STPS1545C Power Schottky rectifier Main product characteristics A1 K IF(AV) 2 x 7.5 A VRRM 45 V Tj (max) 175° C VF(max) 0.57 V A2 A2 Features and Benefits ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Avalanche capability specified K A1 TO-220AB STPS1545CT K Description Dual center tap Schottky rectifier suited for SwitchMode Power Supply and high frequency DC to DC converters. A2 K A1 D2PAK STPS1545CG Packaged either in TO-220AB, D2PAK or I2PAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. March 2007 A2 A1 Rev 6 I2PAK STPS1545CR 1/9 www.st.com 9 Characteristics 1 STPS1545C Characteristics Table 1. Absolute Ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) RMS forward voltage 20 A IF(AV) Average forward current δ = 0.5 Tc = 157° C Per diode 7.5 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 150 A IRRM Peak repetitive reverse current tp = 2 µs square F = 1 kHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 2 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25°C 2700 W -65 to + 175 °C 175 °C 10000 V/µs Value Unit Per diode Total 3.0 1.7 °C/W Coupling 0.35 Tstg Storage temperature range Maximum operating junction temperature Tj dV/dt 1. dPtot --------------dTj (1) Critical rate of rise of reverse voltage < Table 2. 1 -------------------------Rth ( j – a ) thermal runaway condition for a diode on its own heatsink Thermal resistances Symbol Rth(j-c) Parameter Junction to case Rth(c) When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol IR(1) VF(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25°C Tj = 125°C Forward voltage drop VR =VRRM Tj = 125°C IF = 7.5A Tj = 25°C IF = 15 A Tj = 125°C IF = 15 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.020 IF2(RMS) 2/9 Min. Typ. Max. Unit 100 µA 5 15 mA 0.5 0.57 0.84 0.65 0.72 V STPS1545 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV)(A) PF(AV)(W) 9 6 δ = 0.1 δ = 0.2 δ = 0.5 TO-220AB D2PAK Rth(j-a)=Rth(j-c) 8 δ = 0.05 5 7 Rth(j-a)=40°C/W 6 4 δ=1 Rth(j-a)=15°C/W 5 3 4 2 3 T T 2 1 δ=tp/T IF(AV)(A) 1 tp 0 δ=tp/T 0 0 1 2 Figure 3. 3 4 5 6 7 8 9 10 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) Figure 6. 50 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) IM(A) 1.0 120 100 0.8 80 0.6 TC=50°C 60 δ = 0.5 TC=100°C 0.4 TC=150°C 0.2 40 20 IM t δ = 0.1 t(s) δ=0.5 0 1E-3 1E-2 T δ = 0.2 1E-1 1E+0 0.0 1E-4 tp(s) Single pulse 1E-3 1E-2 δ=tp/T 1E-1 tp 1E+0 3/9 Characteristics Figure 7. STPS1545C Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) IR(µA) 1000 5E+4 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1E+4 Tj=125°C 1E+3 500 Tj=100°C Tj=75°C 1E+2 Tj=50°C 1E+1 200 Tj=25°C 1E+0 VR(V) VR(V) 1E-1 100 0 5 10 Figure 9. 15 20 25 30 35 40 45 Forward voltage drop versus forward current (maximum values, per diode) 1 2 5 10 20 50 Figure 10. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 µm) IFM(A) Rth(j-a)(°C/W) 100.0 80 70 Tj=125°C (typical values) 60 Tj=25°C 10.0 50 40 Tj=125°C 30 1.0 20 10 VFM(V) 0.1 0 0.0 4/9 S(Cu)(cm²) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2 4 6 8 10 12 14 16 18 20 STPS1545 2 Package Information Package Information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.55 Nm ● Maximum torque value: 0.70 Nm Figure 11. D2PAK dimensions Dimensions Ref Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0° 8° 0.016 typ. 0° 8° Figure 12. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 5/9 Package Information STPS1545C Figure 13. TO-220AB dimensions Dimensions Ref A H2 Dia C L5 L7 L6 L2 F2 F1 L4 F Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 L2 M E G 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. 6/9 Inches D L9 G1 Millimeters 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STPS1545 Package Information Figure 14. I2PAK dimensions Dimensions Ref A E c2 Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A 4.40 A1 2.49 2.69 0.098 0.106 A1 2.49 b 0.70 0.93 0.028 0.037 b 0.70 b1 1.14 1.17 0.044 0.046 b1 1.14 b2 1.14 1.17 0.044 0.046 b2 1.14 c 0.45 0.60 0.018 0.024 c 0.45 c2 1.23 1.36 0.048 0.054 c2 1.23 D 8.95 9.35 0.352 0.368 D 8.95 e 2.40 2.70 0.094 0.106 e 2.40 E 10.0 10.4 0.394 0.409 E 10.0 L 13.1 13.6 0.516 0.535 L 13.1 L1 3.48 3.78 0.137 0.149 L1 3.48 L2 1.27 1.40 0.050 0.055 L2 1.27 L2 D L1 A1 b1 L b e e1 c In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering Information 3 Ordering Information Ordering type Marking Package Weight Base qty Delivery mode STPS1545CT STPS1545CT TO-220AB STPS1545CG 4 8/9 STPS1545C STPS1545CG 2.23 g 50 Tube 2 1.48 g 50 Tube 2 D PAK STPS1545CG-TR STPS1545CG D PAK 1.48 g 1000 Tape & reel STPS1545CR STPS1545CR I2PAK 1.49 g 50 Tube Revision history Date Revision Description of Changes Jul-2003 5F Last release. 21-Mar-2007 6 Removed ISOWATT and TO-220FPAB packages. STPS1545 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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