STMICROELECTRONICS DSM2180F3V-15K6

DSM2180F3
DSM (Digital Signal Processor System Memory)
for analog devices ADSP-218X family (5 V supply)
NOT FOR NEW DESIGN
FEATURES SUMMARY
■ Glueless Connection to DSP
Figure 1. Packages
– Easily add memory, logic, and I/O to DSP
■
128K Byte Flash Memory
– For Bootloading and/or Data Overlay Memory
– Programmable Decoding and Paging Logic
allows accessing Flash memory as Byte DMA
(BDMA) and as External Data Overlay memory
PQFP52 (T)
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– Rapidly access Flash memory with BDMA for
booting and loading internal DSP Overlay
memory. Alternatively access the same Flash
memory as External Data Overlay memory to
efficiently write Flash memory with code updates and data, a byte at a time with no DMA
setup overhead
(s)
■
– DSM connects to lower byte of 16-bit DSP
data bus. Byte-wide accesses to 8-bit BDMA
space. Half-word accesses to 16-bit Data
Memory Overlay and 16-bit I/O Mem space.
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– Efficient manufacturing allows easy product
testing and Just-In-Time inventory
– Increase total DSP system I/O capability
– I/O controlled by DSP software or PLD logic
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– Use low-cost FlashLINKTM cable with PC
■
– 8mA I/O pin drive at 5 Vcc
■
– Use for peripheral glue logic to keypads, control panel, displays, LCD, UART devices, etc.
Content Security
– Programmable Security Bit blocks access of
device programmers and readers
General purpose PLD
– Over 3,000 Gates of PLD with 16 macro cells
In-System Programming (ISP) with JTAG
– Eliminate sockets for pre-programmed memory and logic devices
Up to 16 Multifunction I/O Pins
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PLCC52 (K)
– Program entire chip in 10-20 seconds with no
involvement of the DSP
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5V Devices (±10%)
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– Individual 16K Byte Flash memory sectors
match size of DSP External Data Overlay
window for efficient data management. Integrated page logic provides easy DSP access
to all 128K Bytes.
■
Zero-Power Technology
– 75 μA standby at VCC=5V
■
Small Packaging
– Eliminate PLDs and external logic devices
– 52-pin PQFP or 52-pin PLCC
– Create state machines, chip selects, simple
shifters and counters, clock dividers, delays
– Packages are ECOPACK®
– Simple PSDsoft ExpressTM software ...Free
June 2008
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Memory Speed
– 90 ns
Rev 2.0
This is information on a product still in production but not recommended for new designs.
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DSM2180F3
TABLE OF CONTENTS
Summary Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
DSP Address/Data/Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Programmable Logic (PLDs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Runtime Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Memory Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
JTAG ISP Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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Security and NVM Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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Typical connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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Specifying Mem Map with PSDsoft ExpressTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Runtime control register definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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Detailed Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
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Instruction Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
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Reading Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Programming Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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Erasing Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Flash Memory Sector Protect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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DSM Security Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Reset Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Decode PLD (DPLD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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DSM2180F3
DSP Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Port B – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Port C – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Port D – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
PLD Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Power On Reset, Warm Reset, Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
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Programming In-Circuit using JTAG ISP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
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AC/DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table:
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Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
CPLD Combinatorial Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
CPLD Macrocell Synchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
CPLD Macrocell Asynchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Input Macrocell Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Flash Memory Program, Write and Erase Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Reset (Reset) Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
ISC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
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PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Table:
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PLCC52 - 52 lead Plastic Leaded Chip Carrier, rectangular . . . . . . . . . . . . . . . . . . . . . . . . 57
Assignments – PLCC52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
PQFP52 - 52 lead Plastic Quad Flatpack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Pin Assignments – PQFP52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
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DSM2180F3
product and manage inventory by rapidly programming test code, then application code as determined by inventory requirements (Just-In Time
inventory). Additionally, JTAG ISP reduces development time by turning fast iterations of DSP code
in the lab. Code updates in the field require no disassembly of product. The FlashLINKTM JTAG programming cable costs $59 USD and plugs into any
PC or note-book parallel port.
40 CNTLO
41 RESET
42 CNTL2
43 CNTL1
44 PB7
45 PB6
46 GND
47 PB5
48 PB4
49 PB3
50 PB2
51 PB1
Figure 3. PQFP Connections
52 PB0
SUMMARY DESCRIPTION
These are system memory devices for use with
Digital Signal Processors from the popular Analog
Devices ADSP-218X family. DSM means Digital
signal processor System Memory. A DSM device
brings in-system programmable Flash memory,
programmable logic, and additional I/O to DSP
systems. The result is a simple and flexible twochip solution for DSP designs. DSM devices provide the flexibility of Flash memory and smart
JTAG programming techniques for both manufacturing and the field. On-chip integrated memory
decode logic and memory paging logic make it
easy to add large amounts of external Flash memory to the ADSP-218X family for bootloading upon
power-up and/or overlay memory. The DSP accesses this Flash memory using either its Byte
DMA (BDMA) interface or as external data overlay
memory (no DMA setup overhead).
39 AD15
PD2 1
37 AD13
PD0 3
36 AD12
PC7 4
PC6 5
uc
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44
AD13
PC7
11
43
AD12
PC6
12
42
AD11
PC5
13
41
AD10
PC4
14
40
AD9
VCC
GND
15
39
AD8
16
38
PC3
17
37
VCC
AD7
PC2
18
PC1
19
PC0
20
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AD2
AD1
AD0
PA0
AD6
35
AD5
34
AD4
AI02857
JTAG In-System Programming (ISP) reduces development time, simplifies manufacturing flow,
and lowers the cost of field upgrades. The JTAG
ISP interface eliminates the need for sockets and
pre-programmed memory and logic devices. For
manufacturing, end products may be assembled
with a blank DSM device soldered to the circuit
board and programmed at the end of the manufacturing line in 10 to 20 seconds with no involvement
of the DSP. This allows efficient means to test
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33
AD3
32
31
30
29
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PA1
27
PA2
26
GND
25
PA3
24
PA4
23
PA5
22
PA6
PA7
21
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AD2 25
PD0
PA4 17
AD14
PA5 16
45
PA6 15
9
PC0 13
PA7 14
AD15
od
PA1 21
1
46
PA2 20
47
48
49
50
51
52
2
3
4
PD1
6
8
5
7
PD2
PC1 12
GND 19
Pr
PC2 11
AD1 24
PC3 10
AD0 23
GND 9
PA0 22
VCC 8
PA3 18
RESET
PC4 7
CNTL0
CNTL2
PB7
CNTL1
PB6
GND
PB5
PB4
PB3
PB2
PB1
PB0
PC5 6
35 AD11
34 AD10
33 AD9
32 AD8
31 VCC
30 AD7
29 AD6
28 AD5
27 AD4
AD3 26
Figure 2. PLCC Connections
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38 AD14
PD1 2
AI02858
In addition to ISP Flash memory, DSM devices
add programmable logic (PLD) and up to 16 configurable I/O pins to the DSP system. The state of
each I/O pin can be driven by DSP software or
PLD logic. PLD and I/O configuration are programmable by JTAG ISP, just like the Flash memory.
The PLD consists of more than 3000 gates and
has 16 macro cell registers. Common uses for the
PLD include chip selects for external devices (i.e.
UART), state-machines, simple shifters and counters, keypad and control panel interfaces, clock dividers, handshake delay, muxes, etc. This
eliminates the need for small external PLDs and
logic devices. Configuration of PLD, I/O, and Flash
memory mapping are easily entered in a pointand-click environment using the software development tool, PSDsoft ExpressTM. This software is
available at no charge from www.psdst.com.
DSM2180F3
AI04910
JTAG
ISP TO
ALL
AREAS
8 I/O
PORTS
8 I/O
PORTS
ISP, I/O, PLD, CHIP SEL
I/O, PLD, CHIP SELECTS
Figure 4. System Block Diagram, Two-Chip Solution
CONTENT SECURITY
POWER MANAGEMENT
I/O CONTROL
8 DATA
The two-chip combination of a DSP and a DSM
device is ideal for systems which have limitations
on size, EMI levels, and power consumption. DSM
memory and logic are “zero-power”, meaning they
SERIAL
DEVICE
SERIAL
DEVICE
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ANALOG
DEVICES
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ADSP-218X
FAMILY
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16 MACROCELL PLD
FLASH MEMORY
128k X 8
ADDR & DECODE LOGIC
WR, RD, BMS, DMS, IOMS
22 ADDRESS
MEM PAGE CONTROL
DSM2180F3
DSP SYSTEM MEMORY
I/O BUS
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automatically go to standby between memory accesses or logic input changes, producing low active and standby current consumption, which is
ideal for battery powered products.
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DSM2180F3
A programmable security bit in the DSM protects
its contents from unauthorized viewing and copying. When set, the security bit will block access of
programming devices (JTAG or others) to the
DSM Flash memory and PLD configuration. The
only way to defeat the security bit is to erase the
entire DSM device, after which the device is blank
and may be used again. The DSP will always have
access to Flash memory contents through the 8-bit
data port even while the security bit is set.
Table 1. DSM2180F3 DSP Memory System Devices
ISP Flash
Memory
Part Number
DSM2180F3-90
Flash Partitioning
PLD
128K Bytes Eight 16K Byte Sectors 16 macro cells
I/O Ports
VCC and I/O
Mem Speed
Up to 16
5V ±10%
90 ns
Table 2. Compatible Analog Devices DSPs
DSP Part Numbers
Operating Voltage, VCC
I/O Capability
5.0
5.0V
ADSP- 2181, 2184, 2185, 2186
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DSM2180F3
ARCHITECTURAL OVERVIEW
Major functional blocks are shown in Figure 5.
DSP Address/Data/Control Interface
These DSP signals attach directly to the DSM inputs for a glueless connection. An 8-bit data connection is formed and all 22 DSP address lines
can be decoded while the DSP operates in full
memory mode. DSP memory strobes; BMS, DMS,
and IOMS are used for BDMA, data, & I/O access
respectively (no program memory access, PMS).
Flash Memory
The 1 Mbit (128K x 8) Flash memory is divided into
eight equally-sized 16K byte sectors that are individually selectable through the Decode PLD. Each
Flash memory sector can be located at any address as defined by the user with PSDsoft Express. The flexibility of the Decode PLD and Page
Register logic allow the DSP to access Flash
memory as Byte DMA (BDMA) or as external data
overlay memory across several memory pages.
BDMA transfers are good for initial bootloading
and for loading internal overlay memory at runtime, but BDMA is not efficient writing to Flash
memory because Flash memory is unlocked, written, and status is checked one byte at a time, requiring an initialization of the BDMA channel for
each and every byte transfer. The DSM device al-
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lows the DSP to alternatively access Flash memory as data overlay memory (using DMS instead of
BMS). Writing Flash memory this way is faster and
requires simpler code. Note: During a DSP data
access using the DMS strobe, only the upper byte
of a 16-bit DSP data word is used.
DSM Flash memory sector size of 16K bytes
matches the DSP external Data Memory Overlay
window size of 16K locations (two 8K windows
when DMOVLAY register is used, see Analog Devices ADSP-218X data sheets). This alignment
provides convenient data management. Also,
each 16K byte sector can be loaded with contents
from different firmware or data files specified in
PSDsoft ExpressTM.
Miscellaneous: The DSP can erase Flash memory
by individual sectors or the entire Flash memory
array may be erased at one time. The Flash memory automatically goes to standby between DSP
read or write accesses to conserve power. Maximum access times include sector decoding time.
Maximum erase cycles is 100K and data retention
is 15 years minimum. Flash memory, as well as
the entire DSM device may be programmed with
the JTAG ISP interface with no DSP involvement.
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DSM2180F3
Figure 5. Block Diagram
INTERNAL ADDR, DATA, CONTROL BUS LINKED TO DSP
DSM2180F3
SECURITY
LOCK
DSP SYSTEM
fs7
fs6
fs5
fs4
fs3
fs2
fs1
fs0
DECODE PLD
(DPLD)
DSP
ADDR
FS0-7
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
RUNTIME CONTROL
CSIOP
CSIOP REGISTER FILE
PLD INPUT BUS
POWER MANAGEMENT
EXTERNAL
CHIP SELECTS
COMPLEX PLD
(CPLD)
AND
ARRAY
DSP
CONTROL
CNTL0
CNTL1
CNTL2
PD0
PD1
PD2
RST\
I/O PORT
EXTERNAL CHIP SELECTS, ESC0-2
A
B
B
C
A
B
B
C
A
B
B
C
A
B
B
C
A
B
B
C
A
B
B
C
A
B
B
C
A
B
B
C
ALLOCATOR
B
B
B
B
B
B
B
B
C
C
C
C
C
C
C
C
PIN FEEDBACK
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JTAG-ISP
TO ALL AREAS
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Programmable Logic (PLDs)
The DSM family contains two PLDS that may optionally run in Turbo or Non-Turbo mode. PLDs operate faster (less propagation delay) while in
Turbo mode but consume more power than NonTurbo mode. Non-Turbo mode allows the PLDs to
automatically go to standby when no inputs are
change to conserve power. The Turbo mode setting is controlled at runtime by DSP software.
Decode PLD (DPLD). This is programmable logic used to select one of the eight individual Flash
memory segments or the group of control registers
within the DSM device. The DPLD can also optionally drive external chip select signals on Port D
pins. DPLD input signals include: DSP address
and control signals, Page Register outputs, DSM
Port Pins, CPLD logic feedback.
Complex PLD (CPLD). This programmable logic
is used to create both combinatorial and sequential general purpose logic. The CPLD contains 16
Output Macrocells (OMCs) and 16 Input Macrocells (IMCs). PSD macrocell registers are unique
in that that have direct connection to the DSP data
bus allowing them to be loaded and read directly
by the DSP at runtime. This direct access is good
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16 INPUT
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PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
3 OPTIONAL OUTPUTS TO PORT D
NODE FEEDBACK
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DSP
DATA
8 SEGMENTS, 16 KB
128 KBytes TOTAL
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
PC2
PC7
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FLASH MEMORY
PAGE REG
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I/O PORT
PC0
PC1
PC3
PC4
PC5
PC6
AI04911
for making small peripheral devices (shifters,
counters, state machines, etc.) that are accessed
directly by the DSP with little overhead. DPLD inputs include DSP address and control signals,
Page Register outputs, DSM Port Pins, and CPLD
feedback.
OMCs: The general structure of the CPLD is similar in nature to a 22V10 PLD device with the familiar sum-of-products (AND-OR) construct. True
and compliment versions of 64 input signals are
available to a large AND array. AND array outputs
feed into a multiple product-term OR gate within
each OMC (up to 10 product-terms for each
OMC). Logic output of the OR gate can be passed
on as combinatorial logic or combined with a flipflop within in each OMC to realize sequential logic.
OMCs can be used as a buried nodes with feedback to the AND array or OMC output can be routed to pins on Port B or PortC.
IMCs: Inputs from pins on Port B or Port C are
routed to IMCs for conditioning (clocking or latching) as they enter the chip, which is good for sampling and debouncing inputs. Alternatively, IMCs
can pass Port input signals directly to PLD inputs
DSM2180F3
without clocking or latching. The DSP may read
the IMCs at any time.
Runtime Control Registers
A block of 256 bytes is decoded inside the DSM
device as DSM control and status registers. 27
registers are used in the block of 256 locations to
control the output state of I/O pins, to read I/O
pins, to control power management, to read/write
macrocells, and other functions at runtime. See
Table 4 for description. The base address of these
256 locations is referred to in this data sheet as
csiop (Chip Select I/O Port). Individual registers
within this block are accessed with an offset from
the base address. The DSP accesses csiop registers using I/O memory with the IOMS strobe. csiop
registers are accessed as bytes, so only the lower
half of a DSP I/O word is used during access.
Memory Page Register
This 8-bit register can be loaded and read by the
DSP at runtime as one of the csiop registers. Its
outputs feed directly into the PLDs. The page register is a powerful feature that allows the DSP to
access all 128K Bytes of DSM Flash memory in
16K byte pages. This size matches the 16K location data overlay window the ADSP-218X family.
Page register outputs may also be used as CPLD
inputs for general use.
I/O Ports
The DSM has 19 individually configurable I/O pins
distributed over the three ports (Ports B, C, and D).
Each I/O pin can be individually configured for different functions such as standard MCU I/O ports
or PLD I/O on a pin by pin basis. (MCU I/O means
that for each pin, its output state can be controlled
or its input value can be read by the DSP at runtime using the csiop registers like an MCU would
do.)
