STMICROELECTRONICS AB-54008L-175

AB-54008L-175
2 stages RF power amp: PD84001-E + PD54008L-E + LPF
N-Channel Enhancement-Mode Lateral MOSFETs
Feature
■
Excellent thermal stability
■
Frequency: 135 - 175MHz
■
Supply voltage: 7.2V
■
Output power: 5W
■
Current < 1.5A
■
Input power < 10dBm
■
Harmonics level < -70dBc
■
Load mismatch 20:1
■
VAPC 5V max
■
Beo Free Amplifier
■
RoHS compliant
Mechanical specification:
L = 40 mm, W = 20 mm
Description
The AB-54008L-175 is a 2 stages RF power
amplifer including output Low Pass Filter for
harmonics rejection specifically designed for 2
Ways Comms VHF portable.
Order code
■
AB-54008L-175
April 2007
Rev 2
1/20
www.st.com
20
Contents
AB-54008L-175
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.1
PowerFLAT™ Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1.1
6.2
Thermal Pad and Via design SOT-89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.1
7
2/20
Mounting indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
AB-54008L-175
Electrical data
1
Electrical data
1.1
Maximum ratings
Table 1.
Absolute maximum ratings
Symbol
VDD
ID
TCASE
TA
2
Parameter
Value
Unit
Supply voltage
15
V
Drain current
2.5
A
-20 to +85
°C
+55
°C
Operating case temperature
Max. ambient temperature
Electrical characteristics
TA = +25 oC, VDD = 7.2 V, VAPC Adjusted
Table 2.
Symbol
FREQ
PIN
Electrical specification
Test conditions
Frequency range
@ POUT = 5W
Min.
Typ.
Max.
Unit
135
175
MHz
5
10
dBm
1.5
A
5
V
-70
dBc
ITOTAL
@ POUT = 5W and PIN = 8dBm
PAE
@ POUT = 5W and PIN = 8dBm
47% - 52%
VAPC
@ POUT = 5W and PIN = 8dBm
4
Harmonics
@ POUT = 5W
3/20
Typical performance
AB-54008L-175
3
Typical performance
Figure 1.
Current vs frequency
Figure 2.
1.35
Efficiency vs frequency
70
68
1.3
66
1.25
64
Drain Eff. (%)
1.2
1.15
62
60
58
56
1.1
54
Id (%) 5 dBm
1.05
Eff (A) 5 dBm
Eff (%) 8 dBm
Id (A) 8 dBm
52
1
135
140
145
150
155
160
165
170
50
175
135
140
145
150
155
Freq. (MHz)
Figure 3.
Gain vs frequency
33
Gain (dB)
32
31
Vdd = 7.2V
Pout = 5W
V APC adjusted
30
29
28
130
140
150
160
Frequency (MHz)
Pin = 8dBm
4/20
Pin = 5dBm
170
180
160
165
170
175
AB-54008L-175
Figure 4.
Typical performance
Gain vs input power
Figure 5.
40
34
38
33
Vdd = 7.2V
Idq = 100m A
36
Vdd = 6V
Idq = 300m A
32
Gain (dB)
Gain (dB)
Gain vs input power
34
32
31
30
29
28
30
27
28
26
-4
-2
0
2
4
6
8
10
-4
-2
0
Input Pow er (dBm )
135 MHz
175 MHz
135 MHz
Gain vs input power
Gain (dB)
Figure 6.
155 MHz
2
4
6
8
10
Input Pow er (dBm )
155 MHz
175 MHz
p
34
33
32
31
30
Vdd = 5V
Idq = 300m A
29
28
27
26
25
24
-4
-2
0
2
4
6
8
10
Input Power (dBm)
135 MHz
Drain current vs output power
2
2
1.6
1.6
1.2
0.8
Vdd = 6V
Idq = 300m A
0.4
0
26 27 28 29 30 31 32 33 34 35 36 37 38
Output Pow er (dBm )
135 MHz
155 MHz
175 MHz
Figure 8.
