FUJITSU MB95F394HPMC-G-SNE2

FUJITSU SEMICONDUCTOR
DATA SHEET
DS07–12632–2E
8-bit Microcontrollers
CMOS
F2MC-8FX MB95390H Series
MB95F394H/F396K/F398H/F394K/F396H/F398K
■ DESCRIPTION
MB95390H is a series of general-purpose, single-chip microcontrollers. In addition to a compact instruction
set, the microcontrollers of this series contain a variety of peripheral resources.
Note: F2MC is the abbreviation of FUJITSU Flexible Microcontroller.
■ FEATURES
• F2MC-8FX CPU core
Instruction set optimized for controllers
• Multiplication and division instructions
• 16-bit arithmetic operations
• Bit test branch instructions
• Bit manipulation instructions, etc.
• Clock
• Selectable main clock source
Main OSC clock (up to 16.25 MHz, maximum machine clock frequency: 8.125 MHz)
External clock (up to 32.5 MHz, maximum machine clock frequency: 16.25 MHz)
Main CR clock (1/8/10/12.5 MHz ±2% or ±2.5%*, maximum machine clock frequency: 12.5 MHz)
*: The main CR clock oscillation accuracy of a product in LQFP package (FPT-48P-M49 or
FPT-52P-M02) is ±2% and that of a product in QFN package (LCC-48P-M11) is ±2.5%.
• Selectable subclock source
Sub-OSC clock (32.768 kHz)
External clock (32.768 kHz)
Sub-CR clock (Typ: 100 kHz, Min: 50 kHz, Max: 200 kHz)
• Timer
• 8/16-bit composite timer × 2 channels
• 8/16-bit PPG × 3 channels
• 16-bit PPG × 1 channel (can work independently or together with the multi-pulse generator)
• 16-bit reload timer × 1 channel (can work independently or together with the multi-pulse generator)
• Time-base timer × 1 channel
• Watch prescaler × 1 channel
(Continued)
For the information for microcontroller supports, see the following website.
http://edevice.fujitsu.com/micom/en-support/
Copyright©2010 FUJITSU SEMICONDUCTOR LIMITED All rights reserved
2010.11
MB95390H Series
(Continued)
• UART/SIO × 1 channel
• Full duplex double buffer
• Capable of clock-asynchronous (UART) serial data transfer and clock-synchronous (SIO) serial data
transfer
• I2C × 1 channel
• Built-in wake-up function
• Multi-pulse generator (MPG) (for DC motor control) × 1 channel
• 16-bit reload timer × 1 channel
• 16-bit PPG timer × 1 channel
• Waveform sequencer (including a 16-bit timer equipped with a buffer and a compare clear function)
• LIN-UART
• Full duplex double buffer
• Capable of clock-synchronous serial data transfer and clock-asynchronous serial data transfer
• External interrupt × 8 channels
• Interrupt by edge detection (rising edge, falling edge, and both edges can be selected)
• Can be used to wake up the device from different low power consumption (standby) modes
• 8/10-bit A/D converter × 12 channels
• 8-bit and 10-bit resolution can be chosen.
• Low power consumption (standby) modes
• Stop mode
• Sleep mode
• Watch mode
• Time-base timer mode
• I/O port
• MB95F394H/F396H/F398H (maximum no. of I/O ports: 44)
General-purpose I/O ports (N-ch open drain)
:3
General-purpose I/O ports (CMOS I/O)
: 41
• MB95F394K/F396K/F398K (maximum no. of I/O ports: 45)
General-purpose I/O ports (N-ch open drain)
:4
General-purpose I/O ports (CMOS I/O)
: 41
• On-chip debug
• 1-wire serial control
• Serial writing supported (asynchronous mode)
• Hardware/software watchdog timer
• Built-in hardware watchdog timer
• Built-in software watchdog timer
• Low-voltage detection reset circuit
• Built-in low-voltage detector
• Clock supervisor counter
• Built-in clock supervisor counter function
• Programmable port input voltage level
• CMOS input level / hysteresis input level
• Dual operation Flash memory
• The erase/write operation and the read operation can be executed in different banks (upper bank/lower
bank) simultaneously.
• Flash memory security function
• Protects the content of the Flash memory
2
DS07–12632–2E
MB95390H Series
■ PRODUCT LINE-UP
Part number
MB95F394H
MB95F396H
MB95F398H
MB95F394K
MB95F396K
MB95F398K
Parameter
Type
Flash memory product
Clock
supervisor
It supervises the main clock oscillation.
counter
Program ROM
20 Kbyte
36 Kbyte
60 Kbyte
20 Kbyte
36 Kbyte
60 Kbyte
capacity
RAM capacity
496 bytes
1008 bytes
2032 bytes
496 bytes
1008 bytes
2032 bytes
Low-voltage
No
Yes
detection reset
Reset input
Dedicated
Selected through software
• Number of basic instructions
: 136
• Instruction bit length
: 8 bits
• Instruction length
: 1 to 3 bytes
CPU functions
• Data bit length
: 1, 8 and 16 bits
• Minimum instruction execution time : 61.5 ns (with machine clock frequency = 16.25 MHz)
• Interrupt processing time
: 0.6 µs (with machine clock frequency = 16.25 MHz)
• I/O ports (Max) : 45
• I/O ports (Max) : 44
General• CMOS I/O
: 41
• CMOS I/O
: 41
purpose I/O
• N-ch open drain: 4
• N-ch open drain: 3
Time-base timer Interval time: 0.256 ms to 8.3 s (with external clock frequency = 4 MHz)
• Reset generation cycle
Hardware/
software
- Main oscillation clock at 10 MHz: 105 ms (Min)
watchdog timer • The sub-CR clock can be used as the source clock of the hardware watchdog timer.
Wild register
It can be used to replace three bytes of data.
• A wide range of communication speeds can be selected by a dedicated reload timer.
• Clock-synchronous serial data transfer and clock-asynchronous serial data transfer is enLIN-UART
abled.
• The LIN function can be used as a LIN master or a LIN slave.
12 channels
8/10-bit A/D
converter
8-bit resolution and 10-bit resolution can be chosen.
2 channels
• The timer can be configured as an "8-bit timer × 2 channels" or a "16-bit timer × 1 channel".
8/16-bit
• It has the following functions: timer function, PWC function, PWM function and input capture
composite timer function.
• Count clock: it can be selected from internal clocks (seven types) and external clocks.
• It can output square wave.
8 channels
External
• Interrupt by edge detection (The rising edge, falling edge, or both edges can be selected.)
interrupt
• It can be used to wake up the device from different standby modes.
• 1-wire serial control
On-chip debug
• It supports serial writing. (asynchronous mode)
(Continued)
DS07–12632–2E
3
MB95390H Series
(Continued)
Part number
MB95F394H
MB95F396H
MB95F398H
MB95F394K
MB95F396K
MB95F398K
Parameter
1 channel
• Data transfer with UART/SIO is enabled.
• It has a full duplex double buffer, variable data length (5/6/7/8 bits), a built-in baud rate
generator and an error detection function.
UART/SIO
• It uses the NRZ type transfer format.
• LSB-first data transfer and MSB-first data transfer are available to use.
• Clock-asynchronous (UART) serial data transfer and clock-synchronous (SIO) serial data
transfer is enabled.
1 channel
• Master/slave transmission and receiving
I2C
• It has the following functions: bus error function, arbitration function, transmission direction
detection function, wake-up function, and functions of generating and detecting repeated
START conditions.
3 channels
8/16-bit PPG
• Each channel of PPG can be used as two 8-bit PPG channels or a single 16-bit PPG channel.
• The counter operating clock can be selected from eight clock sources.
• PWM mode and one-shot mode are available to use.
• The counter operating clock can be selected from eight clock sources.
16-bit PPG
• It supports external trigger start.
• It can work independently or together with the multi-pulse generator.
• Two clock modes and two counter operating modes are available to use.
• It can output square waveform.
16-bit reload
• Count clock: it can be selected from internal clocks (seven types) and external clocks.
timer
• Two counter operating modes: reload mode and one-shot mode
• It can work independently or together with the multi-pulse generator.
• 16-bit PPG timer: 1 channel
Multi-pulse
• 16-bit reload timer operations: toggle output, one-shot output
generator (for
• Event counter: 1 channel
DC motor
• Waveform sequencer (including a 16-bit timer equipped with a buffer and a compare clear
control)
function)
Watch prescaler Eight different time intervals can be selected.
• It supports automatic programming, Embedded Algorithm, and write/erase/erase-suspend/
erase-resume commands.
• It has a flag indicating the completion of the operation of Embedded Algorithm.
Flash memory
• Number of write/erase cycles: 100000
• Data retention time: 20 years
• Flash security feature for protecting the content of the Flash memory
Standby mode Sleep mode, stop mode, watch mode, time-base timer mode
FPT-48P-M49
Package
FPT-52P-M02
LCC-48P-M11
4
DS07–12632–2E
MB95390H Series
■ PACKAGES AND CORRESPONDING PRODUCTS
Part number
MB95F394H
MB95F396H
MB95F398H
MB95F394K
MB95F396K
MB95F398K
FPT-48P-M49
O
O
O
O
O
O
FPT-52P-M02
O
O
O
O
O
O
LCC-48P-M11
O
O
O
O
O
O
Package
O: Available
DS07–12632–2E
5
MB95390H Series
■ DIFFERENCES AMONG PRODUCTS AND NOTES ON PRODUCT SELECTION
• Current consumption
When using the on-chip debug function, take account of the current consumption of flash erase/write.
For details of current consumption, see “■ ELECTRICAL CHARACTERISTICS”.
• Package
For details of information on each package, see “■ PACKAGES AND CORRESPONDING PRODUCTS” and
“■ PACKAGE DIMENSIONS”.
• Operating voltage
The operating voltage varies, depending on whether the on-chip debug function is used or not.
For details of the operating voltage, see “■ ELECTRICAL CHARACTERISTICS”.
• On-chip debug function
The on-chip debug function requires that VCC, VSS and one serial wire be connected to an evaluation tool.
For details of the connection method, refer to “CHAPTER 29 EXAMPLE OF SERIAL PROGRAMMING
CONNECTION” in the hardware manual of the MB95390H Series.
6
DS07–12632–2E
MB95390H Series
PG2/X1A/SNI2
PG1/X0A/SNI1
1
2
Vcc
C
3
4
P40/AN08
P41/AN09
5
6
P42/AN10
P43/AN11
7
8
9
P44/TO1
Vss
PF1/X1
PF0/X0
PF2/RST
P07/INT07/AN07
P06/INT06/AN06
P05/INT05/AN05
P04/INT04/AN04
P03/INT03/AN03
P02/INT02/AN02
P01/INT01/AN01
P00/INT00/AN00
48
47
46
45
44
43
42
41
40
39
38
37
■ PIN ASSIGNMENT
(TOP VIEW)
LQFP48
FPT-48P-M49
36
35
34
33
P67*/OPT5/PPG21/TRG1
P66*/OPT4/PPG20/PPG1
P65*/OPT3/PPG11
P64*/OPT2/PPG10/EC1
32
31
30
29
28
P63*/OPT1/PPG01/TO11
P62*/OPT0/PPG00/TO10
P61/TI1
P60/DTTI
P77/UI0
20
21
22
23
24
P17/SNI0
P70/TO00
P71/TO01
P72/SCL
P73/SDA
P75/UCK0
P74/EC0
17
18
19
P76/UO0
26
25
P14/PPG01
P15/PPG20
P16/PPG21
27
11
12
13
14
15
16
10
P46/SOT
P47/SIN
P10/PPG10
P11/PPG11
P12/DBG
P13/PPG00
P45/SCK
*: High-current pin (8 mA/12 mA)
(Continued)
DS07–12632–2E
7
FPT-52P-M02
P44/TO1
10
P45/SCK
11
P46/SOT
12
13
P00/INT00/AN00
P03/INT03/AN03
P02/INT02/AN02
P01/INT01/AN01
39
38
37
36
P67*/OPT5/PPG21/TRG1
P66*/OPT4/PPG20/PPG1
P65*/OPT3/PPG11
P64*/OPT2/PPG10/EC1
35
34
33
32
31
P63*/OPT1/PPG01/TO11
P62*/OPT0/PPG00/TO10
NC
P61/TI1
P60/DTTI
30
P77/UI0
29
P76/UO0
28
27
P75/UCK0
P74/EC0
P73/SDA
P72/SCL
20
17
18
19
P10/PPG10
P11/PPG11
P12/DBG
P13/PPG00
14
15
16
P47/SIN
24
25
26
7
8
9
P71/TO01
P42/AN10
P43/AN11
41
40
44
(TOP VIEW)
LQFP52
23
5
6
22
P40/AN08
P41/AN09
NC
P17/SNI0
3
4
P70/TO00
Vcc
C
21
1
2
P14/PPG01
P15/PPG20
NC
P16/PPG21
PG2/X1A/SNI2
PG1/X0A/SNI1
43
42
52
51
50
49
48
47
46
45
Vss
PF1/X1
PF0/X0
PF2/RST
P07/INT07/AN07
P06/INT06/AN06
NC
P05/INT05/AN05
P04/INT04/AN04
MB95390H Series
*: High-current pin (8 mA/12 mA)
(Continued)
8
DS07–12632–2E
MB95390H Series
PF2/RST
P07/INT07/AN07
P06/INT06/AN06
P05/INT05/AN05
P04/INT04/AN04
P03/INT03/AN03
P02/INT02/AN02
P01/INT01/AN01
P00/INT00/AN00
43
42
41
40
39
38
37
44
P76/UO0
11
26
P75/UCK0
12
25
P74/EC0
22
23
24
P72/SCL
P73/SDA
P47/SIN
PF0/X0
P77/UI0
27
21
P46/SOT
45
28
P71/TO01
10
P70/TO00
P45/SCK
LCC-48P-M11
P16/PPG21
P17/SNI0
P44/TO1
7
8
9
PF1/X1
P63*/OPT1/PPG01/TO11
P62*/OPT0/PPG00/TO10
P61/TI1
P60/DTTI
P15/PPG20
P42/AN10
P43/AN11
46
32
31
30
29
(TOP VIEW)
QFN48
16
17
18
19
20
5
6
15
P40/AN08
P41/AN09
14
3
4
Vss
P67*/OPT5/PPG21/TRG1
P66*/OPT4/PPG20/PPG1
P65*/OPT3/PPG11
P64*/OPT2/PPG10/EC1
13
Vcc
C
47
36
35
34
33
P11/PPG11
P12/DBG
P13/PPG00
P14/PPG01
1
2
P10/PPG10
PG2/X1A/SNI2
PG1/X0A/SNI1
48
(Continued)
*: High-current pin (8 mA/12 mA)
DS07–12632–2E
9
MB95390H Series
■ PIN FUNCTIONS
Pin no.