Port C hosts the JTAG ISP signals. Since JTAGISP does not occur frequently during the life of a
product, those Port C pins are under-utilized. In
applications that need every I/O pin, JTAG signals
can be multiplexed with general I/O signals to use
them for I/O when not performing ISP. See section
titled “Programming In-Circuit using JTAG ISP” on
page 41 for muxing JTAG pins on Port C, and Application Note AN1153.
The static configuration of all Port pins is defined
with the PSDsoft ExpressTM software development tool. The dynamic action of the Ports pins is
controlled by DSP runtime software.
JTAG ISP Port
In-System Programming (ISP) can be performed
through the JTAG signals on Port C. This serial interface allows programming of the entire DSM
device or subsections (that is, only Flash memory
but not the PLDs) without the participation of the
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DSP. A blank DSM device soldered to a circuit
board can be completely programmed in 10 to 20
seconds. The basic JTAG signals; TMS, TCK,
TDI, and TDO form the IEEE-1149.1 interface.
The DSM device does not implement the IEEE1149.1 Boundary Scan functions. The DSM uses
the JTAG interface for ISP only. However, the
DSM device can reside in a standard JTAG chain
with other JTAG devices and it will remain in BYPASS mode while other devices perform Boundary Scan.
ISP programming time can be reduced as much as
30% by using two more signals on Port C, TSTAT
and TERR in addition to TMS, TCK, TDI and TDO.
The FlashLINKTM JTAG programming cable is
available from STMicroelectronics for $59USD
and PSDsoft Express software is available at no
charge from www.psdst.com. That is all that is
needed to program a DSM device using the parallel port on any PC or note-book. See section titled
“Programming In-Circuit using JTAG ISP” on page
41.
Power Management
The DSM has bits in csiop control registers that
are configured at run-time by the DSP to reduce
power consumption of the CPLD. The Turbo bit in
the PMMR0 register can be set to logic 1 and the
CPLD will go to Non-Turbo mode, meaning it will
latch its outputs and go to sleep until the next transition on its inputs. There is a slight penalty in PLD
performance (longer propagation delay), but significant power savings are realized.
Additionally, bits in two csiop registers can be set
by the DSP to selectively block signals from entering the CPLD which reduces power consumption.
See section titled “Power Management” on page
39.
Security and NVM Sector Protection
A programmable security bit in the DSM protects
its contents from unauthorized viewing and copying. When set, the security bit will block access of
programming devices (JTAG or others) to the
DSM Flash memory and PLD configuration. The
only way to defeat the security bit is to erase the
entire DSM device, after which the device is blank
and may be used again.
Additionally, the contents of each individual Flash
memory sector can be write protected (sector protection) by configuration with PSDsoft ExpressTM.
This is typically used to protect DSP boot code
from being corrupted by inadvertent writes to
Flash memory from the DSP.
Pin Assignments
Pin assignment are shown for the 52-pin PLCC
package in Figure 2, and the 52-pin PQFP package in Figure 3.
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DSM2180F3
Table 3. Pin Description
Pin Name
Type
ADIO0-15
In
Sixteen address inputs from the DSP.
CNTL0
In
Active low write strobe input (WR) from the DSP
CNTL1
In
Active low read strobe input (RD) from the DSP.
CNTL2
In
Active low Byte Memory Select (BMS) signal from the DSP.
Reset
In
Active low reset input from system. Resets DSM I/O Ports, Page Register contents, and other
DSM configuration registers. Must be logic Low at Power-up.
PA0-7
I/O
Eight data bus signals connected to DSP pins D8 - D15.
I/O
Eight configurable Port B signals with the following functions:
1. MCU I/O – DSP may write or read pins directly at runtime with csiop registers.
2. CPLD Output Macrocell (McellAB0-7 or McellBC0-7) outputs.
3. Inputs to the PLDs (Input Macrocells).
Note: Each of the four Port B signals PB0-PB3 may be configured at run-time as either standard
CMOS or for high slew rate. Each of the four Port B signals PB3-PB7 may be configured at
run-time as either standard CMOS or Open Drain Outputs.
I/O
Eight configurable Port C signals with the following functions:
1. MCU I/O – DSP may write or read pins directly at runtime with csiop registers.
2. CPLD Output Macrocell (McellBC0-7) output.
3. Input to the PLDs (Input Macrocells).
4. Pins PC0, PC1, PC5, and PC6 can optionally form the JTAG IEEE-1149.1 ISP serial
interface as signals TMS, TCK, TDI, and TDO respectively.
5. Pins PC3 and PC4 can optionally form the enhanced JTAG signals TSTAT and TERR
respectively. Reduces ISP programming time by up to 30% when used in addition to the
standard four JTAG signals: TDI, TDO, TMS, TCK.
6. Pin PC3 can optionally be configured as the Ready/Busy output to indicate Flash memory
programming status during parallel programming. May be polled by DSP or used as DSP
interrupt to indicate when Flash memory byte programming or erase operations are
complete.
Note 1: Port C pin PC2 input (or any PLD input pin) can be connected to DSP D18 output which
functions as DSP address A16 in DSP Full Memory Mode. See Figure 6.
Note 2: Port C pin PC7 input (or any PLD input pin) can be connected to DSP D19 output which
functions as DSP address A17 in DSP Full Memory Mode. See Figure 6.
Note 3: When used as general I/O, each of the eight Port C signals may be configured at run-time
as either standard CMOS or Open Drain Outputs.
Note 4: The JTAG ISP pins may be multiplexed with other I/O functions.
PB0-7
Description
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Three configurable Port D signals with the following functions:
1. MCU I/O – DSP may write or read pins directly at runtime with csiop registers.
2. Input to the PLDs (no associated Input Macrocells, routes directly into PLDs).
3. CPLD output (External Chip Select). Does not consume Output Macrocells.
4. Pin PD1 can optionally be configured as CLKIN, a common clock input to PLD.
5. Pin PD2 can optionally be configured as CSI, an active low Chip Select Input to select Flash
memory. Flash memory is disabled to conserve more power when CSI is logic high. Can
connect CSI to ADSP-218X PWDACK output signal.
Note 1: It is recommended to connect Port D pin PD0 input to DSP IOMS output which is the
active low I/O Memory Select strobe. See Figure 6.
Note 2: It is recommended to connect Port D pin PD1 input to DSP DMS output which is the active
low Data Memory Select strobe. See Figure 6.
Note 3: It is recommended to connect Port D pin PD2 input to DSP PWDACK output if the DSP
Power Down mode is used. See Figure 6.
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DSM2180F3
TYPICAL CONNECTIONS
Figure 6 shows a typical connection scheme.
Many connection possibilities exist since most
DSM pins are multipurpose. The scheme illustrated is ideal for a design that needs fast JTAG ISP,
Eight additional general I/O with PLD capability,
access to Flash memory as Byte DMA or as Data
Overlay memory, and the DSP uses Power Down
mode. If your design needs more I/O, or Byte DMA
access to Flash memory is all that is needed (no
Data Overlay), or lowest power consumption is not
an issue, then consider the following options.
Port C JTAG: Figure 6 shows all six JTAG signals in use full time (not multiplexed with I/0). Using six-pin JTAG can reduce ISP time by as much
as 30% compared to four-pin JTAG. Alternatively,
four-pin JTAG (TMS, TCK, TDI, TDO) can be used
if more general I/O pins are needed and the few
extra seconds of programming time is not crucial,
freeing up pins PC3 and PC4. Other JTAG options
include mutiplexing JTAG pins with general I/O
(see “Programming In-Circuit using JTAG ISP” on
page 41 and Application Note AN1153) or not using JTAG at all. If no JTAG is used, the DSM device has to be programmed on a conventional
programmer before it is installed on the circuit
board. Using no JTAG makes more I/O available.
Pin PD1. If Flash memory will be accessed only
using Byte DMA mode in your design, and no external Data Overlay memory accesses are used,
then pin PD1 can be used for other purposes
(MCUI/O, common CPLD clock input, external
chip select, or PLD input)
Pin PD2. If the DSP will not use Power Down
mode, then PD2 can be used for other purposes
(MCUI/O, external chip select, PLD input)
Pins PC2 and PC7. In Figure 6, these two pins
are used as dedicated address inputs connected
to DSP address outputs. This will route DSP address signals A16 and A17 directly into the DPLD.
Be aware that any free pin on Port B, Port C, or
Port D may be used for DSP address inputs, it
does not have to be pins PC2 and PC7.
Pin PB0. This pin is shown as a chip select for an
external peripheral device such as a 16450 or
16550 UART. Equivalently, any free pin on Ports
B, C, or D may be used for this.
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SPORT1
SERIAL CHN
SERIAL
DEVICE
_RESET
SPORT0
SERIAL CHN
PF0/MODEA
PF1/MODEB
PF2/MOCEC
PF3
_IRQE/PF4
_IRQL0/PF5
_IRQL1/PF6
_IRQ2/PF7
FL0
FL1
FL2
SERIAL
DEVICE
I/O
I/O
I/O
I/O
INTR/I_O
INTR/I_O
INTR/I_O
INTR/I_O
I/O
I/O
I/O
XTAL
CLKIN
_PWD
_BR
_BG
_BGH
_WR
_RD
_BMS
_IOMS
_DMS
_PMS
_CMS
D8
D9
D10
D11
D12
D13
D14
D15
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N/C
N/C
ADDR0
ADDR1
ADDR2
ADDR3
ADDR4
ADDR5
ADDR6
ADDR7
WRITE
READ
BYTE MEM SELECT
I/O MEM SELECT
DATA MEM SELECT
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
D18
D19
A8
A9
A10
A11
A12
A13
D16
D17
A0
A1
A2
A3
A4
A5
A6
A7
ADDR8
ADDR9
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
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_RESET
POWER DOWN
ADDR16
ADDR17
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PWDACK
_RESET
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CLOCK or
XTAL
PWR_DOWN_IN
BUS_REQUEST
BUS_GRANT
GRANT_HUNG
ADSP-218X
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ADIO8
ADIO9
ADIO10
ADIO11
ADIO12
ADIO13
ADIO14
ADIO15
ADIO0
ADIO1
ADIO2
ADIO3
ADIO4
ADIO5
ADIO6
ADIO7
CNTL0
CNTL1
CNTL2
PD0
PD1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
DSM2180F3
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PD2/_CSI
_RESET
PC2
PC7
PC0
PC1
PC3
PC4
PC5
PC6
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
TMS
TCK
TSTAT
_TERR
TDI
TDO
VCC
_RESET
GND
CHIP SEL
I/O
I/O
I/O
I/O
I/O
I/O
I/O
_SELECT
ADDRESS
_WR
_RD
DATA
AI04912
(UART, ETC)
OPTIONAL
PARALLEL
DEVICE
JTAG-ISP
CONNECTOR
DATA8..15
WRITE
READ
ADDR0..2
DSM2180F3
Figure 6. Typical Connections
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MEMORY MAP
Figure 7 shows a typical system memory map.
The nomenclature fs0..fs7 are individual 16K Byte
Flash memory segment designators. csiop designates the DSM control register block. The DSP
runs in Full Memory Mode. Memory contents of
the DSM device may lie in one or more of three different DSP address spaces; I/O space, Byte DMA
space, and/or External Data Overlay Memory
space. Since the DSM device is a byte-wide memory, it typically is not used in DSP Program Memory space (PMS active).
The designer may easily specify memory mapping
in a point-and-click software environment using
PSDsoft ExpressTM. Since the memory mapping is
implemented with the DPLD and the Page Register, many possibilities exist. Figure 7 shows a typical memory map with the following attributes:
I/O Address Space. The 256 byte locations for
DSM control registers (csiop) reside in DSP I/O
address space, selected by the DSP IOMS signal.
Since DSP I/O accesses are by 16 bits, not 8 bits,
the upper byte of a 16-bit DSP I/O access must be
ignored.
Byte DMA Address Space. The DSP may bootload or fetch overlay bytes from 128K Bytes of
Flash memory using the DSP BDMA channel. The
DSP may also write to Flash memory using the
Byte DMA channel. DSM Flash memory is accessed in 128K continuous byte address locations
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through the BDMA channel and is selected whenever the DSP BMS signal is active.
Flash memory in the DSM device must be unlocked and written by the DSP one byte at a time,
checking status after each write (typical Flash
memory programming algorithm). A DMA channel
is not optimum for this scenario since the channel
must be initialized on each byte access. That is
why the 128K Bytes of Flash memory also lie in
DSP Data Overlay Memory space as described
next.
Data Overlay Memory Address Space. All
128K Bytes of Flash memory also reside in DSP
External Data Overlay Memory space, selected by
DMS, allowing more efficient byte writes to Flash
memory. The DSP uses its external data overlay
window of 8K locations to access external memory
as data. The DSP doubles the size of this window
to 16K locations by manipulating its A13 address
line using its DMOVLAY register (See ADSP-218X
data sheets for details). Since all 128K Bytes of
Flash memory must be accessed through a window of only 16K locations, the DSP uses the Page
Register inside the DSM device to page through 8
pages of 16K Bytes as shown in Figure 7. Since
DSP Data accesses are by 16 bits, not 8 bits, the
upper byte of a 16-bit DSP Data access must be
ignored.
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_cs_uart
8 UART REGS
csiop
256 CONTROL REGS
000FF
00000
Nothing
Mapped
1BFFF
1C000
1FFFF
fs6
16 KBytes
Flash Memory
fs7
DSP Byte DMA Memory
Space ( BMS )
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fs5
16 KBytes
Flash Memory
fs0
16 KBytes
Flash Memory
fs1
16 KBytes
Flash Memory
fs2
16 KBytes
Flash Memory
fs3
16 KBytes
Flash Memory
fs4
16 KBytes
Flash Memory
Nothing
Mapped
00000
03FFF
A13 = 1
16 KBytes
A13 = 0
(8 KWords)
fs0
PAGE 0
A13 = 1
A13 = 0
fs2
PAGE 2
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A13 = 1
A13 = 0
fs3
PAGE 3
A13 = 1
A13 = 0
fs4
PAGE 4
A13 = 0
A13 = 0
A13 = 1
00000
03FFF
AI04913
A13 = 0
fs7
PAGE 7
A13 = 1
fs6
PAGE 6
A13 = 1
fs5
PAGE 5
Flash Memory Paged Over 8 Pages
A13 = 1
fs1
PAGE 1
1FFFF
DSP Data Memory
Space ( DMS)
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00000
03FFF
04000
07FFF
08000
0BFFF
0C000
0FFFF
10000
13FFF
14000
17FFF
18000
16 KBytes
Flash Memory
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00200
1FFFF
DSP I/O Memory
Space ( IOMS)
DSM2180F3
Figure 7. Typical System Memory Map
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DSM2180F3
SPECIFYING MEM MAP WITH PSDSOFT EXPRESSTM
The memory map shown in Figure 7 can be easily
ments of the ABEL language. Figure 8 shows the
specified with PSDsoft ExpressTM in a point-andresulting equations generated by PSDsoft Exclick environment. PSDsoft ExpressTM will generpressTM.
ate Hardware Definition Language (HDL) stateFigure 8. HDL Statements Generated from PSDsoft Express to Implement Memory Map
csiop = ((address >= ^h0000) & (address <= ^h00FF) & (!_ioms & _dms & _bms));
fs0 = ((address >= ^h0000) & (address <= ^h3FFF) & (_ioms & _dms & !_bms))
# ((page == 0) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
fs1 = ((address >= ^h4000) & (address <= ^h7FFF) & (_ioms & _dms & !_bms))
# ((page == 1) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
fs2 = ((address >= ^h8000) & (address <= ^hBFFF) & (_ioms & _dms & !_bms))
# ((page == 2) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
fs3 = ((address >= ^hC000) & (address <= ^hFFFF) & (_ioms & _dms & !_bms))
# ((page == 3) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
fs4 = ((address >= ^h10000) & (address <= ^h13FFF) & (_ioms & _dms & !_bms))
# ((page == 4) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
fs5 = ((address >= ^h14000) & (address <= ^h17FFF) & (_ioms & _dms & !_bms))
# ((page == 5) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
fs6 = ((address >= ^h18000) & (address <= ^h1BFFF) & (_ioms & _dms & !_bms))
# ((page == 6) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
fs7 = ((address >= ^h1C000) & (address <= ^h1FFFF) & (_ioms & _dms & !_bms))
# ((page == 7) & (address >= ^h0000) & (address <= ^h3FFF) & (_ioms & !_dms &
_bms));
! _cs_uart = ((address >= ^h0200) & (address <= ^h0207) & (!_ioms & _dms & _bms));
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Specifying these equations using PSDsoft ExpressTM is very simple. Figure 9 shows how to
specify the equation for the 16K Byte Flash memory segment, fs2. Notice how fs2 can reside in two
different address spaces depending on the state of
the control signals from the DSP (IOMS, DMS, or
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BMS) and the memory page number coming from
the DSM Page Register outputs. This specification
process is repeated for all other Flash memory
segments, the csiop register block, and any external chip select signals (UART, etc.).
