TESDM5V0A Ultra Low Capacitance ESD Protection Array Small Signal Diode MSOP-08 F A I Features Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) B Meet IEC61000-4-4 (EFT) rating. 40A (5/50ns) E Protects six high speed I/O lines Low leakage, Low Operating and Clamping Voltage Ultra low capacitance H Low working Voltage : 5V C Pb free version, RoHS compliant, and Halogen free D G Unit (mm) Dimensions Unit (inch) Min Max Min Max A 2.90 3.10 0.114 0.122 Case : MSOP-08 small outline plastic package B 2.90 3.10 0.114 0.122 Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed C D 0.22 0.38 0.65REF 0.009 0.015 0.0256REF High temperature soldering guaranteed: 260°C/10s E 4.75 5.05 0.187 Molding Compound Flammability Rating: UL94V-0 F -- 0.25 -- 0.010 Weight : 25mg (Appro.) G 0.13 0.23 0.005 0.009 Marking Code : UC68M H 0.40 0.66 0.016 0.026 I 0.75 0.95 0.030 0.037 Mechanical Data 0.199 Ordering Information Part No. Package Packing Packing code Marking RMG UC68M TESDM5V0A MSOP-08 3K / 7" Reel Pin Configuration Vcc GN IO# IO#6 IO# IO# IO# IO#4 Suggested PAD Layout 1.02 4.8 0.65 0.41 Unit: mm Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Maximum Ratings Type Number Symbol Value Units Peak Pulse Power (tp=8/20μs waveform) PPP 200 W Peak Pulse Current (tp = 8/20μs) IPP 6 A VESD ±15 ±18 KV ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Junction Operation Temperature 150 TJ TJ, TSTG Junction and Storage Temperature Range . °C -55 to + 150 °C . Electrical Characteristics Type Number Reverse Stand-Off Voltage Reverse Breakdown Voltag Reverse Leakage Current Clamping Voltage (tp = 8/20us) Junction Capacitance (Between I/O pins) IR= VR= IPP= IPP= 1mA 5V 1A 6A VR=0V, f=1.0MHz Min - V(BR) 6.5 - V IR - 0.5 9.8 15 uA Vc CJ Max 5 Units V Symbol VRWM 0.5 (Typ.) V pF Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application. Version : B10 TESDM5V0A Ultra Low Capacitance ESD Protection Array Small Signal Diode Rating and Characteristic Curves FIG. 2 Pulse Waveform FIG. 1 Admissible Power Dissipation Curve 110 120 100 Waveform Parameters: tr = 8μs, td = 20μs 90 Percent of IPP Power Rating (%) 100 80 60 80 70 e-1 60 50 40 40 td=Ipp/2 30 20 20 10 0 0 0 20 40 60 80 100 120 140 160 0 180 5 10 Ambient Tempeatature ( C) 20 25 30 FIG. 4 Typical Junction Capacitance FIG. 3 Clamping Voltage vs. Peak Pulse Current 20 1.5 Normalized Capacitance (pF) Clamping Voltage (V) 15 Time (us) o 15 10 Waveform Parameters: tr = 8μs, td = 20μs 5 0 1 f = 1.0MHz VR=0V 0.5 0 0 1 2 3 4 5 Peak Pulse Current (A) 6 7 0 1 2 3 4 5 Reverse Voltage (V) Version : B10 TESDM5V0A Ultra Low Capacitance ESD Protection Array Small Signal Diode Application Information Applications for Microprocess based equipment IEEE1394 Firewire Ports ATM Interfaces High Definition Multi-Media Interface (HDMI) Digital Video Interface (DVI) Video Graphs Cards Designed for protection of high-speed interfaces such as USB3.0 Ultra low capacitance between the pairs while being rated to handle >±8kV ESD contact discharges and >±15kV air discharge TESDM5V0A is ultra low capacitance ESD protection array designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD, CDE (Cable Discharge Events), and EFT (electrical fast transients). 5 4 Pin 6 3 7 2 8 1 Definition 1, 2, 3, 4, 5, 6 I/O Lines 7 Ground 8 Vcc Typical Application RJ45 USB3.0 Connector Schematic Diagram for USB3.0 Protection USB3_TX+ USB3_TXUSB3_RX+ USB3.0 Controller USB3_RXD+ D- 5 4 6 3 7 2 8 1 Vcc Version : B10 TESDM5V0A Ultra Low Capacitance ESD Protection Array Small Signal Diode Carrier & Reel specification TSC label Item Top Cover Tape Carieer Tape Any Additional Label (If Required) Symbol Dimension(mm) Carrier depth K 1.22 Max. Sprocket hole D 1.50 +0.10 Reel outside diameter A 180 ± 1 Reel inner diameter D1 50 Min. Feed hole width D2 13.0 ± 0.5 Sprocke hole position E 1.75 ±0.10 Sprocke hole pitch P0 4.00 ±0.10 Embossment center P1 2.00 ±0.10 Overall tape thickness T 0.6 Max. Tape width W 8.30 Max. Reel width W1 14.4 Max. W1 A D2 D1 Direction of Feed Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10 o within the determined cavity. Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. Version : B10