TLP284 TOSHIBA Photocoupler GaAs Ired & Photo−Transistor TLP284 Programmable Controllers AC/DC−Input Module Hybrid ICs Unit in mm TLP284 TLP284 consist of photo transistor, optically coupled to two gallium arsenide infrared emitting diode connected inverse parallel, and can operate directly by AC input current Since TLP284 are guaranteed wide operating temperature (Ta=-55 to 110 ˚C) and high isolation voltage (3750Vrms), it’s suitable for high-density surface mounting applications such as programmable controllers and hybrid ICs. • Collector−emitter voltage : 80 V (min) • Current transfer ratio Rank GB : 50% (min) :100% (min) • Isolation voltage • Guaranteed performance over -55 to 110 ˚C • UL Recognized : UL1577 , File No. E67349 • cUL Recognized : CSA Component Acceptance Service No.5A • BSI (under application) : BS EN 60065: 2002, : BS EN 60950-1: 2006 • : 3750 Vrms (min) Pin Configuration Option (V4) VDE approved : EN60747-5-2 Maximum operating insulation voltage : 707 Vpk Highest permissible over voltage : 6000 Vpk ( Note ) When a EN60747-5-2 approved type is needed, please designate the “Option(V4)” TLP284 1 4 2 3 1 : Anode Cathode 2 : Cathode Anode 3 : Emitter 4 : Collector Construction Mechanical Rating Creepage Distance Clearance Insulation Thickness TOSHIBA 11-3A1 Weight: 0.05 g (typ.) 5.0 mm (min) 5.0 mm (min) 0.4 mm (min) 1 2009-05-27 TLP284 Current Transfer Ratio TYPE ClassiFication(Note1) TLP284 Current Transfer Ration (%) (IC / IF) Marking of Classification IF = 5 mA, VCE = 5 V, Ta = 25℃ Min Max Blank 50 600 Blank ,YE,GR,BL,GB Rank Y 50 150 YE Rank GR 100 300 GR Rank BL 200 600 BL Rank GB 100 600 GB Note1: Ex. rank GB: TLP284 (GB) Application type name for certification test, please use standard product type name, i.e. TLP284 (GB): TLP284 Absolute Maximum Ratings (Ta = 25°C) Symbol Rating Unit Forward current IF(RMS) ±50 mA Forward current derating ΔIF /°C -1.0 (Ta ≥ 75°C) mA /°C IFP ±1 A Tj 125 °C Collector−emitter voltage VCEO 80 V Emitter−collector voltage VECO 7 V Collector current IC 50 mA Collector power dissipation (1 circuit) PC 150 mW Collector power dissipation derating (Ta ≥ 25°C) ΔPC /°C −1.5 mW /°C LED Characteristic Pulse forward current (Note2) Detector Junction temperature Tj 125 °C Storage temperature range Junction temperature Tstg −55~125 °C Operating temperature range Topr −55~110 °C Lead soldering temperature Tsol 260 (10s) °C Total package power dissipation PT 200 mW Total package power dissipation derating (Ta ≥ 25°C) ΔPT /°C −2.0 mW /°C BVS 3750 Vrms Isolation voltage (Note3) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note2: Pulse width ≤ 100μs, frequency 100Hz Note3: AC, 1min., R.H.≤ 60%, Device considered a two terminal device: LED side pins shorted together and detector side pins shorted together. 