz -104 -101 dBc/Hz Phase Noise @ 1 MHz -127 -124 dBc/Hz Phase Noise @ 10MHz -147 -143 dBc/Hz Phase Noise @ 40 MHz -155 -152 dBc/Hz -62 -59 dBc/Hz VCO A with divider by 2 (1640MHz-1950MHz) – Open Loop Phase Noise @ 1 KHz Phase Noise @ 10 KHz -89 -86 dBc/Hz Phase Noise @ 100 KHz -111 -108 dBc/Hz Phase Noise @ 1 MHz -134 -131 dBc/Hz Phase Noise @ 10 MHz -150 -148 dBc/Hz Phase Noise @ 20 MHz -152 -150 dBc/Hz Phase Noise Floor @ 40 MHz -153 -151 dBc/Hz 6/23 STW81100 Table 7. (continued) Parameter Test Condition Min Typ Max Units VCO B with divider by 2 (1900MHz-2200MHz) – Open Loop Phase Noise @ 1 KHz -61 -58 dBc/Hz Phase Noise @ 10 KHz -88 -85 dBc/Hz Phase Noise @ 100 KHz -110 -107 dBc/Hz Phase Noise @ 1 MHz -133 -130 dBc/Hz Phase Noise @ 10MHz -150 -148 dBc/Hz Phase Noise @ 20MHz -152 -150 dBc/Hz Phase Noise Floor @ 40 MHz -153 -151 dBc/Hz -68 -65 dBc/Hz dBc/Hz VCO A with divider by 4 (820MHz-975MHz) – Open Loop Phase Noise @ 1 KHz Phase Noise @ 10 KHz -95 -92 Phase Noise @ 100 KHz -117 -114 dBc/Hz Phase Noise @ 1 MHz -139 -136 dBc/Hz Phase Noise @ 10MHz -151 -149 dBc/Hz Phase Noise Floor @ 40 MHz -153 -151 dBc/Hz -67 -64 dBc/Hz VCO B with divider by 4 (950MHz-1100MHz) – Open Loop Phase Noise @ 1 KHz Phase Noise @ 10 KHz -94 -91 dBc/Hz Phase Noise @ 100 KHz -116 -113 dBc/Hz Phase Noise @ 1 MHz -138 -135 dBc/Hz Phase Noise @ 10MHz -151 -149 dBc/Hz Phase Noise Floor @ 40 MHz -153 -151 dBc/Hz Note 1): Note 2): Phase Noise SSB. VCO amplitude set to maximum value [11]. The phase noise is measured with the Agilent E5052A Signal Source Analyzer. All the closed-loop performances are specified using a Reference Clock signal at 19.2 MHz with phase noise of -141dBc/Hz @1KHz offset and -146dBc/Hz @10KHz offset. All figures are guaranteed by design and characterization. Normalized PN = Measured PN - 20log(N) - 10log(fcomp) where N is the VCO divider ratio (N=B*P+A) and fcomp is the comparison frequency at the PFD input 7/23 STW81100 5 Typical Performance Characteristics The phase noise is measured with the Agilent E5052A Signal Source Analyzer. All the closed-loop measurements are done with fcomp=800 KHz and using a Reference Clock signal at 19.2 MHz with phase noise of -141dBc/Hz @1KHz offset and -146dBc/Hz @10KHz offset. Figure 4. VCO A (Direct output) open loop phase noise Figure 6. VCO B (Direct output) open loop phase noise Figure 5. VCO A (Direct output) closed loop phase noise Figure 7. VCO B (Direct output) closed loop phase noise 8/23 STW81100 Figure 8. VCO A (Divider by 2 output) closed loop phase noise Figure 10. VCO B (Divider by 2 output) closed loop phase noise Figure 9. VCO A (Divider by 4 output) closed loop phase noise Figure 11. VCO B (Divider by 4 output) closed loop phase noise 9/23 STW81100 6 General Description The block diagram of Figure 2 shows the different blocks, which have been integrated to achieve an integer-N PLL frequency synthesizer. The STW81100 consists of 2 internal low-noise VCOs with buffer blocks, a divider by 2, a divider by 4, a low-noise PFD (Phase Frequency Detector), a precise charge pump, a 9-bit programmable reference divider, two programmable counters and a dual-modulus prescaler. The A-counter (6 bits) and B counter (9 bits) counters, in conjunction with the dual modulus prescaler P/ P+1 (64/65), implement an N integer divider, where N = B*P +A. The division ratio of both reference and VCO dividers is controlled through an I2C bus interface. All devices operate with a power supply of 3.3 V and can be powered down when not in use. 7 Circuit Description 7.1 Reference input stage The reference input stage is shown in Figure 12. The resistor network feeds a DC bias at the Fref input while the inverter used as the frequency reference buffer is AC coupled. Figure 12. Reference Frequency Input Buffer VDD Fref INV BUF Power Down 7.2 Reference Divider The 9-bit programmable reference counter allows the input reference frequency to be divided to produce the input clock to the PFD. The division ratio is programmed through the I2C bus interface. 