AB-54008L-175 2 stages RF power amp: PD84001-E + PD54008L-E + LPF N-Channel Enhancement-Mode Lateral MOSFETs Feature ■ Excellent thermal stability ■ Frequency: 135 - 175MHz ■ Supply voltage: 7.2V ■ Output power: 5W ■ Current < 1.5A ■ Input power < 10dBm ■ Harmonics level < -70dBc ■ Load mismatch 20:1 ■ VAPC 5V max ■ Beo Free Amplifier ■ RoHS compliant Mechanical specification: L = 40 mm, W = 20 mm Description The AB-54008L-175 is a 2 stages RF power amplifer including output Low Pass Filter for harmonics rejection specifically designed for 2 Ways Comms VHF portable. Order code ■ AB-54008L-175 April 2007 Rev 2 1/20 www.st.com 20 Contents AB-54008L-175 Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.1 PowerFLAT™ Mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1.1 6.2 Thermal Pad and Via design SOT-89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.2.1 7 2/20 Mounting indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 AB-54008L-175 Electrical data 1 Electrical data 1.1 Maximum ratings Table 1. Absolute maximum ratings Symbol VDD ID TCASE TA 2 Parameter Value Unit Supply voltage 15 V Drain current 2.5 A -20 to +85 °C +55 °C Operating case temperature Max. ambient temperature Electrical characteristics TA = +25 oC, VDD = 7.2 V, VAPC Adjusted Table 2. Symbol FREQ PIN Electrical specification Test conditions Frequency range @ POUT = 5W Min. Typ. Max. Unit 135 175 MHz 5 10 dBm 1.5 A 5 V -70 dBc ITOTAL @ POUT = 5W and PIN = 8dBm PAE @ POUT = 5W and PIN = 8dBm 47% - 52% VAPC @ POUT = 5W and PIN = 8dBm 4 Harmonics @ POUT = 5W 3/20 Typical performance AB-54008L-175 3 Typical performance Figure 1. Current vs frequency Figure 2. 1.35 Efficiency vs frequency 70 68 1.3 66 1.25 64 Drain Eff. (%) 1.2 1.15 62 60 58 56 1.1 54 Id (%) 5 dBm 1.05 Eff (A) 5 dBm Eff (%) 8 dBm Id (A) 8 dBm 52 1 135 140 145 150 155 160 165 170 50 175 135 140 145 150 155 Freq. (MHz) Figure 3. Gain vs frequency 33 Gain (dB) 32 31 Vdd = 7.2V Pout = 5W V APC adjusted 30 29 28 130 140 150 160 Frequency (MHz) Pin = 8dBm 4/20 Pin = 5dBm 170 180 160 165 170 175 AB-54008L-175 Figure 4. Typical performance Gain vs input power Figure 5. 40 34 38 33 Vdd = 7.2V Idq = 100m A 36 Vdd = 6V Idq = 300m A 32 Gain (dB) Gain (dB) Gain vs input power 34 32 31 30 29 28 30 27 28 26 -4 -2 0 2 4 6 8 10 -4 -2 0 Input Pow er (dBm ) 135 MHz 175 MHz 135 MHz Gain vs input power Gain (dB) Figure 6. 155 MHz 2 4 6 8 10 Input Pow er (dBm ) 155 MHz 175 MHz p 34 33 32 31 30 Vdd = 5V Idq = 300m A 29 28 27 26 25 24 -4 -2 0 2 4 6 8 10 Input Power (dBm) 135 MHz Drain current vs output power 2 2 1.6 1.6 1.2 0.8 Vdd = 6V Idq = 300m A 0.4 0 26 27 28 29 30 31 32 33 34 35 36 37 38 Output Pow er (dBm ) 135 MHz 155 MHz 175 MHz Figure 8. Drain current (A) Drain current (A) Figure 7. 155 MHz Drain current vs output power p 1.2 0.8 Vdd = 5V Idq = 300m A 0.4 0 26 27 28 29 30 31 32 33 34 35 36 Output Pow er (dBm ) 175 MHz 135 MHz 155 MHz 175 MHz 5/20 Typical performance AB-54008L-175 Figure 9. S21 response - Low pass filter 0 -10 -20 S21 (dB) -30 -40 -50 -60 -70 -80 -90 -100 0 500000000 1000000000 Frequency (Hz) 6/20 1500000000 2000000000 AB-54008L-175 Table 3. Typical performance Part list Designator Manufacturer Size Value Comment Part Code C1, C5, C16 Murata 0603 nc Capacitor C6 Murata 0603 1uF Capacitor C1F Murata 0603 3.3pF Capacitor GRM1885C1H3R3CZ01 C2, C3, C4, C7, C8, C9, C10 Murata 0603 330pF Capacitor GRM1885C1H391JA01 C2F Murata 0603 18pF Capacitor GRM1885C1H180JA01 C3F Murata 0603 12pF Capacitor GRM1885C1H120JA01 C4F, C6F Murata 0603 22pF Capacitor GRM1885C1H220JA01 C5F, C12 Murata 0603 27pF Capacitor GRM1885C1H270JA01 C7F Murata 0603 15pF Capacitor GRM1885C1H150JA01 C11 Murata 0603 56pF Capacitor GRM1885C1H560JA01 C13 Murata 0603 33pF Capacitor GRM1885C1H330JA01 C14 Murata 0603 100pF Capacitor GRM1885C1H101JA01 C15 Murata 