STMICROELECTRONICS STPS30170CW

STPS30170C
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
2 x 15 A
A1
VRRM
170 V
A2
Tj
175 °C
VF(max)
0.75 V
K
A2
A2
K
FEATURES AND BENEFITS
■
High junction temperature capability
■
Low leakage current
■
Good trade off between leakage current and
forward voltage drop
■
Insulated package: TO-220FPAB
Insulating voltage: 2000 V DC
Capacitance: 45 pF
■
Avalanche specification
A1
A1
K
TO-247
TO-220AB
STPS30170CW
STPS30170CT
K
A2
A2
K
A1
DESCRIPTION
Dual center tab Schottky rectifier suited for High
Frequency Switch Mode Power Supply.
A1
TO-220FPAB
D2PAK
STPS30170CFP
STPS30170CG
Table 2: Order Codes
September 2005
Part Numbers
Marking
STPS30170CW
STPS30170CW
STPS30170CT
STPS30170CT
STPS30170CFP
STPS30170CFP
STPS30170CG
STPS30170CG
STPS30170CG-TR
STPS30170CG
REV. 1
1/9
STPS30170C
Table 3: Absolute Ratings (limiting values, per diode)
Symbol
VRRM
IF(RMS)
Parameter
Value
Unit
Repetitive peak reverse voltage
170
V
RMS forward current
30
A
TO-220FPAB
IF(AV)
Tc = 120 °C
Average forward current TO-220AB /
δ = 0.5
D2PAK
Per diode
15
A
Tc = 155 °C
Per device
TO-247
30
IFSM
Surge non repetitive forward current
tp = 10ms sinusoidal
220
A
PARM
Repetitive peak avalanche power
tp = 1µs Tj = 25 °C
10500
W
-65 to + 175
°C
175
°C
10000
V/µs
Tstg
Tj
dV/dt
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
1
dPtot
* : --------------- > -------------------------- thermal runaway condition for a diode on its own heatsink
Rth ( j – a )
dTj
Table 4: Thermal Parameters
Symbol
Rth(j-c)
Parameter
Junction to case
Value
TO-220FPAB
Per diode
Total
4
3.3
TO-220AB / D2PAK
Per diode
Total
1.6
0.85
TO-247
Per diode
Total
1.5
0.8
Coupling
2.6
Coupling
0.3
Coupling
0.3
TO-220FPAB
Rth(c)
TO-220AB /
D2PAK
TO-247
Unit
°C/W
°C/W
When the diodes 1 and 2 are used simultaneously:
∆ Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 5: Static Electrical Characteristics (per diode)
Symbol
Parameter
IR *
Reverse leakage current
Tests conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF **
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Pulse test:
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
Min.
VR = VRRM
5
Max.
Unit
20
µA
20
mA
0.92
IF = 15 A
0.69
0.75
1
IF = 30 A
0.80
2
To evaluate the conduction losses use the following equation: P = 0.64 x IF(AV) + 0.0073 IF (RMS)
2/9
Typ
0.86
V
STPS30170C
Figure 1: Average forward power dissipation
versus average forward current (per diode)
Figure 2: Average forward current versus
ambient temperature (δ = 0.5, per diode)
IF(AV)(A)
18
PF(AV)(W)
14
d=0.1
12
d=0.2
d=1
d=0.5
d=0.05
Rth(j-a)=Rth(j-c) (TO-220AB, TO -247 & D²PAK)
16
14
10
12
8
10
6
8
Rth(j-a)=Rth(j-c)
(TO-220FPAB)
Rth(j-A)=15 °C/W
6
4
T
T
4
2
d=tp/T
IF(AV)(A)
tp
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
2
d=tp/T
0
Figure 3: Normalized avalanche
derating versus pulse duration
power
Tamb (°C)
25
50
75
100
125
150
Figure 4: Normalized avalanche
derating versus junction temperature
PARM (t p )
PARM (1µs)
1
tp
0
1.2
175
power
PARM (t p )
PARM (25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj (°C)
t p (µs)
0.001
0.01
0.1
1
10
100
1000
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values, per diode) (TO-220AB, TO-247, D2PAK)
0
25
100
125
150
IM(A)
140
130
TO-220AB, TO -247 & D²PAK
200
TO-220FPAB
120
110
100
90
175
150
TC=50°C
125
100
TC=75°C
75
50
TC=125°C
IM
t
t(s)
d =0.5
0
1.E-03
75
Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values, per diode) (TO-220FPAB)
IM(A)
225
25
50
1.E-02
1.E-01
1.E+00
80
70
60
50
40
30
20
10
0
1.E-03
TC=50°C
TC=75°C
IM
TC=125°C
t(s)
t
d =0.5
1.E-02
1.E-01
1.E+00
3/9
STPS30170C
Figure 7: Relative variation of thermal
impedance junction to case versus pulse
duration (per diode) (TO-220AB, TO-247,
D2PAK)
Figure 8: Relative variation of thermal
impedance junction to case versus pulse
duration (per diode) (TO-220FPAB)
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
TO-220FPAB
TO-220AB, TO -247 & D²PAK
0.9
0.9
0.8
0.8
0.7
0.7
d=0.5
0.6
0.6
0.5
0.5
0.4
d=0.2
0.3
d=0.1
d=0.5
0.4
d=0.2
0.3
T
0.1
Single pulse
d=tp/T
tP(s)
T
D=0.1
0.2
0.2
0.1
tp
d =tp/T
tP(s)
Single pulse
tp
0.0
0.0
1.E-03
1.E-02
1.E-01
1.E+00
Figure 9: Reverse leakage current versus
reverse voltage applied (typical values, per
diode)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 10: Junction capacitance versus
reverse voltage applied (typical values, per
diode)
C(pF)
IR(µA)
1000
1.E+06
F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E+05
Tj=175°C
1.E+04
Tj=150°C
Tj=125°C
1.E+03
100
1.E+02
Tj=75°C
1.E+01
Tj=25°C
1.E+00
VR(V)
10
VR(V)
1.E-01
1
0
10
100
1000
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170
Figure 11: Forward voltage drop versus
forward current (maximum values, per diode,
low level)
Figure 12: Forward voltage drop versus
forward current (maximum values, per diode,
high level)
IFM(A)
IFM(A)
15.0
100
12.5
Tj=125°C
(Maximum values)
Tj=125°C
(Maximum values)
10.0
7.5
Tj=125°C
(Typical values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
5.0
Tj=25°C
(Maximum values)
2.5
VFM(V)
VFM(V)
1
0.0
0.0
4/9
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
STPS30170C
Figure 13: Thermal resistance junction to
ambient versus copper surface under tab
(Epoxy printed circuit board, copper
thickness: 35 µm) (D2PAK)
Rth(j-a) (°C/W)
80
D²PAK
70
60
50
40
30
20
10
SCU(cm²)
0
0
5
10
15
20
25
30
35
40
Figure 14: TO-247 Package Mechanical Data
DIMENSIONS
REF.