LQFP48*1
QFN48*2
LQFP52*3
Pin
name
I/O
circuit
type*4
PG2
1
2
1
2
1
2
X1A
Function
General-purpose I/O port
C
Subclock I/O oscillation pin
SNI2
Trigger input pin for the position detection function
of the MPG waveform sequencer
PG1
General-purpose I/O port
X0A
C
Subclock input oscillation pin
Trigger input pin for the position detection function
of the MPG waveform sequencer
SNI1
3
3
3
VCC
—
Power supply pin
4
4
4
C
—
Capacitor connection pin
5
5
5
6
6
6
—
—
7
7
7
8
8
8
9
9
9
10
10
10
11
11
11
12
12
12
13
13
13
14
14
14
15
15
15
16
16
16
17
P40
AN08
P41
AN09
NC
P42
AN10
P43
AN11
P44
TO1
P45
SCK
P46
SOT
P47
SIN
P10
PPG10
P11
PPG11
P12
DBG
P13
PPG00
K
K
—
K
K
G
G
G
J
G
G
H
G
General-purpose I/O port
A/D converter analog input pin
General-purpose I/O port
A/D converter analog input pin
It is an internally connected pin. Always leave it
unconnected.
General-purpose I/O port
A/D converter analog input pin
General-purpose I/O port
A/D converter analog input pin
General-purpose I/O port
16-bit reload timer ch. 0 output pin
General-purpose I/O port
LIN-UART clock I/O pin
General-purpose I/O port
LIN-UART data output pin
General-purpose I/O port
LIN-UART data input pin
General-purpose I/O port
8/16-bit PPG ch. 1 output pin
General-purpose I/O port
8/16-bit PPG ch. 1 output pin
General-purpose I/O port
DBG input pin
General-purpose I/O port
8/16-bit PPG ch. 0 output pin
(Continued)
10
DS07–12632–2E
MB95390H Series
Pin no.
LQFP48*1
QFN48*2
LQFP52*3
17
17
18
18
18
19
—
—
20
19
19
21
Pin
name
P14
PPG01
P15
PPG20
NC
P16
PPG21
I/O
circuit
type*4
G
G
—
G
P17
20
20
22
21
21
23
22
22
24
23
23
25
24
24
26
25
25
27
26
26
28
27
27
29
28
28
30
29
29
31
30
30
32
—
—
33
SNI0
P70
TO00
P71
TO01
P72
SCL
P73
SDA
P74
EC0
P75
UCK0
P76
UO0
P77
UI0
P60
DTTI
P61
TI1
NC
31
34
OPT0
PPG00
TO10
General-purpose I/O port
8/16-bit PPG ch. 0 output pin
General-purpose I/O port
8/16-bit PPG ch. 2 output pin
It is an internally connected pin. Always leave it
unconnected.
General-purpose I/O port
8/16-bit PPG ch. 2 output pin
General-purpose I/O port
G
G
G
I
I
G
G
G
J
G
G
—
Trigger input pin for the position detection function
of the MPG waveform sequencer
General-purpose I/O port
8/16-bit composite timer ch. 0 output pin
General-purpose I/O port
8/16-bit composite timer ch. 0 output pin
General-purpose I/O port
I2C clock I/O pin
General-purpose I/O port
I2C data I/O pin
General-purpose I/O port
8/16-bit composite timer ch. 0 clock input pin
General-purpose I/O port
UART/SIO ch. 0 clock I/O pin
General-purpose I/O port
UART/SIO ch. 0 data output pin
General-purpose I/O port
UART/SIO ch. 0 data input pin
General-purpose I/O port
MPG waveform sequencer input pin
General-purpose I/O port
16-bit reload timer ch. 0 input pin
It is an internally connected pin. Always leave it
unconnected.
General-purpose I/O port
High-current pin
P62
31
Function
D
MPG waveform sequencer output pin
8/16-bit PPG ch. 0 output pin
8/16-bit composite timer ch. 1 output pin
(Continued)
DS07–12632–2E
11
MB95390H Series
Pin no.
LQFP48*1
QFN48*2
LQFP52*3
Pin
name
I/O
circuit
type*4
General-purpose I/O port
High-current pin
P63
32
32
35
OPT1
D
PPG01
8/16-bit composite timer ch. 1 output pin
General-purpose I/O port
High-current pin
P64
33
36
OPT2
D
PPG10
34
34
37
EC1
8/16-bit composite timer ch. 1 clock input pin
P65
General-purpose I/O port
High-current pin
OPT3
D
38
OPT4
General-purpose I/O port
High-current pin
D
36
39
8/16-bit PPG ch. 2 output pin
PPG1
16-bit PPG ch. 1 output pin
General-purpose I/O port
High-current pin
OPT5
D
37
40
8/16-bit PPG ch. 2 output pin
TRG1
16-bit PPG ch. 1 trigger input pin
INT00
General-purpose I/O port
E
AN00
38
41
INT01
General-purpose I/O port
E
AN01
39
42
INT02
General-purpose I/O port
E
AN02
40
43
INT03
AN03
External interrupt input pin
A/D converter analog input pin
P03
40
External interrupt input pin
A/D converter analog input pin
P02
39
External interrupt input pin
A/D converter analog input pin
P01
38
MPG waveform sequencer output pin
PPG21
P00
37
MPG waveform sequencer output pin
PPG20
P67
36
MPG waveform sequencer output pin
8/16-bit PPG ch. 1 output pin
P66
35
MPG waveform sequencer output pin
8/16-bit PPG ch. 1 output pin
PPG11
35
MPG waveform sequencer output pin
8/16-bit PPG ch. 0 output pin
TO11
33
Function
General-purpose I/O port
E
External interrupt input pin
A/D converter analog input pin
(Continued)
12
DS07–12632–2E
MB95390H Series
(Continued)
Pin no.
LQFP48*1
QFN48*2
LQFP52*3
Pin
name
I/O
circuit
type*4
P04
41
41
44
INT04
General-purpose I/O port
E
AN04
42
45
INT05
General-purpose I/O port
E
AN05
—
—
46
NC
43
47
INT06
—
E
48
INT07
General-purpose I/O port
E
AN07
45
49
46
46
50
47
47
51
48
48
52
RST
PF0
X0
PF1
X1
VSS
External interrupt input pin
A/D converter analog input pin
PF2
45
External interrupt input pin
A/D converter analog input pin
P07
44
It is an internally connected pin. Always leave it
unconnected.
General-purpose I/O port
AN06
44
External interrupt input pin
A/D converter analog input pin
P06
43
External interrupt input pin
A/D converter analog input pin
P05
42
Function
General-purpose I/O port
A
B
B
—
Reset pin
Dedicated reset pin in MB95F394H/F396H/F398H
General-purpose I/O port
Main clock I/O oscillation pin
General-purpose I/O port
Main clock I/O oscillation pin
Power supply pin (GND)
*1: Package code: FPT-48P-M49
*2: Package code: LCC-48P-M11
*3: Package code: FPT-52P-M02
*4: For the I/O circuit types, see “■ I/O CIRCUIT TYPE”.
DS07–12632–2E
13
MB95390H Series
■ I/O CIRCUIT TYPE
Type
Circuit
A
Remarks
Reset input / Hysteresis input
Reset output / Digital output
N-ch
B
P-ch
Port select
Digital output
N-ch
Digital output
Standby control
Hysteresis input
Clock input
• N-ch open drain output
• Hysteresis input
• Reset output
• Oscillation circuit
• High-speed side
Feedback resistance:
approx. 1 MΩ
• CMOS output
• Hysteresis input
X1
X0
Standby control / Port select
P-ch
Port select
Digital output
N-ch
Digital output
Standby control
Hysteresis input
C
Port select
R
Pull-up control
P-ch
Digital output
P-ch
N-ch
Digital output
Standby control
Hysteresis input
• Oscillation circuit
• Low-speed side
Feedback resistance:
approx.10 MΩ
• CMOS output
• Hysteresis input
• Pull-up control available
Clock input
X1A
X0A
Standby control / Port select
Port select
R
Pull-up control
Digital output
Digital output
P-ch
N-ch
Digital output
Standby control
Hysteresis input
(Continued)
14
DS07–12632–2E
MB95390H Series
Type
Circuit
D
Remarks
P-ch
Digital output
Digital output
• CMOS output
• Hysteresis input
• High-current output
N-ch
Standby control
Hysteresis input
E
Pull-up control
R
P-ch
Digital output
P-ch
•
•
•
•
CMOS output
Hysteresis input
Pull-up control available
Analog input
•
•
•
•
•
CMOS output
Hysteresis input
CMOS input
Pull-up control available
Analog input
Digital output
N-ch
Analog input
A/D control
Standby control
Hysteresis input
F
Pull-up control
R
P-ch
Digital output
P-ch
Digital output
N-ch
Analog input
A/D control
Standby control
Hysteresis input
CMOS input
G
Pull-up control
R
P-ch
• CMOS output
• Hysteresis input
• Pull-up control available
Digital output
P-ch
Digital output
N-ch
Standby control
Hysteresis input
H
Standby control
Hysteresis input
• N-ch open drain output
• Hysteresis input
Digital output
N-ch
(Continued)
DS07–12632–2E
15
MB95390H Series
(Continued)
Type
Circuit
Remarks
I
Digital output
N-ch
Standby control
• N-ch open drain output
• Hysteresis input
• CMOS input
Hysteresis input
CMOS input
J
Pull-up control
R
P-ch
Digital output
P-ch
•
•
•
•
CMOS output
Hysteresis input
CMOS input
Pull-up control available
•
•
•
•
Hysteresis input
CMOS output
Pull-up control available
Analog input
Digital output
N-ch
Standby control
Hysteresis input
CMOS input
K
Pull-up control
R
P-ch
Digital output
P-ch
Digital output
N-ch
Standby control
Hysteresis input
Analog input
16
DS07–12632–2E
MB95390H Series
■ NOTES ON DEVICE HANDLING
• Preventing latch-ups
When using the device, ensure that the voltage applied does not exceed the maximum voltage rating.
In a CMOS IC, if a voltage higher than VCC or a voltage lower than VSS is applied to an input/output pin that
is neither a medium-withstand voltage pin nor a high-withstand voltage pin, or if a voltage out of the rating
range of power supply voltage mentioned in "1. Absolute Maximum Ratings" of “■ ELECTRICAL CHARACTERISTICS” is applied to the VCC pin or the VSS pin, a latch-up may occur.
When a latch-up occurs, power supply current increases significantly, which may cause a component to be
thermally destroyed.
• Stabilizing supply voltage
Supply voltage must be stabilized.
A malfunction may occur when power supply voltage fluctuates rapidly even though the fluctuation is within
the guaranteed operating range of the VCC power supply voltage.
As a rule of voltage stabilization, suppress voltage fluctuation so that the fluctuation in VCC ripple (p-p value)
at the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the standard VCC value, and the transient
fluctuation rate does not exceed 0.1 V/ms at a momentary fluctuation such as switching the power supply.
• Notes on using the external clock
When an external clock is used, oscillation stabilization wait time is required for power-on reset, wake-up
from subclock mode or stop mode.
■ PIN CONNECTION
• Treatment of unused pins
If an unused input pin is left unconnected, a component may be permanently damaged due to malfunctions
or latch-ups. Always pull up or pull down an unused input pin through a resistor of at least 2 kΩ. Set an
unused input/output pin to the output state and leave it unconnected, or set it to the input state and treat it
the same as an unused input pin. If there is an unused output pin, leave it unconnected.
• Power supply pins
To reduce unnecessary electro-magnetic emission, prevent malfunctions of strobe signals due to an increase
in the ground level, and conform to the total output current standard, always connect the VCC pin and the VSS
pin to the power supply and ground outside the device. In addition, connect the current supply source to the
VCC pin and the VSS pin with low impedance.
It is also advisable to connect a ceramic capacitor of approximately 0.1 µF as a bypass capacitor between
the VCC pin and the VSS pin at a location close to this device.
• DBG pin
Connect the DBG pin directly to an external pull-up resistor.
To prevent the device from unintentionally entering the debug mode due to noise, minimize the distance
between the DBG pin and the VCC or VSS pin when designing the layout of the printed circuit board.
The DBG pin should not stay at “L” level after power-on until the reset output is released.
• RST pin
Connect the RST pin directly to an external pull-up resistor.
To prevent the device from unintentionally entering the reset mode due to noise, minimize the distance
between the RST pin and the VCC or VSS pin when designing the layout of the printed circuit board.
The RST/PF2 pin functions as the reset input/output pin after power-on. In addition, the reset output of the
RST/PF2 pin can be enabled by the RSTOE bit in the SYSC register, and the reset input function and the
general purpose I/O function can be selected by the RSTEN bit in the SYSC register.
