STPS30170C ® HIGH VOLTAGE POWER SCHOTTKY RECTIFIER Table 1: Main Product Characteristics IF(AV) 2 x 15 A A1 VRRM 170 V A2 Tj 175 °C VF(max) 0.75 V K A2 A2 K FEATURES AND BENEFITS ■ High junction temperature capability ■ Low leakage current ■ Good trade off between leakage current and forward voltage drop ■ Insulated package: TO-220FPAB Insulating voltage: 2000 V DC Capacitance: 45 pF ■ Avalanche specification A1 A1 K TO-247 TO-220AB STPS30170CW STPS30170CT K A2 A2 K A1 DESCRIPTION Dual center tab Schottky rectifier suited for High Frequency Switch Mode Power Supply. A1 TO-220FPAB D2PAK STPS30170CFP STPS30170CG Table 2: Order Codes September 2005 Part Numbers Marking STPS30170CW STPS30170CW STPS30170CT STPS30170CT STPS30170CFP STPS30170CFP STPS30170CG STPS30170CG STPS30170CG-TR STPS30170CG REV. 1 1/9 STPS30170C Table 3: Absolute Ratings (limiting values, per diode) Symbol VRRM IF(RMS) Parameter Value Unit Repetitive peak reverse voltage 170 V RMS forward current 30 A TO-220FPAB IF(AV) Tc = 120 °C Average forward current TO-220AB / δ = 0.5 D2PAK Per diode 15 A Tc = 155 °C Per device TO-247 30 IFSM Surge non repetitive forward current tp = 10ms sinusoidal 220 A PARM Repetitive peak avalanche power tp = 1µs Tj = 25 °C 10500 W -65 to + 175 °C 175 °C 10000 V/µs Tstg Tj dV/dt Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage 1 dPtot * : --------------- > -------------------------- thermal runaway condition for a diode on its own heatsink Rth ( j – a ) dTj Table 4: Thermal Parameters Symbol Rth(j-c) Parameter Junction to case Value TO-220FPAB Per diode Total 4 3.3 TO-220AB / D2PAK Per diode Total 1.6 0.85 TO-247 Per diode Total 1.5 0.8 Coupling 2.6 Coupling 0.3 Coupling 0.3 TO-220FPAB Rth(c) TO-220AB / D2PAK TO-247 Unit °C/W °C/W When the diodes 1 and 2 are used simultaneously: ∆ Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 5: Static Electrical Characteristics (per diode) Symbol Parameter IR * Reverse leakage current Tests conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF ** Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Pulse test: * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% Min. VR = VRRM 5 Max. Unit 20 µA 20 mA 0.92 IF = 15 A 0.69 0.75 1 IF = 30 A 0.80 2 To evaluate the conduction losses use the following equation: P = 0.64 x IF(AV) + 0.0073 IF (RMS) 2/9 Typ 0.86 V STPS30170C Figure 1: Average forward power dissipation versus average forward current (per diode) Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV)(A) 18 PF(AV)(W) 14 d=0.1 12 d=0.2 d=1 d=0.5 d=0.05 Rth(j-a)=Rth(j-c) (TO-220AB, TO -247 & D²PAK) 16 14 10 12 8 10 6 8 Rth(j-a)=Rth(j-c) (TO-220FPAB) Rth(j-A)=15 °C/W 6 4 T T 4 2 d=tp/T IF(AV)(A) tp 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 2 d=tp/T 0 Figure 3: Normalized avalanche derating versus pulse duration power Tamb (°C) 25 50 75 100 125 150 Figure 4: Normalized avalanche derating versus junction temperature PARM (t p ) PARM (1µs) 1 tp 0 1.2 175 power PARM (t p ) PARM (25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj (°C) t p (µs) 0.001 0.01 0.1 1 10 100 1000 Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220AB, TO-247, D2PAK) 0 25 100 125 150 IM(A) 140 130 TO-220AB, TO -247 & D²PAK 200 TO-220FPAB 120 110 100 90 175 150 TC=50°C 125 100 TC=75°C 75 50 TC=125°C IM t t(s) d =0.5 0 1.E-03 75 Figure 6: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) IM(A) 225 25 50 1.E-02 1.E-01 1.E+00 80 70 60 50 40 30 20 10 0 1.E-03 TC=50°C TC=75°C IM TC=125°C t(s) t d =0.5 1.E-02 1.E-01 1.E+00 3/9 STPS30170C Figure 7: Relative variation of thermal impedance