2 2009-05-27 TLP284 Individual Electrical Characteristics (Ta = 25°C) Detector LED Characteristic Symbol Test Condition Min Typ Max Unit Forward voltage VF IF = ±10 mA 1.0 1.15 1.3 V Capacitance CT V = 0, f = 1 MHz ― 60 — pF Collector−emitter breakdown voltage V(BR) CEO IC = 0.5 mA 80 ― — V Emitter−collector breakdown voltage V(BR) ECO IE = 0.1 mA 7 ― — V ― 0.01 (2) 0.1 (10) μA ― 2 (4) 50 (50) μA ― 10 ― pF Collector dark current (Note 5) Capacitance (collector to emitter) ICEO CCE VCE = 48 V, Ambient light below (100 ℓx) VCE = 48 V, Ta = 85°C Ambient light below (100 ℓx) (Note 4) (Note 4) V = 0, f = 1 MHz Note 4: Irradiation to marking side using standard light bulb. Note 5: Because of the construction, leak current might be increased by ambient light. Please use photocoupler with less ambient light. Coupled Electrical Characteristics (Ta = 25°C) Characteristic Current transfer ratio Saturated CTR Collector−emitter saturation voltage Symbol IC / IF IC / IF (sat) VCE (sat) Test Condition MIn Typ. Max 50 — 600 100 — 600 — 60 — 30 — — IC = 2.4 mA, IF = ±8 mA — — 0.4 IC = 0.2 mA, IF = ±1 mA — 0.2 — — — 0.4 — — 10 μA 0.33 — 3 — IF = ±5 mA, VCE = 5 V Rank GB IF = ±1 mA, VCE = 0.4 V Rank GB Rank GB Off−state collector current CTR symmetry IC(off) IC (ratio) VF = ± 0.7 V, VCE = 48 V IC (IF = −5 mA) / IC (IF = 5 mA) Note 6 Unit % % V Note 6: IF1 = 5V) I (I = I , V IC(ratio) = C2 F F2 CE IC1(IF = IF1, VCE = 5V) IC1 IC2 VCE IF2 3 2009-05-27 TLP284 Isolation Characteristics (Ta = 25°C) Characteristic Symbol Capacitance input to output CS Isolation resistance RS Test Condition VS = 0V, f = 1 MHz VS = 500 V, R.H.≤ 60% BVS Typ. Max Unit — 0.8 — pF — Ω 1×10 AC, 1 minute Isolation voltage Min 12 10 14 3750 — — AC, 1 second, in oil — 10000 — DC, 1 minute, in oil — 10000 — Vdc Min Typ. Max Unit — 2 — — 3 — — 3 — — 3 — — 2 — — 25 — — 40 — Vrms Switching Characteristics (Ta = 25°C) Characteristic Symbol Rise time tr Fall time tf Turn−on time ton Turn−off time toff Turn−on time tON Storage time ts Turn−off time tOFF Test Condition VCC = 10 V, IC = 2 mA RL = 100 Ω RL = 1.9 kΩ VCC = 5 V, IF = ±16 mA (Fig.1) μs μs (Fig. 1): Switching time test circuit IF RL VCC IF VCE VCE tON 4 tS VCC 4.5V 0.5V tOFF 2009-05-27 TLP284 I F - Ta P C - Ta I F (mA) 100 200 180 80 Allowable collector power Dissipation PC (mW) 160 Allowable forward current 60 120 100 ) 40 140 20 80 60 40 20 0 -20 0 20 40 60 Ambient temperature 80 Ta 100 0 120 -20 0 20 40 Ambient temperature (˚C) IFP-DR Ta 100 120 (˚C) 100 PULSE WIDTH Ta=25˚C IF 300 Forward current IFP 1000 500 (mA) ≦100μs Pulse forward current (mA) 80 IF-VF 3000 100 50 30 10 100˚C 75˚C 50˚C 25˚C 0˚C -25˚C -50˚C 1 0.1 10 10-1 10-2 10-3 Duty cycle ratio 100 0.6 DR 0.8 1 1.2 Forward voltage ∆ V F / ∆ Ta - I F 1.4 VF 1.6 (V) IFP – VFP 1000 (mA) -3.2 -2.8 IFP -2.4 -2 Pulse forward current Forward voltage temperature coefficient ΔVF /ΔTa (mV/℃) 60 -1.6 -1.2 -0.8 100 10 Pulse width≦10μs Repetitive Frequency=100Hz Ta=25℃ 1 0.6 -0.4 0.1 0.5 1 Forward current 5 IF 10 1 1.4 1.8 2.2 2.6 3 50 (mA) Pulse forward voltage VFP (V) *The above graphs show typical characteristic. 5 2009-05-27 TLP284 IC-VCE IC-VCE 30 50 Ta=25˚C (mA) Ta=25˚C 40 50 IC 30 30 20 Collector current Collector current IC (mA) PC (MAX.) 15 20 10 10 IF=5mA 0 0 5 Collector-emitter voltage 25 20 50 30 15 20 15 10 10 5 5 IF=2mA 0 0 10 IC-IF (V) 101 ID (ICEO) (μA) (mA) 10 SAMPLE A Collector dark current IC VCE I C E O - Ta 100 Collector current 1 Collector-emitter voltage (V) VCE 0.5 SAMPLE B 1 VCE=10V VCE=5V VCE=0.4V 0.1 0.1 1 Forward current 10 IF 100 10-1 VCE=48V -2 10 24V 10V 5V 10-3 10-4 0 100 (mA) 20 40 60 Ambient temperature 80 Ta 100 120 (℃) IC/IF -IF 1000 VCE=10V Current transfer ratio IC / IF (%) VCE=5V VCE=0.4V SAMPLE A 100 SAMPLE B 10 0.1 1 Forward current 10 IF 100 (mA) *The above graphs show typical characteristic. 