TESDB5V0A

TESDB5V0A
5V, 2-Channels ESD Protection Array
Small Signal Product
SOT-143
Features
◇ Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
◇ Meet IEC61000-4-4 (EFT) rating. 40A (5/50ns)
◇ Protects two directional I/O lines
◇ Working Voltage : 5V
◇ Pb free version, RoHS compliant, and Halogn free
Mechanical Data
◇ Case : SOT-143 package, molded plastic
◇ Terminal : Matte tin plated, lead free
o
◇ High temperature soldering guaranteed : 260 C/10s
◇ Molding compound flammability Rating : UL 94V-0
◇ Weight : 10 mg (approximately)
Applications
◇ USB Power & Data Line Protection
◇ I2C Bus Protection
◇ Video Line Protection
◇ Microcontroller Input Protections
◇ T1/E1 Secondary IC Side Protection
◇ ISDN S/T Interface
◇ WAN/LAN Equipment
◇ Ethernet 10BaseT
Ordering Information
Part No.
Package
Packing
Packing code
Packing code
(Green)
Marking
TESDB5V0A
SOT-143
3K / 7" Reel
-
RBG
SL3
Manufacture code
Note : Detail please see "Ordering Information(detail, example)" below.
Maximum Ratings and Electrical Characteristics
Rating at 25 oC ambient temperature unless otherwise specified.
Maximum Ratings
Parameter
Peak Pulse Power (tp=8/20μs waveform)
Thermal Resistance form Junction to Ambient
ESD per IEC 61000-4-2 (Air)
Symbol
PPP
Value
RthjA
625
TSTG
Storage Temperature Range
C/W
KV
±8
TJ
Junction Temperature Range
W
o
± 15
VESD
ESD per IEC 61000-4-2 (Contact)
Units
125
-55 to +150
o
C
-55 to +150
o
C
Electrical Characteristics
Parameter
Symbol
VRWM
Min
Max
Units
-
5
V
IR = 1 mA
V(BR)
6
-
V
VRWM = 5 V
IR
-
1
μA
-
9.8
-
10
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Junction Capacitance
IPP = 1 A
IPP = 5 A
VR = 0 V , f = 1.0 MHz
VC
CJ
2
V
pF
Version:C14
Small Signal Product
RATINGS AND CHARACTERISTIC CURVES
Fig. 1 Admissible Power Dissipation Curve
Fig. 2 Pulse Waveform
120
110
100
Waveform parameters:
tr = 8 μs , td = 20 μs
90
80
80
Percent of IPP
Power Rating (%)
100
60
40
20
70
60
e-1
50
40
30
td = Ipp / 2
20
10
0
0
20
40
60
80
100
120
140
160
0
180
0
5
10
Fig. 3 Clamping Voltage VS. Peak Pulse Current
20
25
30
Fig. 4 Typical Junction Capacitance
30
5
Normalized Capacitance (pF)
25
Clamping Voltage (V)
15
Time (us)
Ambient Temperature (oC)
20
15
10
Waveform parameters:
tr = 8 μs , td = 20 μs
5
0
4
3
2
f = 1.0 MHz
1
0
0
1
2
3
4
5
6
7
8
Peak Pulse Current (A)
9
10
11
12
0
1
2
3
4
5
Reverse Voltage (V)
Version : C14
Small Signal Product
Ordering information (Detail, example)
Part No.
Package
Packing
Packing code
Packing code
(Green)
Marking
Manufacture code
TESDB5V0A
SOT-143
3K / 7" Reel
-
RBG
U5V0
(Note)
TESDB5V0A
SOT-143
3K / 7" Reel
-
RBG
U5V0
M0
RBG
U5V0
SOT-143
TESDB5V0A
3K / 7" Reel
Note : Manufacture special control, if empty means no special control requirement.
Tape & Reel specification
Item
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocket hole position
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
K
D
A
D1
D2
E
P0
P1
T
W
W1
Dimension(mm)
1.22 Max.
1.50 ± 0.10
180 ± 1
50 Min.
13.0 ± 0.5
1.75 ±0.10
4.00 ±0.10
2.00 ±0.10
0.6 Max.
8.30 Max.
14.4 Max.
Note 1 : A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
o
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10 within the determined cavity.
Note 2 : If B1 exceeds 4.2mm(0.165") for 8 mm embossed tape, the tape may not feed through all tape feed
Version : C14
Small Signal Product
Dimensions
DIM.
Unit(mm)
Min
Unit(inch)
Max
Min
Max
A
2.800
3.040
0.110
0.120
B
1.200
1.400
0.047
0.055
C
0.750
0.940
0.030
0.037
D
0.300
0.510
0.012
0.020
E
1.800
2.640
0.071
0.104
F
0.000
0.100
0.000
0.004
G
0.080
0.200
0.003
0.008
H
0.300
0.600
0.012
0.024
I
0.750
1.150
0.030
0.045
J
2.100
2.640
0.083
0.104
0.2 TYP.
0.008 TYP.
Unit(mm)
Unit(inch)
K
Suggested PAD Layout
DIM.
Typ.
Typ.
A
2.20
0.087
B
1.92
0.076
C
1.4
0.055
D
1.72
0.068
E
1.0
0.039
F
1.2
0.047
Notes : 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary depending on application.
Applications Information
◇ Designed for the protect tow data lines from transient over-voltages by clmaping them to afixed reference
◇ Data lines are connected at pins 2 and 3
◇ The negative reference (REF1) is connected at pin 1 and which should be connected directly to a ground plane on the board for best results
◇ The positive reference (REF2) is connected at pin 4
Pin
Definition
2, 3
I/O Lines
1
Ground
4
VCC
Version : C14
Small Signal Product
Typical Application
Schematic Diagram for Gigabit Ethernet ESD Protection
◇ Data Line and Power Supply Protection Using VCC
◇ Data Line Protection with Bias and Power Supply Isolation Resistor
◇ Data Line Protection Using Internal ESD Diode
Version : C14