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DSM2180F3
Figure 9. PSDsoft ExpressTM Memory Mapping
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AI03779
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DSM2180F3
RUNTIME CONTROL REGISTER DEFINITION
There are up to 256 addresses decoded inside the
DSM device for control and status information. 27
of these locations contain registers that the DSP
can access at runtime. The base address of this
block of 256 locations is referred to in this manual
as csiop (Chip Select I/O Port). Table 4 lists the 27
registers and their offsets (in hex) from the csiop
base address needed to access individual DSM
control and status registers. The DSP will access
these registers in I/O memory space using its IOMS
strobe. These registers are accesses in bytes, so
the DSP should ignore the upper byte of its 16-bit
I/O access.
Note1: All csiop registers are cleared to logic 0 at
reset.
Note2: Do not write to unused locations within the
csiop block of 256 registers. They should remain
logic zero.
Table 4. CSIOP Registers and their Offsets (in hex)
Register Name
Port B
Port C
Port D
Other
Description
Data In
01
10
11
MCUI/O input mode. Read to obtain current logic level of
Port pins. No writes.
Data Out
05
12
13
MCU I/O output mode. Write to set logic level on Port
pins. Read to check status.
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Direction
07
14
15
MCU I/O mode. Configures Port pin as input or output.
Write to set direction of Port pins.
Logic 1 = out, Logic 0 = in. Read to check status.
Drive Select
09
16
17
Write to configure Port pins as either standard CMOS or
Open Drain on some pins, while selecting high slew rate
on other pins. Read to check status.
Input Macrocells
0B
18
Read to obtain state of IMCs. No writes.
1A
Read to obtain the status of the output enable logic on
each I/O Port driver. No writes.
Enable Out
0D
1B
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20
Read to get logic state of output of OMC bank AB.
Write to load registers of OMC bank AB.
21
Read to get logic state of output of OMC bank BC.
Write to load registers of OMC bank BC.
22
Write to set mask for loading OMCs in bank AB. A logic
1 in a bit position will block reads/writes of the
corresponding OMC. A logic 0 will pass OMC value.
Read to check status.
Mask Macrocells BC
23
Write to set mask for loading OMCs in bank BC. A logic
1 in a bit position will block reads/writes of the
corresponding OMC. A logic 0 will pass OMC value.
Read to check status.
Flash Sector Protect
C0
Read to determine Flash Sector Protection Setting. No
writes.
Security Bit
C2
Read to determine if DSM devices Security Bit is active.
Logic 1 = device secured. No writes.
JTAG Enable
C7
Write to enable JTAG Pins (optional feature). Read to
check status.
PMMR0
B0
Power Management Register 0. Write and read.
PMMR2
B4
Power Management Register 2. Write and read.
Page
E0
Memory Page Register. Write and read.
Output Macrocells AB
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Output Macrocells BC
Mask Macrocells AB
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DSM2180F3
DETAILED OPERATION
Figure 5 shows major functional areas of the device:
■ Flash Memory
■
PLDs (DPLD, CPLD, Page Register)
■
DSP Bus Interface (Address, Data, Control)
■
I/O Ports
■
Runtime Control Registers
■
JTAG ISP Interface
The following describes these functions in more
detail.
Flash Memory
The Flash memory array is divided evenly into
eight equal 16K byte sectors. Each sector is selected by the DPLD can be separately protected
from program and erase cycles. This configuration
is specified by using PSDsoft ExpressTM.
Memory Sector Select Signals. The DPLD generates the Select signals for all the internal memory blocks (see Figure 14). Each of the eight sectors
of the Flash memory has a Select signal (FS0FS7) which contains up to three product terms.
Having three product terms for each Select signal
allows a given sector to be mapped into multiple
areas of system memory.
Ready/Busy (PC3). This signal can be used to
output the Ready/Busy status of the device. The
output on Ready/Busy (PC3) is a 0 (Busy) when
Flash memory is being written, or when Flash
memory is being erased. The output is a 1 (Ready)
when no Write or Erase cycle is in progress. This
signal may be polled by the DSP or used as a DSP
interrupt to indicate when an erase or program cycle is complete.
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Memory Operation. The Flash memory is accessed through the DSP Address, Data, and Control Bus Interface. The DSP can access Flash
memory as BDMA mode or as External Data
Memory Overlay. But from the DSM perspective, it
sees either type of access as a series of byte operations (reads and writes). If the DSP accesses
the DSM in BDMA mode, then the DSP BDMA
channel must be initialized and run for each byte
(or block of bytes) read from Flash memory or it
must initialize the DMA channel for each byte written to Flash memory. Alternatively, if the DSP accesses the DSM in External Data Memory Overlay
mode, then the DSP must only ensure the PSD
Page Register and the DSP DMOVLAY register
contains the correct value, then it performs a normal data read or data write operation without the
burden of initializing the BDMA channel for each
operation (upper byte of 16-bit word is ignored).
DSPs and MCUs cannot write to Flash memory as
it would an SRAM device. Flash memory must first
be “unlocked” with a special sequence of byte
write operations to invoke an internal algorithm,
then a single data byte is written to the Flash memory array, then programming status is checked by
a byte read operation or by checking the Ready/
Busy pin (PC3). Table 5 lists all of the special instruction sequences to program (write) data to the
Flash memory array, erase the array, and check
for different types of status from the array. These
instruction sequences are different combinations
of individual byte write and byte read operations.
Once the Flash memory array is programmed
(written) and then it is in “Read Array” mode, the
DSP will read from Flash memory just as if would
from any 8-bit ROM or SRAM device.
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DSM2180F3
Table 5. Instruction Sequences1,2,3,4
Instruction
Sequence
Cycle 1
Cycle 2
Cycle 3
Cycle 4
Cycle 5
Cycle 6
Read Memory
Contents5
Read byte
from any
valid Flash
memory addr
Read Flash
Identifier6,7
Write AAh to
XX555h
Write 55h
to XXAAAh
Write 90h
to XX555h
Read identifier
with addr lines
A6,A1,A0 =
0,0,1
Read Memory
Sector Protection
Status6,7,8
Write AAh to
XX555h
Write 55h
to XXAAAh
Write 90h
to XX555h
Read identifier
with addr lines
A6,A1,A0 =
0,1,0
Program a Flash
Byte
Write AAh to
XX555h
Write 55h
to XXAAAh
Write A0h
to XX555h
Write
(program)
data to addr
Flash Bulk Erase9
Write AAh to
XX555h
Write 55h
to XXAAAh
Write 80h
to XX555h
Write AAh to
XX555h
Write 55h
to XXAAAh
Write 10h
to XX555h
Flash Sector
Erase10
Write AAh to
XX555h
Write 55h
to XXAAAh
Write 80h
to XX555h
Write AAh to
XX555h
Write 55h
to XXAAAh
Write 30h
to another
Sector
Suspend Sector
Erase11
Write B0h to
address that
activates any
of FS0 - FS7
Resume Sector
Erase12
Write 30h to
addr that
activates any
of FS0 - FS7
Reset Flash
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Write 30h
to another
Sector
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Write F0h to
address that
activates any
of FS0 - FS7
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Note: 1. All values are in hexadecimal, X = Don’t Care
2. A desired internal Flash memory sector select signal (FS0 - FS7) must be active for each write or read cycle. Only one of FS0 - FS7
will be active at any given time depending on the address presented by the DSP and the memory mapping defined in PSDsoft Express. FS0 - FS7 are active high logic internally.
3. DSP addresses A17 through A12 are Don’t Care during the instruction sequence decoding. Only address bits A11-A0 are used
during Flash memory instruction sequence decoding bus cycles. The individual sector select signal (FS0 - FS7) which is active during the instruction sequences determines the complete address.
4. For write operations, addresses are latched on the falling edge of Write Strobe (WR, CNTL0), Data is latched on the rising edge of
Write Strobe (WR, CNTL0)
5. No Unlock or Instruction cycles are required when the device is in the Read Array mode. Operation is like reading a ROM device.
6. The Reset Flash instruction is required to return to the normal Read Array mode if the Error Flag (DQ5) bit goes High, or after reading the Flash Identifier or after reading the Sector Protection Status.
7. The DSP cannot invoke this instruction sequence while executing code from the same Flash memory as that for which the instruction sequence is intended. The DSP must fetch, for example, the code from the DSP SRAM when reading the Flash memory Identifier or Sector Protection Status.
8. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and
(A1,A0)=(1,0)
9. Directing this command to any individual active Flash memory segment (FS0 - FS7) will invoke the bulk erase of all eight Flash
memory sectors.
10. DSP writes command sequece to initial segment to be erased, then writes the byte 30h to additional sectors to be erased. The byte
30h must be addressed to one of the other Flash memory segments (FS0 - FS7) for each additional segment (write 30h to any
address within a desired sector). No more than 80uS can elapse between subsequent additional sector erase commands.
11. The system may perform Read and Program cycles in non-erasing sectors, read the Flash ID or read the Sector Protect Status,
when in the Suspend Sector Erase mode. The Suspend Sector Erase instruction sequence is valid only during a Sector Erase cycle.
12. The Resume Sector Erase instruction sequence is valid only during the Suspend Sector Erase mode.
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DSM2180F3
Instruction Sequences
An instruction sequence consists of a sequence of
specific write or read operations. Each byte written
to the device is received and sequentially decoded
and not executed as a standard write operation to
the memory array. The instruction sequence is executed when the correct number of bytes are properly received and the time between two
consecutive bytes is shorter than the time-out period. Some instruction sequences are structured to
include read operations after the initial write operations.
The instruction sequence must be followed exactly. Any invalid combination of instruction bytes or
time-out between two consecutive bytes while addressing Flash memory resets the device logic into
Read Array mode (Flash memory is read like a
ROM device). The device supports the instruction
sequences summarized in Table 5:
Flash memory:
■ Erase memory by chip or sector
■
Suspend or resume sector erase
■
Program a Byte
■
Reset to Read Array mode
■
Read primary Flash Identifier value
■
Read Sector Protection Status
These instruction sequences are detailed in Table
5. For efficient decoding of the instruction sequences, the first two bytes of an instruction sequence are the coded cycles and are followed by
an instruction byte or confirmation byte. The coded
cycles consist of writing the data AAh to address
XX555h during the first cycle and data 55h to address XXAAAh during the second cycle. Address
signals A17-A12 are Don’t Care during the instruction sequence Write cycles. However, the appropriate internal Sector Select (FS0-FS7) must be
selected internally (active, which is logic 1).
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Reading Flash Memory
Under typical conditions, the DSP may read the
Flash memory using read operations just as it
would a ROM or RAM device. Alternately, the DSP
may use read operations to obtain status information about a Program or Erase cycle that is currently in progress. Lastly, the DSP may use
instruction sequences to read special data from
these memory blocks. The following sections describe these read instruction sequences.
Read Memory Contents. Flash
memory
is
placed in the Read Array mode after Power-up,
chip reset, or a Reset Flash memory instruction
sequence (see Table 5). The DSP can read the
memory contents of the Flash memory by using
read operations any time the read operation is not
part of an instruction sequence.
Read Flash Identifier. The Flash memory identifier is read with an instruction sequence composed
of 4 operations: 3 specific write operations and a
read operation (see Table 5). During the read operation, address bits A6, A1, and A0 must be
0,0,1, respectively, and the appropriate internal
Sector Select (FS0-FS7) must be active. The identifier 0xE3.
Read Memory Sector Protection Status. The
Flash memory Sector Protection Status is read
with an instruction sequence composed of 4 operations: 3 specific write operations and a read operation (see Table 5). During the read operation,
address bits A6, A1, and A0 must be 0,1,0, respectively, while internal Sector Select (FS0-FS7)
designates the Flash memory sector whose protection has to be verified. The read operation produces 01h if the Flash memory sector is protected,
or 00h if the sector is not protected.
The sector protection status can also be read by
the DSP accessing the Flash memory Protection
register in csiop space. See the section entitled
“Flash Memory Sector Protect” for register definitions.
Table 6. Status Bit Definition
Functional Block
bs
Flash Memory
O
FS0-FS7
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
Active (the desired
segment is selected)
Data
Polling
Toggle
Flag
Error
Flag
X
Erase
Timeout
X
X
X
Note: 1. X = Not guaranteed value, can be read either 1 or 0.
2. DQ7-DQ0 represent the Data Bus bits, D7-D0.
Reading the Erase/Program Status Bits. The
device provides several status bits to be used by
the DSP to confirm the completion of an Erase or
Program cycle of Flash memory. These status bits
minimize the time that the DSP spends performing
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these tasks and are defined in Table 6. The status
bits can be read as many times as needed.
For Flash memory, the DSP can perform a read
operation to obtain these status bits while an
Erase or Program instruction sequence is being
executed by the embedded algorithm. See the
DSM2180F3
section entitled “Programming Flash Memory”, on
page 21, for details.
Data Polling Flag (DQ7). When erasing or programming in Flash memory, the Data Polling Flag
(DQ7) bit outputs the complement of the bit being
entered for programming/writing on the Data Polling Flag (DQ7) bit. Once the Program instruction
sequence or the write operation is completed, the
true logic value is read on the Data Polling Flag
(DQ7) bit (in a read operation).
Flash memory instruction features:
■ Data Polling is effective after the fourth Write
pulse (for a Program instruction sequence) or
after the sixth Write pulse (for an Erase
instruction sequence). It must be performed at
the address being programmed or at an address
within the Flash memory sector being erased.
■
During an Erase cycle, the Data Polling Flag
(DQ7) bit outputs a 0. After completion of the
cycle, the Data Polling Flag (DQ7) bit outputs
the last bit programmed (it is a 1 after erasing).
■
If the byte to be programmed is in a protected
Flash memory sector, the instruction sequence
is ignored.
■
If all the Flash memory sectors to be erased are
protected, the Data Polling Flag (DQ7) bit is
reset to 0 for about 100 µs, and then returns to
the previous addressed byte. No erasure is
performed.
Error Flag (DQ5). During a normal Program or
Erase cycle, the Error Flag (DQ5) bit is to 0. This
bit is set to 1 when there is a failure during Flash
memory Byte Program, Sector Erase, or Bulk
Erase cycle.
In the case of Flash memory programming, the Error Flag (DQ5) bit indicates the attempt to program
a Flash memory bit from the programmed state, 0,
to the erased state, 1, which is not valid. The Error
Flag (DQ5) bit may also indicate a Time-out condition while attempting to program a byte.
In case of an error in a Flash memory Sector Erase
or Byte Program cycle, the Flash memory sector in
which the error occurred or to which the programmed byte belongs must no longer be used.
Other Flash memory sectors may still be used.
The Error Flag (DQ5) bit is reset after a Reset
Flash instruction sequence.
Erase Time-out Flag (DQ3). The Erase Timeout Flag (DQ3) bit reflects the time-out period allowed between two consecutive Sector Erase instruction sequence bytes. The Erase Time-out
Flag (DQ3) bit is reset to 0 after a Sector Erase cycle for a time period of 100 µs + 20% unless an additional Sector Erase instruction sequence is
decoded. After this time period, or when the additional Sector Erase instruction sequence is decoded, the Erase Time-out Flag (DQ3) bit is set to 1.
Programming Flash Memory
When a byte of Flash memory is programmed, individual bits are programmed to logic 0. You cannot program a bit in Flash memory to a logic 1
once it has been programmed to a logic 0. A bit
must be erased to logic 1, and programmed to logic 0. That means Flash memory must be erased
prior to being programmed. A byte of Flash memory is erased to all 1s (FFh). The DSP may erase
the entire Flash memory array all at once or individual sector-by-sector, but not byte-by-byte.
However, the DSP may program Flash memory
byte-by-byte.
The Flash memory requires the DSP to send an instruction sequence to program a byte or to erase
sectors (see Table 5).
Once the DSP issues a Flash memory Program or
Erase instruction sequence, it must check for the
status bits for completion. The embedded algorithms that are invoked inside the device provide
several ways give status to the DSP. Status may
be checked using any of three methods: Data Polling, Data Toggle, or Ready/Busy (pin PC3).
Data Polling. Polling on the Data Polling Flag
(DQ7) bit is a method of checking whether a Pro-
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Toggle Flag (DQ6). The device offers another
way for determining when the Flash memory Program cycle is completed. During the internal write
operation and when the Sector Select FS0-FS7 is
true, the Toggle Flag (DQ6) bit toggles from 0 to 1
and 1 to 0 on subsequent attempts to read any
byte of the memory.