6 2009-05-27 TLP284 V C E ( s a t ) - Ta I C - Ta 100 0.28 25 (mA) 10 0.2 Collector current IC collector-Emitter saturation Voltage VCE(sat) (V) 0.24 0.16 0.12 0.08 IF=8mA, IC=2.4mA 0.04 IF=1mA, IC=0.2mA 0 20 40 60 Ambient temperature 1 1 IF=0.5mA 0.1 0.01 80 100 120 Ta 5 VCE=5V 0 -40 -20 10 -40 (℃) -20 0 20 40 60 Ambient temperature Switching time - RL 80 Ta 100 120 (℃) S w i t c h i n g t i m e - Ta 100 1000 Ta=25˚C IF=16mA tOFF VCC=5V ts 10 (μs) 100 ts Switching time Switching time (μs) tOFF 10 tON 1 IF=16mA VCC=5V RL=1.9kΩ tON 0.1 1 1 10 Load resistance -60 100 -40 -20 0 20 40 Ambient temperature RL (kΩ) 60 Ta 80 100 120 (℃) *The above graphs show typical characteristic. 7 2009-05-27 TLP284 Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow ·Temperature profile example of lead (Pb) solder (°C) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 240 210 160 140 less than 30s 60 to 120s Time (s) ·Temperature profile example of using lead (Pb)-free solder (°C) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 260 230 190 180 60 to 120s 30 to 50s Time (s) 2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) ・Please preheat it at 150°C between 60 and 120 seconds. ・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once. 3) Using a soldering iron Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated at most once. 8 2009-05-27 TLP284 2. Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%, respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 9 2009-05-27 TLP284 Option:Specification for Embossed-Tape Packing (TP) for Mini-Flat Coupler 1. Applicable Package Package Product Type SOP4 Mini-Flat Coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. （Example） ＴＬＰ２８4（ＧＢ－ＴＰ，Ｆ） [[G]]/RoHS COMPATIBLE (Note7) Tape type CTR rank Device name 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. P284 Tape feed Figure１ Device Orientation 3.2 Tape Packing Quantity：2500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table１ Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Single empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer 0 6 device (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 10 2009-05-27 TLP284 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2. 2.0 ± 0.1 +0.1 φ1.5 −0 F G K0 12.0 ± 0.3 B D E 0.3 ± 0.05 A φ1.6 ± 0.1 2.5 ± 0.2 Figure２ Table２ Tape Forms Tape Dimensions Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 3.1 ― B 7.5 ― D 5.5 Center line of indented square hole and sprocket hole E 1.75 F 8.0 G 4.0 K0 2.3 Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 11 2009-05-27 TLP284 3.6 Reel (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3. Table3 Reel Dimensions Symbol Dimension A Φ330 ±2 B Φ80 ±1 C Φ13 ±0.5 E 2.0 ±0.5 U 4.0 ±0.5 W1 13.5 ±0.5 W2 17.5 ±1.0 A C U B Unit: mm E W1 W2 Figure3 Reel Form 4. Packing Either one reel or ten reels of photocoupler are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as shown in the following example. （Example） ＴＬＰ２８4（ＧＢ－ＴＰ，Ｆ）2500 pcs. Quantity (must be a multiple of 2500) [[G]]/RoHS COMPATIBLE (Note7) Tape type CTR rank Device name Note7 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. 