Millimeters
Min.
V
V
Dia
A
H
L5
L2
L4
F2
F1
L1
V2
F4
F(x3)
M
G
E
Typ.
Max.
5.15 0.191
0.203
D
2.20
2.60 0.086
0.102
E
0.40
0.80 0.015
0.031
F
1.00
1.40 0.039
0.055
F1
3.00
0.118
F2
2.00
0.078
F3
2.00
2.40 0.078
0.094
F4
3.00
3.40 0.118
0.133
10.90
0.429
H
15.45
15.75 0.608
0.620
L
19.85
20.15 0.781
0.793
L1
3.70
4.30 0.145
0.169
L3
D
L3
Inches
Min.
4.85
L2
F3
Max.
A
G
L
Typ.
18.50
14.20
0.728
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M
2.00
V
5°
V2
Dia.
3.00 0.078
5°
60°
3.55
0.118
60°
3.65 0.139
0.143
5/9
STPS30170C
Figure 15: D2PAK Package Mechanical Data
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
Figure 16: Foot Print Dimensions (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
6/9
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
2.49
2.69
0.098
0.106
0.03
0.23
0.001
0.009
0.70
0.93
0.027
0.037
1.14
1.70
0.045
0.067
0.45
0.60
0.017
0.024
1.23
1.36
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
0.050
0.055
1.40
1.75
0.055
0.069
2.40
3.20
0.094
0.126
0.40 typ.
0.016 typ.
0°
8°
0°
8°
STPS30170C
Figure 17: TO-220FPAB Package Mechanical Data
REF.
A
B
H
Dia
L6
L7
L2
L3
L5
D
F1
L4
F2
F
E
G1
G
A
B
D
E
F
F1
F2
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.4
4.6
0.173
0.181
2.5
2.7
0.098
0.106
2.5
2.75
0.098
0.108
0.45
0.70
0.018
0.027
0.75
1
0.030
0.039
1.15
1.70
0.045
0.067
1.15
1.70
0.045
0.067
4.95
5.20
0.195
0.205
2.4
2.7
0.094
0.106
10
10.4
0.393
0.409
16 Typ.
0.63 Typ.
28.6
30.6
1.126
1.205
9.8
10.6
0.386
0.417
2.9
3.6
0.114
0.142
15.9
16.4
0.626
0.646
9.00
9.30
0.354
0.366
3.00
3.20
0.118
0.126
Figure 18: TO-220AB Package Mechanical Data
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
4.40
4.60
0.173
0.181
1.23
1.32
0.048
0.051
2.40
2.72
0.094
0.107
0.49
0.70
0.019
0.027
0.61
0.88
0.024
0.034
1.14
1.70
0.044
0.066
1.14
1.70
0.044
0.066
4.95
5.15
0.194
0.202
2.40
2.70
0.094
0.106
10
10.40
0.393
0.409
16.4 typ.
0.645 typ.
13
14
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
6.60
0.244
0.259
3.50
3.93
0.137
0.154
2.6 typ.
0.102 typ.
3.75
3.85
0.147
0.151
7/9
STPS30170C
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 6: Ordering Information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS30170CW
STPS30170CW
TO-247
4.40 g
30
Tube
STPS30170CT
STPS30170CT
TO-220AB
2g
50
Tube
STPS30170CFP
STPS30170CFP
TO-220FPAB
1.9 g
50
Tube
STPS30170CG
STPS30170CG
Tube
STPS30170CG
1.48 g
50
STPS30170CG-TR
D2PAK
1000
Tape & reel
■
■
■
■
Epoxy meets UL94, V0
Cooling method: by conduction (C)
TO-220 - Recommended torque value: 0.55 Nm, Maximum torque value: 0.7 Nm.
TO-247 - Recommended torque value: 0.8 Nm, Maximum torque value: 1.0 Nm.
Table 7: Revision History
8/9
Date
Revision
16-Sep-2005
1
Description of Changes
First issue.
STPS30170C
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
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