7.3 Prescaler The dual-modulus prescaler 64/65 takes the CML clock from the VCO buffer and divides it down to a manageable frequency for the CMOS A and B counters. It is based on a synchronous 4/5 core which division ratio depends on the state of the modulus input. 7.4 A and B Counters The A (6 bits) and B (9 bits) counters, in conjunction with the dual modulus prescaler make it possible to generate output frequencies which are spaced only by the reference frequency divided by the reference division ratio. Thus, the division ratio and the VCO output frequency are given by these formulas: N=BxP+A 10/23 ( B ⋅ P + A ) ⋅ F ref F VCO = ----------------------------------------R STW81100 where: – FVCO: output frequency of VCO. – P: modulus of dual modulus prescaler. – B: division ratio of the main counter. – A: division ratio of the swallow counter. – Fref: input reference frequency. – R: division ratio of reference counter. – N: division ratio of PLL For a correct work of the VCO divider, B must be strictly higher than A. A can take any value ranging from 0 to 63. The range of the N number can vary from 4096 to 32767. Figure 13. VCO Divider Diagram VCOBUF- Prescaler 64/65 VCOBUF+ To PFD modulus 6 bit A counter 9 bit B counter 7.5 Phase frequency detector (PFD) The PFD takes inputs from the reference and the VCO dividers and produces an output proportional to the phase error. The PFD includes a delay gate that controls the width of the anti-backlash pulse. This pulse ensures that there is no dead zone in the PFD transfer function. Figure 6 is a simplified schematic of the PFD. Figure 14. PDF Diagram VDD Up D FF Fref R Delay Fref VDD R D FF Down ABL 11/23 STW81100 7.6 Lock Detect This signal indicates that the difference between rising edges of both UP and DOWN PFD signals is found to be shorter than the fixed delay (roughly 5 ns). Lock Detect signal is high when the PLL is locked. When Power Down is activated, Lock Detect is let to high level (Lock Detect consumes current only during PLL transients). 7.7 Change Pump This block drives two matched current sources, Iup and Idown, which are controlled respectively by UP and DOWN PFD outputs. The nominal value of the output current is controlled by an external resistor (to be connected to the REXT input pin) and a selection among 8 by a 3 bit word. The minimum value of the output current is: IMIN = 2*VBG/REXT (VBG~1.17 V) Table 8. Current Value vs Selection CPSEL2 CPSEL1 CPSEL0 Current Value for REXT=9.1 KΩ 0 0 0 IMIN 0.25 mA 0 0 1 2*IMIN 0.50 mA 0 1 0 3*IMIN 0.75 mA 0 1 1 4*IMIN 1.00 mA 1 0 0 5*IMIN 1.25 mA 1 0 1 6*IMIN 1.50 mA 1 1 0 7*IMIN 1.75 mA 1 1 1 8*IMIN 2.00 mA Note: The current is output on pin ICP. During the VCO auto calibration, ICP and VCTRL pins are forced to VDD/2. Figure 15. Loop Filter Connection VDD VCTRL BUF C3 Charge Pump R3 ICP R1 C1 BUF Cal bit 12/23 C2 STW81100 7.8 Voltage Controlled Oscillators 7.8.1 VCO Selection Within STW81100 two low-noise VCOs are integrated to cover a wide band from 3280MHz to 4400MHz (direct output), from 1640MHz to 2200MHz (selecting divider by 2) and from 820MHz to 1100MHz (selecting divider by 4). VCO A frequency range 3280MHz-3900MHz VCO B frequency range 3800MHz-4400MHz 7.8.2 VCO Frequency Calibration Both VCOs can operate