HTSEMI ES1A

ES1A THRU ES1M
Features
•
•
•
•
•
For
Surface
Mount
Applications
1 Amp Super Fast
Recovery
Silicon Rectifier
50 to 1000 Volts
Extremely Low Thermal Resistance
Easy Pick And Place
High Temp Soldering: 250°C for 10 Seconds At Terminals
Superfast Recovery Times For High Efficiency
Maximum Ratings
•
•
•
Operating Temperature: -50°C to +150°C
Storage Temperature: -50°C to +150°C
Maximum Thermal Resistance; 15 °C/W Junction To Lead
Device
Maximum
Maximum Maximum
Catalog
Marking
Recurrent
RMS
DC
Number
Peak Reverse
Voltage
Blocking
Voltage
Voltage
ES1A
ES1A
50V
35V
50V
ES1B
ES1B
100V
70V
100V
ES1C
ES1C
150V
105V
150V
200V
140V
200V
ES1D
ES1D
ES1G
ES1G
400V
280V
400V
ES1J
ES1J
600V
420V
600V
ES1K
ES1K
800V
560V
800V
ES1M
1000V
700V
1000V
ES1M
DO-214AC
(SMAJ) (High Profile)
H
Cathode Band
J
A
E
ES1A-D
ES1G-K
ES1M
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Maximum Reverse
Recovery Time
ES1A-D
ES1G-K
ES1M
Typical Junction
Capacitance
IF(AV)
1.0A
D
G
TJ = 75°C
IFSM
30A
8.3ms, half sine
VF
.975V
1.35V
1.60V
IFM = 1.0A;
TJ = 25°C*
IR
5µA
100µA
TJ = 25°C
TJ = 100°C
Trr
50ns
60ns
100ns
CJ
45pF
IF=0.5A, IR=1.0A,
Irr=0.25A
Measured at
1.0MHz, VR=4.0V
B
F
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
C
DIMENSIONS
DIM
A
B
C
D
E
F
G
H
J
INCHES
MIN
.078
.067
.002
--.035
.065
.205
.160
.100
MM
MIN
1.98
1.70
.05
--.89
1.65
5.21
4.06
2.57
MAX
.116
.089
.008
.02
.055
.096
.224
.180
.112
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
1 JinYu
semiconductor
www.htsemi.com
Date:2011/05
NOTE
ES1A THRU ES1M
Figure 1
Typical Forward Characteristics
20
Figure 2
Forward Derating Curve
10
2.4
6
2.2
4
2.0
1.8
2
1.6
25°C
Amps
1.4
1
1.2
.6
Amps
.4
1.0
.8
.6
.2
.4
Single Phase, Half Wave
.2 60Hz Resistive or Inductive Load
.1
.06
0
.04
25
50
75
100
125
150
°C
Average Forward Rectified Current - Amperesversus
Ambient Temperature - °C
.02
.01
0
.2
.4
.6
.8
1.2
1.0
Volts
Instantaneous Forward Current - Amperesversus
Instantaneous Forward Voltage - Volts
Figure 3
Junction Capacitance
100
60
40
20
pF
TJ=25°C
10
6
4
2
1
.1
.2
.4
1
Volts
2
4
10
20
40
100
200
400
1000
Junction Capacitance - pFversus
Reverse Voltage - Volts
2
JinYu
semiconductor
www.htsemi.com
Date:2011/05
ES1A thru ES1M
Figure 4
Peak Forward Surge Current
30
Figure 5
New SMA Assembly
25
20
15
Amps
10
Round Lead
Process
5
0
1
2
4
6
8 10
20
40
60 80 100
Cycles
Peak Forward Surge Current - Amperesversus
Number Of Cycles At 60Hz - Cycles
Figure 6
Reverse Recovery Time Characteristic And Test Circuit Diagram
50Ω
10Ω
trr
+0.5A
0
Pulse
Generator
Note 2
25Vdc
1Ω
Oscilloscope
Note 1
-0.25
-1.0
1cm
Set Time Base for 20/100ns/cm
Notes:
1. Rise Time = 7ns max.
Input impedance = 1 megohm, 22pF
2. Rise Time = 10ns max.
Source impedance = 50 ohms
3. Resistors are non-inductive
3