DS07–12632–2E
17
MB95390H Series
• C pin
Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. The bypass capacitor for
the VCC pin must have a capacitance larger than CS. For the connection to a smoothing capacitor CS, see
the diagram below. To prevent the device from unintentionally entering a mode to which the device is not set
to transit due to noise, minimize the distance between the C pin and CS and the distance between CS and
the VSS pin when designing the layout of a printed circuit board.
• DBG/RST/C pins connection diagram
DBG
C
RST
Cs
18
DS07–12632–2E
MB95390H Series
■ BLOCK DIAGRAM
F2MC-8FX CPU
PF2*1/RST*2
Dual operation Flash with
security function
(60 Kbyte)
Reset with LVD
PF1/X1*2
PF0/X0*2
PG2/X1A*2
Oscillator
circuit
CR
oscillator
PG1/X0A*2
(P04)
(P05)
RAM (496/1008/2032 bytes)
Clock control
P70/TO00
8/16-bit composite timer ch. 0
P12/DBG*1
On-chip debug
P74/EC0
Wild register
8/10-bit A/D converter
P00/INT00 to P07/INT07
P71/TO01
(P00/AN00 to P07/AN07)
P40/AN08 to P43/AN11
External interrupt
(P62/TO10)
C
Interrupt controller
P45/SCK
P46/SOT
LIN-UART
Internal bus
8/16-bit composite timer ch. 1
(P64/EC1)
MPG
16-bit reload timer
P47/SIN
(P61/TI1)
P44/TO1
P62/OPT0 to P67/OPT5*3
Waveform sequencer
P75/UCK0
P76/UO0
(P63/TO11)
UART/SIO
P17/SNI0, PG1/SNI1, PG2/SNI2
P60/DTTI
P61/TI1
P77/UI0
16-bit PPG timer
P72/SCL*1
2
IC
P73/SDA*1
(P62/PPG00*3), P13/PPG00
(P63/PPG01*3), P14/PPG01
(P66/PPG20*3), P15/PPG20
(P67/PPG21*3), P16/PPG21
8/16-bit PPG ch. 1
8/16-bit PPG ch. 0
(P67/TRG1)
(P66/PPG1)
P10/PPG10, (P64/PPG10*3)
P11/PPG11, (P65/PPG11*3)
8/16-bit PPG ch. 2
Port
Vcc
*1: PF2, P12, P72 and P73 are N-ch open drain pins.
Vss
*2: Software option
Port
*3: P62 to P67 are high-current pins.
Note: Pins in parentheses indicate that functions of those pins are shared among different resources.
DS07–12632–2E
19
MB95390H Series
■ CPU CORE
• Memory Space
The memory space of the MB95390H Series is 64 Kbyte in size, and consists of an I/O area, a data area,
and a program area. The memory space includes areas intended for specific purposes such as
general-purpose registers and a vector table. The memory maps of the MB95390H Series are shown below.
• Memory Maps
MB95F394H/F394K
MB95F396H/F396K
0000H
0000H
I/O
I/O
0080H
0090H
0100H
Access prohibited
RAM 496 bytes
0080H
0090H
0100H
0200H
Access prohibited
0F80H
Access prohibited
RAM 2032 bytes
Registers
0200H
Access prohibited
0F80H
Flash 4 Kbyte
I/O
0080H
0090H
0100H
0480H
0880H
0F80H
Extended I/O
Extended I/O
1000H
2000H
Access prohibited
RAM 1008 bytes
Registers
Registers
0200H
0280H
MB95F398H/F398K
0000H
1000H
2000H
Flash 4 Kbyte
Access prohibited
Extended I/O
1000H
Vacant
Vacant
7FFFH
Flash 60 Kbyte
Flash 32 Kbyte
BFFFH
Flash 16 Kbyte
FFFFH
20
FFFFH
FFFFH
DS07–12632–2E
MB95390H Series
■ I/O MAP
Address
Register
abbreviation
Register name
R/W Initial value
0000H
PDR0
Port 0 data register
R/W
00000000B
0001H
DDR0
Port 0 direction register
R/W
00000000B
0002H
PDR1
Port 1 data register
R/W
00000000B
0003H
DDR1
Port 1 direction register
R/W
00000000B
0004H
—
—
—
0005H
WATR
R/W
11111111B
0006H
—
—
—
0007H
SYCC
System clock control register
R/W
0000X011B
00000XXXB
(Disabled)
Oscillation stabilization wait time setting register
(Disabled)
0008H
STBC
Standby control register
R/W
0009H
RSRR
Reset source register
R/W XXXXXXXXB
000AH
TBTC
Time-base timer control register
R/W
00000000B
000BH
WPCR
Watch prescaler control register
R/W
00000000B
000CH
WDTC
Watchdog timer control register
R/W
00XX0000B
000DH
SYCC2
System clock control register 2
R/W
XX100011B
000EH
to
0011H
—
—
—
0012H
PDR4
Port 4 data register
R/W
00000000B
Port 4 direction register
R/W
00000000B
—
—
(Disabled)
0013H
PDR4
0014H,
0015H
—
0016H
PDR6
Port 6 data register
R/W
00000000B
0017H
DDR6
Port 6 direction register
R/W
00000000B
0018H
DDR7
Port 7 data register
R/W
00000000B
0019H
DDR7
Port 7 direction register
R/W
00000000B
001AH
to
0027H
—
—
—
0028H
PDRF
Port F data register
R/W
00000000B
(Disabled)
(Disabled)
0029H
DDRF
Port F direction register
R/W
00000000B
002AH
PDRG
Port G data register
R/W
00000000B
002BH
DDRG
Port G direction register
R/W
00000000B
002CH
PUL0
Port 0 pull-up register
R/W
00000000B
002DH
PUL1
Port 1 pull-up register
R/W
00000000B
002EH,
002FH
—
—
—
0030H
PUL4
Port 4 pull-up register
R/W
00000000B
0031H
PUL6
Port 6 pull-up register
R/W
00000000B
Port 7 pull-up register
R/W
00000000B
—
—
R/W
00000000B
0032H
PUL7
0033H,
0034H
—
0035H
PULG
(Disabled)
(Disabled)
Port G pull-up register
(Continued)
DS07–12632–2E
21
MB95390H Series
Address
Register
abbreviation
0036H
T01CR1
8/16-bit composite timer 01 status control register 1
R/W
00000000B
0037H
T00CR1
8/16-bit composite timer 00 status control register 1
R/W
00000000B
0038H
T11CR1
8/16-bit composite timer 11 status control register 1
R/W
00000000B
0039H
T10CR1
8/16-bit composite timer 10 status control register 1
R/W
00000000B
003AH
PC01
8/16-bit PPG timer 01 control register
R/W
00000000B
003BH
PC00
8/16-bit PPG timer 00 control register
R/W
00000000B
003CH
PC11
8/16-bit PPG timer 11 control register
R/W
00000000B
003DH
PC10
8/16-bit PPG timer 10 control register
R/W
00000000B
003EH
PC21
8/16-bit PPG timer 21 control register
R/W
00000000B
003FH
PC20
8/16-bit PPG timer 20 control register
R/W
00000000B
0040H
TMCSRH1
16-bit reload timer control status register upper
R/W
00000000B
0041H
TMCSRL1
16-bit reload timer control status register lower
R/W
00000000B
0042H,
0043H
—
—
—
0044H
PCNTH1
16-bit PPG status control register upper
R/W
00000000B
0045H
PCNTL1
16-bit PPG status control register lower
R/W
00000000B
0046H,
0047H
—
—
—
0048H
EIC00
External interrupt circuit control register ch. 0/ch. 1
R/W
00000000B
0049H
EIC10
External interrupt circuit control register ch. 2/ch. 3
R/W
00000000B
004AH
EIC20
External interrupt circuit control register ch. 4/ch. 5
R/W
00000000B
004BH
EIC30
External interrupt circuit control register ch. 6/ch. 7
R/W
00000000B
004CH
to
004FH
—
—
—
0050H
SCR
LIN-UART serial control register
R/W
00000000B
0051H
SMR
LIN-UART serial mode register
R/W
00000000B
0052H
SSR
LIN-UART serial status register
R/W
00001000B
0053H
RDR/TDR
LIN-UART receive/transmit data register
R/W
00000000B
0054H
ESCR
LIN-UART extended status control register
R/W
00000100B
0055H
ECCR
LIN-UART extended communication control register
R/W
000000XXB
0056H
SMC10
UART/SIO serial mode control register 1
R/W
00000000B
0057H
SMC20
UART/SIO serial mode control register 2
R/W
00100000B
0058H
SSR0
UART/SIO serial status and data register
R/W
00000001B
0059H
TDR0
UART/SIO serial output data register
R/W
00000000B
005AH
RDR0
UART/SIO serial input data register
R
00000000B
005BH
to
005FH
—
(Disabled)
—
—
Register name
(Disabled)
(Disabled)
(Disabled)
R/W Initial value
(Continued)
22
DS07–12632–2E
MB95390H Series
Address
Register
abbreviation
0060H
IBCR00
Register name
I2C bus control register 0
2
R/W Initial value
R/W
00000000B
0061H
IBCR10
I C bus control register 1
R/W
00000000B
0062H
IBCR0
I2C bus status register
R/W
00000000B
0063H
IDDR0
I2C data register
0064H
IAAR0
R/W
00000000B
2
R/W
00000000B
2
I C clock control register
R/W
00000000B
I C address register
0065H
ICCR0
0066H
OPCUR
Output control register (upper)
R/W
00000000B
0067H
OPCLR
Output control register (lower)
R/W
00000000B
0068H
IPCUR
Input control register (upper)
R/W
00000000B
0069H
IPCLR
Input control register (lower)
R/W
00000000B
006AH
NCCR
Noise cancellation control register
R/W
00000000B
006BH
TCSR
Timer control status register
R/W
00000000B
006CH
ADC1
8/10-bit A/D converter control register 1
R/W
00000000B
006DH
ADC2
8/10-bit A/D converter control register 2
R/W
00000000B
006EH
ADDH
8/10-bit A/D converter data register (upper)
R/W
00000000B
006FH
ADDL
8/10-bit A/D converter data register (lower)
R/W
00000000B
0070H
—
—
—
0071H
FSR2
Flash memory status register 2
R/W
00000000B
0072H
FSR
Flash memory status register
R/W
000X0000B
0073H
SWRE0
Flash memory sector write control register 0
R/W
00000000B
0074H
FSR3
R
00000000B
0075H
—
—
—
0076H
WREN
Wild register address compare enable register
R/W
00000000B
0077H
WROR
Wild register data test setting register
R/W
00000000B
0078H
—
—
—
0079H
ILR0
Interrupt level setting register 0
R/W
11111111B
007AH
ILR1
Interrupt level setting register 1
R/W
11111111B
007BH
ILR2
Interrupt level setting register 2
R/W
11111111B
007CH
ILR3
Interrupt level setting register 3
R/W
11111111B
007DH
ILR4
Interrupt level setting register 4
R/W
11111111B
007EH
ILR5
Interrupt level setting register 5
R/W
11111111B
007FH
—
—
—
0F80H
WRARH0
Wild register address setting register (upper) ch. 0
R/W
00000000B
0F81H
WRARL0
Wild register address setting register (lower) ch. 0
R/W
00000000B
0F82H
WRDR0
Wild register data setting register ch. 0
R/W
00000000B
(Disabled)
Flash memory status register 3
(Disabled)
Mirror of register bank pointer (RP) and
mirror of direct bank pointer (DP)
(Disabled)
(Continued)
DS07–12632–2E
23
MB95390H Series
Address
Register
abbreviation
0F83H
WRARH1
Wild register address setting register (upper) ch. 1
R/W
00000000B
0F84H
WRARL1
Wild register address setting register (lower) ch. 1
R/W
00000000B
0F85H
WRDR1
Wild register data setting register ch. 1
R/W
00000000B
0F86H
WRARH2
Wild register address setting register (upper) ch. 2
R/W
00000000B
0F87H
WRARL2
Wild register address setting register (lower) ch. 2
R/W
00000000B
0F88H
WRDR2
Wild register data setting register ch. 2
R/W
00000000B
0F89H
to
0F91H
—
—
—
0F92H
T01CR0
8/16-bit composite timer 01 status control register 0
R/W
00000000B
0F93H
T00CR0
8/16-bit composite timer 00 status control register 0
R/W
00000000B
0F94H
T01DR
8/16-bit composite timer 01 data register
R/W
00000000B
0F95H
T00DR
8/16-bit composite timer 00 data register
R/W
00000000B
0F96H
TMCR0
8/16-bit composite timer 00/01 timer mode control register
R/W
00000000B
0F97H
T11CR0
8/16-bit composite timer 11 status control register 0
R/W
00000000B
0F98H
T10CR0
8/16-bit composite timer 10 status control register 0
R/W
00000000B
0F99H
T11DR
8/16-bit composite timer 11 data register
R/W
00000000B
0F9AH
T10DR
8/16-bit composite timer 10 data register
R/W
00000000B
0F9BH
TMCR1
8/16-bit composite timer 10/11 timer mode control register
R/W
00000000B
0F9CH
PPS01
8/16-bit PPG01 cycle setting buffer register
R/W
11111111B
0F9DH
PPS00
8/16-bit PPG00 cycle setting buffer register
R/W
11111111B
0F9EH
PDS01
8/16-bit PPG01 duty setting buffer register
R/W
11111111B
0F9FH
PDS00
8/16-bit PPG00 duty setting buffer register
R/W
11111111B
0FA0H
PPS11
8/16-bit PPG11 cycle setting buffer register
R/W
11111111B
0FA1H
PPS10
8/16-bit PPG10 cycle setting buffer register
R/W
11111111B
0FA2H
PDS11
8/16-bit PPG11 duty setting buffer register
R/W