Drain current (A)
Drain current (A)
Figure 7.
155 MHz
Drain current vs output power
p
1.2
0.8
Vdd = 5V
Idq = 300m A
0.4
0
26
27
28
29
30
31
32
33
34
35
36
Output Pow er (dBm )
175 MHz
135 MHz
155 MHz
175 MHz
5/20
Typical performance
AB-54008L-175
Figure 9.
S21 response - Low pass filter
0
-10
-20
S21 (dB)
-30
-40
-50
-60
-70
-80
-90
-100
0
500000000
1000000000
Frequency (Hz)
6/20
1500000000
2000000000
AB-54008L-175
Table 3.
Typical performance
Part list
Designator
Manufacturer
Size
Value
Comment
Part Code
C1, C5, C16
Murata
0603
nc
Capacitor
C6
Murata
0603
1uF
Capacitor
C1F
Murata
0603
3.3pF
Capacitor
GRM1885C1H3R3CZ01
C2, C3, C4, C7,
C8, C9, C10
Murata
0603
330pF
Capacitor
GRM1885C1H391JA01
C2F
Murata
0603
18pF
Capacitor
GRM1885C1H180JA01
C3F
Murata
0603
12pF
Capacitor
GRM1885C1H120JA01
C4F, C6F
Murata
0603
22pF
Capacitor
GRM1885C1H220JA01
C5F, C12
Murata
0603
27pF
Capacitor
GRM1885C1H270JA01
C7F
Murata
0603
15pF
Capacitor
GRM1885C1H150JA01
C11
Murata
0603
56pF
Capacitor
GRM1885C1H560JA01
C13
Murata
0603
33pF
Capacitor
GRM1885C1H330JA01
C14
Murata
0603
100pF
Capacitor
GRM1885C1H101JA01
C15
Murata
0603
39pF
Capacitor
GRM1885C1H390JA01
DC-CON1
Phoenix Contact
2.54mm , 5 pole
DC connector
1725685
L1
Coilcraft
1812
24nH
Inductor
1812SMS-33NJ
L1F
Coilcraft
1008
39nH
Inductor
1008CS-390NX_BW
L2
Coilcraft
1812
33nH
Inductor
1812SMS-33NJ
L2F
Coilcraft
1008
22nH
Inductor
1008CS-220NX_BW
L3
Coilcraft
1812
35.5nH
Inductor
1812SMS-22NJ
L3F
Coilcraft
1008
27nH
Inductor
1008CS-270NX_BW
L4
Coilcraft
0603
18nH
Inductor
0603HC-18NX_BW
L5
Coilcraft
Minispring A
18.5nH
Inductor
A05T
PD54008L-E
STMicroelectronics
QFN 5x5
N-Channel
Enhancement
PD54003L
PD84001-E
STMicroelectronics
SOT89
N-Channel
Enhancement
PD84001
R1, R4
Tyco/Electronics
Neohm
0603
62KΩ
Resistor
CRG Series Thick Film
R2
Tyco/Electronics
Neohm
0603
430KΩ
Resistor
CRG Series Thick Film
R3
Tyco/Electronics
Neohm
0603
240Ω
Resistor
CRG Series Thick Film
R5
Tyco/Electronics
Neohm
0603
150KΩ
Resistor
CRG Series Thick Film
R6
Tyco/Electronics
Neohm
0603
11Ω
Resistor
CRG Series Thick Film
7/20
Typical performance
Table 3.
