ONSEMI MC74HC4851A

MC74HC4851A,
MC74HC4852A
Analog Multiplexers/
Demultiplexers with
Injection Current Effect
Control
http://onsemi.com
MARKING
DIAGRAMS
Automotive Customized
These devices are pin compatible to standard HC405x and
MC1405xB analog mux/demux devices, but feature injection current
effect control. This makes them especially suited for usage in
automotive applications where voltages in excess of normal logic
voltage are common.
The injection current effect control allows signals at disabled analog
input channels to exceed the supply voltage range without affecting
the signal of the enabled analog channel. This eliminates the need for
external diode/ resistor networks typically used to keep the analog
channel signals within the supply voltage range.
The devices utilize low power silicon gate CMOS technology. The
Channel Select and Enable inputs are compatible with standard CMOS
outputs.
Features
•
•
•
•
•
•
Injection Current Cross−Coupling Less than 1mV/mA (See Figure 9)
Pin Compatible to HC405X and MC1405XB Devices
Power Supply Range (VCC − GND) = 2.0 to 6.0 V
In Compliance With the Requirements of JEDEC Standard No. 7A
Chip Complexity: 154 FETs or 36 Equivalent Gates
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
16
PDIP−16
N SUFFIX
CASE 648
16
1
MC74HC485xAN
AWLYYWWG
1
16
SOIC−16
D SUFFIX
CASE 751B
16
1
HC485xAG
AWLYWW
1
16
SOIC−16 WIDE
DW SUFFIX
CASE 751G
16
1
HC4851A
AWLYWWG
1
16
16
1
TSSOP−16
DT SUFFIX
CASE 948F
HC48
5xA
ALYWG
G
1
x
= 1 or 2
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 9
1
Publication Order Number:
MC74HC4851A/D
MC74HC4851A, MC74HC4852A
FUNCTION TABLE − MC74HC4851A
Control Inputs
13
X0
14
X1
15
X2
ANALOG
12
MULTIPLEXER/
INPUTS/ X3
DEMULTIPLEXER
OUTPUTS X4 1
5
X5
2
X6
4
X7
11
A
CHANNEL
10
B
SELECT
9
INPUTS
C
6
ENABLE
PIN 16 = VCC
PIN 8 = GND
3
X
Select
B
A
Enable
C
L
L
L
L
L
L
L
L
H
L
L
L
L
H
H
H
H
X
L
L
H
H
L
L
H
H
X
COMMON
OUTPUT/
INPUT
ON Channels
X0
X1
X2
X3
X4
X5
X6
X7
NONE
L
H
L
H
L
H
L
H
X
VCC
X2
X1
X0
X3
A
B
C
16
15
14
13
12
11
10
9
6
7
Figure 1. MC74HC4851A Logic Diagram
Single−Pole, 8−Position Plus Common Off
1
2
3
4
5
X4
X6
X
X7
X5
Enable NC
8
GND
Figure 2. MC74HC4851A 16−Lead Pinout (Top View)
FUNCTION TABLE − MC74HC4852A
Control Inputs
12
ANALOG
INPUTS/OUTPUTS
CHANNEL‐SELECT
INPUTS
X0
14
X1
15
X2
11
X3
Y0
Y1
Y2
Y3
A
B
ENABLE
X SWITCH
13
X
COMMON
OUTPUTS/INPUTS
1
5
2
Y SWITCH
3
B
L
L
L
L
H
L
L
H
H
X
Select
A
ON Channels
L
H
L
H
X
Y0
Y1
Y2
Y3
X0
X1
X2
X3
NONE
X = Don’t Care
Y
4
10
9
Enable
PIN 16 = VCC
PIN 8 = GND
VCC
X2
X1
X
X0
X3
A
B
16
15
14
13
12
11
10
9
6
7
8
GND
6
Figure 3. MC74HC4852A Logic Diagram
Double−Pole, 4−Position Plus Common Off
1
2
3
4
5
Y0
Y2
Y
Y3
Y1
Enable NC
Figure 4. MC74HC4852A 16−Lead Pinout (Top View)
http://onsemi.com
2
MC74HC4851A, MC74HC4852A
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
Positive DC Supply Voltage
(Referenced to GND)
–0.5 to + 7.0
V
Vin
DC Input Voltage (Any Pin)
(Referenced to GND)
–0.5 to VCC + 0.5
V
$25
mA
750
500
450
mW
–65 to + 150
°C
I
Parameter
DC Current, Into or Out of Any Pin
PD
Power Dissipation in Still Air,
Plastic DIP†
SOIC Package†
TSSOP Package†
