MPX5100 Rev 11, 4/2008 Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and Calibrated The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPX5100/MPXV5100 SERIES INTEGRATED PRESSURE SENSOR 0 to 100 kpa (0 to 14.5 psi) 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.7 V Output SMALL OUTLINE PACKAGES Features • • • • • • 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Absolute, Differential and Gauge Configurations Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option MPXV5100GC6U CASE 482A-01 MPXV5100GC7U CASE 482C-03 Typical Applications • • • • MPXV5100DP CASE 1351-01 Patient Monitoring Process Control Pump/Motor Control Pressure Switching PIN NUMBER(1) ORDERING INFORMATION Device Type Options Case No. MPX Series Order Device Marking Number UNIBODY PACKAGE (MPX5100 SERIES) Basic Absolute Elements Differential Ported Differential Dual Ports Elements Absolute, Single Port MPXV5100GP CASE 1369-01 867 MPX5100A MPX5100A 867 MPX5100D MPX5100D MPX5100DP MPX5100DP 867C 867B MPX5100AP MPX5100AP Gauge, Single Port 867B MPX5100GP MPX5100GP Gauge, Axial PC Mount 867F MPX5100GSX MPX5100D Gauge, Axial Port, SMT 482A MPXV5100GC6U MPXV5100G Gauge, Axial Port, DIP 482C MPX5V100GC7U MPXV5100G Gauge, Dual Port, SMT 1351 MPXV5100DP MPXV5100 Gauge, Side Port, SMT 1369 MPXV5100GP MPXV5100G 1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead. PIN NUMBER(1) 1 2 3 VOUT GND VS 4 5 6 N/C N/C N/C 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. UNIBODY PACKAGES MPX5100A/D CASE 867-08 MPX5100AP/GP CASE 867B-04 © Freescale Semiconductor, Inc., 2005-2008. All rights reserved. MPX5100DP CASE 867C-05 MPX5100GSX CASE 867F-03 VS Thin Film Temperature Compensation and Gain Stage # 1 Sensing Element GND Gain Stage # 2 and Ground Reference Shift Circuitry VOUT Pins 1 and 5 through 8 are NO CONNECTS for small outline packages Pins 4, 5, and 6 are NO CONNECTS for unibody packages Figure 1. Fully Integrated Pressure Sensor Schematic TABLE 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 400 kPa Storage Temperature TSTG -40° to +125°C °C TA -40° to +125°C °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. TABLE 2. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol POP (1) Pressure Range Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A VS Supply Voltage(2) Supply Current Min Typ Max Unit 0 15 — — 100 115 4.75 5.0 5.25 VDC kPa IO — 7.0 10 mAdc (0 to 85°C) VOFF 0.088 0.20 0.313 VDC Full Scale Output(4) @ VS = 5.0 V Differential and Absolute (0 to 85°C) VFSO 4.587 4.700 4.813 VDC Full Scale Span(5) @ VS = 5.0 V Differential and Absolute (0 to 85°C) VFSS — 4.500 — VDC Accuracy(6) — — — ±2.5 %VFSS Sensitivity V/P — 45 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc Warm-Up Time(8) — — 20 — ms — — ±0.5 — %VFSS Minimum Pressure @ VS = 5.0 V Offset Stability (9) Offset(3) 1. 2. 3. 4. 5. 1 kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. MPX5100 2 Sensors Freescale Semiconductor 7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Fluorosilicone Gel Die Coat Die Output Voltage (V) 3 Span Range (Typ) Vout = VS*(0.009*P+0.04) ± (Pressure Error * Temperature Factor * 0.009 * VS VS = 5.0 V ± 0.25 Vdc PE = 2.5 TM = 1 TEMP = 0 to 85°C 4 MAX 2 TYP 1 110 100 90 80 70 60 50 40 30 10 0 20 MIN 0 Pressure (kPa) (Typ) Offset Figure 2. Output Vs. Pressure Differential Stainless Steel Metal Cover Fluorosilicone Gel Die Coat Epoxy Plastic Case Wire Bond Lead Frame 5 Output Range (Typ) ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0× to 85×C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Die Epoxy Plastic Case Wire Bond Die Bond Lead Frame Differential/Gauge Element Stainless Steel Metal Cover Absolute Element Die Bond Figure 3. Cross Sectional Diagrams (Not to Scale) Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. +5.0 V VOUT OUTPUT Vs IPS 1.0 μF 0.01 μF GND 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) MPX5100 Sensors Freescale Semiconductor 3 Transfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04) ± (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ±5% P kPa Temperature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series Break Points Temp 4.0 Multiplier - 40 0 to 85°C +125° 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in °C 80 100 120 140 Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band MPX5100D/MPX5100G/MPXV5100G Series Error Limits for Pressure 3.0 Error (kPa) 2.0 1.0 0.0 0 20 40 60 80 100 120 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) 0 to 100 kPa ± 2.5 kPa MPX5100 4 Sensors Freescale Semiconductor Transfer Function (MPX5100A) Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.095) ± (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ±5% P kPa Temperature Error Multiplier MPX5100A Series Break Points Temp Multiplier 4.0 - 40 0 to 85°C +125° 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in °C Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band MPX5100A Series Error Limits for Pressure 3.0 Error (kPa) 2.0 1.0 0.0 0 20 40 60 80 100 130 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) 15 to 115 kPa ± 2.5 kPa MPX5100 Sensors Freescale Semiconductor 5 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using Table 3 below. TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Part Number MPX5100A, MPX5100D Case Type 867 Pressure (P1) Side Identifier Stainless Steel Cap MPX5100DP 867C Side with Part Marking MPX5100AP, MPX5100GP 867B Side with Port Attached MPX5100GSX 867F Side with Port Attached MPXV5100GC6U 482A Side with Port Attached MPXV5100GC7U 482C Side with Port Attached MPXV5100DP 1351 Side with Part Marking MPXV5100GP 1369 Side with Port Attached INFORMATION FOR USING THE SMALL OUTLINE PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder Figure 5. Small Outline Package Footprint MPX5100 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 4 0.25 (0.010) 5 N M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S V W W V C H J -T- MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE PIN 1 IDENTIFIER M K INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. -A4 5 N -BG 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C -T- INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15˚ 0˚ 15˚ 0˚ 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N UNIBODY PACKAGE MPX5100 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5100 Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5100 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS P 0.25 (0.010) M T Q -A- M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N -Q- PORT #2 VACUUM (P2) B PIN 1 1 2 3 4 5 K 6 C SEATING PLANE -T- -T- S SEATING PLANE D 6 PL 0.13 (0.005) G J F M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX CASE 867C-05 ISSUE F UNIBODY PACKAGE -TC A E -Q- U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) -P0.25 (0.010) M T Q 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867F-03 ISSUE D UNIBODY PACKAGE MPX5100 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5100 12 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -TC A E -Q- U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) -P0.25 (0.010) M T Q 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G F CASE 867F-03 ISSUE D CASE 1351-01 UNIBODY PACKAGE ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX PAGE 2 OF 2 MPX5100 Sensors Freescale Semiconductor 13 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5100 14 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -TC A E -Q- U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) -P0.25 (0.010) M T Q 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G F CASE 867F-03 ISSUE D CASE 1369-01 UNIBODY PACKAGE ISSUE B SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX PAGE 2 OF 2 MPX5100 Sensors Freescale Semiconductor 15 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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