11111111B
0FA3H
PDS10
8/16-bit PPG10 duty setting buffer register
R/W
11111111B
0FA4H
PPGS
8/16-bit PPG startup register
R/W
00000000B
0FA5H
REVC
8/16-bit PPG output reverse register
R/W
00000000B
0FA6H
PPS21
8/16-bit PPG21 cycle setting buffer register
R/W
11111111B
0FA7H
PPS20
8/16-bit PPG20 cycle setting buffer register
R/W
11111111B
TMRH1
16-bit reload timer timer register (upper)
TMRLRH1
16-bit reload timer reload register (upper)
R/W
00000000B
R/W
00000000B
0FA8H
0FA9H
Register name
(Disabled)
TMRL1
16-bit reload timer timer register (lower)
TMRLRL1
16-bit reload timer reload register (lower)
R/W Initial value
0FAAH
PDS21
8/16-bit PPG21 duty setting buffer register
R/W
11111111B
0FABH
PDS20
8/16-bit PPG20 duty setting buffer register
R/W
11111111B
(Continued)
24
DS07–12632–2E
MB95390H Series
Address
Register
abbreviation
Register name
0FACH
to
0FAFH
—
(Disabled)
0FB0H
PDCRH1
0FB1H
R/W Initial value
—
—
16-bit PPG down counter register (upper)
R
00000000B
PDCRL1
16-bit PPG down counter register (lower)
R
00000000B
0FB2H
PCSRH1
16-bit PPG cycle setting buffer register (upper)
R/W
11111111B
0FB3H
PCSRL1
16-bit PPG cycle setting buffer register (lower)
R/W
11111111B
0FB4H
PDUTH1
16-bit PPG duty setting buffer register (upper)
R/W
11111111B
0FB5H
PDUTL1
16-bit PPG duty setting buffer register (lower)
R/W
11111111B
0FB6H
to
0FBBH
—
—
—
0FBCH
BGR1
LIN-UART baud rate generator register 1
R/W
00000000B
0FBDH
BGR0
LIN-UART baud rate generator register 0
R/W
00000000B
0FBEH
PSSR0
UART/SIO prescaler select register
R/W
00000000B
0FBFH
BRSR0
UART/SIO baud rate setting register
R/W
00000000B
0FC0H,
0FC1H
—
—
—
0FC2H
AIDRH
A/D input disable register (upper)
R/W
00000000B
0FC3H
AIDRL
A/D input disable register (lower)
R/W
00000000B
0FC4H
OPDBRH0
Output data buffer register (upper) ch. 0
R/W
00000000B
0FC5H
OPDBRL0
Output data buffer register (lower) ch. 0
R/W
00000000B
0FC6H
OPDBRH1
Output data buffer register (upper) ch. 1
R/W
00000000B
0FC7H
OPDBRL1
Output data buffer register (lower) ch. 1
R/W
00000000B
0FC8H
OPDBRH2
Output data buffer register (upper) ch. 2
R/W
00000000B
0FC9H
OPDBRL2
Output data buffer register (lower) ch. 2
R/W
00000000B
0FCAH
OPDBRH3
Output data buffer register (upper) ch. 3
R/W
00000000B
0FCBH
OPDBRL3
Output data buffer register (lower) ch. 3
R/W
00000000B
0FCCH
OPDBRH4
Output data buffer register (upper) ch. 4
R/W
00000000B
0FCDH
OPDBRL4
Output data buffer register (lower) ch. 4
R/W
00000000B
0FCEH
OPDBRH5
Output data buffer register (upper) ch. 5
R/W
00000000B
0FCFH
OPDBRL5
Output data buffer register (lower) ch. 5
R/W
00000000B
0FD0H
OPDBRH6
Output data buffer register (upper) ch. 6
R/W
00000000B
0FD1H
OPDBRL6
Output data buffer register (lower) ch. 6
R/W
00000000B
0FD2H
OPDBRH7
Output data buffer register (upper) ch. 7
R/W
00000000B
0FD3H
OPDBRL7
Output data buffer register (lower) ch. 7
R/W
00000000B
0FD4H
OPDBRH8
Output data buffer register (upper) ch. 8
R/W
00000000B
0FD5H
OPDBRL8
Output data buffer register (lower) ch. 8
R/W
00000000B
0FD6H
OPDBRH9
Output data buffer register (upper) ch. 9
R/W
00000000B
0FD7H
OPDBRL9
Output data buffer register (lower) ch. 9
R/W
00000000B
0FD8H
OPDBRHA
Output data buffer register (upper) ch. A
R/W
00000000B
0FD9H
OPDBRLA
Output data buffer register (lower) ch. A
R/W
00000000B
(Disabled)
(Disabled)
(Continued)
DS07–12632–2E
25
MB95390H Series
(Continued)
Address
Register
abbreviation
Register name
R/W Initial value
0FDAH
OPDBRHB
Output data buffer register (upper) ch. B
R/W
00000000B
0FDBH
OPDBRLB
Output data buffer register (lower) ch. B
R/W
00000000B
0FDCH
OPDUR
Output data register (upper)
R
0000XXXXB
0FDDH
OPDLR
Output data register (lower)
R
XXXXXXXXB
0FDEH
CPCUR
Compare clear register (upper)
R/W XXXXXXXXB
0FDFH
CPCLR
Compare clear register (lower)
R/W XXXXXXXXB
0FE0H,
0FE1H
—
0FE2H
TMBUR
Timer buffer register (upper)
0FE3H
TMBLR
Timer buffer register (lower)
0FE4H
CRTH
Main CR clock trimming register (upper)
R/W 0XXXXXXXB
0FE5H
CRTL
Main CR clock trimming register (lower)
R/W 00XXXXXXB
0FE6H,
0FE7H
—
0FE8H
SYSC
0FE9H
(Disabled)
(Disabled)
—
—
R
XXXXXXXXB
R
XXXXXXXXB
—
—
System configuration register
R/W
11000011B
CMCR
Clock monitoring control register
R/W
00000000B
0FEAH
CMDR
Clock monitoring data register
R
00000000B
0FEBH
WDTH
Watchdog timer selection ID register (upper)
R
XXXXXXXXB
0FECH
WDTL
Watchdog timer selection ID register (lower)
0FEDH
—
0FEEH
ILSR
0FEFH
WICR
0FF0H
to
0FFFH
—
R
XXXXXXXXB
—
—
Input level select register
R/W
00000000B
Interrupt pin control register
R/W
01000000B
—
—
(Disabled)
(Disabled)
• R/W access symbols
R/W : Readable / Writable
R
: Read only
W
: Write only
• Initial value symbols
0
: The initial value of this bit is “0”.
1
: The initial value of this bit is “1”.
X
: The initial value of this bit is indeterminate.
Note: Do not write to an address that is “(Disabled)”. If a “(Disabled)” address is read, an indeterminate value
is returned.
26
DS07–12632–2E
MB95390H Series
■ INTERRUPT SOURCE TABLE
Vector table address
Priority order of
interrupt
Bit name of
sources of the
interrupt level
same level
setting register
(occurring
simultaneously)
Interrupt
request
number
Upper
Lower
External interrupt ch. 0, ch. 4
IRQ00
FFFAH
FFFBH
L00 [1:0]
External interrupt ch. 1, ch. 5
IRQ01
FFF8H
FFF9H
L01 [1:0]
External interrupt ch. 2, ch. 6
IRQ02
FFF6H
FFF7H
L02 [1:0]
External interrupt ch. 3, ch. 7
IRQ03
FFF4H
FFF5H
L03 [1:0]
UART/SIO ch. 0, MPG (DTTI)
IRQ04
FFF2H
FFF3H
L04 [1:0]
8/16-bit composite timer ch. 0
(lower)
IRQ05
FFF0H
FFF1H
L05 [1:0]
8/16-bit composite timer ch. 0
(upper)
IRQ06
FFEEH
FFEFH
L06 [1:0]
LIN-UART (reception)
IRQ07
FFECH
FFEDH
L07 [1:0]
LIN-UART (transmission)
IRQ08
FFEAH
FFEBH
L08 [1:0]
8/16-bit PPG ch. 1 (lower)
IRQ09
FFE8H
FFE9H
L09 [1:0]
8/16-bit PPG ch. 1 (upper)
IRQ10
FFE6H
FFE7H
L10 [1:0]
8/16-bit PPG ch. 2 (upper)
IRQ11
FFE4H
FFE5H
L11 [1:0]
8/16-bit PPG ch. 0 (upper)
IRQ12
FFE2H
FFE3H
L12 [1:0]
8/16-bit PPG ch. 0 (lower)
IRQ13
FFE0H
FFE1H
L13 [1:0]
8/16-bit composite timer ch. 1
(upper)
IRQ14
FFDEH
FFDFH
L14 [1:0]
8/16-bit PPG ch. 2 (lower)
IRQ15
FFDCH
FFDDH
L15 [1:0]
16-bit reload timer ch. 1, MPG
(write timing/compare clear),
I2C
IRQ16
FFDAH
FFDBH
L16 [1:0]
16-bit PPG timer ch. 1, MPG
(position detection/compare
match)
IRQ17
FFD8H
FFD9H
L17 [1:0]
8/10-bit A/D converter
IRQ18
FFD6H
FFD7H
L18 [1:0]
Time-base timer
IRQ19
FFD4H
FFD5H
L19 [1:0]
Watch prescaler
IRQ20
FFD2H
FFD3H
L20 [1:0]
IRQ21
FFD0H
FFD1H
L21 [1:0]
8/16-bit composite timer ch. 1
(lower)
IRQ22
FFCEH
FFCFH
L22 [1:0]
Flash memory
IRQ23
FFCCH
FFCDH
L23 [1:0]
Interrupt source
—
DS07–12632–2E
High
Low
27
MB95390H Series
■ ELECTRICAL CHARACTERISTICS
1. Absolute Maximum Ratings
Parameter
Symbol
Power supply voltage*1
Input voltage*1
Output voltage*
1
Maximum clamp current
Total maximum clamp
current
“L” level maximum
output current
Rating
VCC
VSS − 0.3
VSS + 6
V
VI
VSS − 0.3
VSS + 6
V
*2
VO
VSS − 0.3
VSS + 6
V
*2
ICLAMP
−2
+2
mA
Applicable to specific pins*3
Σ|ICLAMP|
—
20
mA
Applicable to specific pins*3
IOL1
—
15
IOL2
—
15
—
“H” level maximum
output current
mA
4
“L” level average current
“L” level total average
output current
mA
Other than P62 to P67
Average output current =
operating current × operating ratio
(1 pin)
P62 to P67
Average output current =
operating current × operating ratio
(1 pin)
12
ΣIOL
—
100
mA
ΣIOLAV
—
50
mA
IOH1
—
−15
IOH2
—
−15
P12, P62 to P67, P72, P73 and PF2
−4
Other than P12, P62 to P67, P72,
P73 and PF2
Average output current =
operating current × operating ratio
(1 pin)
—
mA
mA
Total average output current =
operating current × operating ratio
(Total number of pins)
Other than P12, P62 to P67, P72,
P73 and PF2
P12, P62 to P67, P72, P73 and PF2
Average output current =
operating current × operating ratio
(1 pin)
IOHAV2
—
−8
ΣIOH
—
−100
mA
ΣIOHAV
—
−50
mA
Power consumption
Pd
—
320
mW
Operating temperature
TA
−40
+85
°C
Tstg
−55
+150
°C
Storage temperature
P62 to P67
—
“H” level average
current
“H” level total average
output current
Other than P62 to P67
IOLAV2
IOHAV1
“H” level total maximum
output current
Remarks
Max
IOLAV1
“L” level total maximum
output current
Unit
Min
Total average output current =
operating current × operating ratio
(Total number of pins)
(Continued)
28
DS07–12632–2E
MB95390H Series
(Continued)
*1: The parameter is based on VSS = 0.0 V.
*2: VI and VO must not exceed VCC + 0.3 V. VI must not exceed the rated voltage. However, if the maximum
current to/from an input is limited by means of an external component, the ICLAMP rating is used instead of
the VI rating.
*3: Applicable to the following pins: P00 to P07, P10, P11, P13 to P17, P40 to P47, P60 to P67, P70, P71,
P74 to P77, PF0, PF1, PG1 and PG2
• Use under recommended operating conditions.
• Use with DC voltage (current).
• The HV (High Voltage) signal is an input signal exceeding the VCC voltage. Always connect a limiting resistor
between the HV (High Voltage) signal and the microcontroller before applying the HV (High Voltage) signal.
• The value of the limiting resistor should be set to a value at which the current to be input to the microcontroller
pin when the HV (High Voltage) signal is input is below the standard value, irrespective of whether the
current is transient current or stationary current.
• When the microcontroller drive current is low, such as in low power consumption modes, the HV (High
Voltage) input potential may pass through the protective diode to increase the potential of the VCC pin,
affecting other devices.
• If the HV (High Voltage) signal is input when the microcontroller power supply is off (not fixed at 0 V), since
power is supplied from the pins, incomplete operations may be executed.
• If the HV (High Voltage) input is input after power-on, since power is supplied from the pins, the voltage
of power supply may not be sufficient to enable a power-on reset.
• Do not leave the HV (High Voltage) input pin unconnected.
• Example of a recommended circuit
• Input/Output equivalent circuit
Protective diode
VCC
HV(High Voltage) input (0 V to 16 V)
P-ch
Limiting
resistor
N-ch
R
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
DS07–12632–2E
29
MB95390H Series
2. Recommended Operating Conditions
(VSS = 0.0 V)
Parameter
Symbol
Power supply
voltage
VCC
Smoothing
capacitor
CS
Operating
temperature
TA
Value
Min
Max
2.4*1*2
5.5*1
2.3
5.5
2.9
5.5
2.3
5.5
0.022
1
−40
+85
+5
+35
Unit
Remarks
In normal operation
V
Other than on-chip debug
Hold condition in stop mode mode
In normal operation
Hold condition in stop mode
On-chip debug mode
µF *3
°C
Other than on-chip debug mode
On-chip debug mode
*1: The value varies depending on the operating frequency, the machine clock and the analog guaranteed range.