Tstg
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
°C
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating − Plastic DIP: – 10 mW/°C from 65° to 125°C
SOIC Package: – 7 mW/°C from 65° to 125°C
TSSOP Package: − 6.1 mW/°C from 65° to 125°C
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
Positive DC Supply Voltage
(Referenced to GND)
2.0
6.0
V
Vin
DC Input Voltage (Any Pin)
(Referenced to GND)
GND
VCC
V
VIO*
Static or Dynamic Voltage Across Switch
0.0
1.2
V
TA
Operating Temperature Range, All Package Types
– 55
+ 125
°C
tr, tf
Input Rise/Fall Time
(Channel Select or Enable Inputs)
0
0
0
1000
500
400
ns
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
*For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be
drawn; i.e., the current out of the switch may contain both VCC and switch input components. The
reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted
Symbol
Parameter
Condition
Guaranteed Limit
VCC
V
−55 to 25°C
≤85°C
≤125°C
Unit
VIH
Minimum High−Level Input Voltage,
Channel−Select or Enable Inputs
Ron = Per Spec
2.0
3.0
4.5
6.0
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
V
VIL
Maximum Low−Level Input Voltage,
Channel−Select or Enable Inputs
Ron = Per Spec
2.0
3.0
4.5
6.0
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
V
Iin
Maximum Input Leakage Current on Digital Pins
(Enable/A/B/C)
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
mA
ICC
Maximum Quiescent Supply Current
(per Package)
Vin(digital) = VCC or GND
Vin(analog) = GND
6.0
2
20
40
mA
http://onsemi.com
3
MC74HC4851A, MC74HC4852A
DC CHARACTERISTICS — Analog Section
Guaranteed Limit
Symbol
Ron
Parameter
Condition
VCC
−55 to 25°C
≤85°C
≤125°C
Unit
Maximum “ON” Resistance
Vin = VIL or VIH;VIS = VCC to
GND; IS ≤ 2.0 mA
2.0
3.0
4.5
6.0
1700
1100
550
400
1750
1200
650
500
1800
1300
750
600
W
Delta “ON” Resistance
Vin = VIL or VIH; VIS = VCC/2
IS ≤ 2.0 mA
2.0
3.0
4.5
6.0
300
160
80
60
400
200
100
80
500
240
120
100
W
Ioff
Maximum Off−Channel Leakage Current,
Any One Channel
Common Channel
Vin = VCC or GND
6.0
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
Ion
Maximum On−Channel Leakage
Vin = VCC or GND
Channel−to−Channel
6.0
±0.1
±0.1
±0.1
VCC
−55 to 25°C
≤85°C
≤125°C
Unit
Maximum Propagation Delay, Analog Input to Analog Output
2.0
3.0
4.5
6.0
160
80
40
30
180
90
45
35
200
100
50
40
ns
Maximum Propagation Delay, Enable or Channel−Select to Analog Output
2.0
3.0
4.5
6.0
260
160
80
78
280
180
90
80
300
200
100
80
ns
10
35
130
10
35
130
10
35
130
pF
DRon
mA
mA
AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Parameter
Symbol
tPHL,
tPLH
tPHL,
tPHZ,PZH
tPLH,
tPLZ,PZL
Cin
Maximum Input Capacitance
(All Switches Off)
(All Switches Off)
CPD
Power Dissipation Capacitance
Digital Pins
Any Single Analog Pin
Common Analog Pin
Typical
5.0
20
pF
INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = −55°C to +125°C)
Symbol
VDout
Parameter
Condition
Maximum Shift of Output Voltage of Enabled Analog Channel
Iin* ≤ 1 mA, RS ≤ 3,9 kW
Iin* ≤ 10 mA, RS ≤ 3,9 kW
Iin* ≤ 1 mA, RS ≤ 20 kW
Iin* ≤ 10 mA, RS ≤ 20 kW
* Iin = Total current injected into all disabled channels.