When the internal cycle is complete, the toggling
stops and the data read on the Data Bus D0-7 is
the addressed memory byte. The device is now
accessible for a new read or write operation. The
cycle is finished when two successive reads yield
the same output data. Flash memory specific features:
■ The Toggle Flag (DQ6) bit is effective after the
fourth write operation (for a Program instruction
sequence) or after the sixth write operation (for
an Erase instruction sequence).
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toggles to 0 for about 100 µs and then returns to
the previous addressed byte.
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■
If the byte to be programmed belongs to a
protected Flash memory sector, the instruction
sequence is ignored.
■
If all the Flash memory sectors selected for
erasure are protected, the Toggle Flag (DQ6) bit
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DSM2180F3
gram or Erase cycle is in progress or has completed. Figure 10 shows the Data Polling algorithm.
When the DSP issues a Program instruction sequence, the embedded algorithm within the device
begins. The DSP then reads the location of the
byte to be programmed in Flash memory to check
status. The Data Polling Flag (DQ7) bit of this location becomes the compliment of bit 7 of the original data byte to be programmed. The DSP
continues to poll this location, comparing the Data
Polling Flag (DQ7) bit and monitoring the Error
Flag (DQ5) bit. When the Data Polling Flag (DQ7)
bit matches bit7 of the original data, and the Error
Flag (DQ5) bit remains 0, then the embedded algorithm is complete. If the Error Flag (DQ5) bit is
1, the DSP should test the Data Polling Flag (DQ7)
bit again since the Data Polling Flag (DQ7) bit may
have changed simultaneously with the Error Flag
(DQ5) bit (see Figure 10).
The Error Flag (DQ5) bit is set if either an internal
time-out occurred while the embedded algorithm
attempted to program the byte or if the DSP attempted to program a 1 to a bit that was not erased
(not erased is logic 0).
It is suggested (as with all Flash memories) to read
the location again after the embedded programming algorithm has completed, to compare the
byte that was written to the Flash memory with the
byte that was intended to be written.
When using the Data Polling method during an
Erase cycle, Figure 10 still applies. However, the
Data Polling Flag (DQ7) bit is 0 until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a time-out condition on the Erase cycle, a
0 indicates no error. The DSP can read any location within the sector being erased to get the Data
Polling Flag (DQ7) bit and the Error Flag (DQ5) bit.
PSDsoft Express generates ANSI C code functions which implement these Data Polling algorithms.
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Figure 10. Data Polling Flowchart
START
READ DQ5 & DQ7
at VALID ADDRESS
DQ7
=
DATA
YES
NO
NO
DQ5
=1
YES
READ DQ7
DQ7
=
DATA
NO
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AI01369B
Data Toggle. Checking the Toggle Flag (DQ6) bit
is a method of determining whether a Program or
Erase cycle is in progress or has completed. Figure 11 shows the Data Toggle algorithm.
When the DSP issues a Program instruction sequence, the embedded algorithm within the device
begins. The DSP then reads the location of the
byte to be programmed in Flash memory to check
status. The Toggle Flag (DQ6) bit of this location
toggles each time the DSP reads this location until
the embedded algorithm is complete. The DSP
continues to read this location, checking the Toggle Flag (DQ6) bit and monitoring the Error Flag
(DQ5) bit. When the Toggle Flag (DQ6) bit stops
toggling (two consecutive reads yield the same
value), and the Error Flag (DQ5) bit remains 0,
then the embedded algorithm is complete. If the
Error Flag (DQ5) bit is 1, the DSP should test the
Toggle Flag (DQ6) bit again, since the Toggle Flag
(DQ6) bit may have changed simultaneously with
the Error Flag (DQ5) bit (see Figure 11).
DSM2180F3
Figure 11. Data Toggle Flowchart
START
READ
DQ5 & DQ6
DQ6
=
TOGGLE
NO
YES
NO
DQ5
=1
YES
READ DQ6
DQ6
=
TOGGLE
NO
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YES
FAIL
PASS
AI01370B
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The Error Flag (DQ5) bit is set if either an internal
time-out occurred while the embedded algorithm
attempted to program the byte, or if the DSP attempted to program a 1 to a bit that was not erased
(not erased is logic 0).
It is suggested (as with all Flash memories) to read
the location again after the embedded programming algorithm has completed, to compare the
byte that was written to Flash memory with the
byte that was intended to be written.
When using the Data Toggle method after an
Erase cycle, Figure 11 still applies. the Toggle
Flag (DQ6) bit toggles until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a
time-out condition on the Erase cycle, a 0 indicates no error. The DSP can read any location
within the sector being erased to get the Toggle
Flag (DQ6) bit and the Error Flag (DQ5) bit.
PSDsoft Express generates ANSI C code functions which implement these Data Toggling algorithms.
Erasing Flash Memory
Flash Bulk Erase. The Flash Bulk Erase instruction sequence uses six write operations followed
by a read operation of the status register, as described in Table 5. If any byte of the Bulk Erase instruction sequence is wrong, the Bulk Erase
instruction sequence aborts and the device is re-
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set to the Read Flash memory status. The Bulk
Erase command may be addresses to any one individual valid Flash memory segment (FS0-FS7)
and the entire array (all segments) will be erased.
During a Bulk Erase, the memory status may be
checked by reading the Error Flag (DQ5) bit, the
Toggle Flag (DQ6) bit, and the Data Polling Flag
(DQ7) bit, as detailed in the section entitled “Programming Flash Memory”, on page 21. The Error
Flag (DQ5) bit returns a 1 if there has been an
Erase Failure (maximum number of Erase cycles
have been executed).
It is not necessary to program the memory with
00h because the device automatically does this
before erasing to 0FFh.
During execution of the Bulk Erase instruction sequence, the Flash memory does not accept any instruction sequences.
The address provided with the Flash Bulk Erase
command sequence (Table 5) may select any one
of the eight internal Flash memory Sector Select
signals (FS0 - FS7). An erase of the entire Flash
memory array will occur even though the command was sent to just one Flash memory sector.
Flash Sector Erase. The Sector Erase instruction sequence uses six write operations, as described in Table 5. Additional Flash Sector Erase
codes and Flash memory sector addresses can be
written subsequently to erase other Flash memory
sectors in parallel, without further coded cycles, if
the additional bytes are transmitted in a shorter
time than the time-out period of about 100 µs. The
input of a new Sector Erase code restarts the timeout period.
The status of the internal timer can be monitored
through the level of the Erase Time-out Flag (DQ3)
bit. If the Erase Time-out Flag (DQ3) bit is 0, the
Sector Erase instruction sequence has been received and the time-out period is counting. If the
Erase Time-out Flag (DQ3) bit is 1, the time-out
period has expired and the device is busy erasing
the Flash memory sector(s). Before and during
Erase time-out, any instruction sequence other
than Suspend Sector Erase and Resume Sector
Erase instruction sequences abort the cycle that is
currently in progress, and reset the device to Read
Array mode. It is not necessary to program the
Flash memory sector with 00h as the device does
this automatically before erasing (byte=FFh).
During a Sector Erase, the memory status may be
checked by reading the Error Flag (DQ5) bit, the
Toggle Flag (DQ6) bit, and the Data Polling Flag
(DQ7) bit, as detailed in the section entitled “Programming Flash Memory”, on page 21.
During execution of the Erase cycle, the Flash
memory accepts only Reset and Suspend Sector
Erase instruction sequences. Erasure of one
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DSM2180F3
Flash memory sector may be suspended, in order
to read data from another Flash memory sector,
and then resumed.
The address provided with the initial Flash Sector
Erase command sequence (Table 5) must select
the first desired sector (FS0 - FS7) to erase. Subsequent sector erase commands that are appended on within the time-out period must be
addressed to other desired segments (FS0 - FS7).
Suspend Sector Erase. When a Sector Erase
cycle is in progress, the Suspend Sector Erase instruction sequence can be used to suspend the
cycle by writing 0B0h to any address when an appropriate Sector Select (FS0-FS7) is selected
(See Table 5). This allows reading of data from another Flash memory sector after the Erase cycle
has been suspended. Suspend Sector Erase is
accepted only during an Erase cycle and defaults
to Read mode. A Suspend Sector Erase instruction sequence executed during an Erase time-out
period, in addition to suspending the Erase cycle,
terminates the time out period.
The Toggle Flag (DQ6) bit stops toggling when the
device internal logic is suspended. The status of
this bit must be monitored at an address within the
Flash memory sector being erased. The Toggle
Flag (DQ6) bit stops toggling between 0.1 µs and
15 µs after the Suspend Sector Erase instruction
sequence has been executed. The device is then
automatically set to Read mode.
If an Suspend Sector Erase instruction sequence
was executed, the following rules apply:
– Attempting to read from a Flash memory sector
that was being erased outputs invalid data.
– Reading from a Flash memory sector that was
not being erased is valid.
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– The Flash memory cannot be programmed, and
only responds to Resume Sector Erase and Reset Flash instruction sequences (Read is an operation and is allowed).
– If a Reset Flash instruction sequence is received, data in the Flash memory sector that
was being erased is invalid.
Resume Sector Erase. If a Suspend Sector
Erase instruction sequence was previously executed, the erase cycle may be resumed with this
instruction sequence. The Resume Sector Erase
instruction sequence consists of writing 030h to
any address while an appropriate Sector Select
(FS0-FS7) is active. (See Table 5.)
Flash Memory Sector Protect.
Each Flash memory sector can be separately protected against Program and Erase cycles. Sector
Protection provides additional data security because it disables all Program or Erase cycles. This
mode can be activated through the JTAG Port or a
Device Programmer. Sector protection can be selected for each sector using PSDsoft Express.
This automatically protects selected sectors when
the device is programmed through the JTAG Port
or a Device Programmer. Flash memory sectors
can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The DSP can read (but cannot change) the
sector protection bits.
Any attempt to program or erase a protected Flash
memory sector is ignored by the device. The Verify
operation results in a read of the protected data.
This allows a guarantee of the retention of the Protection status.
The sector protection status can be read by the
DSP through the Flash memory protection registers (in the csiop block) as defined in Table 7.
c
u
d
e
t
le
)
s
t(
o
r
P
o
s
b
O
-
Bit 7
Bit 6
u
d
o
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Sec7_Prot
Sec6_Prot
Sec5_Prot
Sec4_Prot
Sec3_Prot
Sec2_Prot
Sec1_Prot
Sec0_Prot
Table 7. Sector Protection/Security Bit Definition – Flash Protection Register
r
P
e
t
e
l
o
Note: 1. Bit Definitions:
Sec<i>_Prot 1 = Flash memory sector <i> is write protected.
Sec<i>_Prot 0 = Flash memory sector <i> is not write protected.
s
b
O
Table 8. Security Bit Definition
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Security_Bit
not used
not used
not used
not used
not used
not used
not used
Note: 1. Bit Definitions:
1 = Security Bit in device has been set.
24/63
DSM2180F3
DSM Security Bit
A programmable security bit in the DSM protects
its contents from unauthorized viewing and copying. When set, the security bit will block access of
programming devices (JTAG or others) to the
DSM Flash memory and PLD configuration. The
only way to defeat the security bit is to erase the
entire DSM device, after which the device is blank
and may be used again. The DSP will always have
access to Flash memory contents through the 8-bit
data port even while the security bit is set. The
DSP can read the status of the security bit (but it
cannot change it) by reading the Device Security
register in the csiop block as defined in Table 8.
Reset Flash
The Reset Flash instruction sequence resets the
internal memory logic state machine and puts
Flash memory into Read Array mode. It consists of
one write cycle (see Table 5). It must be executed
after:
– Reading the Flash Protection Status or Flash ID
– An Error condition has occurred (and the device
has set the Error Flag (DQ5) bit to 1) during a
Flash memory Program or Erase cycle.
The Reset Flash instruction sequence puts the
Flash memory back into normal Read Array mode.
It may take the Flash memory up to a few milliseconds to complete the Reset cycle. The Reset
Flash instruction sequence is ignored when it is issued during a Program or Bulk Erase cycle of the
Flash memory. The Reset Flash instruction sequence aborts any on-going Sector Erase cycle,
and returns the Flash memory to the normal Read
Array mode within a few milliseconds.
Page Register
The 8-bit Page Register increases the addressing
capability of the DSP by a factor of up to 256. The
contents of the register can also be read by the
DSP. The outputs of the Page Register (PG0PG7) are inputs to the DPLD decoder and can be
included in the Sector Select (FS0-FS7) equations. See Figure 12.
If memory paging is not needed, or if not all 8 page
register bits are needed for memory paging, then
these bits may be used in the CPLD for general
logic. The eight flip-flops in the register are connected to the internal data bus D0-D7. The DSP
can write to or read from the Page Register. The
Page Register can be accessed at address location csiop + E0h. Page Register outputs are
cleared to logic 0 at reset.
ct
(s)
o
r
P
e
s
b
O
t
e
l
o
du
Figure 12. Page Register
RESET
D0 - D7
D0
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
Q7
PGR0
INTERNAL
SELECTS
AND LOGIC
PGR1
PGR2
DPLD
AND
CPLD
PGR3
PGR4
PGR5
PGR6
PGR7
R/W
PAGE
REGISTER
PLD
PLDs
The PLDs bring programmable logic to the device.
After specifying the logic for the PLDs using PSDsoft Express, the logic is programmed into the device and available upon Power-up.
The PLDs have selectable levels of performance
and power consumption.
The device contains two PLDs: the Decode PLD
(DPLD), and the Complex PLD (CPLD), as shown
in Figure 13.
c
u
d
)
s
t(
o
r
P
Table 9. DPLD and CPLD Inputs
e
t
le
Input Source
o
s
b
O
-
Input Name
Number
of
Signals
DSP Address Bus1
A15-A0
16
DSP Control Signals2
CNTL2-CNTL0
3
Reset
RST
1
PortB Input Macrocells
PB7-PB0
8
PortC Input Macrocells
PC7-PC0
8
Port D Inputs
PD2-PD0
3
Page Register
PG7-PG0
8
Macrocell AB
Feedback
MCELLAB FB7-0
8
Macrocell BC
Feedback
MCELLBC FB7-0
8
Flash memory
Program Status Bit
Ready/Busy
1
Note: 1. DSP address lines A16, A17, and others may enter the
DSM device on any pin on ports B, C, or D. See Figure 6
for recommended connections.
2. Additional DSP control signals may enter the DMS device
on any pin on Ports B, C, or D. See Figure 6 for recommended connections.
25/63
DSM2180F3
The DPLD performs address decoding, and generates select signals for internal and external components, such as memory, registers, and I/O ports.
The DPLD can generates External Chip Select
(ECS0-ECS2) signals on Port D.
The CPLD can be used for logic functions, such as
loadable counters and shift registers, state machines, and encoding and decoding logic. These
logic functions can be constructed using the 16
Output Macrocells (OMC), 16 Input Macrocells
(IMC), and the AND Array.
The AND Array is used to form product terms.
These product terms are configured from the logic
definition entered in PSDsoft Express. An Input
Bus consisting of 64 signals is connected to the
PLDs. Input signals are shown in Table 9.
Turbo Bit. The PLDs in the device can minimize
power consumption by switching off when inputs
remain unchanged for an extended time of about
70 ns. Resetting the Turbo bit to 0 (Bit 3 of the
PMMR0 register) automatically places the PLDs
into standby if no inputs are changing. Turning the
Turbo mode off increases propagation delays
while reducing power consumption. Additionally,
five bits are available in the PMMR registers in
csiop to block DSP control signals from entering
the PLDs. This reduces power consumption and
can be used only when these DSP control signals
are not used in PLD logic equations. Each of the
two PLDs has unique characteristics suited for its
applications. They are described in the following
sections.
Figure 13. PLD Diagram
c
u
d
8
PAGE
REGISTER
Data
Bus
8
64
Flash Memory Selects
e
t
le
1
External Chip Selects to PORT D
PLD INPUT BUS
1
)
s
(
ct
JTAG Select
Direct Macrocell Access from MCU Data Bus
Output Macrocell Feedback
u
d
o
CPLD
r
P
e
64
16 Output
Macrocell
PT
ALLOC.
t
e
l
o
s
b
O
o
s
b
O
CSIOP Select
3
16
o
r
P
16 Input Macrocell
(PORT B,C)
MCELLAB
to PORT B
Macrocell
Alloc.