0603 39pF Capacitor GRM1885C1H390JA01 DC-CON1 Phoenix Contact 2.54mm , 5 pole DC connector 1725685 L1 Coilcraft 1812 24nH Inductor 1812SMS-33NJ L1F Coilcraft 1008 39nH Inductor 1008CS-390NX_BW L2 Coilcraft 1812 33nH Inductor 1812SMS-33NJ L2F Coilcraft 1008 22nH Inductor 1008CS-220NX_BW L3 Coilcraft 1812 35.5nH Inductor 1812SMS-22NJ L3F Coilcraft 1008 27nH Inductor 1008CS-270NX_BW L4 Coilcraft 0603 18nH Inductor 0603HC-18NX_BW L5 Coilcraft Minispring A 18.5nH Inductor A05T PD54008L-E STMicroelectronics QFN 5x5 N-Channel Enhancement PD54003L PD84001-E STMicroelectronics SOT89 N-Channel Enhancement PD84001 R1, R4 Tyco/Electronics Neohm 0603 62KΩ Resistor CRG Series Thick Film R2 Tyco/Electronics Neohm 0603 430KΩ Resistor CRG Series Thick Film R3 Tyco/Electronics Neohm 0603 240Ω Resistor CRG Series Thick Film R5 Tyco/Electronics Neohm 0603 150KΩ Resistor CRG Series Thick Film R6 Tyco/Electronics Neohm 0603 11Ω Resistor CRG Series Thick Film 7/20 Typical performance Table 3. AB-54008L-175 Part list (continued) Designator Manufacturer RFin, RF OUT Amplifier, RF OUT Filter Johnson Size Value Comment Part Code SMA 142-0701-801 Substrate FR-4 Substrate H = 20mil ; h = 2oz TL1 W = 0.92mm ; L = 3mm Z = 50Ω Transmission Line TL2 W = 0.92mm ; L = 7.2mm Z = 50Ω Transmission Line TL3 W = 0.92mm ; L = 6.23mm Z = 50Ω Transmission Line TL4 W = 0.92mm ; L = 6.62mm Z = 50Ω Transmission Line TL5 W = 0.92mm ; L = 5.8mm Z = 50Ω Transmission Line TL6 W = 0.92mm ; L = 2.2mm Z = 50Ω Transmission Line TL7 W = 0.92mm ; L = 11mm Z = 50Ω Transmission Line TL8 W = 0.92mm ; L = 12.4mm Z = 50Ω Transmission Line TL9 W = 0.92mm ; L = 2mm Z = 50Ω Transmission Line 8/20 AB-54008L-175 4 Circuit layout Circuit layout Figure 10. Test fixture component layout Figure 11. test circuit photomaster 9/20 Circuit schematic 5 Circuit schematic Figure 12. Circuit schematic Figure 13. Bias schematic Figure 14. Filter schematic 10/20 AB-54008L-175 AB-54008L-175 Circuit schematic Figure 15. Input matching schematic Figure 16. Inter matching schematic Figure 17. Output matching schematic 11/20 Package mechanical data 6 AB-54008L-175 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 12/20 AB-54008L-175 6.1 Package mechanical data PowerFLAT™ Mechanical data Table 4. PowerFLAT™ Mechanical data mm inch Dim. Min. Typ. Max. A 0.90 A1 0.02 A3 0.24 Min. Typ. Max. 1.00 0.035 0.039 0.05 0.001 0.002 0.009 AA 0.15 0.25 0.35 0.006 0.01 0.014 b 0.43 0.51 0.58 0.017 0.020 0.023 c 0.64 0.71 0.79 0.025 0.028 0.031 D 5.00 0.197 d 0.30 0.011 E 5.00 0.197 E2 2.49 2.57 2.64 0.098 0.101 e 1.27 0.050 f 3.37 0.132 g 0.74 0.03 h 0.21 0.008 0.104 Figure 18. PowerFLAT™ Package dimensions 13/20 Package mechanical data Table 5. AB-54008L-175 PowerFLAT™ Tape & reel dimensions mm. inch Dim. Min. Typ Max. Min. Typ Max. Ao 5.15 5.25 5.35 0.12 0.13 0.13 Bo 5.15 5.25 5.35 0.12 0.13 0.13 Ko 1.0 1.1 1.2 0.02 0.02 0.02 Figure 19. PowerFLAT™ Tape & reel 14/20 AB-54008L-175 6.1.1 Package mechanical data Mounting indications Figure 20. Standard SMD mounting 15/20 Package mechanical data 6.2 AB-54008L-175 Thermal Pad and Via design SOT-89 Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 21. Pad layout details 16/20 AB-54008L-175 6.2.1 Package mechanical data Soldering profile Figure 22 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 22. Recommended solder profile Figure 23 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 23. Recommended solder profile for leaded devices 17/20 Package mechanical data Figure 24. Reel information 18/20 AB-54008L-175 AB-54008L-175 7 Revision history Revision history Table 6. Revision history Date Revision Changes 21-Nov-2006 1 Initial release. 23-Apr-2007 2 Updated component part list 19/20 AB-54008L-175 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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