TESDE5V0/TESDE12V/TESDE24V Bi-directional ESD Protection Diode Small Signal Diode 0503 Features Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) Designed for mounting on small surface. Moisture sensitivity level 1 Protects one birectional I/O line Working Voltage : 5V, 12V, 24V Pb free version, RoHS compliant, and Halogen free Mechanical Data Dimensions Case : 0503 standard package, molded plastic Unit (mm) Unit (inch) Min Max Min Max 0.053 Terminal: Gold plated,solder per MIL-STD-750, Method 2026 guaranteed A 1.15 1.35 0.045 B 0.65 0.85 0.026 0.034 High temperature soldering guaranteed: 260°C/10s C 0.60. 0.75 0.024 0.030 Mounting position: Any D 0.40(Typ.) 0.016(Typ.) Weight :2 mg (approximately) E 0.55(Typ.) 0.022(Typ.) Marking Code : E05, E12, E24 Applications Pin Configutation Cell Phone Handsets and Accessories Notebooks, Desktops, and Servers Keypads, Side Keys, USB 2.0, LCD Displays Portable Instrumentation Touch panel Suggested PAD Layout 0.55 Ordering Information 0.022 0.85 Part No. Package code Package Packing Marking 4K / 7" Reel E05 TESDE5V0 RZG 0503 TESDE12V RZG 0503 4K / 7" Reel E12 TESDE24V RZG 0503 4K / 7" Reel E24 0.033 0.012 1.40 Unit : 0.055 mm inch Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Maximum Ratings Symbol Type Number Value TESDE5V0 Peak Pulse Power (tp=8/20μs waveform) TESDE12V 75 PPP 25 TESDE24V ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Junction and Storage Temperature Range Units W 47 ±15 ±8 VESD TJ, TSTG . KV -55 to + 150 . °C Version : C11 TESDE5V0/TESDE12V/TESDE24V Bi-directional ESD Protection Diode Small Signal Diode Electrical Characteristics Type Number Symbol TESDE5V0 Reverse Stand-Off Voltage Min Max - 5 VRWM TESDE12V 12 TESDE5V0 TESDE12V IR= 1mA V(BR) TESDE24V Reverse Leakage Current TESDE5V0 VR= 5V TESDE12V VR= 12V VR= 24V IPP= 1A TESDE24V Clamping Voltage TESDE5V0 Clamping Voltage TESDE12V Clamping Voltage TESDE24V IPP= 5A IPP= 1A IPP= 5A IPP= 1A IPP= 5A IR Vc Vc Vc TESDE12V TESDE24V 5.1 - 13 - 25 - - 2 - 9.8 - 15 - 25 - 33 - 47 - 51 V uA V V V 15 (Typ.) TESDE5V0 Junction Capacitance V 24 TESDE24V Reverse Breakdown Voltage Units VR=0V, f=1.0MHz CJ 12 (Typ.) pF 10 (Typ.) Version : C11 TESDE5V0/TESDE12V/TESDE24V Bi-directional ESD Protection Diode Small Signal Diode Rating and Sharacteristic Curves FIG 1 Non-Repetitive Peak Pulse Power vs. Pulse Time 10 FIG 2 Pulse Waveform 110 Waveform Parameters: tr = 8μs, td = 20μs 90 80 Percent of IPP Peak Pulse Power Ppp (KW) 100 1 70 60 50 td=Ipp/2 40 0.1 30 20 10 0 0.01 0.1 1 10 100 0 1000 5 10 15 20 25 30 Time (us) FIG 3 Admissible Power Dissipation Curve FIG 4 Typical Junction Capacitance 15 120 Normalized Capacitance Power Rating (%) 100 TESDE5V0 10 80 60 40 TESDE12V TESDE24V 5 20 f = 1.0MHz 0 0 0 20 40 60 80 100 120 140 160 180 o Ambient Tempeatature ( C) 0 5 10 15 20 25 Reverse Voltage (V) FIG 5 Clamping Voltage vs. Peak Pulse Current) 60 Clamping Voltage (V) 50 TESDE24V 40 30 TESDE12V 20 10 Waveform Parameters tr = 8μs, td = 20μs TESDE5V0 0 0 1 2 3 4 5 Peak Pulse Current (A) Version : C11 TESDE5V0/TESDE12V/TESDE24V Bi-directional ESD Protection Diode Small Signal Diode Applications Information Designed to protect one data, I/O, or power supply line. Designed to protect sensitive electronics from damage or latch-up due to ESD Designed to replace multilayer varistors (MLVs) in portable applications Features large crosssectional area junctions for conducting high transient currents Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs The combination of small size and high ESD surge capability makes them ideal for use in portable applications. Circuit Board Layout Recommendations Good circuit board layout is critical for the suppression of ESD induced transients. Place the ESD Protection Diode near the input terminals or connectors to restrict transient coupling. Minimize the path length between the ESD Protection Diode and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Tape & Reel specification TSC label Symbol Dimension (mm) Carrier width A 0.90 ± 0.10 Carrier length B 1.46 ± 0.10 Carrier depth C 0.80 ± 0.10 Sprocket hole d 1.55 ± 0.05 Reel outside diameter D 178 ± 1 Reel inner diameter D1 60.0 Min Feed hole width D2 13.0 ± 0.20 Sprocket hole position E 1.75 ±0.10 Punch hole position F 3.50 ±0.05 Punch hole pitch P 4.00 ±0.10 Sprocket hole pitch P0 4.00 ±0.10 Embossment center P1 2.00 ±0.05 Overall tape thickness T 0.23 ± 0.05 Tape width W 8.00 ±0.20 Reel width W1 13.5 Max Item Top Cover Tape Carieer Tape Any Additional Label (If Required) P0 d P1 T E A C F W B W1 D D2 D1 Direction of Feed Version : C11