junction to case versus pulse duration (per diode) (TO-220AB, TO-247, D2PAK) Figure 8: Relative variation of thermal impedance junction to case versus pulse duration (per diode) (TO-220FPAB) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 TO-220FPAB TO-220AB, TO -247 & D²PAK 0.9 0.9 0.8 0.8 0.7 0.7 d=0.5 0.6 0.6 0.5 0.5 0.4 d=0.2 0.3 d=0.1 d=0.5 0.4 d=0.2 0.3 T 0.1 Single pulse d=tp/T tP(s) T D=0.1 0.2 0.2 0.1 tp d =tp/T tP(s) Single pulse tp 0.0 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Figure 9: Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 10: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) IR(µA) 1000 1.E+06 F=1MHz VOSC=30mVRMS Tj=25°C 1.E+05 Tj=175°C 1.E+04 Tj=150°C Tj=125°C 1.E+03 100 1.E+02 Tj=75°C 1.E+01 Tj=25°C 1.E+00 VR(V) 10 VR(V) 1.E-01 1 0 10 100 1000 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 Figure 11: Forward voltage drop versus forward current (maximum values, per diode, low level) Figure 12: Forward voltage drop versus forward current (maximum values, per diode, high level) IFM(A) IFM(A) 15.0 100 12.5 Tj=125°C (Maximum values) Tj=125°C (Maximum values) 10.0 7.5 Tj=125°C (Typical values) Tj=125°C (Typical values) 10 Tj=25°C (Maximum values) 5.0 Tj=25°C (Maximum values) 2.5 VFM(V) VFM(V) 1 0.0 0.0 4/9 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 STPS30170C Figure 13: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 µm) (D2PAK) Rth(j-a) (°C/W) 80 D²PAK 70 60 50 40 30 20 10 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 Figure 14: TO-247 Package Mechanical Data DIMENSIONS REF. Millimeters Min. V V Dia A H L5 L2 L4 F2 F1 L1 V2 F4 F(x3) M G E Typ. Max. 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F1 3.00 0.118 F2 2.00 0.078 F3 2.00 2.40 0.078 0.094 F4 3.00 3.40 0.118 0.133 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L3 D L3 Inches Min. 4.85 L2 F3 Max. A G L Typ. 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 V 5° V2 Dia. 3.00 0.078 5° 60° 3.55 0.118 60° 3.65 0.139 0.143 5/9 STPS30170C Figure 15: D2PAK Package Mechanical Data REF. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Figure 16: Foot Print Dimensions (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 6/9 A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0° 8° 0° 8° STPS30170C Figure 17: TO-220FPAB Package Mechanical Data REF. A B H Dia L6 L7 L2 L3 L5 D F1 L4 F2 F E G1 G A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.018 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.205 2.4 2.7 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.205 9.8 10.6 0.386 0.417 2.9 3.6 0.114 0.142 15.9 16.4 0.626 0.646 9.00 9.30 0.354 0.366 3.00 3.20 0.118 0.126 Figure 18: TO-220AB Package Mechanical Data REF. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F M G1 E G A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 7/9 STPS30170C In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6: Ordering Information Ordering type Marking Package Weight Base qty Delivery mode STPS30170CW STPS30170CW TO-247 4.40 g 30 Tube STPS30170CT STPS30170CT TO-220AB 2g 50 Tube STPS30170CFP STPS30170CFP TO-220FPAB 1.9 g 50 Tube STPS30170CG STPS30170CG Tube STPS30170CG 1.48 g 50 STPS30170CG-TR D2PAK 1000 Tape & reel ■ ■ ■ ■ Epoxy meets UL94, V0 Cooling method: by conduction (C) TO-220 - Recommended torque value: 0.55 Nm, Maximum torque value: 0.7 Nm. TO-247 - Recommended torque value: 0.8 Nm, Maximum torque value: 1.0 Nm. Table 7: Revision History 8/9 Date Revision 16-Sep-2005 1 Description of Changes First issue. STPS30170C Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9