*2: This value becomes 2.88 V when the low-voltage detection reset is used.
*3: Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. The bypass capacitor for
the VCC pin must have a capacitance larger than CS. For the connection to a smoothing capacitor CS, see
the diagram below. To prevent the device from unintentionally entering an unknown mode due to noise,
minimize the distance between the C pin and CS and the distance between CS and the VSS pin when designing
the layout of a printed circuit board.
• DBG / RST / C pins connection diagram
*
DBG
C
RST
Cs
*: Since the DBG pin becomes a communication pin in on-chip debug mode,
set a pull-up resistor value suiting the input/output specifications of P12/DBG.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of
the semiconductor device. All of the device's electrical characteristics are warranted when the
device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented
on the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
30
DS07–12632–2E
MB95390H Series
3. DC Characteristics
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter Symbol
"H" level
input voltage
“L” level
input voltage
Open-drain
output
application
voltage
“H” level
output
voltage
“L” level
output
voltage
Pin name
Condition
VIHI
P47, P72, P73,
P77
Unit
Remarks
VCC + 0.3
V
When CMOS input
level (hysteresis
input) is selected
—
VCC + 0.3
V
Hysteresis input
0.7 VCC
—
VCC + 0.3
V
Hysteresis input
*1
VSS − 0.3
—
0.3 VCC
V
When CMOS input
level (hysteresis
input) is selected
VILS
P00 to P07,
P10 to P17,
P40 to P47,
P60 to P67,
P70 to P77,
PF0, PF1, PG1,
PG2
*1
VSS − 0.3
—
0.2 VCC
V
Hysteresis input
VILM
PF2
—
VSS − 0.3
—
0.3 VCC
V
Hysteresis input
VD
P12, P72, P73,
PF2
—
VSS − 0.3
—
VSS + 5.5
V
VOH1
Output pins
other than P12,
IOH = −4 mA
P62 to P67,
P72, P73, PF2
VCC − 0.5
—
—
V
VOH2
P62 to P67
IOH = −8 mA
VCC − 0.5
—
—
V
VOL1
Output pins
other than
P62 to P67
IOL = 4 mA
—
—
0.4
V
VOL2
P62 to P67
IOL = 12 mA
—
—
0.4
V
ILI
All input pins
0.0 V < VI < VCC
−5
—
+5
When pull-up
µA resistance is
disabled
RPULL
P00 to P07,
P10, P11,
P13 to P17,
P40 to P47,
P60, P61,
P70, P71,
P74 to P76,
PG1, PG2
VI = 0 V
25
50
100
When pull-up
kΩ resistance is
enabled
Min
Typ*3
Max
*1
0.7 VCC
—
VIHS
P00 to P07,
P10 to P17,
P40 to P47,
P60 to P67,
P70 to P77,
PF0, PF1, PG1,
PG2
*1
0.8 VCC
VIHM
PF2
—
VIL
P47, P72, P73,
P77
Input leak
current (Hi-Z
output leak
current)
Pull-up
resistance
Value
(Continued)
DS07–12632–2E
31
MB95390H Series
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter Symbol
Input
capacitance
Pin name
Condition
Value
Unit
Remarks
Min
Typ*3
Max
—
5
15
pF
—
14.8
17
Except during Flash
mA memory writing and
erasing
—
33.5
39.5
During Flash
mA memory writing and
erasing
—
16.6
21
mA At A/D conversion
—
7
9
mA
ICCL
VCC = 5.5 V
VCC
(External clock FCL = 32 kHz
FMPL = 16 kHz
operation)
Subclock mode
(divided by 2)
TA = +25°C
—
60
153
µA
ICCLS
VCC = 5.5 V
FCL = 32 kHz
FMPL = 16 kHz
Subsleep mode
(divided by 2)
TA = +25°C
—
9.4
84
µA
ICCT
VCC = 5.5 V
FCL = 32 kHz
Watch mode
Main stop mode
TA = +25°C
—
4.3
30
µA
ICCMCR
VCC = 5.5 V
FCRH = 12.5 MHz
FMP = 12.5 MHz
Main CR clock
mode
—
11.8
13.2
mA
VCC = 5.5 V
Sub-CR clock
mode
(divided by 2)
TA = +25°C
—
113
410
µA
CIN
Other than VCC
f = 1 MHz
and VSS
VCC = 5.5 V
FCH = 32 MHz
FMP = 16 MHz
Main clock
mode
(divided by 2)
ICC
VCC = 5.5 V
FCH = 32 MHz
FMP = 16 MHz
Main sleep
mode
(divided by 2)
ICCS
Power
supply
current*2
VCC
ICCSCR
(Continued)
32
DS07–12632–2E
MB95390H Series
(Continued)
Parameter
Symbol
ICCTS
Pin name
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Value
Condition
Unit
Remarks
Min Typ*3 Max
VCC = 5.5 V
FCH = 32 MHz
Time-base timer
VCC
mode
(External clock TA = +25°C
operation)
VCC = 5.5 V
Substop mode
TA = +25°C
—
0.9
3
mA
—
3.4
22.5
µA
ILVD
Current
consumption for
low-voltage
detection circuit only
—
31
54
µA
ICRH
Current
consumption for the
main CR oscillator
—
0.5
0.6
mA
Current
consumption for the
sub-CR oscillator
oscillating at 100
kHz
—
20
72
µA
ICCH
Power supply
current*2
VCC
ICRL
*1: The input levels of P47, P72, P73 and P77 can be switched between “CMOS input level” and “hysteresis
input level”. The input level selection register (ILSR) is used to switch between the two input levels.
*2: • The power supply current is determined by the external clock. When the low-voltage detection option is
selected, the power-supply current will be the sum of adding the current consumption of the low-voltage
detection circuit (ILVD) to one of the value from ICC to ICCH. In addition, when both the low-voltage detection
option and the CR oscillator are selected, the power supply current will be the sum of adding up the current
consumption of the low-voltage detection circuit, the current consumption of the CR oscillators (ICRH, ICRL)
and a specified value. In on-chip debug mode, the CR oscillator (ICRH) and the low-voltage detection circuit
are always enabled, and current consumption therefore increases accordingly.
• See "4. AC Characteristics: (1) Clock Timing" for FCH and FCL.
• See "4. AC Characteristics: (2) Source Clock/Machine Clock" for FMP and FMPL.
*3: VCC = 5.0 V, TA = 25°C
DS07–12632–2E
33
MB95390H Series
4. AC Characteristics
(1) Clock Timing
(VCC = 2.4 V to 5.5 V, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol Pin name Condition
X0, X1
FCH
X0
X1: open
X0, X1
Clock
frequency
FCRH
FCL
—
X0A, X1A
Input clock
pulse width
Input clock rise
time and fall
time
CR oscillation
start time
tHCYL
*1
—
Max
Unit
Remarks
Min
Typ
1
—
1
—
12
1
—
32.5
12.25
12.5
9.80
10
7.84
8
10.20 MHz When the main CR clock is
*2
8.16 MHz used
0.98
1
1.02
12.18
12.5
9.75
10
7.80
8
10.25 MHz When the main CR clock is
*3
8.20 MHz used
0.97
1
1.03
MHz
—
32.768
—
kHz
When the sub-oscillation
circuit is used
—
32.768
—
kHz
When the sub-external
clock is used
16.25 MHz
When the main oscillation
circuit is used
MHz When the main external
MHz clock is used
12.75 MHz
MHz
12.82 MHz
—
—
—
50
100
200
kHz
When the sub-CR clock is
used
X0, X1
—
61.5
—
1000
ns
When the main oscillation
circuit is used
83.4
—
1000
ns
FCRL
Clock cycle
time
—
Value
X0
X1: open
X0, X1
*1
30.8
—
1000
ns
When the external clock is
used
tLCYL
X0A, X1A
—
—
30.5
—
µs
When the subclock is used
tWH1
tWL1
X0
33.4
—
—
ns
tWH2
tWL2
tCR
tCF
X1: open
X0, X1
*1
12.4
—
—
ns
X0A
—
—
15.2
—
µs
—
—
5
ns
X0
X1: open
When the external clock is
used, the duty ratio should
range between 40% and
60%.
When the external clock is
used
X0, X1
*1
—
—
5
ns
tCRHWK
—
—
—
—
80
µs
When the main CR clock is
used
tCRLWK
—
—
—
—
10
µs
When the sub-CR clock is
used
*1: The external clock signal is input to X0 and the inverted external clock signal to X1.
*2: These specifications are only applicable to a product in LQFP package (FPT-48P-M49 or FPT-52P-M02).
*3: These specifications are only applicable to a product in QFN package (LCC-48P-M11).
34
DS07–12632–2E
MB95390H Series
• Input waveform generated when an external clock (main clock) is used
tHCYL
tWH1
tWL1
tCR
tCF
0.8 VCC 0.8 VCC
X0, X1
0.2 VCC
0.2 VCC
0.2 VCC
• Figure of main clock input port external connection
When a crystal oscillator or
a ceramic oscillator is used
X0
When the external clock is used When the external clock
(X1 is open)
is used
X0
X1
X1
X0
X1
Open
FCH
FCH
FCH
• Input waveform generated when an external clock (subclock) is used
tLCYL
tWH2
tCR
tWL2
tCF
0.8 VCC 0.8 VCC
X0A
0.2 VCC
0.2 VCC
0.2 VCC
• Figure of subclock input port external connection
When a crystal oscillator or
a ceramic oscillator is used
X0A
X1A
FCL
When the external clock
is used
X0A
X1A
Open
FCL
DS07–12632–2E
35
MB95390H Series
(2) Source Clock/Machine Clock
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Source clock
cycle time*1
Symbol
tSCLK
Pin
name
—
FSP
Source clock
frequency
—
FSPL
Machine clock
cycle time*2
(minimum
instruction
execution
time)
tMCLK
—
FMPL
Unit
Remarks
Min
Typ
Max
61.5
—
2000
ns
When the main external clock is used
Min: FCH = 32.5 MHz, divided by 2
Max: FCH = 1 MHz, divided by 2
80
—
1000
ns
When the main CR clock is used
Min: FCRH = 12.5 MHz
Max: FCRH = 1 MHz
—
61
—
µs
When the sub-oscillation clock is used
FCL = 32.768 kHz, divided by 2
—
20
—
µs
When the sub-CR clock is used
FCRL = 100 kHz, divided by 2
0.5
—
16.25
MHz When the main oscillation clock is used
1
—
12.5
MHz When the main CR clock is used
—
16.384
—
kHz When the sub-oscillation clock is used
—
50
—
kHz
61.5
—
32000
ns
When the main oscillation clock is used
Min: FSP = 16.25 MHz, no division
Max: FSP = 0.5 MHz, divided by 16
80
—
16000
ns
When the main CR clock is used
Min: FSP = 12.5 MHz
Max: FSP = 1 MHz, divided by 16
61
—
976.5
µs
When the sub-oscillation clock is used
Min: FSPL = 16.384 kHz, no division
Max: FSPL = 16.384 kHz, divided by 16
20
—
320
µs
When the sub-CR clock is used
Min: FSPL = 50 kHz, no division
Max: FSPL = 50 kHz, divided by 16
0.031
—
16.25
MHz When the main oscillation clock is used
0.0625
—
12.5
MHz When the main CR clock is used
1.024
—
16.384
3.125
—
50
—
FMP
Machine clock
frequency
Value
When the sub-CR clock is used
FCRL = 100 kHz, divided by 2
kHz When the sub-oscillation clock is used
kHz
When the sub-CR clock is used
FCRL = 100 kHz
*1: This is the clock before it is divided according to the division ratio set by the machine clock divide ratio select
bits (SYCC:DIV1, DIV0). This source clock is divided to become a machine clock according to the divide
ratio set by the machine clock divide ratio select bits (SYCC:DIV1, DIV0). In addition, a source clock can be
selected from the following.
• Main clock divided by 2
• Main CR clock
• Subclock divided by 2
• Sub-CR clock divided by 2
*2: This is the operating clock of the microcontroller. A machine clock can be selected from the following.
• Source clock (no division)
• Source clock divided by 4
• Source clock divided by 8
• Source clock divided by 16
36
DS07–12632–2E
MB95390H Series
• Schematic diagram of the clock generation block
Divided
by 2
FCH
(Main oscillation)
FCRH
(Main CR clock)
FCL
(Sub-oscillation)
FCRL
(Sub-CR clock)
SCLK
(Source clock)
Divided
by 2
Divided
by 2
Clock mode select bits
(SYCC2: RCS1, RCS0)
Division
circuit
× 1
× 1/4
× 1/8
×1/16
MCLK
(Machine clock)
Machine clock divide ratio select bits
(SYCC:DIV1, DIV0)
• Operating voltage - Operating frequency (When TA = −40°C to +85°C)
MB95390H (without the on-chip debug function)
5.5
Operating voltage (V)
5.0
A/D converter operation range
4.0
3.5
3.0
2.4
16 kHz
3 MHz
10 MHz
16.25 MHz
Source clock frequency (FSP/FSPL)
• Operating voltage - Operating frequency (When TA = −40°C to +85°C)
MB95390H (with the on-chip debug function)
5.5
Operating voltage (V)
5.0
A/D converter operation range
4.0
3.5
2.9
3.0
16 kHz
3 MHz
12.5 MHz
16.25 MHz
Source clock frequency (FSP)
DS07–12632–2E
37
MB95390H Series
(3) External Reset
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
RST “L” level
pulse width
Symbol
tRSTL
Value
Unit
Remarks
Min
Max
2 tMCLK*1
—
ns
In normal operation
Oscillation time of the
oscillator*2 + 100
—
µs
In stop mode, subclock mode,
subsleep mode, watch mode, and
power-on
100
—
µs
In time-base timer mode
*1: See “(2) Source Clock/Machine Clock” for tMCLK.
