TSC TESDE5V0_11

TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
0503
Features
—Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
—Designed for mounting on small surface.
—Moisture sensitivity level 1
—Protects one birectional I/O line
—Working Voltage : 5V, 12V, 24V
—Pb free version, RoHS compliant, and Halogen free
Mechanical Data
Dimensions
—Case : 0503 standard package, molded plastic
Unit (mm)
Unit (inch)
Min
Max
Min
Max
0.053
—Terminal: Gold plated,solder
per MIL-STD-750, Method 2026 guaranteed
A
1.15
1.35
0.045
B
0.65
0.85
0.026
0.034
—High temperature soldering guaranteed: 260°C/10s
C
0.60.
0.75
0.024
0.030
—Mounting position: Any
D
0.40(Typ.)
0.016(Typ.)
—Weight :2 mg (approximately)
E
0.55(Typ.)
0.022(Typ.)
—Marking Code : E05, E12, E24
Applications
Pin Configutation
—Cell Phone Handsets and Accessories
—Notebooks, Desktops, and Servers
—Keypads, Side Keys, USB 2.0, LCD Displays
—Portable Instrumentation
—Touch panel
Suggested PAD Layout
0.55
Ordering Information
0.022
0.85
Part No.
Package code Package
Packing
Marking
4K / 7" Reel
E05
TESDE5V0
RZG
0503
TESDE12V
RZG
0503
4K / 7" Reel
E12
TESDE24V
RZG
0503
4K / 7" Reel
E24
0.033
0.012
1.40
Unit :
0.055
mm
inch
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Symbol
Type Number
Value
TESDE5V0
Peak Pulse Power (tp=8/20μs
waveform)
TESDE12V
75
PPP
25
TESDE24V
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
Junction and Storage Temperature Range
Units
W
47
±15
±8
VESD
TJ, TSTG
.
KV
-55 to + 150
.
°C
Version : C11
TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
Electrical Characteristics
Type Number
Symbol
TESDE5V0
Reverse Stand-Off Voltage
Min
Max
-
5
VRWM
TESDE12V
12
TESDE5V0
TESDE12V
IR= 1mA
V(BR)
TESDE24V
Reverse Leakage Current
TESDE5V0
VR=
5V
TESDE12V
VR=
12V
VR=
24V
IPP=
1A
TESDE24V
Clamping Voltage
TESDE5V0
Clamping Voltage
TESDE12V
Clamping Voltage
TESDE24V
IPP=
5A
IPP=
1A
IPP=
5A
IPP=
1A
IPP=
5A
IR
Vc
Vc
Vc
TESDE12V
TESDE24V
5.1
-
13
-
25
-
-
2
-
9.8
-
15
-
25
-
33
-
47
-
51
V
uA
V
V
V
15 (Typ.)
TESDE5V0
Junction Capacitance
V
24
TESDE24V
Reverse Breakdown Voltage
Units
VR=0V, f=1.0MHz
CJ
12 (Typ.)
pF
10 (Typ.)
Version : C11
TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
Rating and Sharacteristic Curves
FIG 1 Non-Repetitive Peak Pulse Power vs. Pulse Time
10
FIG 2 Pulse Waveform
110
Waveform Parameters:
tr = 8μs, td = 20μs
90
80
Percent of IPP
Peak Pulse Power Ppp (KW)
100
1
70
60
50
td=Ipp/2
40
0.1
30
20
10
0
0.01
0.1
1
10
100
0
1000
5
10
15
20
25
30
Time (us)
FIG 3 Admissible Power Dissipation Curve
FIG 4 Typical Junction Capacitance
15
120
Normalized Capacitance
Power Rating (%)
100
TESDE5V0
10
80
60
40
TESDE12V
TESDE24V
5
20
f = 1.0MHz
0
0
0
20
40
60
80
100
120
140
160
180
o
Ambient Tempeatature ( C)
0
5
10
15
20
25
Reverse Voltage (V)
FIG 5 Clamping Voltage vs. Peak Pulse Current)
60
Clamping Voltage (V)
50
TESDE24V
40
30
TESDE12V
20
10
Waveform Parameters
tr = 8μs, td = 20μs
TESDE5V0
0
0
1
2
3
4
5
Peak Pulse Current (A)
Version : C11
TESDE5V0/TESDE12V/TESDE24V
Bi-directional ESD Protection Diode
Small Signal Diode
Applications Information
—Designed to protect one data, I/O, or power supply line.
—Designed to protect sensitive electronics from damage or latch-up due to ESD
—Designed to replace multilayer varistors (MLVs) in portable applications
—Features large crosssectional area junctions for conducting high transient currents
—Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs
—The combination of small size and high ESD surge capability makes them ideal for use in portable applications.
Circuit Board Layout Recommendations
Good circuit board layout is critical for the suppression of ESD induced transients.
—Place the ESD Protection Diode near the input terminals or connectors to restrict transient coupling.
—Minimize the path length between the ESD Protection Diode and the protected line.
—Minimize all conductive loops including power and ground loops.
—The ESD transient return path to ground should be kept as short as possible.
—Never run critical signals near board edges.
—Use ground planes whenever possible.
Tape & Reel specification
TSC label
Symbol
Dimension
(mm)
Carrier width
A
0.90 ± 0.10
Carrier length
B
1.46 ± 0.10
Carrier depth
C
0.80 ± 0.10
Sprocket hole
d
1.55 ± 0.05
Reel outside diameter
D
178 ± 1
Reel inner diameter
D1
60.0 Min
Feed hole width
D2
13.0 ± 0.20
Sprocket hole position
E
1.75 ±0.10
Punch hole position
F
3.50 ±0.05
Punch hole pitch
P
4.00 ±0.10
Sprocket hole pitch
P0
4.00 ±0.10
Embossment center
P1
2.00 ±0.05
Overall tape thickness
T
0.23 ± 0.05
Tape width
W
8.00 ±0.20
Reel width
W1
13.5 Max
Item
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
P0
d
P1
T
E
A
C
F
W
B
W1
D
D2
D1
Direction of Feed
Version : C11