TLP173A TOSHIBA Photocoupler Photorelay TLP173A Telecommunications Control Equipment Data Acquisition System Security Equipment Measurement Equipment Unit: mm The Toshiba TLP173A consists of a gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET in a MFSOP6 package. This photorelay requires 2mA of LED current to turn it on. It is suitable for applications that need electrical power savings. • 4-pin SOP (MFSOP6): Height = 2.5 mm, pitch = 2.54 mm • Normally open (1-Form-A) device • Peak off-state voltage: 60 V (min) • Trigger LED current: 2 mA (max) • On-state current: 70 mA (max) • On-state resistance: 50 Ω (max) • Isolation voltage: 3750 Vrms (min) JEDEC ― • UL (pending approval) : UL1577, File No.E67349 JEITA ― • c-UL (pending approval) CSA Component Acceptance Service No. 5A File No.E67349 • BSI (pending approval): • SEMKO (pending approval): • Option (V4) type TOSHIBA 11-4C1 Weight: 0.09 g (typ.) VDE (pending approval): Maximum operating insulation voltage: 565Vpk Highest permissible over voltage: 6000Vpk Pin Configuration (top view) 1 6 3 4 Internal Circuit 1 6 3 4 1: Anode 3: Cathode 4: Drain 6: Drain 1 2009-12-22 TLP173A Absolute Maximum Rating (Ta = 25°C) Characteristics Symbol Rating Unit IF 50 mA ΔIF/°C −0.5 mA/°C Reverse voltage VR 5 V Pulse forward current (100 μs pulse, 100 pps) IFP 1 A Junction temperature Tj 125 °C VOFF 60 V ION 70 mA ΔION/°C −0.7 mA/°C Tj 125 °C Storage temperature Tstg −55 to 125 °C Operating temperature Topr −40 to 85 °C Lead soldering temperature (10 s) Tsol 260 °C BVS 3750 Vrms Forward current Forward current derating (Ta ≥ 25°C) LED Off-state output terminal voltage Detector On-state current Forward current derating (Ta ≥ 25°C) Junction temperature Isolation voltage (AC, 1 min, R.H. ≤ 60%) (Note 1) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note: This product is more sensitive than conventional products to electrostatic discharge (ESD). It is therefore all the more necessary to observe general precautions regarding ESD when handling this component. Note 1: LED pins are shorted together. Detector pins are also shorted together. Recommended Operating Conditions Characteristics Symbol Min Typ. Max Unit Supply voltage VDD ⎯ ⎯ 48 V Forward current IF ⎯ 3 25 mA On-state current ION ⎯ ⎯ 60 mA Operating temperature Topr −20 ⎯ 65 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Electrical Characteristics (Ta = 25°C) Characteristics LED Test Condition Min Typ. Max Unit Forward voltage VF IF = 10 mA 1.0 1.15 1.3 V Reverse current IR VR = 5 V ⎯ ⎯ 10 μA V = 0, f = 1 MHz ⎯ 30 ⎯ pF Off-state current IOFF VOFF = 60 V ⎯ 1 1000 nA Capacitance COFF VOFF = 0, f = 1 MHz ⎯ 10 ⎯ pF Capacitance Detector Symbol CT 2 2009-12-22 TLP173A Coupled Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Trigger LED current IFT ION = 70 mA ⎯ 0.6 2 mA Return LED current IFC IOFF = 100 μA 0.1 ⎯ ⎯ mA On-state resistance RON ION = 70 mA, IF= 3 mA ⎯ 25 50 Ω Min Typ. Max Unit 0.4 ⎯ pF ⎯ Ω Isolation Characteristics (Ta = 25°C) Characteristics Symbol Capacitance input to output CS Isolation resistance RS Test Condition VS = 0 V, f = 1 MHz ⎯ 10 VS = 500 V, R.H. .≤ 60% 5 × 10 10 3750 ⎯ ⎯ AC, 1 s, in oil ⎯ 10000 ⎯ DC, 1 min, in oil ⎯ 10000 ⎯ Vdc Min Typ. Max Unit ⎯ 1.0 5.0 AC, 1 min Isolation voltage BVS 14 Vrms Switching Characteristics (Ta = 25°C) Characteristics Symbol Turn-on time tON Turn-off time tOFF Test Condition RL = 200 Ω (Note.2) VDD = 10 V, IF = 3 mA RL = 200 Ω (Note.2) VDD = 10 V, IF = 3 mA ms ⎯ 0.5 5.0 Note 2: Switching time test circuit IF 1 6 RL VDD IF VOUT 3 VOUT 4 10% tON 3 90% tOFF 2009-12-22 TLP173A I F ─ Ta I ON ─ Ta (mA) ION 50 40 Allowable On-sate current Allowable forward current IF (mA) 60 30 20 10 0 -40 -20 0 20 40 60 Ambient temperature 80 100 80 70 60 50 40 30 20 10 0 -40 Ta (°C) -20 0 (mA) ION (mA) Allowable On-sate current Forward current IF 10 1 0.9 1.0 1.1 1.2 Forward voltage VF 1.3 1.4 20 0 -20 -40 -60 -80 -2 -1 0 1 VON 2 (V) I FT ─ Ta 2.8 ION = 70mA (mA) (Ω) I FT Trigger LED current RON On-sate resistance Ta (°C) 40 On-sate voltage 20 10 0 -20 100 Ta = 25℃ IF = 3mA 60 (V) IF = 3mA ION = 70mA -40 80 80 RON ─ Ta 30 60 I ON ─ VON Ta = 25℃ 0.1 0.8 40 Ambient temperature I F ─ VF 100 20 0 20 40 Ambient temperature 60 80 100 2.4 2.0 1.6 1.2 0.8 0.4 0 0.0 -40 Ta (°C) -20 0 20 40 Ambient temperature 60 80 100 Ta (°C) *: The above graphs show typical characteristics. 