12 2009-05-27 TLP284 TOSHIBA Photocoupler Option:(V4) Attachment : Specifications for EN60747-5-2 option: (V4) Types : TLP284(F) Type designations for “option: (V4)”, which are tested under EN60747 requirements. Ex.: TLP284 (V4-GB-TP,F) V4 : EN60747 option GB : CTR rank type TP : Standard tape & reel type F : [[G]]/RoHS COMPATIBLE (Note 7 ) Note: Use TOSHIBA standard type number for safety standard application. Ex.: TLP284 (V4-GB-TP,F) → TLP284 EN60747 Isolation Characteristics Description Symbol Rating Unit Application classification I-IV I-III for rated mains voltage ≤ 150Vrms for rated mains voltage ≤ 300Vrms Climatic classification ― 55 / 110 / 21 ― 2 ― VIORM 707 Vpk Input to output test voltage, Method A Vpr=1.5 × VIORM, type and sample test tp=10s, partial discharge<5pC Vpr 1060 Vpk Input to output test voltage, Method B Vpr=1.875 × VIORM, 100% production test tp=1s, partial discharge<5pC Vpr 1325 Vpk Highest permissible overvoltage (transient overvoltage, tpr=60s) VTR 6000 Vpk Safety limiting values (max. permissible ratings in case of fault, also refer to thermal derating curve) current (input current IF, Psi=0) power (output or total power dissipation) temperature Isi Psi Tsi 250 400 150 mA mW ℃ Insulation resistance Rsi ≥10 Pollution degree Maximum operating insulation voltage VIO=500V, Ta=Tsi 13 9 Ω 2009-05-27 TLP284 Insulation Related Specifications Minimum creepage distance Cr 5.0mm Minimum clearance Cl 5.0mm Minimum insulation thickness ti 0.4mm CTl 175 Comparative tracking index 1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g. at a standard distance between soldering eye centers of 3.5mm). If this is not permissible, the user shall take suitable measures. 2. This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuit. VDE test sign：Marking on product for EN60747 Ｖ ：Marking on packing for EN60747 VDE Marking Example： TLP284(F) CTR Rank Marking v Mark for option(V4) Type name without “TL” P284 1pin indication Lot No. 14 2009-05-27 TLP284 Figure 1 Partial discharge measurement procedure according to EN60747 Destructive test for qualification and sampling tests. Method A (for type and sampling tests, destructive tests) t1, t2 t3, t4 tp(Measuring time for partial discharge) tb tini Figure VINITIAL(6kV) V Vpr(1060V) = 1 to 10 s =1s VIORM(707V) = 10 s = 12 s = 60 s 0 t1 tini t3 tP t2 tb 2 Partial discharge measurement procedure according to EN60747 Non-destructive test for100% inspection. Method B Vpr(1325V ) V (for sample test,nondestructive test) t3, t4 tp(Measuring time for partial discharge) tb VIORM(707V ) = 0.1 s =1s = 1.2 s Isi (mA) t tP t3 Figure t t4 tb t4 3 Dependency of maximum safety ratings on ambient temperature 500 500 400 400 300 300 200 100 0 → Isi ← 0 25 50 Psi (mW) 200 Psi 100 75 100 125 150 0 175 Ta (°C) 15 2009-05-27 TLP284 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 16 2009-05-27