on 32 frequency ranges that are selected by adding or subtracting capacitors to the resonator. These frequency ranges are intended to cover the wide band of operation and compensate for process variation on the VCO center frequency. An automatic selection of the range is performed when the bit SERCAL rises from “0” to “1”. The charge pump is inhibited and the pins ICP & VCTRL are at VDD/2 volts. Then the ranges are tested to select the one which with this VCO input voltage is the nearest to the desired output frequency (Fout = N*Fref/R). When this selection is achieved the signal ENDCALB (which means End of Calibration) falls to “0”, then the charge pump is enabled again and SERCAL should be reset to “0” before the next channel step. The PLL has just to perform fine adjustment around VDD/2 on the loop filter to reach Fout, which enables a fast settle. Figure 16. VCO Sub-Bands Frequency Characteristics The SERCAL bit should be set to “1” at each division ratio change. It should be noted that in order to reset the autocalibrator State Machine after a power-up, and anyway before the first calibration, the INITCAL bit should be set to “1” and back to “0” (this operation is automatically performed by the Power On Reset circuitry). The calibration takes approximately 7 periods of the Comparison Frequency. The maximum allowed fcomp to perform the calibration process is 1 MHz. Using an higher fcomp the following procedure should be adopted: 1. Calibrate the VCO at the desired frequency with an fcomp less than 1 MHz 2. Set the A, B and R dividers ratio for the desired fcomp 13/23 STW81100 7.8.3 VCO Voltage Amplitude Control The bits A0 and A1 control the voltage swing of the VCO. The following table gives the voltage level expected on the resonator nodes. Table 9. 8 Code A[1:0] Differential output voltage (Vp) 00 1.1 01 1.3 10 1.9 11 2.1 I2C bus interface Data transmission from microprocessor to the STW81100 takes place through the 2 wires (SDA and SCL) I2C-BUS interface. The STW81100 is always a slave device. The I2C-bus protocol defines any device that sends data on to the bus as a transmitter and any device that reads the data as receiver. The device that controls the data transfer is known as the Master and the others as the slave. The master will always initiate the transfer and will provide the serial clock for synchronization. 8.1 General Features 8.1.1 Power ON Reset The device at Power ON is able to configure itself to a fixed configuration, with all programmable bits set to factory default setting. 8.1.2 Data Validity Data changes on the SDA line must only occur when the SCL is LOW. SDA transitions while the clock is HIGH are used to identify START or STOP condition. Figure 17. SDA SCL DATA LINE STABLE DATA VALID CHANGE DATA ALLOWED 8.1.3 START condition A Start condition is identified by a HIGH to LOW transition of the data bus SDA while the clock signal SCL is stable in the HIGH state. A Start condition must precede any command for data transfer. 14/23 STW81100 8.1.4 STOP condition A LOW to HIGH transition of the data bus SDA identifies start while the clock signal SCL is stable in the HIGH state. A STOP condition terminates communications between the STW81100 and the Bus Master. Figure 18. SCL SDA START STOP 8.1.5 Byte format and acknowledge Every byte transferred on the SDA line must contain bits. Each byte must be followed by an acknowledge bit. The MSB is transferred first. An acknowledge bit is used to indicate a successful data transfer. The bus transmitter, either master or slave, will release the SDA bus after sending 8 bits of data. During the 9th clock pulse the receiver pulls