I/O PORTS
DECODE PLD
(DPLD)
)
s
t(
8
MCELLBC
to PORT B or C 8
Direct Macrocell Input to MCU Data Bus
16
Input Macrocell and Input Ports
3
PORT D Inputs
AI04900B
26/63
DSM2180F3
DECODE PLD (DPLD)
The DPLD, shown in Figure 14, is used for decoding the address for internal and external components. The DPLD can be used to generate the
following decode signals:
■ 8 Flash memory Sector Select (FS0-FS7)
signals with three product terms each
■
1 internal csiop select for DSM device control
and status registers (csiop is the base address
of the block of 256 byte locations)
■
1 JTAG Select signal (enables JTAG operations
on Port C when multiplexing JTAG signals with
general I/O signals)
■
3 external chip select output signals for Port D
pins, each with one product term.
Figure 14. DPLD Logic Array
(INPUTS)
I /O PORTS (PORT A,B,C)
3
ro
3
MCELLAB.FB [7:0] (Feedback)
FS1
(8)
P
e
let
3
MCELLBC.FB [7:0] (Feedback)
(8)
PG0 - PG7
(8)
3
so
(16)
A[15:0]
(3)
PD[2:0]
CNTRL[2:0] (Read/Write Control Signals) (3)
RESET
(1)
RD_BSY
(1)
d
o
r
P
e
t
c
u
t
e
l
o
bs
(s)
b
O
-
c
u
d
FS0
(16)
)
s
t(
3
3
FS2
FS3
8 Flash Memory
Sector Selects
FS4
FS5
3
FS6
3
FS7
1
CSIOP
I/O Decoder
Select
1
JTAGSEL
JTAG ISP
1
ECS0
1
ECS1
1
ECS2
External Chip Selects
to PORT D
AI04901
O
27/63
DSM2180F3
COMPLEX PLD (CPLD)
The CPLD can be used to implement system logic
functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols,
state machines, and random logic. See application
note AN1171 for details on how to specify logic using PSDsoft Express.
As shown in Figure 15, the CPLD has the following
blocks:
■ 16 Input Macrocells (IMC)
■
16 Output Macrocells (OMC)
■
Macrocell Allocator
■
Product Term Allocator
■
AND Array capable of generating up to 130
product terms
■
Two I/O Ports.
Each of the blocks are described in the sections
that follow.
The Input Macrocells (IMC) and Output Macrocells
(OMC) are connected to the device internal data
bus and can be directly accessed by the DSP. This
enables the DSP software to load data into the
Output Macrocells (OMC) or read data from both
the Input and Output Macrocells (IMC and OMC).
This feature allows efficient implementation of system logic and eliminates the need to connect the
data bus to the AND Array as required in most
standard PLD macro cell architectures.
Figure 15. Macrocell and I/O Port
PLD INPUT BUS
Product Terms
from other
MacrocellS
DSP ADDRESS / DATA BUS
c
u
d
TO OTHER I/O PORTS
CPLD Macrocells
I/O PORTS
DATA
LOAD
CONTROL
PT PRESET
MCU DATA IN
PRODUCT TERM
ALLOCATOR
o
r
P
LATCHED
ADDRESS OUT
e
t
le
DATA
MCU LOAD
)
s
t(
I/O Pin
Q
D
MUX
WR
AND ARRAY
UP TO 10
PRODUCT TERMS
MUX
POLARITY
SELECT
PR DI LD
D/T
MUX
PT
CLOCK
PLD INPUT BUS
GLOBAL
CLOCK
)
s
(
ct
D/T/JK FF
SELECT
PT CLEAR
so
b
O
-
COMB.
/REG
SELECT
CK
u
d
o
CLOCK
SELECT
Q
Macrocell
Out to
MCU
CL
r
P
e
CPLD
OUTPUT
CPLD OUTPUT
SELECT
PDR
Macrocell
to
I/O Port
Alloc.
INPUT
Q
DIR
REG.
D
WR
PT Output Enable (OE)
bs
O
I/O Port Input
Q D
Q D
PT INPUT LATCH GATE/CLOCK
Output Macrocell (OMC). Eight of the Output
Macrocells (OMC) are connected to Port B pins
and are named as McellAB0-McellAB7. The other
eight Macrocells are connected to Ports B or C
pins and are named as McellBC0-McellBC7.
OMCs may be used for internal feedback only
(buried registers), or their outputs may be routed
to external Port pins.
28/63
Input Macrocells
MUX
t
e
l
o
Macrocell Feedback
G
AI04902B
The Output Macrocell (OMC) architecture is
shown in Figure 17. As shown in the figure, there
are native product terms available from the AND
Array, and borrowed product terms available (if
unused) from other Output Macrocells (OMC). The
polarity of the product term is controlled by the
XOR gate. The Output Macrocell (OMC) can implement either sequential logic, using the flip-flop
DSM2180F3
element, or combinatorial logic. The multiplexer
selects between the sequential or combinatorial
logic outputs. The multiplexer output can drive a
port pin and has a feedback path to the AND Array
inputs.
The flip-flop in the Output Macrocell (OMC) block
can be configured as a D, T, JK, or SR type in
PSDsoft ExpressTM. The flip-flop’s clock, preset,
and clear inputs may be driven from a product
term of the AND Array. Alternatively, CLKIN (PD1)
can be used for the clock input to the flip-flop. The
flip-flop is clocked on the rising edge of CLKIN
(PD1). The preset and clear are active High inputs.
Each clear input can use up to two product terms.
Output Macrocell Allocator. Outputs of the 16
OMCs can be routed to a combination of pins on
Port B or Port D as shown in Figure 16. The OMC
output pin is automatically determined by
choosing pin functions in PSDsoft ExpressTM.
Routing can occur on a bit-by-bit basis, spitting
assignment between the Ports. However, one
OMC can be routed to one Port pin only, not both.
Figure 16. OMC Allocator
PORT B PINS
PORT C PINS
7 6 5 4 3 2 1 0
7 6 5 4 3 2 1 0
7 6 5 4 3 2 1 0
OMCs (MCELLAB)
7 6 5 4 3 2 1 0
OMCs (MCELLBC)
AI04915
Table 10. Output Macrocell Port and Data Bit Assignments
c
u
d
)
s
t(
Output
Macrocell
Port
Assignment
Native Product Terms
Maximum Borrowed
Product Terms
Data Bit for Loading or
Reading
McellAB0
Port B0
3
6
D0
McellAB1
Port B1
3
6
McellAB2
Port B2
3
McellAB3
Port B3
3
McellAB4
Port B4
3
e
t
le
McellAB5
Port B5
3
McellAB6
Port B6
3
McellAB7
Port B7
McellBC0
Port B0 or C0
McellBC1
Port B1 or C1
(s)
McellBC2
Port B or, C2
6
o
r
P
D1
D2
6
D3
6
D4
6
D5
6
D6
6
D7
4
5
D0
4
5
D1
4
5
D2
Port B3 orC3
4
5
D3
Port B4 orC4
4
6
D4
Port B5 or C5
4
6
D5
McellBC6
Port B6 orC6
4
6
D6
McellBC7
Port B7 orC7
4
6
D7
McellBC4
t
e
l
o
McellBC5
s
b
O
ct
u
d
o
r
P
e
McellBC3
3
so
b
O
-
Product Term Allocator. The CPLD has a Product Term Allocator. PSDsoft ExpressTM uses the
Product Term Allocator to borrow and place product terms from one Macrocell to another. This happens automatically in PSDsoft ExpressTM, but
understanding how allocation works will help you if
your logic design does not “fit”, in which case you
may try selecting a different pin or different OMC
where the allocation resources may differ and the
design will then fit. The following list summarizes
how product terms are allocated:
■ McellAB0-McellAB7 all have three native
product terms and may borrow up to six more
■
McellBC0-McellBC3 all have four native product
terms and may borrow up to five more
■
McellBC4-McellBC7 all have four native product
terms and may borrow up to six more.
29/63
DSM2180F3
Each Macrocell may only borrow product terms
from certain other Macrocells. Product terms already in use by one Macrocell are not available for
another Macrocell. Product term allocation does
not add any propagation delay to the logic.
If an equation requires more product terms than
are available to it through product term allocation,
then “external” product terms are required, which
consumes other Output Macrocells (OMC). This is
called product term expansion and also happens
automatically in PSDsoft ExpressTM as needed.
Product tern expansion causes additional propagation delay because an OMC is consumed by the
expansion and it’s output is rerouted (or fed back)
into the AND array.
You can examine the fitter report generated by
PSDsoft Express to see resulting product term allocation and product term expansion.
Loading and Reading the Output Macrocells
(OMCs). Each of the two OMC blocks (8 OMCs
each) occupies a memory location in the DSP address space, as defined in the csiop block
MCELLAB0-7 and MCELLBC0-7 (see Table 4).
The flip-flops in each of the 16 OMCs can be loaded from the data bus by a DSP. Loading the OMCs
with data from the DSP takes priority over internal
functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the DSP.
The ability to load the flip-flops and read them
back is useful in such applications as loadable
counters and shift registers, mailboxes, and handshaking protocols.
Data is loaded into the Output Macrocells (OMC)
on the trailing edge of Write Strobe (WR, CNTL0).
Figure 17. CPLD Output Macrocell
c
u
d
MASK
REG.
Output Macrocell CS
INTERNAL DATA BUS
e
t
le
RD
PT
Allocator
WR
ENABLE (.OE)
(s)
AND ARRAY
PLD INPUT BUS
PRESET(.PR)
PT
od
r
P
e
PT
t
e
l
o
s
b
O
t
c
u
PT
POLARITY
SELECT
o
r
P
D [ 7:0]
Direction
Register
COMB/REG
SELECT
DIN PR
MUX
LD
Q
I/O Pin
Macrocell
Allocator
IN
CLEAR (.RE)
CLR
Port
Driver
Programmable
FF (D / T/JK /SR)
PT CLK
CLKIN
o
s
b
O
-
)
s
t(
MUX
Feedback (.FB)
Port Input
Input
Macrocell
AI04903B
30/63
DSM2180F3
The OMC Mask Register. There is one Mask
Register for each of the two groups of eight Output
Macrocells (OMC). The Mask Registers can be
used to block the loading of data to individual Output Macrocells (OMC). The default value for the
Mask Registers is 00h, which allows loading of the
Output Macrocells (OMC). When a given bit in a
Mask Register is set to a 1, the DSP is blocked
from writing to the associated Output Macrocells
(OMC). For example, suppose McellAB0-3 are being used for a state machine. You would not want
a DSP write to McellAB to overwrite the state machine registers. Therefore, you would want to load
the Mask Register for McellAB (Mask Macrocell
AB) with the value 0Fh.
The Output Enable of the OMC. The
Output
Macrocells (OMC) block can be connected to an I/
O port pin as a PLD output. The output enable of
each port pin driver is controlled by a single product term from the AND Array, ORed with the Direction Register output. The pin is enabled upon
Power-up if no output enable equation is defined
and if the pin is declared as a PLD output in PSDsoft Express.
If the Output Macrocell (OMC) output is specified
as an internal node and not as a port pin output in
the PSDsoft Express, then the port pin can be
used for other I/O functions. The internal node
feedback can be routed as an input to the AND Array.
Figure 18. Input Macrocell
INTERNAL DATA BUS
INPUT MACROCELL _ RD
D [ 7: 0]
ENABLE ( .OE )
AND ARRAY
PT
OUTPUT
Microcells BC
AND
Microcells AB
e
t
le
PLD INPUT BUS
)
s
(
ct
MUX
o
r
P
e
t
e
l
o
s
b
O
o
r
P
so
b
O
-
PT
Feedback
c
u
d
DIRECTION
REGISTER
du
Q
)
s
t(
I/O Pin
Port
Driver
D
PT
D FF
Q
D
G
LATCH
Input Macrocells (IMC). The CPLD has 16 Input
Macrocells (IMC), one for each pin on Ports B and
C. The architecture of the IMCs is shown in Figure
18. The IMCs are individually configurable, and
can be used as a latch, a register, or to pass incoming Port signals prior to driving them onto the
PLD input bus. This is useful for sampling and debouncing inputs to the AND array (keypad inputs,
etc.). Additionally, the outputs of the IMCs can be
read by the DSP asynchronously at any time
Input Microcell
AI04904
through the internal data bus using the csiop register block (see Table 4).
The enable for the latch and clock for the register
are driven by a product term from the CPLD. Each
product term output is used to latch or clock four
IMCs. Port inputs 3-0 can be controlled by one
product term and 7-4 by another.
Configurations for the IMCs are specified by equations specified in PSDsoft Express. See Application note AN1171.
31/63
DSM2180F3
DSP Bus Interface
The “no-glue logic” DSP Bus Interface allows direct connection. DSP address, data, and control
signals connect directly to the DSM device. See
Figure 6 for typical connections.
DSP address, data and control signals are routed
to Flash memory, I/O control (csiop), OMCs, and
IMCs within the DMS. The DSP address range for
each of these components is specified in PSDsoft
ExpressTM.
I/O Ports
There are three programmable I/O ports: Ports B,
C, and D. Each of the ports is eight bits except Port
D, which is 3 bits. Each port pin is individually user
configurable, thus allowing multiple functions per
port. The ports are configured using PSDsoft Ex-
pressTM or by the DSP writing to on-chip registers
in the csiop block.
The topics discussed in this section are:
■ General Port architecture
■
Port operating modes
■
Port Configuration Registers (PCR)
■
Port Data Registers
■
Individual Port functionality.
General Port Architecture. The general architecture of the I/O Port block is shown in Figure 19.
Individual Port architectures are shown in Figure
20 to Figure 23. In general, once the purpose for a
port pin has been defined in PSDsoft ExpressTM,
that pin is no longer available for other purposes.
Exceptions are noted.
Figure 19. General I/O Port Architecture
DATA OUT
REG.
D
c
u
d
DATA OUT
Q
WR
OUTPUT
MUX
e
t
le
Macrocell Outputs
EXT CS
INTERNAL DATA BUS
READ MUX
P
D
DATA IN
)
s
(
ct
B
o
s
b
O
-
PORT PIN
OUTPUT
SELECT
ENABLE OUT
u
d
o
r
P
e
o
r
P
)
s
t(
DIR REG.
WR
D
Q
t
e
l
o
ENABLE PRODUCT TERM (.OE)
s
b
O
Input
Macrocell
CPLD-INPUT
As shown in Figure 19, the ports contain an output
multiplexer whose select signals are driven by the
configuration bits determined by PSDsoft Express.
Inputs to the multiplexer include the following:
■ Output data from the Data Out register (for MCU
I/O mode)
■
CPLD Macrocell output (OMC)
32/63
AI04905B
■
External Chip Selects ESC0-2 from the DPLD to
Port D pins only.
The Port Data Buffer (PDB) is a tri-state buffer that
allows only one source at a time to be read by the
DSP. The Port Data Buffer (PDB) is connected to
the Internal Data Bus for feedback and can be
read by the DSP. The Data Out and Macrocell out-
DSM2180F3
puts, Direction Registers, and port pin input are all
connected to the Port Data Buffer (PDB).
The Port pin’s tri-state output driver enable is controlled by a two input OR gate whose inputs come
from the CPLD AND Array enable product term
and the Direction Register. If the enable product
term of any of the Array outputs are not defined
and that port pin is not defined as a CPLD output
in PSDsoft ExpressTM, then the Direction Register
has sole control of the buffer that drives the port
pin.
The contents of these registers can be altered by
the DSP. The Port Data Buffer (PDB) feedback
path allows the DSP to check the contents of the
registers.
Ports B, and C have embedded IMCs. The IMCs
can be configured as registers (for sampling or de-
bouncing), as transparent latches, or direct inputs
to the PLDs. The registers and latches are clocked
by a product term from the PLD AND Array. The
outputs from the IMCs drive the PLD input bus and
can be read by the DSP. See the section entitled
“Input Macrocell”, on page 31.
Port Operating Modes
The I/O Ports have several modes of operation.
Modes are defined using PSDsoft ExpressTM, and
then runtime control from the DSP can occur using
the registers in the csiop block. See Application
Note AN1171 for more detail.
Table 11 summarizes which modes are available
on each port. Each of the port operating modes
are described in the following sections.
Table 11. Port Operating Modes
Port Mode
Port B
Port C
MCU I/O
Yes
Yes
PLD I/O
McellAB Outputs
McellBC Outputs
Additional Ext. CS Outputs
PLD Inputs
Yes
Yes
No
Yes
No
Yes
No
Yes
JTAG ISP
No
Note: 1. Can be multiplexed with other I/O functions.
o
s
b
O
-
MCU I/O Mode. In the MCU I/O mode, the DSP
uses the I/O Ports block to expand its own I/O
ports. The DSP can read I/O pins, set the direction
of I/O pins, and change the state of I/O pins by accessing the registers in the csiop block. The csiop
register definition and their addresses may be
found in Table 4.