*2: The oscillation time of an oscillator is the time for it to reach 90% of its amplitude. The crystal oscillator has
an oscillation time of between several ms and tens of ms. The ceramic oscillator has an oscillation time of
between hundreds of µs and several ms. The external clock has an oscillation time of 0 ms. The CR oscillator
clock has an oscillation time of between several µs and several ms.
• In normal operation
tRSTL
RST
0.2 VCC
0.2 VCC
• In stop mode, subclock mode, subsleep mode, watch mode and power-on
tRSTL
RST
X0
0.2 VCC
0.2 VCC
90% of
amplitude
Internal
operating
clock
Oscillation
time of
oscillator
Internal reset
38
100 μs
Oscillation stabilization wait time
Execute instruction
DS07–12632–2E
MB95390H Series
(4) Power-on Reset
(VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol
Condition
Power supply rising time
tR
Power supply cutoff time
tOFF
tR
Value
Unit
Min
Max
—
—
50
ms
—
1
—
ms
Remarks
Wait time until power-on
tOFF
2.5 V
VCC
0.2 V
0.2 V
0.2 V
Note: A sudden change of power supply voltage may activate the power-on reset function. When changing the
power supply voltage during the operation, set the slope of rising to a value below within 30 mV/ms as
shown below.
VCC
2.3 V
Set the slope of rising to
a value below 30 mV/ms.
Hold condition in stop mode
VSS
DS07–12632–2E
39
MB95390H Series
(5) Peripheral Input Timing
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol
Peripheral input “H” pulse width
tILIH
Peripheral input “L” pulse width
tIHIL
Value
Pin name
INT00 to INT07, EC0, EC1,TI1,
TRG1
Unit
Min
Max
2 tMCLK*
—
ns
2 tMCLK*
—
ns
*: See “(2) Source Clock/Machine Clock” for tMCLK.
tILIH
INT00 to INT07,
EC0, EC1, TI1,
TRG1
40
0.8 VCC
tIHIL
0.8 VCC
0.2 VCC
0.2 VCC
DS07–12632–2E
MB95390H Series
(6) LIN-UART Timing
Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is disabled*2.
(ESCR register: SCES bit = 0, ECCR register: SCDE bit = 0)
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol Pin name
Value
Condition
Unit
Min
Max
5 tMCLK*3
—
ns
+95
ns
—
ns
—
ns
Serial clock cycle time
tSCYC
SCK
SCK ↓ → SOT delay time
tSLOVI
Valid SIN → SCK ↑
tIVSHI
SCK ↑ → valid SIN hold time
tSHIXI
SCK, SOT Internal clock
−95
operation output pin:
SCK, SIN CL = 80 pF + 1 TTL
tMCLK*3 + 190
SCK, SIN
0
Serial clock “L” pulse width
tSLSH
SCK
3t
* − tR
—
ns
Serial clock “H” pulse width
tSHSL
SCK
tMCLK*3 + 95
—
ns
SCK ↓ → SOT delay time
tSLOVE
SCK, SOT
—
2 tMCLK*3 + 95
ns
Valid SIN → SCK ↑
tIVSHE
SCK, SIN
190
—
ns
* + 95
—
ns
SCK ↑ → valid SIN hold time
tSHIXE
SCK, SIN
MCLK 3
External clock
operation output pin:
CL = 80 pF + 1 TTL
t
MCLK 3
SCK fall time
tF
SCK
—
10
ns
SCK rise time
tR
SCK
—
10
ns
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or
a falling edge of the serial clock.
*2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock.
*3: See “(2) Source Clock/Machine Clock” for tMCLK.
DS07–12632–2E
41
MB95390H Series
• Internal shift clock mode
tSCYC
2.4 V
SCK
0.8 V
0.8 V
tSLOVI
2.4 V
SOT
0.8 V
tIVSHI
tSHIXI
0.8 VCC 0.8 VCC
SIN
0.2 VCC 0.2 VCC
• External shift clock mode
tSLSH
tSHSL
0.8 VCC
0.8 VCC
0.8 VCC
SCK
0.2 VCC
tF
0.2 VCC
tR
tSLOVE
2.4 V
SOT
0.8 V
tIVSHE
tSHIXE
0.8 VCC 0.8 VCC
SIN
0.2 VCC 0.2 VCC
42
DS07–12632–2E
MB95390H Series
Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is disabled*2.
(ESCR register: SCES bit = 1, ECCR register: SCDE bit = 0)
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol Pin name
Value
Condition
Unit
Min
Max
5 tMCLK*3
—
ns
+95
ns
—
ns
—
ns
Serial clock cycle time
tSCYC
SCK
SCK ↑ → SOT delay time
tSHOVI
Valid SIN → SCK ↓
tIVSLI
SCK ↓ → valid SIN hold time
tSLIXI
SCK, SOT Internal clock
−95
operation output pin:
SCK, SIN CL = 80 pF + 1 TTL
tMCLK*3 + 190
SCK, SIN
0
Serial clock “H” pulse width
tSHSL
SCK
3t
* − tR
—
ns
Serial clock “L” pulse width
tSLSH
SCK
tMCLK*3 + 95
—
ns
SCK ↑ → SOT delay time
tSHOVE
SCK, SOT
—
2 tMCLK*3 + 95
ns
Valid SIN → SCK ↓
tIVSLE
SCK, SIN
190
—
ns
* + 95
—
ns
SCK ↓ → valid SIN hold time
tSLIXE
SCK, SIN
MCLK 3
External clock
operation output pin:
CL = 80 pF + 1 TTL
t
MCLK 3
SCK fall time
tF
SCK
—
10
ns
SCK rise time
tR
SCK
—
10
ns
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or
a falling edge of the serial clock.
*2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock.
*3: See “(2) Source Clock/Machine Clock” for tMCLK.
DS07–12632–2E
43
MB95390H Series
• Internal shift clock mode
tSCYC
2.4 V
2.4 V
SCK
0.8 V
tSHOVI
2.4 V
SOT
0.8 V
tIVSLI
tSLIXI
0.8 VCC 0.8 VCC
SIN
0.2 VCC 0.2 VCC
• External shift clock mode
tSHSL
0.8 VCC
tSLSH
0.8 VCC
SCK
0.2 VCC
tR
tF
0.2 VCC
0.2 VCC
tSHOVE
2.4 V
SOT
0.8 V
tIVSLE
tSLIXE
0.8 VCC 0.8 VCC
SIN
0.2 VCC 0.2 VCC
44
DS07–12632–2E
MB95390H Series
Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is enabled*2.
(ESCR register: SCES bit = 0, ECCR register: SCDE bit = 1)
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol Pin name
Serial clock cycle time
tSCYC
SCK
SCK ↑ → SOT delay time
tSHOVI
SCK, SOT
Valid SIN → SCK ↓
tIVSLI
SCK, SIN
SCK ↓ → valid SIN hold time
tSLIXI
SCK, SIN
SOT → SCK ↓ delay time
tSOVLI
SCK, SOT
Value
Condition
Unit
Min
Max
5 tMCLK*3
—
ns
+95
ns
—
ns
—
ns
4 tMCLK*3
ns
−95
Internal clock
operation output pin: tMCLK*3 + 190
CL = 80 pF + 1 TTL
0
—
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or
a falling edge of the serial clock.
*2: The serial clock delay function is a function that delays the output signal of the serial clock for half clock.
*3: See “(2) Source Clock/Machine Clock” for tMCLK.
tSCYC
2.4 V
SCK
0.8 V
SOT
2.4 V
2.4 V
0.8 V
0.8 V
tIVSLI
SIN
DS07–12632–2E
0.8 V
tSHOVI
tSOVLI
tSLIXI
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
45
MB95390H Series
Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is enabled*2.
(ESCR register: SCES bit = 1, ECCR register: SCDE bit = 1)
(VCC = 5.0 V±10%, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol Pin name
Value
Condition
Max
5 tMCLK*3
—
ns
+95
ns
—
ns
—
ns
Serial clock cycle time
tSCYC
SCK
SCK ↓ → SOT delay time
tSLOVI
Valid SIN → SCK ↑
tIVSHI
SCK ↑ → valid SIN hold time
tSHIXI
SCK, SOT Internal clock
−95
SCK, SIN operation output pin: tMCLK*3 + 190
CL = 80 pF + 1 TTL
SCK, SIN
0
SOT → SCK ↑ delay time
tSOVHI
Unit
Min
SCK, SOT
—
4t
MCLK 3
*
ns
*1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or
a falling edge of the serial clock.
*2: The serial clock delay function is a function that delays the output signal of the serial clock for half clock.
*3: See “(2) Source Clock/Machine Clock” for tMCLK.
tSCYC
2.4 V
SCK
2.4 V
0.8 V
tSOVHI
SOT
2.4 V
0.8 V
0.8 V
tIVSHI
SIN
46
tSLOVI
2.4 V
tSHIXI
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
DS07–12632–2E
MB95390H Series
(7) Low-voltage Detection
(VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Value
Symbol
Min
Typ
Max
Unit
Remarks
Release voltage
VDL+
2.52
2.7
2.88
V
At power supply rise
Detection voltage
VDL-
2.42
2.6
2.78
V
At power supply fall
Hysteresis width
VHYS
70
100
—
mV
Power supply start voltage
Voff
—
—
2.3
V
Power supply end voltage
Von
4.9
—
—
V
Power supply voltage
change time
(at power supply rise)
tr
3000
—
—
µs
Slope of power supply that the reset
release signal generates within the
rating (VDL+)
Power supply voltage
change time
(at power supply fall)
tf
300
—
—
µs
Slope of power supply that the reset
detection signal generates within the
rating (VDL-)
Reset release delay time
td1
—
—
300
µs
Reset detection delay time
td2
—
—
20
µs
VCC
Von
Voff
time
tf
tr
VDL+
VHYS
VDL-
Internal reset signal
time
td2
DS07–12632–2E
td1
47
MB95390H Series
(8) I2C Timing
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = −40°C to +85°C)
Value
Parameter
Standardmode
Fast-mode Unit
Min
Max
Min
Max
0
100
0
400
kHz
SCL, SDA
4.0
—
0.6
—
µs
Symbol Pin name Condition
SCL clock frequency
fSCL
(Repeated) START condition hold time
SDA ↓ → SCL ↓
tHD;STA
SCL
SCL clock “L” width
tLOW
SCL
4.7
—
1.3
—
µs
SCL clock “H” width
tHIGH
SCL
4.0
—
0.6
—
µs
4.7
—
0.6
—
µs
(Repeated) START condition setup
time
SCL ↑ → SDA ↓
tSU;STA
Data hold time
SCL ↓ → SDA ↓↑
tHD;DAT
SCL, SDA
0
3.45*2
0
0.9*3
µs
Data setup time
SDA ↓↑ → SCL ↑
tSU;DAT
SCL, SDA
0.25
—
0.1
—
µs
STOP condition setup time
SCL ↑ → SDA ↑
tSU;STO
SCL, SDA
4
—
0.6
—
µs
tBUF
SCL, SDA
4.7
—
1.3
—
µs
SCL, SDA
R = 1.7 kΩ,
C = 50 pF*1
Bus free time between STOP condition
and START condition
*1: R represents the pull-up resistor of the SCL and SDA lines, and C the load capacitor of the SCL and SDA lines.
*2: The maximum tHD;DAT in the Standard-mode is applicable only when the time during which the device is holding
the SCL signal at “L” (tLOW) does not extend.
*3: A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, provided that the condition
of tSU;DAT ≥ 250 ns is fulfilled.
tWAKEUP
SDA
tLOW
tHD;DAT
tHIGH
tHD;STA
tBUF
SCL
tHD;STA
tSU;DAT
fSCL
tSU;STA
tSU;STO
(Continued)
48
DS07–12632–2E
MB95390H Series
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Sym- Pin
Condition
bol name
Value*2
Min
Max
Unit
Remarks
SCL clock “L”
width
tLOW SCL
(2 + nm/2)tMCLK − 20
—
ns
Master mode
SCL clock “H”
width
tHIGH SCL
(nm/2)tMCLK − 20
(nm/2)tMCLK + 20
ns
Master mode
START
SCL,
condition hold tHD;STA
SDA
time
(−1 + nm/2)tMCLK − 20
(−1 + nm)tMCLK + 20
ns
Master mode
Maximum value
is applied when
m, n = 1, 8.
Otherwise, the
minimum value
is applied.
STOP
condition
setup time
tSU;STO
SCL,
SDA
(1 + nm/2)tMCLK − 20
(1 + nm/2)tMCLK + 20
ns
Master mode
START
condition
setup time
tSU;STA
SCL,
SDA
(1 + nm/2)tMCLK − 20
(1 + nm/2)tMCLK + 20
ns
Master mode
tBUF
SCL,
SDA
(2 nm + 4)tMCLK − 20
—
ns
tHD;DAT
SCL,
SDA
3 tMCLK − 20
—
ns
Master mode
ns
Master mode
When assuming
that “L” of SCL is
not extended,
the minimum
value is applied
to first bit of
continuous data.
Otherwise, the
maximum value
is applied.
ns
Minimum value
is applied to
interrupt at 9th
SCL↓. Maximum
value is applied
to the interrupt at
the 8th SCL↓.