the SDA low to acknowledge the receipt of 8 bits data. Figure 19. SCL 1 2 3 7 8 9 // SDA MSB // START ACKNOWLEDGMENT FROM RECEIVER 8.1.6 Device addressing To start the communication between the Master and the STW81100, the master must initiate with a start condition. Following this, the master sends onto the SDA line 8 bits (MSB first) corresponding to the device select address and read or write mode. The first 7 MSB‘s are the device address identifier, corresponding to the I2C-Bus definition. For the STW81100 the address is set as “1100A2A1A0”, 3bits programmable. The 8th bit (LSB) is the read or write operation bit (RW; set to 1 in read mode and to 0 in write mode). After a START condition the STW81100STW81100 identifies on the bus the device address and, if matched, it will acknowledge the identification on SDA bus during the 9th clock pulse. 8.1.7 Single-byte write mode Following a START condition the master sends a device select code with the RW bit set to 0. The STW81100 gives an acknowledge and waits for the internal sub-address (1 byte). This byte provides access to any of the internal registers. After the reception of the internal byte sub-address the STW81100 again responds with an acknowledge. A single byte write to sub-address 00H would affect DATA_OUT[119:112], so a single byte write with subaddress 07H would affect DATA_OUT[63:56] and so on. 15/23 STW81100 Table 10. S 1100A2A1A0 0 ack sub-address byte ack DATA IN ack P 8.1.8 Multi-byte write mode The multi-byte write mode can start from any internal address. The master sends the data bytes and each one is acknowledged. The master terminates the transfer by generating a STOP condition. The sub-address decides the starting byte. A multi byte with sub-address 07H and 5 DATA_IN byte would affect the bytes starting from DATA_OUT[63:56] to DATA_OUT[31:24] and so on. Table 11. S 1100A2A1A0 0 ack sub-address byte ack DATA IN ack .... DATA IN ack P 8.1.9 Current Byte Address Read In the current byte address read mode, following a START condition, the master sends the device address with the rw bit set to 1 (No sub-address is needed as there is only 1 byte read register). The STW81100 acknowledges this and outputs the data byte. The master does not acknowledge the received byte, but terminates the transfer with a STOP condition. Table 12. S 1100A2A1A0 0 ack sub-address byte ack DATA IN ack .... DATA IN 8.2 Timing Specification Figure 20. Data and clock SDA SCL tcwl tcs tch tcwh Table 13. 16/23 Symbol Tcs Parameter Data to clock set up time Minimum time (ns) 2 Tch Data to clock hold time 2 Tcwh Clock pulse width high 10 Tcwl Clock pulse width low 5 ack P STW81100 Figure 21. Start and Stop SDA SCL tstop2 tstop1 tstart1 tstart2 Table 14. Symbol Parameter Minimum time (ns) Tstart1,2 Clock to data start time 2 Tstop1,2 Data to clock down stop time 2 Figure 22. Ack SDA SCL 8 9 td1 td2 Table 15. Symbol Parameter Maximum time (ns) Td1 Ack begin delay 2 Td2 Ack end delay 2 8.3 I2C Register STW81100 has 6 write-only registers and 1 read-only register. The following table gives a short description of the write-only registers list. 17/23 STW81100 Table 16. HEX CODE DEC CODE DESCRIPTION 0x00 0 FUNCTIONAL_MODE 0x01 1 B_COUNTER 0x02 2 A_COUNTER 0x03 3 REF_DIVIDER 0x04 4 CALIBRATION 0x05 5 CONTROL Table 17. Functional_Mode MSB LSB b7 b6 b5 b4 b3 b2 b1 b0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 FUNCTIONAL_MODE register is used to select different functional mode for the STW81100 synthesizer according to the following table: Table 18. Decimal value Description 0 Power down mode 1 Enable VCO A, output frequency divided by 2 2 Enable VCO B, output