The MCU I/O direction may be changed by writing
to the corresponding bit in the Direction Register,
or by the output enable product term. When the pin
is configured as an output, the content of the Data
Out Register drives the pin. When configured as
an input, the DSP can read the port input through
the Data In buffer. See Figure 19.
PLD I/O Mode. Inputs from Ports B and C to either PLD (DPLD or CPLD) come through IMCs. Inputs from Port D to either PLDs are routed directly
in and do not use IMCs. Outputs from the CPLD to
Port B come from the OMC group MCELLAB0-7.
Outputs from the CPLD to Port C come from OMC
group MCELLBC0-7. Outputs from the DPLD to
Port D come from the external chip select logic
block ECS0-2.
All PLD outputs may be tri-stated at the Port pins
with a control signal. This output enable control
signal can be defined by a product term from the
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Yes
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Port D
No
No
Yes
Yes
No
PLD, or by resetting the corresponding bit in the
Direction Register to 0. The corresponding bit in
the Direction Register must not be set to logic 1 by
the DSP if the pin is defined for a PLD input signal
in PSDsoft Express. The PLD I/O mode is defined
in PSDsoft Express by specifying PLD equations.
JTAG In-System Programming (ISP). Some of
the pins on Port C are based on the IEEE 1194.1
JTAG specification and is used for In-System Programming (ISP). You can multiplex the function of
these Port C JTAG pins with other functions. ISP
is not performed very frequently in the life of the
product, so multiplexing these pin’s functions with
general purpose I/O functions gives more utility
from Port C. See the section entitled “Programming In-Circuit Using JTAG ISP”, and Application
Note AN1153.
Port Configuration Registers (PCR). Each Port
has a set of Port Configuration Registers (PCR)
used for configuration of the pins. The contents of
the registers can be accessed by the DSP through
normal read/write bus cycles of the csiop registers
listed in Table 4.
The pins of a port are individually configurable and
each bit in the register controls its respective pin.
For example, Bit 0 in a register refers to Bit 0 of its
33/63
DSM2180F3
port. The three Port Configuration Registers
(PCR), are shown in Table 12. Default is logic 0.
Table 14. Port Pin Direction Control, Output
Enable P.T. Defined
Direction
Register Bit
Table 12. Port Configuration Registers (PCR)
Register Name
Port
DSP Access
Output Enable
P.T.
Port Pin Mode
0
0
Input
Data In
B,C,D
Read
0
1
Output
Data Out
B,C,D
Write/Read
1
0
Output
Direction
B,C,D
Write/Read
1
1
Output
B,C,D
Write/Read
Drive
Select1
Table 15. Port Direction Assignment Example
Note: 1. See Table 16 for Drive Register bit definition.
Data In Register. The DSP may read the Data In
registers in the csiop block at any time to determine the logic state of a Port pin. This will be the
state at the pin regardless of whether it is driven by
a source external to the DSM or driven internally
from the DSM device. Reading a logic zero for a bit
in a Data In register means the corresponding Port
pin is also at logic zero. Reading logic one means
the pin is logic one. Each bit in a Data In register
corresponds to an individual Port pin. For a given
Port, bit 0 in a Data In register corresponds to pin
0 of the Port. Example, bit 0 of the Data In register
for Port B corresponds to Port B pin PB0.
Data Out Register. The DSP may write (or read)
the Data Out register in the csiop block at any
time. Writing the Data Out register will change the
logic state of a Port pin only if it is not driven or
controlled by the CPLD. Writing a logic zero to a bit
in a Data Out register will force the corresponding
Port pin to be logic zero. Writing logic one will drive
the pin to logic one. Each bit in the Data Out registers correspond to Port pins the same way as the
Data In registers described above. When some
pins of a Port are driven by the CPLD, writing to
the corresponding bit in a Data Out register will
have no effect as the CPLD overrides the Data Out
register.
Direction Register. The Direction Register, in
conjunction with the output enable (except for Port
D), controls the direction of data flow in the I/O
Ports. Any bit set to 1 in the Direction Register
causes the corresponding pin to be an output, and
any bit set to 0 causes it to be an input. The default
mode for all port pins is input.
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Table 13. Port Pin Direction Control, Output
Enable P.T. Not Defined
Direction Register Bit
Port Pin Mode
0
Input
1
Output
34/63
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
1
1
1
Figure 20 and Figure 21 show the Port Architecture diagrams for Ports B and C, respectively. The
direction of data flow for Ports B, and C are controlled not only by the direction register, but also by
the output enable product term from the PLD AND
Array. If the output enable product term is not active, the Direction Register has sole control of a
given pin’s direction.
An example of a configuration for a Port with the
three least significant bits set to output and the remainder set to input is shown in Table 15. Since
Port D only contains three pins (shown in Figure
23), the Direction Register for Port D has only the
three least significant bits active.
Drive Select Register. The Drive Select Register
configures the pin driver as Open Drain or CMOS
(standard push/pull) for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins
configured as Open Drain. Open Drain outputs are
diode clamped, thus the maximum voltage on an
pin configured as Open Drain is Vcc + 0.7V.
A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a
1. The default pin drive is CMOS.
Note that the slew rate is a measurement of the
rise and fall times of an output. A higher slew rate
means a faster output response and may create
more electrical noise. A pin operates in a high slew
rate when the corresponding bit in the Drive Register is set to 1. The default rate is standard slew.
Table 16 shows the Drive Register for Ports B, C,
and D. It summarizes which pins can be configured as Open Drain outputs and which pins the
slew rate can be set for.
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DSM2180F3
Table 16. Drive Register Pin Assignment
Drive
Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Port B
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Slew
Rate
Slew
Rate
Slew
Rate
Slew
Rate
Port C
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Open
Drain
Port D
NA1
NA1
NA1
NA1
NA1
Slew
Rate
Slew
Rate
Slew
Rate
Note: 1. NA = Not Applicable.
Figure 20. Port B Structure
DATA OUT
REG.
D
DATA OUT
Q
WR
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OUTPUT
MUX
MACROCELL OUTPUTS
INTERNAL DATA BUS
READ MUX
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OUTPUT
SELECT
D
DATA IN
B
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DIR REG.
D
WR
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PORT B
PIN
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ENABLE OUT
ENABLE PRODUCT TERM (.OE)
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CPLD-INPUT
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Port B – Functionality and Structure
Port B can be configured to perform one or more
of the following functions:
■ MCU I/O Mode
■
Input
Macrocell
AI04906B
■
CPLD Input – Via the Input Macrocells (IMC).
■
Open Drain/Slew Rate – pins PB3-PB0 can be
configured to fast slew rate, pins PB7-PB4 can
be configured to Open Drain Mode.
CPLD Output – Macrocells McellAB7-McellAB0
can be connected to Port B. McellBC7McellBC0 can be connected to Port B or Port C.
35/63
DSM2180F3
Figure 21. Port C Structure
DATA OUT
REG.
D
DATA OUT
Q
WR
PORT C PIN
JTAG ISP
OUTPUT
MUX
MCELLBC [ 7:0 ]
INTERNAL DATA BUS
READ MUX
P
OUTPUT
SELECT
D
DATA IN
B
ENABLE OUT
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DIR REG.
D
Q
WR
ENABLE PRODUCT TERM (.OE)
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INPUT
MACROCELL
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JTAG ISP
CPLD-INPUT
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Port C – Functionality and Structure
Port C can be configured to perform one or more
of the following functions (see Figure 21):
■ MCU I/O Mode
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■
CPLD Output – McellBC7-McellBC0 outputs
can be connected to Port B or Port C.
■
CPLD Input – via the Input Macrocells (IMC)
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CONFIGURATION
BIT
AI04907
■
In-System Programming (ISP) – JTAG port can
be enabled for programming/erase of the
device. (See the section entitled “Programming
In-Circuit Using JTAG ISP”, and Application
Note AN1153, for more information on JTAG
programming.)
■
Open Drain – Port C pins can be configured in
Open Drain Mode
DSM2180F3
Figure 22. Port D Structure
DATA OUT
REG.
DATA OUT
D
Q
WR
PORT D PIN
OUTPUT
MUX
ECS[ 2:0]
INTERNAL DATA BUS
READ MUX
OUTPUT
SELECT
P
D
DATA IN
B
ENABLE PRODUCT
TERM (.OE)
DIR REG.
D
Q
WR
CPLD-INPUT
Port D – Functionality and Structure
Port D has three I/O pins. See Figure 22 and Figure 23. Port D can be configured to perform one or
more of the following functions:
■ MCU I/O Mode
DPLD Output – External Chip Selects, ECS0-2
does not consume OMCs
■
CPLD Input – direct input to the CPLD, does not
use IMCs
■
Slew rate – pins can be set up for fast slew rate
■
Port D pins can be configured in PSDsoft as input pins for other dedicated functions:
CLKIN (PD1) as input to the OMCs Flip-flops
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PSD Chip Select Input (CSI, PD2). Driving this
signal logic High disables the Flash memory,
putting it in standby mode.
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■
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AI02889
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External Chip Select. The DPLD also provides
three External Chip Select outputs (ESC0-2) on
Port D pins that can be used to select external devices as defined in PSDsoft Express. Each External Chip Select consists of one product term that
can be configured active High or Low. The output
enable of the pin is controlled by either the output
enable product term or the Direction Register.
(See Figure 23.) External Chip Selects for Port D
pins do not consume OMCs. External chip select
outputs can also come from the CPLD if chip select equations are specified in PSDsoft Express for
Ports B or C.
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37/63
DSM2180F3
Figure 23. Port D External Chip Select Signals
ENABLE (.OE)
PLD INPUT BUS
CPLD AND ARRAY
PT0
DIRECTION
REGISTER
PD0 PIN
ECS0
POLARITY
BIT
ENABLE (.OE)
PT1
DIRECTION
REGISTER
PD1 PIN
ECS1
POLARITY
BIT
ENABLE (.OE)
PT2
DIRECTION
REGISTER
ECS2
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POLARITY
BIT
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PD2 PIN
AI02890
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DSM2180F3
POWER MANAGEMENT
The device offers configurable power saving options. These options may be used individually or in
combinations, as follows:
■ All memory blocks in the device are built with
zero-power management technology. Zeropower technology puts the memories into
standby mode when address/data inputs are
not changing (zero DC current). As soon as a
transition occurs on an input, the affected
memory “wakes up”, changes and latches its
outputs, then goes back to standby. The
designer does not have to do anything special to
achieve memory standby mode when no inputs
are changing—it happens automatically.
■
Both PLDs (DPLD and CPLD) are also Zeropower, but this is not the default operation. The
DSP must set a bit at run-time to achieve Zeropower as described next.
The PMMR registers can be written by the DSP
at run-time to manage power. The device has a
Turbo bit in the PMMR0 register. This bit can be
set to turn the Turbo mode off (the default is with
Turbo mode turned on). While Turbo mode is
off, the PLDs can achieve standby current when
no PLD inputs are changing (zero DC current).
Even when inputs do change, significant power
can be saved at lower frequencies (AC current),
compared to when Turbo mode is on. When the
Turbo mode is on, there is a significant DC
current component and the AC component is
higher.
■
Further significant power savings can be
achieved by blocking signals that are not used
in DPLD or CPLD logic equations. The “blocking
bits” in PMMR registers can be set to logic 1 by
the DSP to block designated signals from reaching both PLDs. Current consumption of the
PLDs is directly related to the composite frequency of the changes on their inputs (see Figure 25), so blocking unused PLD inputs can
significantly lower PLD operating frequency and
power consumption. The DSP also has the option of blocking certain PLD input when not
needed, then letting them pass for when needed
for specific logic operations. Table 17 and Table
18 define the PMMR registers.
PSD Chip Select Input (CSI, PD2) can be used
to disable the internal memories and csiop
registers, placing them in standby mode even if
inputs are changing. This feature does not block
any internal signals or disable the PLDs. There
is a slight penalty in memory access time when
PSD Chip Select Input (CSI, PD2) makes its
initial transition from deselected to selected.
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Table 17. Power Management Mode Registers PMMR01
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Bit 0
X
0
Not used, and should be set to zero.
Bit 1
X
0
Not used, and should be set to zero.
Bit 2
X
0
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Not used, and should be set to zero.
0 = on PLD Turbo mode is on
Bit 3
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PLD Turbo
1 = off PLD Turbo mode is off, saving power.
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Bit 4
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Bit 5
0 = on
PLD Array clk
CLKIN (PD1) input to the PLD AND Array is passed onto PLDs. Every change of
CLKIN (PD1) Powers-up the PLD when Turbo bit is 0.
1 = off CLKIN (PD1) input to PLD AND Array is blocked, saving power.
0 = on CLKIN (PD1) input to the PLD Macrocells is passed onto PLDs.
PLD MCell clk
1 = off CLKIN (PD1) input to PLD Macrocells is blocked, saving power.
Bit 6
X
0
Not used, and should be set to zero.
Bit 7
X
0
Not used, and should be set to zero.
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (Reset) pulses do not clear the registers.
39/63
DSM2180F3
PLD Power Management
The power and speed of the PLDs are controlled
by the Turbo bit (bit 3) in the PMMR0. By setting
the bit to 1, the Turbo mode is off and the PLDs
consume the specified stand-by current when the
inputs are not switching for an extended time of
70 ns. The propagation delay time is increased by
10 ns after the Turbo bit is set to 1 (turned off)
when the inputs change at a composite frequency
of less than 15 MHz. When the Turbo bit is reset to
0 (turned on), the PLDs run at full power and
speed. The Turbo bit affects the PLD’s DC power,
AC power, and propagation delay.
Blocking MCU control signals with the bits of the
PMMR registers can further reduce PLD AC power
consumption by lowering the effective composite
frequency of inputs to the PLDs.
Table 18. Power Management Mode Registers PMMR21
Bit 0
X
0
Not used, and should be set to zero.
Bit 1
X
0
Not used, and should be set to zero.
PLD Array
CNTL0
0 = on Cntl0 input to the PLD AND Array is passed onto PLDs.
Bit 2
PLD Array
CNTL1
0 = on Cntl1 input to the PLD AND Array is passed onto PLDs.
PLD Array
CNTL2
0 = on Cntl2 input to the PLD AND Array is passed onto PLDs.
PLD Array
PD0
0 = on PD0 input to the PLD AND Array is passed onto PLDs.
PLD Array
PC7
0 = on PC7 input to the PLD AND Array is passed onto PLDs.
X
0
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
1 = off Cntl0 input to PLD AND Array is blocked, saving power.
1 = off Cntl1 input to PLD AND Array is blocked, saving power.
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1 = off Cntl2 input to PLD AND Array is blocked, saving power.
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1 = off PD0 input to PLD AND Array is blocked, saving power.
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1 = off PC7 input to PLD AND Array is blocked, saving power.
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Not used, and should be set to zero.
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (Reset) pulses do not clear the registers.
)
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PSD Chip Select Input (CSI, PD2)
PD2 of Port D can be configured in PSDsoft Express as PSD Chip Select Input (CSI). When Low,
the signal selects and enables the internal Flash
memory and I/O blocks for Read or Write operations involving the device. A High on PSD Chip Select Input (CSI, PD2) disables the Flash memory
and reduces the device power consumption. However, the PLD and I/O signals remain operational
when PSD Chip Select Input (CSI, PD2) is High.
There may be a timing penalty when using PSD
Chip Select Input (CSI, PD2) depending on the
speed grade of the device that you are using. See
the timing parameter tSLQV in Table 31.
Input Clock. The device provides the option to
block CLKIN (PD1) from reaching the PLDs to
save AC power consumption. CLKIN (PD1) is an
input to the PLD AND Array and the OMCs.
If CLKIN (PD1) is not being used as part of the
PLD logic equation, the clock should be blocked to
save AC power. CLKIN (PD1) is disconnected
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40/63
from the PLD AND Array or the Macrocells block
by setting bits 4 or 5 to a 1 in PMMR0.
Input Control Signals. The device provides the
option to block the input control signals (CNTL0,
CNTL1, CNTL2, PD0, and PC7) from reaching the
PLDs to save AC power consumption. These control signals are inputs to the PLD AND Array. If any
of these are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They are disconnected
from the PLD AND Array by setting bits 2, 3, 4, 5,
and 6 to a 1 in the PMMR2 register. Note: CNTL0
and CNTL1 (DSP WR and DSP RD) are permanently routed to the Flash memory array and cannot be blocked from the array by the PMMR
registers (that’s why WR and RD signals do not
have to be specified in PSDsoft Express for Flash
memory segment chip-select equations for FS0 FS7). CNTL0 and CNTL1 are blocked from the
PLDs with PMMR registers bits when these signals are specifically used in logic equations specified in PSDsoft Express.