http://onsemi.com
4
Typ
Max
Unit
0.1
1.0
0.5
5.0
1.0
5.0
2.0
20
mV
MC74HC4851A, MC74HC4852A
1100
1000
R on , ON RESISTANCE (OHMS)
900
-55°C
800
+25°C
700
+125°C
600
500
400
300
200
R on , ON RESISTANCE (OHMS)
1100
1000
100
800
700
600
500
+25°C
300
+125°C
200
0.4
0.8
1.2
1.6
0
0.0
2.0
0.6
1.2
1.8
2.4
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 5. Typical On Resistance VCC = 2V
Figure 6. Typical On Resistance VCC = 3V
660
440
600
400
540
360
480
420
360
-55°C
300
+25°C
240
+125°C
180
-55°C
280
160
120
40
2.7
3.6
+125°C
200
80
1.8
+25°C
240
60
0.9
0
0.0
4.5
1.2
2.4
3.6
4.8
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND
Figure 7. Typical On Resistance VCC = 4.5V
Figure 8. Typical On Resistance VCC = 6V
http://onsemi.com
5
3.0
320
120
0
0.0
-55°C
400
100
R on , ON RESISTANCE (OHMS)
R on , ON RESISTANCE (OHMS)
0
0.0
900
6.0
MC74HC4851A, MC74HC4852A
External DC P.S.
VCC = 5 V
Vin2 / Iin2 meas. here.
Current Source
HP4155C
Smu #2
Vin1 = 4.9 V (Smu3)
Iin1 meas. Here
Vm1 connected here.
X7
RS
X0
4
16
13
3
X
Vout
Vm2 connected here.
6
NOTES: Rs = 3.9 KW or 20 KW.
NOTES: Vm1 & Vm2 are internal
NOTES:
HP4155C Voltmeters.
8
GND or VSS
Figure 9. Injection Current Coupling Specification
http://onsemi.com
6
MC74HC4851A, MC74HC4852A
5V
6V
5V
VCC
VCC
HC4051A
Sensor
Microcontroller
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
(8x Identical Circuitry)
Common Out
A/D - Input
Figure 10. Actual Technology
Requires 32 passive components and one extra 6V regulator
to suppress injection current into a standard HC4051 multiplexer
5V
VCC
VCC
HC4851A
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
Sensor
(8x Identical Circuitry)
Common Out
Microcontroller
A/D - Input
Figure 11. MC74HC4851A Solution
Solution by applying the HC4851A multiplexer
http://onsemi.com
7
MC74HC4851A, MC74HC4852A
PLOTTER
VCC
PROGRAMMABLE
POWER
SUPPLY
MINI COMPUTER
DC ANALYZER
16
VEE
VCC
OFF
-
+
VCC
VCC
A
COMMON O/I
OFF
NC
DEVICE
UNDER TEST
ANALOG IN
VIH
COMMON OUT
6
8
GND
Figure 13. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
Figure 12. On Resistance Test
Set−Up
VCC
16
VEE
ANALOG I/O
16
A
OFF
VCC
OFF
VIH
VCC
VCC
VCC
ON
VEE
COMMON O/I
VCC
N/C
ANALOG I/O
VIL
6
COMMON O/I
OFF
6
8
8
Figure 14. Maximum Off Channel Leakage Current,
Common Channel, Test Set−Up
Figure 15. Maximum On Channel Leakage Current,
Channel to Channel, Test Set−Up
VCC
VCC
16
VCC
CHANNEL
SELECT
ON/OFF
50%
OFF/ON
GND
tPLH
ANALOG
OUT
COMMON O/I
ANALOG I/O
TEST
POINT
CL*
tPHL
6
50%
8
CHANNEL SELECT
*Includes all probe and jig capacitance
Figure 16. Propagation Delays, Channel Select
to Analog Out
Figure 17. Propagation Delay, Test Set−Up Channel
Select to Analog Out
http://onsemi.com
8
MC74HC4851A, MC74HC4852A
VCC
16
VCC
ANALOG
IN
COMMON O/I
ANALOG I/O
ON
50%
TEST
POINT
CL*
GND
tPLH
tPHL
ANALOG
OUT
6
8
50%
*Includes all probe and jig capacitance
Figure 18. Propagation Delays, Analog In
to Analog Out
tf
tr
tPZL
ANALOG
OUT
2
GND
tPLZ
16
HIGH
IMPEDANCE
10%
VCC
VCC
1
TEST
POINT
ON/OFF
CL*
VOL
tPHZ
ENABLE
VOH
90%
10kW
ANALOG I/O
2
50%
tPZH
POSITION 1 WHEN TESTING tPHZ AND tPZH
POSITION 2 WHEN TESTING tPLZ AND tPZL
1
VCC
90%
50%
10%
ENABLE
ANALOG
OUT
Figure 19. Propagation Delay, Test Set−Up