frequency divided by 2 3 Enable external VCO, output frequency divided by 2 4 Enable VCO A, output frequency divided by 4 5 Enable VCO B, output frequency divided by 4 6 Enable external VCO, output frequency divided by 4 7 Enable VCO A, direct output 8 Enable VCO B, direct output 9 Enable external VCO, direct output Table 19. B_COUNTER MSB LSB b7 b6 b5 b4 b3 b2 b1 b0 B8 B7 B6 B5 B4 B3 B2 B1 B[8:1] Counter value (bit B0 in the next register) 18/23 STW81100 Table 20. A_COUNTER MSB LSB b7 b6 b5 b4 b3 b2 b1 b0 B0 A5 A4 A3 A2 A1 A0 RS Bit B0 for B Counter, A Counter value and bit R8 for Reference divider. Table 21. REF_DIVIDER MSB LSB b7 b6 b5 b4 b3 b2 b1 b0 R7 R6 R5 R4 R3 R2 R1 R0 Reference Clock divider ratio R[7:0] (bit R8 in the previous register). The LO output frequency is programmed by setting the proper value for A,B and R according to the following formula: F REF_CLK F OUT = D R ⋅ ( B ⋅ 64 + A ) ⋅ -------------------------R { where DR equals 1 for Direct Output 0.5 for Output Divided by 2 0.25 for Output Divided by 4 Table 22. Calibration MSB LSB b7 b6 b5 b4 b3 b2 b1 b0 INIT CAL SER CAL SEL EXT CAL CAL 0 CAL 1 CAL 2 CAL 3 CAL 4 This register controls VCO calibrator. INITCAL: resets the auto-calibrator State Machine (writing to “1” and back to “0”) SERCAL: at “1” starts the VCO auto-calibration (should be reset to “0” at the end of calibration) SELEXTCAL: at “1” selects control word EXTCAL[4:0] for the VCO EXTCAL[4:0]: control word for the VCO Table 23. CONTROL b7 b6 b5 b4 b3 b2 b1 b0 PLL_A0 PLL_A1 CP SEL 0 CP SEL 1 CP SEL 2 NA NA NA The CONTROL register is used to set the VCO output voltage amplitude and the Charge Pump Current. PLL_A[1:0]: VCO amplitude CPSEL[2:0]: Charge Pump output current 19/23 STW81100 Table 24. READ-ONLY REGISTER b7 b6 b5 b4 b3 b2 b1 b0 ILLEG AL_SUBAD0 END CALB LOCK_DET INT CAL4 INT CAL3 INT CAL2 INT CAL1 INT CAL0 This register is automatically addressed in the ‘current byte address read mode’. ILLEGAL_SUBADD: gives “1” if the sub-address value is not correct ENDCALB: at “0” means end of auto-calibration phase LOCK_DET: “1” when PLL is locked INTCAL[4:0]: internal value of the VCO control word Figure 23. Application Diagram DIV2 BUF LO_OUT OUTBUFP 50 Ω BUF OUTBUFN DIV4 BUF EXT LO EXTVCO_INP EXT VCO BUFF EXTVCO_INN CHARGE PUMP VCTRL REF_IN 20/23 ICP REXT STW81100 9 Package Information Figure 24. VFQFPN28 Mechanical Data & Package Dimensions REF. mm inch MIN. TYP. MAX. MIN. TYP. MAX. 0.800 0.900 1.000 0.031 0.035 0.039 A1 0.020 0.050 0.0008 0.0019 A2 0.650 1.000 0.025 0.250 0.300 0.007 0.0098 0.012 5.000 5.150 0.191 A A3 0.200 b 0.180 D 4.850 D1 0.039 0.0078 4.750 0.197 0.203 0.187 D2 1.250 2.700 3.250 0.049 0.106 0.128 E 4.850 5.000 5.150 0.191 0.197 0.203 E1 E2 4.750 1.250 e L P 2.700 0.187 3.250 0.049 0.500 0.350 0.550 OUTLINE AND MECHANICAL DATA 0.106 0.128 0.020 0.750 0.60 0.014 0.022 0.029 0.0236 K 14˚ 14˚ ddd 0.080 0.003 Notes: 1) VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Packages No lead. Very thin: A = 1.00 Max. 2) The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body. Exact shape and size of this feature is optional. VFQFPN-28 (5x5x1.0mm) Very Fine Quad Flat Package No lead 7655832 A 21/23 STW81100 10 Revision History Table 25. Revision History 22/23 Date Revision Description of Changes March 2005 1 First Issue April 2005 2 Changed the maturity from Preliminary to Final datasheet. Modified sections: 1, 2, 4 (Tables 6, 7). Added new section 5 "Typical Performance Characteristics". Modified sub-section 7.8.2 “VCO Frequency Calibration”. Changed “Package Informations”. STW81100 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 23/23