TLP266J
Photocouplers
GaAs Infrared LED & Photo Triac
TLP266J
1. Applications
•
Triac Drivers
•
Programmable Logic Controllers (PLCs)
•
AC-Output Modules
•
Solid-State Relays
2. General
The TLP266J consists of a zero crossing photo triac, optically coupled to a gallium arsenide infrared emitting
diode. The TLP266J is housed in the SO6 package and guarantees a creepage distance of 5.0 mm (min), a clearance
of 5.0 mm (min) and insulation thickness of 0.4 mm (min). Therefore, the TLP266J meets the reinforced insulation
class requirements of international safety standards.
3. Features
(1)
Peak off-state voltage: 600 V (min)
(2)
Zero crossing functionary (ZC)
(3)
Trigger LED current: 10 mA (max)
(4)
On-state current: 70 mA (max)
(5)
Isolation voltage: 3750 Vrms (min)
(6)
Safety standards
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
VDE-approved: Option (V4) EN60747-5-5 (Note)
Maximum operating insulation voltage: 707 Vpeak
Note:
Highest permissible overvoltage: 6000 Vpeak
When an EN60747-5-5 approved type is needed, please designate the Option (V4)
(V4).
Trigger LED Current (Note) (Unless otherwise specified, Ta = 25 )
Table
Rank
IFT Rank
Marking
None
10
(IFT7)
7
Note:
Trigger LED Current IFT
(min)
Trigger LED Current IFT
(max)
Unit
VT = 3 V
10
mA
VT = 3 V
7
Test Condition
Specify both the part number and a rank in this format when ordering.
Example: TLP266J (IFT7)
For safety standard certification, however, specify the part number alone.
Example: TLP266J
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4. Packaging and Pin Assignment
1: Anode
3: Cathode
4: Triac Terminal
6: Triac Terminal
11-4M1S
5. Mechanical Parameters
Characteristics
2.54-mm pitch
Unit
Creepage distances
5.0 (min)
mm
Clearance distances
5.0 (min)
Internal isolation thickness
0.4 (min)
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6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Input forward current
Input forward current derating
(Ta ≥ 53 )
Note
Rating
Unit
IF
30
mA
∆IF/∆Ta
-0.3
mA/
Input forward current (pulsed)
IFP
1
A
Input reverse voltage
VR
5
V
Junction temperature
Tj
125
Input power dissipation
PD
50
mW
VDRM
600
V
IT(RMS)
70
mA
Detector Off-state output terminal voltage
(Note 1)
R.M.S. on-state current
(Ta = 25 )
R.M.S. on-state current
(Ta = 70 )
IT(RMS)
40
R.M.S. on-state current derating
(Ta ≥ 25 )
∆IT(RMS)/∆Ta
-0.67
mA/
ON-state current (pulsed)
IONP
(Note 2)
2
A
Peak non-repetitive surge current
ITSM
(Note 3)
1.2
A
Junction temperature
Tj
125
Input power dissipation
PD
200
mW
Common Operating temperature
Topr
-40 to 100
Tstg
-55 to 125
Storage temperature
Lead soldering temperature
Isolation voltage
(10 s)
Tsol
AC, 1 min, R.H. ≤ 60 %
BVS
260
(Note 4)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 100 µs, 100 pps
Note 2: Pulse width (PW) ≤ 100 µs, 120 pps
Note 3: Pulse width (PW) ≤ 10 ms
Note 4: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are
shorted together.
7. Recommended Operating Conditions (Note)
Characteristics
Symbol
AC mains voltage
Input forward current
Note
Min
Typ.
Max
Unit
VAC
240
V
IF
15
20
25
mA
ON-state current (pulsed)
IONP
1
A
Operating temperature
Topr
-25
85
Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
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8. Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Input forward voltage
Note
Test Condition
Min
Typ.
Max
Unit
1.27
1.4
V
VF
IF = 10 mA
1.0
Input reverse current
IR
VR = 5 V
10
µA
Input capacitance
Ct
V = 0 V, f = 1 MHz
30
pF
Detector Peak off-state current
IDRM
VDRM = 600 V
10
1000
nA
Peak on-state voltage
VTM
ITM = 70 mA
1.7
2.8
V
Holding current
IH
Critical rate of rise of off-state
voltage
dv/dt
Critical rate of rise of
commutating voltage (dv/dt)
dv/dt(c)
Vin = 240 V, Ta = 85
See Fig. 8.1.
0.6
mA
200
500
V/µs
0.2
Vin = 60 Vrms, IT = 15 mA
See Fig. 8.1.
Fig. 8.1 dv/dt Test Circuit
9. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
10
mA
Trigger LED current
IFT
VT = 3 V
Inhibit voltage
VIH
IF = Rated IFT
30
V
Inhibit current
IIH
IF = Rated IFT
VT = Rated VDRM
200
600
µA
Turn-on time
ton
VD = 6 → 4 V, RL = 100 Ω,
IF = Rated IFT × 1.5 mA
30
100
µs
Min
Typ.
Max
Unit
0.8
pF
1 × 1012
1014
Ω
Vrms
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Total capacitance (input to output)
CS
(Note 1) VS = 0 V, f = 1 MHz
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60%
Isolation voltage
BVS
(Note 1) AC, 1 min.
3750
AC, 1 s in oil
10000
DC, 1 min. in oil
10000
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are
shorted together.
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11. Characteristics Curves (Note)
Fig. 11.1 IF - Ta
Fig. 11.2 IT(RMS) - Ta
Fig. 11.3 IF - VF
Fig. 11.4 IFP - DR
Fig. 11.5 IFP - VFP
Fig. 11.6 Normalized IFT - Ta
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Fig. 11.7 Normalized IDRM - Ta
Fig. 11.8 Normalized VDRM - Ta
Fig. 11.9 Normalized IH - Ta
Fig. 11.10 Normalized VIH - Ta
Fig. 11.11 Normalized IIH - Ta
Note:
The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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12. Soldering and Storage
12.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow (See Fig. 12.1.1 and 12.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 12.1.1 An Example of a Temperature
Profile When Sn-Pb Eutectic Solder Is Used
•
Fig. 12.1.2 An Example of a Temperature
Profile When Lead(Pb)-Free Solder Is Used
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350 Heating by soldering iron must be done only once per lead.
12.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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13. Land Pattern Dimensions (for reference only)
(Unit: mm)
14. Marking (Note)
Note:
A different marking is used for photocouplers that have been qualified according to option (V4) of EN60747.
See Fig.15.4.
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15. EN60747-5-5 Option (V4) Specification
•
Part number: TLP266J (Note)
•
The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP266J(V4-TPL,E(O
V4: EN60747 option
TPL: Tape type
E: [[G]]/RoHS COMPATIBLE (Note 1)
Note: Use TOSHIBA standard type number for safety standard application.
e.g., TLP266J(V4-TPL,E(O → TLP266J
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Fig. 15.1 EN60747 Insulation Characteristics
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Fig. 15.2 Insulation Related Specifications (Note)
Note:
Note:
If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall
take suitable measures.
This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 15.3 Marking on packing
for EN60747
Fig. 15.4 Marking Example (Note)
Note:
The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747.
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Fig. 15.6 Measurement Procedure
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Package Dimensions
Unit: mm
Weight: 0.08 g (typ.)
Package Name(s)
TOSHIBA: 11-4M1S
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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