SMS3.3 3.3 Volt TVS Array For ESD and Latch-Up Protection PROTECTION PRODUCTS Description Features Transient protection for data lines to The SMS series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect up to four lines operating at 3.3 volts. The SMS3.3 is a solid-state device designed specifically for transient suppression. It is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over traditional pn junction processes. They offer desirable characteristics for board level protection including fast response time, low clamping voltage and no device degradation. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Protects four I/O lines Working voltage: 3.3V Low leakage current (<1µA) Low clamping voltage Low capacitance (35pF typical) Solid-state EPD TVS technology Mechanical Characteristics The SMS3.3 may be used to meet the immunity requirements of IEC 61000-4-2, level 4 (±15kV air, ±8kV contact discharge). The low cost SOT23-6L package makes them ideal for use in portable electronics such as cell phones, PDA’s, and notebook computers. EIAJ SOT23-6L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications Equivalent Circuit Diagram Cell phone Handsets and Accessories Microprocessor Based Equipment Personal Digital Assistants (PDA’s) and Pagers Desktops PC and Servers Notebook, Laptop, and Palmtop Computers Portable Instrumentation Peripherals MP3 Players Cordless Phones Schematic & PIN Configuration SOT23-6L (Top View) Revision 08/11/04 1 United States Patent No. www.semtech.com SMS3.3 PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Ppk 200 Watts Peak Pulse Current (tp = 8/20µs) IPP 12 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD >25 >15 kV Soldering Temperature TL 260 (10 seconds) o Operating Temperature TJ -55 to +125 o TSTG -55 to +150 o Storage Temperature C C C Electrical Characteristics SMS3.3 Par ame te r Reverse Stand-Off Voltage Symbo l Co nditio ns Minimum Typical V RWM Maximum Units 3.3 V Punch-Through Voltage V PT IPT = 2µ A 3.5 V Snap -Back Voltage V SB ISB = 50mA 2.8 V Reverse Leakage Current IR V RWM = 3.3V, T=25°C Clamp ing Voltage VC Clamp ing Voltage 0.5 µA IPP = 1A , tp = 8/20µ s A ny I/O to Ground 4.5 V VC IPP = 5A , tp = 8/20µ s A ny I/O to Ground 6.8 V Clamp ing Voltage VC IPP = 12A , tp = 8/20µ s A ny I/O to Ground 8.7 V Steering Diode Forward Voltage (Reverse Clamp ing Voltage) VF IPP = 1A , tp = 8/20µ s A ny I/O to Ground 1.7 V Junction Cap acitance Cj Each I/O p in and Ground V R = 0V, f = 1MHz 40 pF 2004 Semtech Corp. 2 0.05 35 www.semtech.com SMS3.3 PRODUCTS PROTECTION PRODUCTS Power Derating Non-Repetitive Peak Pulse Power vs. Pulse Time 10 110 90 % of Rated Power or IPP Peak Pulse Power - PPk (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 0 1000 25 50 Pulse Waveform 125 150 10 Waveform Parameters: tr = 8µs td = 20µs 90 80 70 9 Clamping Voltage - VC (V) 100 PP 100 Clam ping V oltage vs. P eak Pulse Current Clamping Voltage Peak 110 Percent of I 75 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) e-t 60 50 40 td = IPP/2 30 20 8 7 6 5 4 Waveform Parameters: tr = 8µs td = 20µs 3 2 10 1 0 0 5 10 15 20 25 0 30 0 2 4 Time (µs) 6 8 10 12 14 Peak Pulse Current - IPP (A) Capacitance vs. R ever se V oltage Re erse Voltage For w ar d V oltage vs. FFor or w ar d Current orw ard Voltage orw ard 10 40 I/O to GND f = 1MHz 9 30 7 Capacitance - Cj (pF) Forward Voltage- VF (V) 8 6 5 4 Waveform Parameters: tr = 8µs td = 20µs 3 2 1 20 10 0 0 0 2 4 6 8 10 12 14 0 Forward Current - IF (A) 2004 Semtech Corp. 1 2 3 4 Reverse Voltage - VR (V) 3 www.semtech.com SMS3.3 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Four Data Lines SMS3.3 Circuit Diagram The SMS3.3 is designed to protect up to four unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4 and 6 to the data lines. Pin 2 and 5 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z z z z z z Protection of Four Unidirectional Lines Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2004 Semtech Corp. 4 www.semtech.com SMS3.3 PRODUCTS PROTECTION PRODUCTS Typical Applications 2004 Semtech Corp. 5 www.semtech.com SMS3.3 PROTECTION PRODUCTS Outline Drawing Drawing -SOT23 - SO-8 6L Outline A e1 2X E/2 D DIM N EI 1 H H E ccc C 2X N/2 TIPS c GAGE PLANE 2 A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc 0.25 L e 01 (L1) B DETAIL A D aaa C A2 SEATING PLANE C A SEE DETAIL A1 bxN bbb A DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .057 .035 .000 .006 .035 .045 .051 .010 .020 .003 .009 .110 .114 .118 .060 .063 .069 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 6 0° 10° .004 .008 .008 1.45 0.90 0.00 0.15 .90 1.15 1.30 0.25 0.50 0.08 0.22 2.80 2.90 3.00 1.50 1.60 1.75 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 6 0° 10° 0.10 0.20 0.20 SIDE VIEW C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern -SOT23 6L X DIM (C) G C G P X Y Z Z Y DIMENSIONS MILLIMETERS INCHES (.098) .055 .037 .024 .043 .141 (2.50) 1.40 0.95 0.60 1.10 3.60 P NOTES: 1. 2004 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6 www.semtech.com SMS3.3 PRODUCTS PROTECTION PRODUCTS Marking Ordering Information Part Number Lead Finish Qty per Reel R eel Size SMS3.3.TC SnPb 3,000 7 Inch SMS3.3.TCT Pb free 3,000 7 Inch Note: (1) No suffix indicates tube pack. Top Side Mark Tape and Reel Specification Device Orientation in Tape: Direction of Feed Tape Specifications (per EIA 481) Reel Material: Tape Material: Tape Width: Component Pitch (max.): Component Cavity Play: Static Dissipative Static Dissipative 8mm +/- 0.30mm 4mm +/- 0.10mm 20° Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 7 www.semtech.com