Bus free time
between
STOP
condition and
START
condition
Data hold
time
Data setup
time
tSU;DAT
SCL,
SDA
Setup time
between
clearing inter- tSU;INT SCL
rupt and SCL
rising
R = 1.7 kΩ,
C = 50 pF*1
(−2 + nm/2)tMCLK − 20
(nm/2)tMCLK − 20
(−1 + nm/2)tMCLK + 20
(1 + nm/2)tMCLK + 20
(Continued)
DS07–12632–2E
49
MB95390H Series
(Continued)
Parameter
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = −40°C to +85°C)
Value*2
Sym- Pin
Unit
Remarks
Condition
bol name
Min
Max
SCL clock “L” width
tLOW
SCL
4 tMCLK − 20
—
ns
At reception
SCL clock “H” width
tHIGH
SCL
4 tMCLK − 20
—
ns
At reception
START condition
detection
tHD;STA
SCL,
SDA
2 tMCLK − 20
—
ns
Not detected when
1 tMCLK is used at
reception
STOP condition
detection
tSU;STO
SCL,
SDA
2 tMCLK − 20
—
ns
Not detected when
1 tMCLK is used at
reception
RESTART condition
SCL,
tSU;STA
detection condition
SDA
2 tMCLK − 20
—
ns
Not detected when
1 tMCLK is used at
reception
2 tMCLK − 20
—
ns
At reception
Bus free time
tBUF
SCL,
SDA
Data hold time
tHD;DAT
SCL,
SDA
2 tMCLK − 20
—
ns
At slave
transmission mode
Data setup time
tSU;DAT
SCL,
SDA
tLOW − 3 tMCLK − 20
—
ns
At slave
transmission mode
Data hold time
tHD;DAT
SCL,
SDA
0
—
ns
At reception
Data setup time
tSU;DAT
SCL,
SDA
tMCLK − 20
—
ns
At reception
Oscillation
stabilization wait
time
+2 tMCLK − 20
—
ns
SCL,
SDA↓ → SCL↑
tWAKEUP
SDA
(at wakeup function)
R = 1.7 kΩ,
C = 50 pF*1
*1: R represents the pull-up resistor of the SCL and SDA lines, and C the load capacitor of the SCL and SDA lines.
See “(2) Source Clock/Machine Clock” for tMCLK.
m represents the CS4 bit and CS3 bit (bit4 and bit3) in the I2C clock control register (ICCR0).
n represents the CS2 bit to CS0 bit (bit2 to bit0) in the I2C clock control register (ICCR0).
The actual timing of I2C is determined by the values of m and n set by the machine clock (tMCLK) and the
CS4 to CS0 bits in the ICCR0 register.
• Standard-mode:
m and n can be set to values in the following range: 0.9 MHz < tMCLK (machine clock) < 10 MHz.
The usable frequencies of the machine clock are determined by the settings of m and n as shown below.
(m, n) = (1, 8)
: 0.9 MHz < tMCLK ≤ 1 MHz
(m, n) = (1, 22), (5, 4), (6, 4), (7, 4), (8, 4)
: 0.9 MHz < tMCLK ≤ 2 MHz
(m, n) = (1, 38), (5, 8), (6, 8), (7, 8), (8, 8)
: 0.9 MHz < tMCLK ≤ 4 MHz
(m, n) = (1, 98)
: 0.9 MHz < tMCLK ≤ 10 MHz
• Fast-mode:
m and n can be set to values in the following range: 3.3 MHz < tMCLK (machine clock) < 10 MHz.
The usable frequencies of the machine clock are determined by the settings of m and n as shown below.
(m, n) = (1, 8)
: 3.3 MHz < tMCLK ≤ 4 MHz
(m, n) = (1, 22), (5, 4)
: 3.3 MHz < tMCLK ≤ 8 MHz
(m, n) = (6, 4)
: 3.3 MHz < tMCLK ≤ 10 MHz
*2: •
•
•
•
50
DS07–12632–2E
MB95390H Series
(9) UART/SIO, Serial I/O Timing
Parameter
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = −40°C to +85°C)
Value
Pin name
Condition
Unit
Min
Max
Symbol
Serial clock cycle time
tSCYC
UCK0
UCK ↓ → UO time
tSLOV
UCK0, UO0
Valid UI → UCK ↑
tIVSH
UCK0, UI0
UCK ↑ → valid UI hold time
tSHIX
Serial clock “H” pulse width
Serial clock “L” pulse width
4 tMCLK*
—
ns
−190
+190
ns
2 tMCLK*
—
ns
UCK, UI0
2 tMCLK*
—
ns
tSHSL
UCK0
4 tMCLK*
—
ns
tSLSH
UCK0
4 tMCLK*
—
ns
—
190
ns
Internal clock
operation
External clock
operation
UCK ↓ → UO time
tSLOV
UCK0, UO0
Valid UI → UCK ↑
tIVSH
UCK0, UI0
2 tMCLK*
—
ns
UCK ↑ → valid UI hold time
tSHIX
UCK0, UI0
2 tMCLK*
—
ns
*: See “(2) Source Clock/Machine Clock” for tMCLK.
• Internal shift clock mode
tSCYC
2.4 V
UCK0
0.8 V
0.8 V
tSLOV
2.4 V
UC0
0.8 V
tIVSH
tSHIX
0.8 VCC 0.8 VCC
UI0
0.2 VCC 0.2 VCC
• External shift clock mode
tSLSH
tSHSL
0.8 VCC
0.8 VCC
UCK0
0.2 VCC
0.2 VCC
tSLOV
2.4 V
UC0
0.8 V
tIVSH
tSHIX
0.8 VCC 0.8 VCC
UI0
0.2 VCC 0.2 VCC
DS07–12632–2E
51
MB95390H Series
(10) MPG Input Timing
Parameter
Symbol
Input pulse width
SNI0 to SNI2,
DTTI
tTIWH
tTIWL
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = −40°C to +85°C)
Value
Pin name
Condition
Unit Remarks
Min
Max
SNI0 to SNI2,
DTTI
0.8 VCC
4 tMCLK
—
ns
0.8 VCC
0.2 VCC
tTIWH
52
—
0.2 VCC
tTIWL
DS07–12632–2E
MB95390H Series
5. A/D Converter
(1) A/D Converter Electrical Characteristics
(VCC = 4.0 V to 5.5 V, VSS = 0.0 V, TA = −40°C to +85°C)
Parameter
Symbol
Resolution
Total error
Linearity error
—
Differential linear
error
Value
Unit
Min
Typ
Max
—
—
10
bit
−3
—
+3
LSB
−2.5
—
+2.5
LSB
−1.9
—
+1.9
LSB
Remarks
Zero transition
voltage
VOT
VSS − 1.5 LSB VSS + 0.5 LSB VSS + 2.5 LSB
V
Full-scale transition
voltage
VFST
VCC − 4.5 LSB
VCC − 2 LSB
VCC + 0.5 LSB
V
0.9
—
16500
µs
4.5 V ≤ VCC ≤ 5.5 V
1.8
—
16500
µs
4.0 V ≤ VCC < 4.5 V
0.6
—
∞
µs
4.5 V ≤ VCC ≤ 5.5 V,
with external
impedance < 5.4 kΩ
1.2
—
∞
µs
4.0 V ≤ VCC < 4.5 V,
with external
impedance < 2.4 kΩ
Compare time
Sampling time
—
—
Analog input current
IAIN
−0.3
—
+0.3
µA
Analog input voltage
VAIN
VSS
—
VCC
V
DS07–12632–2E
53
MB95390H Series
(2) Notes on Using the A/D Converter
• External impedance of analog input and its sampling time
• The A/D converter has a sample and hold circuit. If the external impedance is too high to keep sufficient
sampling time, the analog voltage charged to the capacitor of the internal sample and hold circuit is
insufficient, adversely affecting A/D conversion precision. Therefore, to satisfy the A/D conversion precision
standard, considering the relationship between the external impedance and minimum sampling time, either
adjust the register value and operating frequency or decrease the external impedance so that the sampling
time is longer than the minimum value. In addition, if sufficient sampling time cannot be secured, connect
a capacitor of about 0.1 µF to the analog input pin.
• Analog input equivalent circuit
Analog input
Comparator
R
C
During sampling: ON
VCC
R
C
4.5 V ≤ VCC ≤ 5.5 V
1.95 kΩ (Max)
17 pF (Max)
4.0 V ≤ VCC < 4.5 V
8.98 kΩ (Max)
17 pF (Max)
Note: The values are reference values.
• Relationship between external impedance and minimum sampling time
[External impedance = 0 kΩ to 20 kΩ]
[External impedance = 0 kΩ to 100 kΩ]
20
External impedance [kΩ]
External impedance [kΩ]
100
90
80
70
60
(VCC ≥ 4.5 V)
50
(VCC ≥ 4.0 V)
40
30
20
10
18
16
14
12
(VCC ≥ 4.5 V)
10
(VCC ≥ 4.0 V)
8
6
4
2
0
0
0
2
4
6
8
10
12
Minimum sampling time [μs]
14
0
1
2
3
4
Minimum sampling time [μs]
• A/D conversion error
As |VCC−VSS| decreases, the A/D conversion error increases proportionately.
54
DS07–12632–2E
MB95390H Series
(3) Definitions of A/D Converter Terms
• Resolution
It indicates the level of analog variation that can be distinguished by the A/D converter.
When the number of bits is 10, analog voltage can be divided into 210 = 1024.
• Linearity error (unit: LSB)
It indicates how much an actual conversion value deviates from the straight line connecting
the zero transition point (“00 0000 0000” ← → “00 0000 0001”) of a device to
the full-scale transition point (“11 1111 1111” ← → “11 1111 1110”) of the same device.
• Differential linear error (unit: LSB)
It indicates how much the input voltage required to change the output code by 1 LSB deviates from an
ideal value.
• Total error (unit: LSB)
It indicates the difference between an actual value and a theoretical value. The error can be caused by a
zero transition error, a full-scale transition errors, a linearity error, a quantum error, or noise.
Ideal I/O characteristics
Total error
VFST
3FFH
3FFH
2 LSB
3FDH
Digital output
Digital output
3FDH
004H
003H
Actual conversion
characteristic
3FEH
3FEH
VOT
{1 LSB × (N-1) + 0.5 LSB}
004H
VNT
003H
1 LSB
002H
002H
001H
Actual conversion
characteristic
Ideal characteristic
001H
0.5 LSB
VSS
Analog input
1 LSB =
VCC - VSS
(V)
1024
N
VCC
VSS
Analog input
VCC
VNT - {1 LSB × (N - 1) + 0.5 LSB}
Total error of
=
[LSB]
digital output N
1 LSB
: A/D converter digital output value
VNT : Voltage at which the digital output transits from (N - 1)H to NH
(Continued)
DS07–12632–2E
55
MB95390H Series
(Continued)
Zero transition error
Full-scale transition error
004H
Ideal characteristic
Actual conversion
characteristic
3FFH
Actual conversion
characteristic
002H
Digital output
Digital output
003H
Actual conversion
characteristic
Ideal
characteristic
3FEH
VFST
(measurement
value)
3FDH
Actual conversion
characteristic
001H
3FCH
VOT (measurement value)
VSS
Analog input
VCC
VSS
Linearity error
3FFH
3FEH
Ideal characteristic
(N+1)H
Actual conversion
characteristic
{1 LSB × N + VOT}
VFST
(measurement
value)
VNT
004H
Digital output
Digital output
3FDH
002H
VCC
Differential linearity error
Actual conversion
characteristic
V(N+1)T
NH
VNT
(N-1)H
Actual conversion
characteristic
003H
Analog input
Ideal
characteristic
Actual conversion
characteristic
(N-2)H
001H
VOT (measurement value)
VSS
Analog input
VCC
VNT - {1 LSB × N + VOT}
Linearity error
=
of digital output N
1 LSB
N
VSS
Analog input
VCC
V(N+1)T - VNT
Differential linear error
=
- 1
of digital output N
1 LSB
: A/D converter digital output value
VNT : Voltage at which the digital output transits from (N - 1)H to NH
VOT (ideal value) = VSS + 0.5 LSB [V]
VFST (ideal value) = VCC - 2 LSB [V]
56
DS07–12632–2E
MB95390H Series
6. Flash Memory Write/Erase Characteristics
Parameter
Value
Unit
Remarks
Min
Typ
Max
Sector erase time
(2 Kbyte sector)
—
0.2*1
0.5*2
s
The time of writing 00H prior to
erasure is excluded.
Sector erase time
(16 Kbyte sector)
—
0.5*1
7.5*2
s
The time of writing 00H prior to
erasure is excluded.
Byte writing time
—
21
6100*2
µs
System-level overhead is excluded.
Erase/write cycle
100000
—
—
cycle
Power supply voltage at erase/
write
3.0
—
5.5
V
Flash memory data retention
time
20*3
—
—
year Average TA = +85°C
*1: TA = +25°C, VCC = 5.0 V, 100000 cycles
*2: TA = +85°C, VCC = 3.0 V, 100000 cycles
*3: This value is converted from the result of a technology reliability assessment. (The value is converted from
the result of a high temperature accelerated test using the Arrhenius equation with the average temperature
being +85°C).
