STPS745 Power Schottky rectifier Main product characteristics A IF(AV) 7.5 A VRRM 45 V Tj (max) 150° C VF(max) 0.57 V K A NC D2PAK STPS745G Features and Benefits ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Insulated package: TO-220FPAC Insulating voltage = 2000 V DC Capacitance = 12 pF ■ K A Avalanche capability specified A K K TO-220AC STPS745D Description Single Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. TO-220FPAC STPS745FP ’’‘ Packaged either in TO-220AC, TO-220FPAC or D2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. March 2007 Rev 7 1/9 www.st.com 9 Characteristics 1 STPS745 Characteristics ’ Table 1. Absolute Ratings (limiting values) Symbo l Parameter Repetitive peak reverse voltage VRRM IF(RMS) RMS forward voltage Average forward current δ = 0.5 IF(AV) Tc = 160° C TO-220FPAC Tc = 145° C 45 V 20 A 7.5 A 150 A Surge non repetitive forward current tp = 10 ms Sinusoidal IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 2 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 2700 W -65 to + 175 °C 175 °C 10000 V/µs Storage temperature range Maximum operating junction temperature (1) Tj dV/dt dPtot --------------dTj Critical rate of rise of reverse voltage < Table 2. 1 -------------------------Rth ( j – a ) thermal runaway condition for a diode on its own heatsink Thermal resistances Symbol Rth (j-c) Table 3. Symbol IR(1) VF(1) Parameter Value TO-220AC / D2PAK 3.0 TO-220FPAC 5.5 Junction to case Unit °C/W Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Forward voltage drop VR = VRRM Tj = 125° C IF = 7.5 A Tj = 25° C IF = 15 A Tj = 125° C IF = 15 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.020 IF2(RMS) 2/9 Unit IFSM Tstg 1. TO-220AC / D2PAK Value Min. Typ. Max. Unit 100 µA 5 15 mA 0.5 0.57 0.84 0.65 0.72 V STPS745 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 9 6 δ = 0.1 δ = 0.2 δ = 0.05 5 δ = 0.5 8 Rth(j-a)=Rth(j-c) TO-220AC 7 TO-220FPAC δ=1 4 6 Rth(j-a)=15°C/W 5 3 Rth(j-a)=40°C/W 4 2 3 T T 2 1 δ=tp/T IF(AV)(A) 1 tp 0 δ=tp/T 0 0 1 2 3 Figure 3. 4 5 6 7 8 9 10 Normalized avalanche power derating versus pulse duration 0 25 50 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC and D2PAK) 50 Figure 6. 75 100 125 150 Non repetitive surge peak forwardcurrent versus overload duration (maximum values) (TO-220FPAC) IM(A) IM(A) 80 120 70 100 60 80 50 60 TC=50°C 40 TC=100°C 30 TC=50°C TC=100°C 40 20 TC=150°C IM t 1E-2 TC=150°C IM 10 t(s) δ=0.5 0 1E-3 20 t t(s) δ=0.5 1E-1 1E+0 0 1E-3 1E-2 1E-1 1E+0 3/9 Characteristics Figure 7. STPS745 Figure 8. Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220AC and D2PAK) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.8 0.8 0.6 Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220FPAC) 0.6 δ = 0.5 0.4 δ = 0.5 0.4 δ = 0.2 δ = 0.2 T δ = 0.1 0.2 tp(s) Single pulse 0.0 1E-4 1E-3 Figure 9. δ=tp/T 1E-2 tp 1E-1 T δ = 0.1 0.2 tp(s) Single pulse 1E+0 Reverse leakage current versus reverse voltage applied (typical values) 0.0 1E-3 1E-2 δ=tp/T 1E-1 tp 1E+0 1E+1 Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(µA) 1000 5E+4 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1E+4 Tj=125°C 1E+3 500 Tj=100°C Tj=75°C 1E+2 Tj=50°C 1E+1 200 Tj=25°C 1E+0 VR(V) 1E-1 VR(V) 100 0 5 10 15 20 25 30 35 40 45 Figure 11. Forward voltage drop versus forward current (maximum values) 1 2 5 10 20 50 Figure 12. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 µm) IFM(A) Rth(j-a)(°C/W) 100.0 80 Tj=125°C (typical values) 70 60 Tj=25°C 10.0 50 Tj=125°C 40 30 1.0 20 10 S(Cu)(cm²) VFM(V) 0 0.1 0.0 4/9 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2 4 6 8 10 12 14 16 18 20 STPS745 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.55 Nm ● Maximum torque value: 0.70 Nm Table 4. D2PAK dimensions Dimensions Ref Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 5/9 Package information Table 5. STPS745 TO-220FPAC dimensions Dimensions Ref A B H Dia Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L6 L7 L2 L3 L5 F1 D L4 L2 F G1 G 6/9 E 16 Typ. 0.63 Typ. L3 28.6 30.6 0.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 STPS745 Package information Table 6. TO-220AC dimensions Dimensions Ref A H2 ØI C L5 L7 L6 L2 F1 Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 D L9 L4 F L2 M E G Millimeters 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 3 4 8/9 STPS745 Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS745D STPS745D TO-220AC 1.86 g 50 Tube STPS745G STPS745G D2PAK 1.48 g 50 Tube STPS745G-TR STPS745G D2PAK 1.48 g 1000 Tape & reel STPS745FP STPS745FP TO-220FPAC 1.9 g 50 Tube Revision history Date Revision Jul-2003 6G 22-Mar-2007 7 Description of Changes Last release. Removed ISOWATT package. STPS745 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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