Analog In to Analog Out
50%
6
8
HIGH
IMPEDANCE
Figure 20. Propagation Delays, Enable to
Analog Out
Figure 21. Propagation Delay, Test Set−Up
Enable to Analog Out
VCC
A
VCC
16
ON/OFF
COMMON O/I
NC
ANALOG I/O
OFF/ON
VCC
6
8
11
CHANNEL SELECT
Figure 22. Power Dissipation Capacitance,
Test Set−Up
http://onsemi.com
9
MC74HC4851A, MC74HC4852A
Gate = VCC
(Disabled)
Disabled Analog Mux Input
Vin > VCC + 0.7V
P+
Common Analog Output
Vout > VCC
P+
+
+
+
N - Substrate (on VCC potential)
Figure 23. Diagram of Bipolar Coupling Mechanism
Appears if Vin exceeds VCC, driving injection current into the substrate
A
B
C
ENABLE
11
10
9
6
Figure 24. Function Diagram, HC4851A
http://onsemi.com
10
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
14
INJECTION
CURRENT
CONTROL
15
INJECTION
CURRENT
CONTROL
12
INJECTION
CURRENT
CONTROL
1
INJECTION
CURRENT
CONTROL
5
INJECTION
CURRENT
CONTROL
2
INJECTION
CURRENT
CONTROL
4
INJECTION
CURRENT
CONTROL
3
X0
X1
X2
X3
X4
X5
X6
X7
X
MC74HC4851A, MC74HC4852A
A
B
ENABLE
10
9
6
Figure 25. Function Diagram, HC4852A
http://onsemi.com
11
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
14
INJECTION
CURRENT
CONTROL
15
INJECTION
CURRENT
CONTROL
12
INJECTION
CURRENT
CONTROL
13
INJECTION
CURRENT
CONTROL
1
INJECTION
CURRENT
CONTROL
5
INJECTION
CURRENT
CONTROL
2
INJECTION
CURRENT
CONTROL
4
INJECTION
CURRENT
CONTROL
3
X0
X1
X2
X3
X
Y0
Y1
Y2
Y3
Y
MC74HC4851A, MC74HC4852A
ORDERING INFORMATION
Package
Shipping†
MC74HC4851ANG
PDIP−16
(Pb−Free)
500 Units / Box
MC74HC4851ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC4851ADR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
TSSOP−16*
2500 Units / Tape & Reel
MC74HC4851ADWG
SOIC−16 WIDE
(Pb−Free)
48 Units / Rail
MC74HC4851ADWR2G
SOIC−16 WIDE
(Pb−Free)
1000 Units / Tape & Reel
MC74HC4852ANG
PDIP−16
(Pb−Free)
500 Units / Box
MC74HC4852ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC4852ADR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
TSSOP−16*
2500 Units / Tape & Reel
Device
MC74HC4851ADTR2G
MC74HC4852ADTR2G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
12
MC74HC4851A, MC74HC4852A
PACKAGE DIMENSIONS
PDIP−16
N SUFFIX
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
DIM
A
B
C
D
F
G
H
J
K
L
M
S
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
B
M
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
http://onsemi.com
13
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74HC4851A, MC74HC4852A
SOIC−16 WIDE
DW SUFFIX
CASE 751G−03
ISSUE C
A
D
9
h X 45 _
E
0.25
H
8X
M
B
M
16
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
q
1
MILLIMETERS
DIM MIN
MAX
A
2.35
2.65
A1 0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0_
7_
8
16X
M
14X
e
T A
S
B
S
L
A
0.25
B
B
A1
SEATING
PLANE
C
T
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.
CONTROLLING DIMENSION: MILLIMETER.
3.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7.
DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE -W-.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
G
H
DETAIL E
http://onsemi.com
14
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74HC4851A, MC74HC4852A
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
15
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74HC4851A/D