DSM2180F3
Figure 24. Reset (RESET) Timing
VCC(min)
VCC
tNLNH-PO
tNLNH
tNLNH-A
tOPR
Power-On Reset
tOPR
Warm Reset
RESET
AI02866b
Power On Reset, Warm Reset, Power-down
Power On Reset. Upon Power-up, the device requires a Reset (RESET) pulse of duration tNLNH-PO
after VCC is steady. During this time period, the device loads internal configurations, clears some of
the registers and sets the Flash memory into Operating mode. After the rising edge of Reset (RESET), the device remains in the Reset mode for an
additional period, tOPR, before the first memory access is allowed.
The Flash memory is reset to the Read Array
mode upon Power-up. Sector Select FS0-FS7
must all be Low, Write Strobe (WR, CNTL0) High,
during Power On Reset for maximum security of
the data contents and to remove the possibility of
a byte being written on the first edge of Write
Strobe (WR, CNTL0). Any Flash memory Write cycle initiation is prevented automatically when VCC
is below VLKO.
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Table 19. Status During Power-On Reset, Warm Reset and Power-down Mode
Port Configuration
Power-On Reset
Warm Reset
MCU I/O
Input mode
Input mode
PLD Output
Valid after internal PSD
configuration bits are
loaded
Valid
Register
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Power-On Reset
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Warm Reset
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Power-down Mode
Unchanged
Depends on inputs to PLD
(addresses are blocked in
PD mode)
Power-down Mode
PMMR0 and PMMR2
Cleared to 0
Unchanged
Unchanged
OMC Flip-flop status
Cleared to 0 by internal
Power-On Reset
Depends on .re and .pr
equations
Depends on .re and .pr
equations
Cleared to 0
Cleared to 0
Unchanged
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All other registers
Warm Reset. Once the device is up and running,
the device can be reset with a pulse of a much
shorter duration, tNLNH. The same tOPR period is
needed before the device is operational after
warm reset. Figure 24 shows the timing of the
Power-up and warm reset.
I/O Pin, Register and PLD Status at Reset. Table 19 shows the I/O pin, register and PLD status
during Power On Reset, warm reset and Powerdown mode. PLD outputs are always valid during
warm reset, and they are valid in Power On Reset
once the internal device Configuration bits are
loaded. This loading of the device is completed
typically long before the VCC ramps up to operating level. Once the PLD is active, the state of the
outputs are determined by the PSDsoft Express
equations.
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Programming In-Circuit using JTAG ISP
In-System Programming (ISP) can be performed
through the JTAG signals on Port C. This serial interface allows programming of the entire DSM device or subsections (i.e. only Flash memory but not
the PLDs) without and participation of the DSP. A
blank DSM device soldered to a circuit board can
be completely programmed in 10 to 20 seconds.
The basic JTAG signals; TMS, TCK, TDI, and
TDO form the IEEE-1149.1 interface. The DSM
device does not implement the IEEE-1149.1
Boundary Scan functions. The DSM uses the
JTAG interface for ISP only. However, the DSM
device can reside in a standard JTAG chain with
other JTAG devices as it will remain in BYPASS
mode while other devices perform Boundary
Scan.
41/63
DSM2180F3
ISP programming time can be reduced as much as
30% by using two more signals on Port C, TSTAT
and TERR in addition to TMS, TCK, TDI and TDO.
See Table 20. The FlashLINKTM JTAG programming cable available from STMicroelectronics for
$59USD and PSDsoft Express software that is
available at no charge from www.psdst.com is all
that is needed to program a DSM device using the
parallel port on any PC or laptop.
By default, the four pins on Port C are enabled for
the basic JTAG signals TMS, TCK, TDI, and TDO
on a blank device (and as shipped from factory)
See Application Note AN1153 for more details on
JTAG In-System Programming (ISP).
Standard JTAG Signals. The standard JTAG
signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are
logically ORed. When enabled, TDI, TDO, TCK,
and TMS are inputs, waiting for a JTAG serial
command from an external JTAG controller device
(such as FlashLINK or Automated Test Equipment). When the enabling command is received,
TDO becomes an output and the JTAG channel is
fully functional inside the device. The same command that enables the JTAG channel may optionally enable the two additional JTAG signals,
TSTAT and TERR.
The following symbolic logic equation specifies the
conditions enabling the four basic JTAG signals
(TMS, TCK, TDI, and TDO) on their respective
Port C pins. For purposes of discussion, the logic
label JTAG_ON is used. When JTAG_ON is true,
the four pins are enabled for JTAG operation.
When JTAG_ON is false, the four pins can be
used for general device I/O as specified in PSDsoft Express. JTAG_ON can become true by any
of three different ways as shown:
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Method 1 is most common. This is when the JTAG
pins are selected in PSDsoft Express to be “dedicated” JTAG pins. They can always transmit and
receive JTAG information because they are “fulltime” JTAG pins.
Method 2 is used only when the JTAG pins are
multiplexed with general I/O functions. For designs that need every I/O pin, the JTAG pins may
be used for general I/O when they are not used for
ISP. However, when JTAG pins are multiplexed
with general I/O functions, the designer must include a way to get the pins back into JTAG mode
when it is time for JTAG operations again. In this
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42/63
Table 20. JTAG Port Signals
Port C Pin
JTAG Signals
Description
PC0
TMS
Mode Select
PC1
TCK
Clock
PC3
TSTAT
PC4
TERR
PC5
TDI
PC6
TDO
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Status
o
r
P
)
s
t(
Error Flag
Serial Data In
Serial Data Out
JTAG Extensions. TSTAT and TERR are two
JTAG extension signals (must be used as a pair)
enabled by a command received over the four
standard JTAG signals (TMS, TCK, TDI, and
TDO) by PSDsoft Express. They are used to
speed Program and Erase cycles by indicating
status on device pins instead of having to scan the
status out serially using the standard JTAG channel. See Application Note AN1153.
TERR indicates if an error has occurred when
erasing a sector or programming a byte in Flash
memory. This signal goes Low (active) when an
Error condition occurs.
TSTAT behaves the same as Ready/Busy described previously. TSTAT is inactive logic 1 when
the device is in Read mode (Flash memory contents can be read). TSTAT is logic 0 when Flash
memory Program or Erase cycles are in progress.
TSTAT and TERR can be configured as opendrain type signals with PSDsoft Express. This facilitates a wired-OR connection of TSTAT signals
from multiple DSM2180F3 devices and a wiredOR connection of TERR signals from those same
devices. This is useful when several devices are
“chained” together in a JTAG environment. PSDsoft Express puts TSTAT and TERR signals to
open-drain by default. Click on 'Properties' in the
JTAG-ISP window of PSDsoft Express to change
to standard CMOS push-pull. It is recommended
o
s
b
O
-
JTAG_ON =
1. PSDsoft Express Pin Configuration -OR2. PSDsoft Express PLD equation -OR3. DSP writes to register in csiop block
t
e
l
o
case, a single PLD input from Ports B, C, or D
must be dedicated to switch the Port C pins from I/
O mode back to ISP mode at any time. It is recommended to physically connect this dedicated PLD
input pin to the JEN\ output signal from the Flashlink cable when multiplexing JTAG signals. See
Application Note AN1153 for details.
Method 3 is rarely used to control JTAG pin operation. The DSP can set the port C pins to function
as JTAG ISP by setting the JTAG Enable bit in a
register of the csiop block, but as soon as the DSM
chip is reset, the csiop block registers are cleared,
which turns off the JTAG-ISP function. Controlling
JTAG pins using this method is not recommended.
DSM2180F3
to use 10 kΩ pull-up resistors to VCC on all JTAGISP signals on your circuit board.
Initial Delivery State
When delivered from ST, the device has all bits in
the memory and PLDs erased to logic 1. The DSM
Configuration Register bits are set to 0. The code,
configuration, and PLD logic are loaded using the
programming procedure. The four basic JTAG ISP
signals (TCK, TMS, TDI, TDO) are ready for ISP
function.
c
u
d
e
t
le
)
s
(
ct
)
s
t(
o
r
P
o
s
b
O
-
u
d
o
r
P
e
t
e
l
o
s
b
O
43/63
DSM2180F3
AC/DC PARAMETERS
These tables describe the AD and DC parameters
of the device:
❏ DC Electrical Specification
❏ AC Timing Specification
■ PLD Timing
– Asynchronous Clock Mode
The following are issues concerning the parameters presented:
■ In the DC specification the supply current is
given for different modes of operation. Before
calculating the total power consumption,
determine the percentage of time that the
device is in each mode. Also, the supply power
is considerably different if the Turbo bit is 0.
– Input Macrocell Timing
■
The AC power component gives the PLD and
Flash memory a mA/MHz specification. Figure
25 show the PLD mA/MHz as a function of the
number of Product Terms (PT) used.
■
In the PLD timing parameters, add the required
delay when Turbo bit is 0.
– Combinatorial Timing
– Synchronous Clock Mode
■
DSP Timing
– Read Timing
– Write Timing
– Reset Timing
Figure 25. PLD ICC /Frequency Consumption
c
u
d
110
100
VCC = 5V
90
(100
e
t
le
FF
70
O
O
60
RB
50
TU
ICC – (mA)
80
40
30
O
B
UR
T
10
0
0
o
r
P
e
du
5
ON
BO
TUR
o
s
b
O
-
F
OF
)
s
(
ct
20
o
r
P
%)
ON
BO
R
U
T
10
15
)
(25%
PT 100%
PT 25%
20
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
t
e
l
o
s
b
O
44/63
25
AI02894
)
s
t(
DSM2180F3
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings table may cause permanent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality documents.
Table 21. Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage Temperature
TLEAD
Lead Temperature during Soldering (20 seconds max.)1
Min.
Max.
Unit
–65
125
°C
235
°C
VIO
Input and Output Voltage (Q = VOH or Hi-Z)
–0.6
7.0
V
VCC
Supply Voltage
–0.6
7.0
V
VPP
Device Programmer Supply Voltage
–0.6
14.0
V
VESD
Electrostatic Discharge Voltage (Human Body model) 2
–2000
2000
c
u
d
Note: 1. IPC/JEDEC J-STD-020A
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
e
t
le
)
s
(
ct
)
s
t(
V
o
r
P
o
s
b
O
-
u
d
o
r
P
e
t
e
l
o
s
b
O
45/63
DSM2180F3
DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC
and AC Characteristic tables that follow are derived from tests performed under the Measure-
ment Conditions summarized in the relevant
tables. Designers should check that the operating
conditions in their circuit match the measurement
conditions when relying on the quoted parameters.
Table 22. Operating Conditions
Symbol
VCC
TA
Parameter
Min.
Max.
Unit
Supply Voltage
4.5
5.5
V
Ambient Operating Temperature (industrial)
–40
85
°C
Min.
Max.
Unit
Table 23. AC Measurement Conditions
Symbol
CL
Parameter
Load Capacitance
30
pF
Input Rise and Fall Times
5
Input Pulse Voltages
1.5
Input and Output Timing Reference Voltages
1.5
r
P
e
t
le
Note: 1. Output Hi-Z is defined as the point where data out is no longer driven.
Figure 26. AC Measurement I/O Waveform
3.0V
Test Point
0V
1.5V
t
c
u
(s)
ns
uc
od
V
V
Figure 27. AC Measurement Load Circuit
o
s
b
O
-
2.01 V
195 Ω
Device
Under Test
CL = 30 pF
(Including Scope and
Jig Capacitance)
AI03103b
AI03104b
d
o
r
P
e
t
e
l
o
)
s
t(
Table 24. Capacitance
s
b
O
Symbol
CIN
Parameter
Input Capacitance (for input
pins)
Test Condition
Typ.2
Max.
VIN = 0V
4
6
COUT
Output Capacitance (for input/
output pins)
VOUT = 0V
8
12
CVPP
Capacitance (for CNTL2/VPP)
VPP = 0V
18
25
Note: 1. Sampled only, not 100% tested.
2. Typical values are for TA = 25°C and nominal supply voltages.
46/63
Unit
pF
pF
pF
DSM2180F3
Table 25. AC Symbols for PLD Timing
Signal Letters
Signal Behavior
A
Address Input
t
Time
C
CEout Output
L
Logic Level Low
D
Input Data
H
Logic Level High
E
E Input
V
Valid
N
Reset Input or Output
X
No Longer a Valid Logic Level
P
Port Signal Output
Z
Float
Q
Output Data
PW
Pulse Width
R
RD Input (read)
S
Chip Select Input, BMS, DMS, IOMS, or FSx
W
WR Input (write)
B
VSTBY Output
M
Output Macrocell
c
u
d
Example: tAVWL – Time from Address Valid to
Write input Low.
Figure 28. Switching Waveforms – Key
WAVEFORMS
e
t
le
INPUTS
so
u
d
o
r
P
e
t
e
l
o
bs
o
r
P
OUTPUTS
STEADY INPUT
)
s
(
ct
)
s
t(
b
O
-
STEADY OUTPUT
MAY CHANGE FROM
HI TO LO
WILL BE CHANGING
FROM HI TO LO
MAY CHANGE FROM
LO TO HI
WILL BE CHANGING
LO TO HI
DON'T CARE
CHANGING, STATE
UNKNOWN
OUTPUTS ONLY
CENTER LINE IS
TRI-STATE
AI03102
O
47/63
DSM2180F3
Table 26. DC Characteristics
Symbol
Test Condition
(in addition to those in
Table 22)
Parameter
Min.
Typ.
Max.
Unit
VIH
Input High Voltage
4.5 V < VCC < 5.5 V
2
VCC +0.5
V
VIL
Input Low Voltage
4.5 V < VCC < 5.5 V
–0.5
0.8
V
VIH1
Reset High Level Input Voltage (Note 1)
0.8VCC
VCC +0.5
V
VIL1
Reset Low Level Input Voltage
–0.5
0.2VCC –0.1
V
VHYS
Reset Pin Hysteresis
0.3
VLKO
VCC (min) for Flash Erase and
Program
2.5
VOL
Output Low Voltage
(Note 1)
V
0.01
0.1
V
IOL = 8 mA, VCC = 4.5 V
0.25
0.45
V
IOH = –20 µA, VCC = 4.5 V
4.4
4.49
IOH = –2 mA, VCC = 4.5 V
2.4
3.9
VOH1
Output High Voltage VSTBY On
IOH1 = 1 µA
VSTBY – 0.8
IIDLE
Idle Current (VSTBY input)
VCC > VSTBY
–0.1
ISB
Stand-by Supply Current
for Power-down Mode
CSI >VCC –0.3 V (Notes 2,3)
ILI
Input Leakage Current
VSS < VIN < VCC
ILO
Output Leakage Current
0.45 < VOUT < VCC
PLD Only
ICC (DC)
(Note 5)
Operating
Supply
Current
(s)
r
P
e
t
e
l
o
ICC (AC)
(Note 5)
s
b
O
Note: 1.
2.
3.
4.
5.
48/63
Flash memory AC Adder
V
75
200
µA
–1
±.1
1
µA
–10
±5
10
µA
0
t
c
u
During Flash memory Write/
Flash memory Erase Only
PLD AC Adder
V
µA
b
O
-
PLD_TURBO = Off,
f = 0 MHz (Note 5)
c
u
d
ro
P
e
let
so
)
s
t(
V
0.1
PLD_TURBO = On,
f = 0 MHz
od
V
IOL = 20 µA, VCC = 4.5 V
Output High Voltage Except
VSTBY On
VOH
4.2
Read Only, f = 0 MHz
µA/PT
400
700
µA/PT
15
30
mA
0
0
mA
2.5
3.5
mA/
MHz
(see note 4)
Reset (Reset) has hysteresis. VIL1 is valid at or below 0.2VCC –0.1. VIH1 is valid at or above 0.8VCC .
CSI deselected.
PLD is in non-Turbo mode, and none of the inputs are switching.
Please see Figure 25 for the PLD current calculation.
