STMICROELECTRONICS STPS20L60C

STPS20L60CT/CG/CR
®
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
A1
IF(AV)
2 x 10 A
VRRM
60 V
Tj (max)
150 °C
VF (max)
0.56 V
K
A2
K
FEATURES AND BENEFITS
LOW FORWARD VOLTAGE DROP
NEGLIGIBLE SWITCHING LOSSES
LOW THERMAL RESISTANCE
AVALANCHE CAPABILITY SPECIFIED
A2
A2
■
■
A1
K
A1
D2PAK
STPS20L60CG
■
TO-220AB
STPS20L60CT
■
DESCRIPTION
Dual center tap Schottky rectifiers suited for
Switched Mode Power Supplies and high
frequency DC to DC converters.
Packaged in TO-220AB, I2PAK and D2PAK, this
device is intended for use in high frequency
inverters.
A2
K
A1
I2PAK
STPS20L60CR
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
VRRM
IF(RMS)
Parameter
Tc = 140°C
δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs square F = 1kHz
PARM
Repetitive peak avalanche power
tp = 1µs
dV/dt
* :
30
A
10
20
A
220
A
1
A
5800
W
- 65 to + 175
°C
150
°C
10000
V/µs
RMS forward current
Average forward current
Tj
Unit
V
Repetitive peak reverse voltage
IF(AV)
Tstg
Value
60
Storage temperature range
Per diode
Per device
Tj = 25°C
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
July 2003 - Ed: 3C
1/6
STPS20L60CT/CG/CR
THERMAL RESISTANCE
Symbol
Parameter
Rth (j-c)
2
Junction to case
2
Per diode
Total
Coupling
TO-220AB / I PAK / D PAK
TO-220AB / I2PAK / D2PAK
Rth (c)
Value
Unit
1.6
0.85
0.1
°C/W
°C/W
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
Tests conditions
IR *
Reverse leakage current
Tj = 25°C
Min.
Typ.
VR = VRRM
Forward voltage drop
Unit
350
µA
95
mA
0.6
V
65
Tj = 125°C
VF *
Max.
Tj = 25°C
IF = 10 A
Tj = 125°C
IF = 10 A
Tj = 25°C
IF = 20 A
Tj = 125°C
IF = 20 A
0.48
0.56
0.74
0.62
0.7
Pulse test : * tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.42x IF(AV) + 0.014 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
8
12
δ = 0.1
δ = 0.2
δ = 0.5
δ=1
Rth(j-a)=Rth(j-c)
10
δ = 0.05
6
8
5
4
Rth(j-a)=15°C/W
6
3
4
T
2
T
2
1
0
ambient
IF(av)(A)
PF(av)(W)
7
Fig. 2: Average current versus
temperature (δ=0.5) (per diode).
δ=tp/T
IF(av) (A)
0
2/6
1
2
3
4
5
6
7
8
9
10
δ=tp/T
tp
11
12
0
0
Tamb(°C)
tp
25
50
75
100
125
150
STPS20L60CT/CG/CR
Fig. 3: Normalized avalanche power derating
versus pulse duration.
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
1
0
10
100
0
1000
25
50
75
100
125
150
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
Fig. 6: Relative variation of thermal transient
impedance junction to case versus pulse duration.
IM(A)
200
180
160
140
120
100
80
60
40 IM
20
0
1E-3
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6
δ = 0.5
Tc=25°C
0.4
δ = 0.2
Tc=75°C
T
δ = 0.1
0.2
Tc=100°C
t
t(s)
δ=0.5
1E-2
tp(s)
Single pulse
1E-1
1E+0
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
IR(mA)
0.0
1E-4
1E-3
1E-2
δ=tp/T
1E-1
tp
1E+0
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values, per diode).
C(nF)
5E+2
2.0
Tc=150°C
1E+2
F=1MHz
Tj=25°C
Tc=125°C
1.0
1E+1
Tc=100°C
Tc=75°C
0.5
1E+0
Tc=50°C
1E-1
Tc=25°C
0.2
1E-2
1E-3
VR(V)
0
5
10 15 20 25 30 35 40 45 50 55 60
VR(V)
0.1
1
10
100
3/6
STPS20L60CT
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).
IFM(A)
100.0
Tj=150°C
(typical values)
Tj=25°C
10.0
Tj=125°C
1.0
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
PACKAGE MECHANICAL DATA
I2PAK
DIMENSIONS
REF.
A
E
c2
L2
D
L1
A1
b2
L
b1
b
e
4/6
c
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
STPS20L60CT/CG/CR
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
REF.
Millimeters
Inches
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
Min.
Max.
4.40
4.60
2.49
2.69
0.03
0.23
0.70
0.93
1.14
1.70
0.45
0.60
1.23
1.36
8.95
9.35
10.00
10.40
4.88
5.28
15.00
15.85
1.27
1.40
1.40
1.75
2.40
3.20
0.40 typ.
0°
8°
Min.
Max.
0.173
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.045
0.067
0.017
0.024
0.048
0.054
0.352
0.368
0.393
0.409
0.192
0.208
0.590
0.624
0.050
0.055
0.055
0.069
0.094
0.126
0.016 typ.
0°
8°
FOOTPRINT
16.90
10.30
5.08
1.30
3.70
8.90
5/6
STPS20L60CT/CG/CR
PACKAGE MECHANICAL DATA
TO-220AB
DIMENSIONS
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
■
■
■
Millimeters
Inches
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
Min.
Max.
4.40
4.60
1.23
1.32
2.40
2.72
0.49
0.70
0.61
0.88
1.14
1.70
1.14
1.70
4.95
5.15
2.40
2.70
10
10.40
16.4 typ.
13
14
2.65
2.95
15.25
15.75
6.20
6.60
3.50
3.93
2.6 typ.
3.75
3.85
Min.
Max.
0.173
0.181
0.048
0.051
0.094
0.107
0.019
0.027
0.024
0.034
0.044
0.066
0.044
0.066
0.194
0.202
0.094
0.106
0.393
0.409
0.645 typ.
0.511
0.551
0.104
0.116
0.600
0.620
0.244
0.259
0.137
0.154
0.102 typ.
0.147
0.151
COOLING METHOD: C
RECOMMENDED TORQUE VALUE: 0.55 M.N
MAXIMUM TORQUE VALUE: 0.70 M.N
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS20L60CT
STPS20L60CT
TO-220AB
2.2g
50
Tube
STPS20L60CT
STPS20L60CT
TO-220AB
STPS20L60CG
■
REF.
A
STPS20L60CG
2.2g
1000
Bulk
2
1.48 g
50
Tube
2
D PAK
STPS20L60CG-TR
STPS20L60CG
D PAK
1.48 g
1000
Tape & reel
STPS20L60CR
STPS20L60CR
I2PAK
1.49 g
50
Tube
EPOXY MEETS UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
6/6