DS07–12632–2E
57
MB95390H Series
■ SAMPLE CHARACTERISTICS
• Power supply current temperature characteristics
ICC − VCC
TA = +25°C, FMP = 2, 4, 8, 10, 16 MHz (divided by 2)
Main clock mode with the external clock operating
ICC − TA
VCC = 5.5 V, FMP = 10, 16 MHz (divided by 2)
Main clock mode with the external clock operating
20
20
15
FMP = 16 MHz
10
FMP = 16 MHz
ICC[mA]
ICC[mA]
15
FMP = 10 MHz
10
FMP = 10 MHz
FMP = 8 MHz
5
5
FMP = 4 MHz
FMP = 2 MHz
0
−50
0
2
3
4
5
6
7
0
ICCS − VCC
TA = +25°C, FMP = 2, 4, 8, 10, 16 MHz (divided by 2)
Main sleep mode with the external clock operating
+150
8
7
7
FMP = 16 MHz
FMP = 16 MHz
6
6
5
ICCS[mA]
5
ICCS[mA]
+100
ICCS − TA
VCC = 5.5 V, FMP = 10, 16 MHz (divided by 2)
Main sleep mode with the external clock operating
8
FMP = 10 MHz
4
FMP = 8 MHz
FMP = 10 MHz
4
3
3
2
FMP = 4 MHz
1
FMP = 2 MHz
2
1
0
0
2
3
4
5
6
−50
7
0
+50
+100
+150
TA[°C]
VCC[V]
ICCL − VCC
TA = +25°C, FMPL = 16 kHz (divided by 2)
Subclock mode with the external clock operating
ICCL − TA
VCC = 5.5 V, FMPL = 16 kHz (divided by 2)
Subclock mode with the external clock operating
100
100
75
75
ICCL[μA]
ICCL[μA]
+50
TA[°C]
VCC[V]
50
25
50
25
0
2
3
4
5
VCC[V]
6
7
0
−50
0
+50
+100
+150
TA[°C]
(Continued)
58
DS07–12632–2E
MB95390H Series
ICCLS − VCC
TA = +25°C, FMPL = 16 kHz (divided by 2)
Subsleep mode with the external clock operating
ICCLS − TA
VCC = 5.5 V, FMPL = 16 kHz (divided by 2)
Subsleep mode with the external clock operating
14
16
12
14
12
10
10
ICCLS[μA]
ICCLS[μA]
8
6
8
6
4
4
2
2
0
0
2
3
4
5
6
−50
7
0
VCC[V]
ICCT − VCC
TA = +25°C, FMPL = 16 kHz (divided by 2)
Watch mode with the external clock operating
+100
+150
ICCT − TA
VCC = 5.5 V, FMPL = 16 kHz (divided by 2)
Watch mode with the external clock operating
50
50
40
40
30
30
ICCT[μA]
ICCT[μA]
+50
TA[°C]
20
20
10
10
0
0
2
3
4
5
6
−50
7
0
VCC[V]
+50
+100
+150
TA[°C]
ICTS − VCC
TA = +25°C, FMP = 2, 4, 8, 10, 16 MHz (divided by 2)
Time-base timer mode with the external clock
operating
ICTS − TA
VCC = 5.5 V, FMPL = 10, 16 kHz (divided by 2)
Time-base timer mode with the external clock
operating
1.5
1.5
1.0
ICTS[mA]
FMP = 16 MHz
FMP = 10 MHz
0.5
FMP = 16 MHz
ICTS[mA]
1.0
FMP = 10 MHz
0.5
FMP = 8 MHz
FMP = 4 MHz
FMP = 2 MHz
0.0
0.0
−50
2
3
4
5
6
7
0
+50
+100
+150
TA[°C]
VCC[V]
(Continued)
DS07–12632–2E
59
MB95390H Series
(Continued)
ICCH − TA
VCC = 5.5 V, FMPL = (stop)
Substop mode with the external clock stopping
4.5
9
4.0
8
3.5
7
3.0
6
ICCH[μA]
ICCH[μA]
ICCH − VCC
TA = +25°C, FMPL = (stop)
Substop mode with the external clock stopping
2.5
2.0
5
4
1.5
3
1.0
2
0.5
1
0.0
0
2
3
4
5
6
−50
7
0
VCC[V]
ICCMCR − VCC
TA = +25°C, FMP = 1, 8, 10, 12.5 MHz (no division)
Main clock mode with the main CR clock operating
20
20
15
15
FMP = 12.5 MHz
10
FMP = 10 MHz
FMP = 12.5 MHz
FMP = 10 MHz
FMP = 8 MHz
5
5
FMP = 1 MHz
FMP = 1 MHz
0
0
2
3
4
5
6
−50
7
0
VCC[V]
+50
+100
+150
TA[°C]
ICCSCR − VCC
TA = +25°C, FMPL = 50 kHz (divided by 2)
Subclock mode with the sub-CR clock operating
ICCSCR − TA
VCC = 5.5 V, FMPL = 50 kHz (divided by 2)
Subclock mode with the sub-CR clock operating
140
140
120
120
100
100
ICCSCR[μA]
ICCSCR[μA]
+150
10
FMP = 8 MHz
80
60
80
60
40
40
20
20
0
0
2
3
4
5
VCC[V]
60
+100
ICCMCR − TA
VCC = 5.5 V, FMP = 1, 8, 10, 12.5 MHz (no division)
Main clock mode with the main CR clock operating
ICCMCR[mA]
ICCMCR[mA]
+50
TA[°C]
6
7
−50
0
+50
+100
+150
TA[°C]
DS07–12632–2E
MB95390H Series
• Input voltage characteristics
VIHI − VCC and VILI − VCC
TA = +25°C
VIHS − VCC and VILS − VCC
TA = +25°C
4
4
3
3
VIHS
VIHS/VILS[V]
VIHI/VILI[V]
VIHI
VILI
2
2
1
VILS
1
0
0
2
3
4
5
6
2
3
VCC[V]
4
5
6
VCC[V]
VIHM − VCC and VILM − VCC
TA = +25°C
4
VIHM/VILM[V]
3
VIHM
2
VILM
1
0
2
3
4
5
6
VCC[V]
DS07–12632–2E
61
MB95390H Series
• Output voltage characteristics
(VCC − VOH2) − IOH
TA = +25°C
2.0
2.0
1.8
1.8
1.6
1.6
1.4
1.4
VCC − VOH2 [V]
VCC − VOH1 [V]
(VCC − VOH1) − IOH
TA = +25°C
1.2
1.0
0.8
1.2
1.0
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0
0
−2
−6
−4
−8
−10
0
−2
−6
−4
IOH [mA]
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
8
10
VOL2 − IOL
TA = +25°C
2.0
2.0
1.8
1.8
1.6
1.6
1.4
1.4
1.2
1.2
VOL2 [V]
VOL1 [V]
−10
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
VOL1 − IOL
TA = +25°C
1.0
1.0
0.8
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0
0
2
6
4
IOL [mA]
8
10
0
2
6
4
IOL [mA]
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
62
−8
IOH [mA]
VCC = 2.4 V
VCC = 2.7 V
VCC = 3.5 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
DS07–12632–2E
MB95390H Series
• Pull-up characteristics
RPULL − VCC
TA = +25°C
350
300
RPULL[kΩ]
250
200
150
100
50
0
1
2
3
4
5
6
7
VCC[V]
DS07–12632–2E
63
MB95390H Series
■ MASK OPTIONS
No.
Part Number
MB95F394H
MB95F396H
MB95F398H
Selectable/Fixed
MB95F394K
MB95F396K
MB95F398K
Fixed
1
Low-voltage detection reset Without low-voltage detection reset With low-voltage detection reset
2
Reset
64
With dedicated reset input
Without dedicated reset input
DS07–12632–2E
MB95390H Series
■ ORDERING INFORMATION
Part Number
Package
MB95F394HPMC-G-SNE2
MB95F394KPMC-G-SNE2
MB95F396HPMC-G-SNE2
MB95F396KPMC-G-SNE2
MB95F398HPMC-G-SNE2
MB95F398KPMC-G-SNE2
48-pin plastic LQFP
(FPT-48P-M49)
MB95F394HPMC1-G-SNE2
MB95F394KPMC1-G-SNE2
MB95F396HPMC1-G-SNE2
MB95F396KPMC1-G-SNE2
MB95F398HPMC1-G-SNE2
MB95F398KPMC1-G-SNE2
52-pin plastic LQFP
(FPT-52P-M02)
MB95F394HWQN-G-SNE1
MB95F394HWQN-G-SNERE1
MB95F394KWQN-G-SNE1
MB95F394KWQN-G-SNERE1
MB95F396HWQN-G-SNE1
MB95F396HWQN-G-SNERE1
MB95F396KWQN-G-SNE1
MB95F396KWQN-G-SNERE1
MB95F398HWQN-G-SNE1
MB95F398HWQN-G-SNERE1
MB95F398KWQN-G-SNE1
MB95F398KWQN-G-SNERE1
48-pin plastic QFN
(LCC-48P-M11)
DS07–12632–2E
65
MB95390H Series
■ PACKAGE DIMENSION
48-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
7.00 mm × 7.00 mm
Lead shape
Gullwing
Lead bend
direction
Normal bend
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.17 g
(FPT-48P-M49)
48-pin plastic LQFP
(FPT-48P-M49)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
9.00±0.20(.354±.008)SQ
*7.00±0.10(.276±.004)SQ
36
0.145±0.055
(.006±.002)
25
24
37
0.08(.003)
Details of "A" part
+0.20
1.50 –0.10
+.008
13
48
"A"
0°~8°
1
0.50(.020)
(Mounting height)
.059 –.004
INDEX
0.10±0.10
(.004±.004)
(Stand off)
12
0.22±0.05
(.008±.002)
0.08(.003)
0.25(.010)
M
0.60±0.15
(.024±.006)
C
2010 FUJITSU SEMICONDUCTOR LIMITED HMbF48-49Sc-1-2
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
66
DS07–12632–2E
MB95390H Series
52-pin plastic LQFP
Lead pitch
0.65 mm
Package width ×
package length
10.00 × 10.00 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.32 g
Code
(Reference)
P-LFQFP52-10× 10-0.65
(FPT-52P-M02)
52-pin plastic LQFP
(FPT-52P-M02)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
12.00±0.20(.472±.008)SQ
*10.00±0.10(.394±.004)SQ
39
0.145±0.055
(.006±.002)
27
Details of "A" part
40
26
+0.20
1.50 –0.10
+.008
(Mounting height)
.059 –.004
0.25(.010)
INDEX
0.10(.004)
52
0~8˚
14
"A"
0.50±0.20
(.020±.008)
1
13
0.65(.026)
+0.065
0.30 –0.035
.012
C
+.0026
–.0014
0.13(.005)
M
2010 FUJITSU SEMICONDUCTOR LIMITED F52002Sc-2-1
0.10±0.10
(.004±.004)
(Stand off)
0.60±0.15
(.024±.006)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
DS07–12632–2E
67
MB95390H Series
(Continued)
48-pin plastic QFN
Lead pitch
0.50 mm
Package width ×
package length
7.00 mm × 7.00 mm
Sealing method
Plastic mold
Mounting height
0.80 mm MAX
Weight
0.12 g
(LCC-48P-M11)
48-pin plastic QFN
(LCC-48P-M11)
7.00±0.10
(.276±.004)
4.40±0.15
(.173±.006)
7.00±0.10
(.276±.004)
4.40±0.15
(.173±.006)
INDEX AREA
+0.05
0.25 –0.07
+.002
(.010 –.003
)
0.50(.020)
0.50±0.05
(.020±.002)
1PIN CORNER
(C0.30(C.012))
(TYP)
0.75±0.05
(.030±.002)
0.02
(.001
C
+0.03
–0.02
+.001
–.001
(0.20(.008))
)
2009-2010 FUJITSU SEMICONDUCTOR LIMITED C48064S-c-1-2
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
68
DS07–12632–2E
MB95390H Series
■ MAJOR CHANGES IN THIS EDITION
Page
1
Section
■ FEATURES
Details
Changed the main CR clock oscillation accuracy.
±2% → ±2% or ±2.5%
Added a remark about the main CR clock accuracy.
4
■ PRODUCT LINE-UP
Added FPT-52P-M02.
5
■ PACKAGES AND
CORRESPONDING PRODUCTS
Added FPT-52P-M02.
6
■ DIFFERENCES AMONG
PRODUCTS AND NOTES ON
PRODUCT SELECTION
Added a reference for the connection method in “• Onchip debug function”.
8
■ PIN ASSIGNMENT
Added the pin assignment diagram of FPT-52P-M02.
10 to 13 ■ PIN FUNCTIONS
34
■ ELECTRICAL CHARACTERISTICS
4. AC Characteristics
(1) Clock Timing
Added the pin numbers of FPT-52P-M02.
Changed the values of clock frequency (FCRH).
Added conditions related to the LQFP package and the
QFN package for the values of clock frequency (FCRH).
Added footnotes *2 and *3.
58 to 63 ■ SAMPLE CHARACTERISTICS
Added “■ SAMPLE CHARACTERISTICS”.
65
■ ORDERING INFORMATION
Added the part numbers of FPT-52P-M02.
67
■ PACKAGE DIMENSION
Added the package diagram of FPT-52P-M02.
The vertical lines marked on the left side of the page indicate the changes.
DS07–12632–2E
69
MB95390H Series
MEMO
70
DS07–12632–2E
MB95390H Series
MEMO
DS07–12632–2E
71
MB95390H Series
FUJITSU SEMICONDUCTOR LIMITED
Nomura Fudosan Shin-yokohama Bldg. 10-23, Shin-yokohama 2-Chome,
Kohoku-ku Yokohama Kanagawa 222-0033, Japan
Tel: +81-45-415-5858
http://jp.fujitsu.com/fsl/en/
For further information please contact:
North and South America
FUJITSU SEMICONDUCTOR AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
http://us.fujitsu.com/micro/
Asia Pacific
FUJITSU SEMICONDUCTOR ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://www.fujitsu.com/sg/services/micro/semiconductor/
Europe
FUJITSU SEMICONDUCTOR EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/semiconductor/
FUJITSU SEMICONDUCTOR SHANGHAI CO., LTD.
Rm. 3102, Bund Center, No.222 Yan An Road (E),
Shanghai 200002, China
Tel : +86-21-6146-3688 Fax : +86-21-6335-1605
http://cn.fujitsu.com/fss/
Korea
FUJITSU SEMICONDUCTOR KOREA LTD.
206 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fmk/
FUJITSU SEMICONDUCTOR PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road,
Tsimshatsui, Kowloon, Hong Kong
Tel : +852-2377-0226 Fax : +852-2376-3269
http://cn.fujitsu.com/fsp/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU SEMICONDUCTOR does
not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating
the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR or any
third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right
by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or
other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect
to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in
nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in
weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of overcurrent levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations
of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Sales Promotion Department