4 2009-12-22 TLP173A tON,tOFF ─ I F tON,tOFF ─ Ta 10 IF = 3mA VDD = 10V RL = 200Ω (ms) tON,tOFF 0.1 tOFF tON Switching time tON,tOFF 1 Switching time (ms) 10 VDD = 10V RL = 200Ω Ta = 25℃ 0.01 0.1 1 10 Forward current IF 100 (mA) tON 1 tOFF 0.1 -40 -20 0 20 40 Ambient temperature 60 80 100 Ta (°C) I OFF ─ Ta VOFF = 60V 1 Off-state current I OFF (nA) 10 0.1 0.01 0.001 -40 -20 0 20 40 Ambient temperature 60 80 100 Ta (°C) *: The above graphs show typical characteristics. 5 2009-12-22 TLP173A Precautions about the Soldering of the SMD Type Photocoupler ＜Types＞ TLP173A(F) ＜Mounting Method＞ 1) Using Solder Reflow ・Temperature profile example of lead (Pb) solder (°C) Package surface temperature 240 210 160 140 less than 30s 60～120s Time (s) ・Temperature profile example of using lead (Pb-free) solder (°C) Package surface temperature 260 230 190 180 60～120s 30～50s Time (s) ・The use of the reflow is to twice. ・In case of second reflow soldering should be performed within 2 weeks of the first reflow under the above conditions. 2) Using Solder Flow (for lead (Pb) solder, or lead (Pd)-free solder) ・Please preheat is at 150°C between 60 and 120 seconds. ・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once. ・The use of the reflow is to once. 3) Using a Soldering Iron ・Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated at most once. 6 2009-12-22 TLP173A Specification for Embossed-Tape Packing (TP) for Mini-Flat Coupler 1. Applicable Package Package Product Type MF-SOP6 Mini-Flat Coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. （Example） ＴＬＰ１７３A（ＴＰＬ，Ｆ） [[G]]/RoHS COMPATIBLE(Note 3) Tape type Device name 3. Tape Dimensions 3.1 Specification Classification Are as Shown in Table 1 3.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Figure１ Device Orientation 7 2009-12-22 TLP173A 3.3 Empty Device Recesses Are as Shown in Table 2. Table 2 Empty Device Recesses Standard Remarks 0 Within any given 40-mm section of tape, not including leader and trailer Occurrences of 2 or more successive empty device recesses Single empty device recesses 6 device (max.) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only a cover tape. 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3. 0.3 ± 0.05 A G K0 12.0 ± 0.3 B D E +0.1 φ1.5 −0 F φ1.6 ± 0.1 3.15 ± 0.2 Figure 2 Tape Forms Table 3 Tape Dimensions Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 4.2 ― B 7.6 ― D 5.5 Center line of indented square hole and sprocket hole E 1.75 F 8.0 G 4.0 K0 2.8 Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max.) per 10 feed holes Cumulative error +0.1 (max.) per 10 feed holes -0.3 Internal space 8 2009-12-22 TLP173A 3.6 Reel (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4. Table 4 Reel Dimensions A C U B Unit: mm E Symbol Dimension A Φ380 ±2 B Φ80 ±1 C Φ13 ±0.5 E 2.0 ±0.5 U 4.0 ±0.5 W1 13.5 ±0.5 W2 17.5 ±1.0 W1 W2 Figure 3 Reel Form 4. Packing Either one reel or five reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. （Example） TLP173A (TPL,F) 3000 pcs Quantity (must be a multiple of 3000) [[G]]/RoHS COMPATIBLE(Note 3) Tape type Device name Note 3 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. 9 2009-12-22 TLP173A RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 10 2009-12-22