AB-54008L-175
Part list (continued)
Designator
Manufacturer
RFin, RF OUT
Amplifier, RF
OUT Filter
Johnson
Size
Value
Comment
Part Code
SMA
142-0701-801
Substrate
FR-4
Substrate
H = 20mil ;
h = 2oz
TL1
W = 0.92mm ;
L = 3mm
Z = 50Ω Transmission Line
TL2
W = 0.92mm ;
L = 7.2mm
Z = 50Ω Transmission Line
TL3
W = 0.92mm ;
L = 6.23mm
Z = 50Ω Transmission Line
TL4
W = 0.92mm ;
L = 6.62mm
Z = 50Ω Transmission Line
TL5
W = 0.92mm ;
L = 5.8mm
Z = 50Ω Transmission Line
TL6
W = 0.92mm ;
L = 2.2mm
Z = 50Ω Transmission Line
TL7
W = 0.92mm ;
L = 11mm
Z = 50Ω Transmission Line
TL8
W = 0.92mm ;
L = 12.4mm
Z = 50Ω Transmission Line
TL9
W = 0.92mm ;
L = 2mm
Z = 50Ω Transmission Line
8/20
AB-54008L-175
4
Circuit layout
Circuit layout
Figure 10. Test fixture component layout
Figure 11. test circuit photomaster
9/20
Circuit schematic
5
Circuit schematic
Figure 12. Circuit schematic
Figure 13. Bias schematic
Figure 14. Filter schematic
10/20
AB-54008L-175
AB-54008L-175
Circuit schematic
Figure 15. Input matching schematic
Figure 16. Inter matching schematic
Figure 17. Output matching schematic
11/20
Package mechanical data
6
AB-54008L-175
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
12/20
AB-54008L-175
6.1
Package mechanical data
PowerFLAT™ Mechanical data
Table 4.
PowerFLAT™ Mechanical data
mm
inch
Dim.
Min.
Typ.
Max.
A
0.90
A1
0.02
A3
0.24
Min.
Typ.
Max.
1.00
0.035
0.039
0.05
0.001
0.002
0.009
AA
0.15
0.25
0.35
0.006
0.01
0.014
b
0.43
0.51
0.58
0.017
0.020
0.023
c
0.64
0.71
0.79
0.025
0.028
0.031
D
5.00
0.197
d
0.30
0.011
E
5.00
0.197
E2
2.49
2.57
2.64
0.098
0.101
e
1.27
0.050
f
3.37
0.132
g
0.74
0.03
h
0.21
0.008
0.104
Figure 18. PowerFLAT™ Package dimensions
13/20
Package mechanical data
Table 5.
AB-54008L-175
PowerFLAT™ Tape & reel dimensions
mm.
inch
Dim.
Min.
Typ
Max.
Min.
Typ
Max.
Ao
5.15
5.25
5.35
0.12
0.13
0.13
Bo
5.15
5.25
5.35
0.12
0.13
0.13
Ko
1.0
1.1
1.2
0.02
0.02
0.02
Figure 19. PowerFLAT™ Tape & reel
14/20
AB-54008L-175
6.1.1
Package mechanical data
Mounting indications
Figure 20. Standard SMD mounting
15/20
Package mechanical data
6.2
AB-54008L-175
Thermal Pad and Via design SOT-89
Thernal vias are required in the PCB layout to effectively conduct heat away from the
package. The via pattern has been designed to address thermal, power dissipation and
electrical requirements of the device.
The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025 plating on via walls. If micro vias are used in a
design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar
results.
Figure 21. Pad layout details
16/20
AB-54008L-175
6.2.1
Package mechanical data
Soldering profile
Figure 22 shows the recommeded solder for devices that have Pb-free terminal plating and
where a Pb-free solder is used.
Figure 22. Recommended solder profile
Figure 23 shows the recommeded solder for devices with Pb-free terminal plating used with
leaded solder, or for devices with leaded terminal plating used with a leaded solder.
Figure 23. Recommended solder profile for leaded devices
17/20
Package mechanical data
Figure 24. Reel information
18/20
AB-54008L-175
AB-54008L-175
7
Revision history
Revision history
Table 6.
Revision history
Date
Revision
Changes
21-Nov-2006
1
Initial release.
23-Apr-2007
2
Updated component part list
19/20
AB-54008L-175
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