IOUT = 0 mA
DSM2180F3
Table 27. CPLD Combinatorial Timing
-90
Symbol
Parameter
Turbo
Off
Slew
Rate1
Unit
Max
Fast PT
Alloc
Add 2
Add 10
Sub 2
ns
Conditions
Min
tPD
CPLD Input Pin/Feedback to
CPLD Combinatorial Output
25
tEA
CPLD Input to CPLD Output
Enable
26
Add 10
Sub 2
ns
tER
CPLD Input to CPLD Output
Disable
26
Add 10
Sub 2
ns
tARP
CPLD Register Clear or Preset
Delay
26
Add 10
Sub 2
ns
tARPW
CPLD Register Clear or Preset
Pulse Width
tARD
CPLD Array Delay
20
Any Macrocell
Add 10
16
Add 2
ns
Note: 1. Fast Slew Rate output available on PB3-PB0, and PD2-PD0.
c
u
d
e
t
le
)
s
(
ct
ns
)
s
t(
o
r
P
o
s
b
O
-
u
d
o
r
P
e
t
e
l
o
s
b
O
49/63
DSM2180F3
Table 28. CPLD Macrocell Synchronous Clock Mode Timing
-90
Symbol
Parameter
Conditions
Min
fMAX
Max
Fast PT
Aloc
Turbo
Off
Slew
Rate1
Unit
Maximum Frequency
External Feedback
1/(tS+tCO)
30.30
MHz
Maximum Frequency
Internal Feedback
(fCNT)
1/(tS+tCO–10)
43.48
MHz
Maximum Frequency
Pipelined Data
1/(tCH+tCL)
50.00
MHz
tS
Input Setup Time
15
tH
Input Hold Time
0
ns
tCH
Clock High Time
Clock Input
10
ns
tCL
Clock Low Time
Clock Input
10
ns
tCO
Clock to Output Delay
Clock Input
18
tARD
CPLD Array Delay
Any Macrocell
16
tMIN
Minimum Clock Period 2
tCH+tCL
Add 2
ns
)
s
t(
Sub 2
uc
Add 2
20
r
P
e
t
le
Note: 1. Fast Slew Rate output available on PB3-PB0, and PD2-PD0.
2. CLKIN (PD1) tCLCL = tCH + tCL .
Add 10
od
ns
ns
ns
Table 29. CPLD Macrocell Asynchronous Clock Mode Timing
-90
Symbol
Parameter
Min
fMAXA
b
O
-
Maximum Frequency
External Feedback
1/(tSA+tCOA)
Maximum Frequency
Internal Feedback
(fCNTA)
1/(tSA+tCOA–10)
)
s
(
ct
u
d
o
Maximum Frequency
Pipelined Data
so
Conditions
1/(tCHA+tCLA)
r
P
e
Max
PT
Aloc
Turbo
Off
Slew
Rate
Unit
26.32
MHz
35.71
MHz
41.67
MHz
tSA
Input Setup Time
tHA
Input Hold Time
12
Clock Input High Time
12
Add 10
ns
Clock Input Low Time
12
Add 10
ns
t
e
l
o
tCHA
tCLA
s
b
O
tCOA
Clock to Output Delay
tARDA
CPLD Array Delay
tMINA
Minimum Clock Period
50/63
8
Add 2
1/fCNTA
16
28
ns
ns
30
Any Macrocell
Add 10
Add 10
Add 2
Sub 2
ns
ns
ns
DSM2180F3
Figure 29. Input to Output Disable / Enable
INPUT
tER
tEA
INPUT TO
OUTPUT
ENABLE/DISABLE
AI02863
Figure 30. Asynchronous Reset / Preset
tARPW
RESET/PRESET
INPUT
tARP
REGISTER
OUTPUT
c
u
d
)
s
t(
AI02864
Figure 31. Synchronous Clock Mode Timing – PLD
tCH
CLKIN
e
t
le
tCL
o
s
b
O
tS
INPUT
REGISTERED
OUTPUT
o
r
P
e
c
u
d
(t s)
o
r
P
tH
tCO
AI02860
Figure 32. Asynchronous Clock Mode Timing (product term clock)
t
e
l
o
O
bs
tCHA
tCLA
CLOCK
tSA
tHA
INPUT
tCOA
REGISTERED
OUTPUT
AI02859
51/63
DSM2180F3
Table 30. Input Macrocell Timing
-90
Symbol
Parameter
Conditions
Min
Max
PT
Aloc
Turbo
Off
Unit
tIS
Input Setup Time
(Note 1)
0
tIH
Input Hold Time
(Note 1)
20
tINH
NIB Input High Time
(Note 1)
12
ns
tINL
NIB Input Low Time
(Note 1)
12
ns
tINO
NIB Input to Combinatorial Delay
(Note 1)
ns
Add 10
46
Add 2
Add 10
ns
ns
Note: 1. Inputs from Port B, and C relative to register/ latch clock from the PLD.
Figure 33. Input Macrocell Timing (product term clock)
t INH
t INL
PT CLOCK
t IS
c
u
d
t IH
INPUT
e
t
le
OUTPUT
t INO
AI03101
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
s
b
O
52/63
o
s
b
O
-
o
r
P
)
s
t(
DSM2180F3
Table 31. Read Timing
-90
Symbol
Parameter
Turbo
Off
Unit
Max
90
Add 10
ns
Conditions
Min
(Note 1)
tAVQV
Address Valid to Data Valid
tSLQV
CS Valid to Data Valid
100
ns
tRLQV
RD to Data Valid 8-Bit Bus
32
ns
tRHQX
RD Data Hold Time
1
ns
tRLRH
RD Pulse Width
32
ns
tRHQZ
RD to Data High-Z
10
ns
Note: 1. Any input used to select an internal DSM function.
Figure 34. Read Timing
tAVQV
ADDRESS
NON-MULTIPLEXED
BUS
ADDRESS
VALID
DATA
NON-MULTIPLEXED
BUS
o
r
P
DATA
VALID
e
t
le
tSLQV
CSI
so
tRLQV
tRLRH
RD
)
s
(
ct
b
O
-
c
u
d
)
s
t(
tRHQX
tRHQZ
AI04908
u
d
o
r
P
e
t
e
l
o
s
b
O
53/63
DSM2180F3
Table 32. Write Timing
-90
Symbol
Parameter
Conditions
Unit
Min.
tAVWL
Address Valid to Leading Edge of WR
tSLWL
(Note 1)
Max.
0
ns
CS Valid to Leading Edge of WR
0
ns
tDVWH
WR Data Setup Time
35
ns
tWHDX
WR Data Hold Time
4
ns
tWLWH
WR Pulse Width
35
ns
tWHAX1
Trailing Edge of WR to Address Invalid
3
ns
tWHAX2
Trailing Edge of WR to DPLD Address Invalid
0
ns
tWHPV
Trailing Edge of WR to Port Output
Valid Using I/O Port Data Register
tDVMV
Data Valid to Port Output Valid Using Macrocell
Register Preset/Clear
(Note 3)
tWLMV
WR Valid to Port Output Valid Using
Macrocell Register Preset/Clear
(Note 2)
Note: 1.
2.
3.
4.
30
55
uc
55
ns
)
s
t(
ns
ns
d
o
r
Any input used to select an internal DSM function.
Assuming data is stable before active write signal.
Assuming write is active before data becomes valid.
TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal DSM memory.
P
e
let
Figure 35. Write Timing
tAVWL
)
s
(
ct
ADDRESS
NON-MULTIPLEXED
BUS
ADDRESS
VALID
DATA
NON-MULTIPLEXED
BUS
u
d
o
r
P
e
CSI
t
e
l
o
s
b
O
54/63
(Note 4)
WR
o
s
b
O
-
DATA
VALID
tSLWL
tDVWH
t WLWH
t WHDX
t WHAX
AI04909
DSM2180F3
Table 33. Flash Memory Program, Write and Erase Times
Symbol
Parameter
Min.
Typ.
Max.
Unit
Flash Bulk Erase1 (pre-programmed)
3
30
s
Flash Bulk Erase (not pre-programmed)
5
tWHQV3
Sector Erase (pre-programmed)
1
tWHQV2
Sector Erase (not pre-programmed)
2.2
tWHQV1
Byte Program
14
Program / Erase Cycles (per Sector)
s
30
s
s
1200
µs
100,000
tWHWLO
Sector Erase Time-Out
tQ7VQV
DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2
cycles
100
µs
30
ns
Note: 1. Programmed to all zero before erase.
2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
Table 34. Reset (Reset) Timing
Symbol
Parameter
Conditions
tNLNH
RESET Active Low Time 1
tNLNH–PO
Power On Reset Active Low Time
tOPR
RESET High to Operational Device
Min
Max
150
uc
1
Pr
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles.
2. Warm reset aborts Flash memory Program or Erase cycles, and puts the device in Read mode.
e
t
le
Figure 36. Reset (RESET) Timing
VCC(min)
VCC
tNLNH-PO
RESET
(s)
t
c
u
Power-On Reset
d
o
r
P
e
tOPR
o
s
b
O
-
od
tNLNH
tNLNH-A
)
s
t(
Unit
ns
ms
120
ns
tOPR
Warm Reset
AI02866b
t
e
l
o
s
b
O
55/63
DSM2180F3
Table 35. ISC Timing
-90
Symbol
Parameter
Conditions
Unit
Min
Max
tISCCF
Clock (TCK, PC1) Frequency (except for PLD)
(Note 1)
tISCCH
Clock (TCK, PC1) High Time (except for PLD)
(Note 1)
26
ns
tISCCL
Clock (TCK, PC1) Low Time (except for PLD)
(Note 1)
26
ns
tISCCFP
Clock (TCK, PC1) Frequency (PLD only)
(Note 2)
tISCCHP
Clock (TCK, PC1) High Time (PLD only)
(Note 2)
240
ns
tISCCLP
Clock (TCK, PC1) Low Time (PLD only)
(Note 2)
240
ns
tISCPSU
ISC Port Set Up Time
8
ns
tISCPH
ISC Port Hold Up Time
5
ns
tISCPCO
ISC Port Clock to Output
23
ns
tISCPZV
ISC Port High-Impedance to Valid Output
23
ns
tISCPVZ
ISC Port Valid Output to
High-Impedance
18
2
c
u
d
e
t
le
Figure 37. ISC Timing
t ISCCH
TCK
o
r
P
o
s
b
O
-
t ISCCL
TDI/TMS
)
s
(
ct
u
d
o
r
P
e
t ISCPSU
t ISCPH
t ISCPZV
t ISCPCO
ISC OUTPUTS/TDO
t
e
l
o
s
b
O
56/63
MHz
)
s
t(
23
Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode.
2. For Program or Erase PLD only.
t ISCPVZ
ISC OUTPUTS/TDO
AI02865
MHz
ns
DSM2180F3
PACKAGE MECHANICAL
In order to meet environmental requirements, ST
offers the DSM2180F3V in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the
inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular
D
D1
A1
A2
M
M1
1 N
b1
e
D2/E2 D3/E3
E1 E
c
u
d
b
L1
L
e
t
le
PLCC-B
)
s
(
ct
Note: Drawing is not to scale.
o
s
b
O
-
o
r
P
)
s
t(
C
A
CP
PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular
du
mm
Symbol
o
r
P
e
Min.
Max.
4.57
0.165
0.180
2.54
2.79
0.100
0.110
–
0.91
–
0.036
B
0.33
0.53
0.013
0.021
B1
0.66
0.81
0.026
0.032
A
A1
t
e
l
o
A2
s
b
O
Typ.
inches
Min.
Max.
4.19
Typ.
C
0.246
0.261
0.0097
0.0103
D
19.94
20.19
0.785
0.795
D1
19.05
19.15
0.750
0.754
D2
17.53
18.54
0.690
0.730
E
19.94
20.19
0.785
0.795
E1
19.05
19.15
0.750
0.754
E2
17.53
18.54
0.690
0.730
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DSM2180F3
e
1.27
–
–
0.050
–
–
R
0.89
–
–
0.035
–
–
N
52
52
Nd
13
13
Ne
13
13
Table 36. Assignments – PLCC52
Pin No.
Pin Assignments
Pin No.
Pin Assignments
1
GND
27
PA2
2
PB5
28
PA1
3
PB4
29
PA0
4
PB3
30
AD0
5
PB2
31
AD1
6
PB1
32
AD2
7
PB0
33
8
PD2
34
9
PD1
35
10
PD0
36
11
PC7
12
PC6
13
PC5
14
PC4
15
VCC
16
GND
17
PC3
Pr
od
AD4
AD5
AD6
AD7
38
VCC
39
AD8
40
AD9
41
AD10
42
AD11
43
AD12
44
AD13
PC1
45
AD14
PC0
46
AD15
PA7
47
CNTL0
22
PA6
48
RESET
23
PA5
49
CNTL2
24
PA4
50
CNTL1
25
PA3
51
PB7
26
GND
52
PB6
20
(s)
ct
u
d
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l
o
21
so
PC2 (VSTBY)
19
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AD3
37
18
s
b
O
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t
le
uc
)
s
t(
b
O
-
DSM2180F3
PQFP52 - 52 lead Plastic Quad Flatpack
D
D1
D2
A2
e
E2 E1 E
Ne
b
N
1
A
Nd
CP
L1
c
u
d
c
A1
QFP
α
L
Note: Drawing is not to scale.
e
t
le
PQFP52 - 52 lead Plastic Quad Flatpack
Symb.
mm
Typ.
Min.
A
A1
A2
2.00
b
c
13.20
D1
E1
r
P
e
10.00
inches
Min.
Max.
2.35
0.093
0.25
0.010
2.10
0.079
0.077
0.083
0.38
0.009
0.015
0.11
0.23
0.004
0.009
12.95
13.45
0.520
0.510
0.530
9.90
10.10
0.394
0.390
0.398
–
–
0.307
–
–
t
e
l
o
13.20
12.95
13.45
0.520
0.510
0.530
10.00
9.90
10.10
0.394
0.390
0.398
E2
7.80
–
–
0.307
–
–
e
0.65
–
–
0.026
L
0.88
0.73
1.03
0.035
0.029
0.041
L1
1.60
–
–
0.063
α
0°
7°
0°
7°
E
s
b
O
7.80
Typ.
o
r
P
0.22
ct
u
d
o
D
D2
(s)
1.80
o
s
b
O
Max.
)
s
t(
N
52
52
Nd
13
13
Ne
13
13
CP
0.10
0.004
59/63
DSM2180F3
Table 37. Pin Assignments – PQFP52
Pin No.
Pin Assignments
Pin No.
Pin Assignments
1
PD2
27
AD4
2
PD1
28
AD5
3
PD0
29
AD6
4
PC7
30
AD7
5
PC6
31
VCC
6
PC5
32
AD8
7
PC4
33
AD9
8
VCC
34
AD10
9
GND
35
AD11
10
PC3
36
AD12
11
PC2
37
AD13
12
PC1
38
13
PC0
39
14
PA7
15
PA6
16
PA5
17
PA4
18
PA3
19
GND
20
PA2
21
PA1
22
PA0
24
t
e
l
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25
26
s
b
O
60/63
ro
AD15
CNTL0
41
RESET
42
CNTL2
43
CNTL1
44
PB7
45
PB6
46
GND
47
PB5
48
PB4
AD0
49
PB3
AD1
50
PB2
AD2
51
PB1
AD3
52
PB0
o
r
P
e
23
AD14
P
e
let
40
c
u
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)
s
t(
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ct
(s)
o
s
b
O
-
DSM2180F3
PART NUMBERING
Table 38. Ordering Information Scheme
Example:
DSM21
80 F3
- 90 T
6
Device Type
DSM21 = DSP System Memory for ADSP-21XX Family
DSP Applicability
80 = Analog Devices ADSP-218X family
Memory Density
F3 = 1 Mbit x 8 (128K Bytes)
Operating Voltage (Vcc)
blank = 5V ±10%
c
u
d
1
V = 3.3V ± 10%
Access Time
90 = 90 nsec
15 = 150 nsec
e
t
le
Package
K = 52-pin PLCC
T = 52-pin PQFP
Temperature Range
6 = –40 to 85oC (Industrial)
)
s
(
ct
)
s
t(
o
r
P
o
s
b
O
-
Note: 1. The 3.3V±10% devices are not covered by this data sheet, but by the DSM2180F3V data sheet.
du
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
o
r
P
e
device, please contact your nearest ST Sales Office.
t
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DSM2180F3
REVISION HISTORY
Table 39. Document Revision History
Date
Rev.
Description of Revision
20-Jun-2001
1.0
Document written
06-Nov-2001
1.1
Information on the 3.3V±10% range removed to a separate data sheet
17-Dec-2001
1.2
PQFP52 package mechanical data updated
12-Jun-2008
2.0
Disclaimer updated.
Updated datasheet status to “not for new design”.
Added ECOPACK text in cover page and section titled “Package Mechanical”.
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s
b
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-
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DSM2180F3
Please Read Carefully:
c
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)
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t(
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o
r
P
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e
t
le
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o
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b
O
-
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s
(
ct
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