STGIPS10K60A IGBT intelligent power module (IPM) 10 A, 600 V, DBC isolated SDIP-25L molded Features ■ 10 A, 600 V, 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes ■ 3.3 V, 5 V, 15 V CMOS/TTL inputs comparators with hysteresis and pull down resistor ■ Internal bootstrap diode ■ Interlocking function ■ 5 kΩ NTC thermistor for temperature control ■ VCE(sat) negative temperature coefficient ■ Short-circuit rugged IGBT ■ Under-voltage lockout ■ DBC fully isolated package ■ Isolation rating of 2500 Vrms/min. SDIP-25L Applications ■ 3-phase inverters for low power motor drives ■ Home appliances, such as washing machines, refrigerators, air conditioners Description The STGIPS10K60A intelligent power module provides a compact, high performance AC motor drive for a simple and rugged design. It mainly targets low power inverters for applications such as home appliances and air conditioners. It combines ST proprietary control ICs with the most advanced short circuit rugged IGBT system technology. Please refer to dedicated technical note TN0107 for mounting instructions. Table 1. Device summary Order code Marking Package Packaging STGIPS10K60A GIPS10K60A SDIP-25L Tube June 2010 Doc ID 15587 Rev 5 1/17 www.st.com 17 Contents STGIPS10K60A Contents 1 Internal block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . 3 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1.1 4 NTC thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 Doc ID 15587 Rev 5 STGIPS10K60A Internal block diagram and pin configuration 1 Internal block diagram and pin configuration Figure 1. Internal block diagram Pin in 1 Pin in 25 OUTU V boot U P T1 L IN U HIN U V CC LIN Vboot HIN VCC HVG R1 D1 OUT U C1 T2 LVG GND R2 D2 NU OUTV V boot V P T3 GN D L IN V HIN V LIN Vboot HIN VCC HVG R3 D3 OUT V C2 LVG GND T4 R4 D4 OUTW NV V boot W P T5 L IN W HIN W T1 T2 LIN Vboot HIN VCC HVG R5 OUT W C3 LVG GND T6 R6 1 Pin in 16 D5 2 NTC Doc ID 15587 Rev 5 D6 NW Pin 17 3/17 Internal block diagram and pin configuration Table 2. Pin description Pin Symbol 1 OUTU High side reference output for U phase 2 Vboot U Bootstrap voltage for U phase 3 LINU Low side logic input for U phase 4 HINU High side logic input for U phase 5 VCC Low voltage power supply 6 OUTV High side reference output for V phase 7 Vboot V Bootstrap voltage for V phase 8 GND Ground 9 LINV Low side logic input for V phase 10 HINV High side logic input for V phase 11 OUTW High side reference output for W phase 12 Vboot W Bootstrap voltage for W phase 13 LINW Low side logic input for W phase 14 HINW High side logic input for W phase 15 T1 NTC thermistor terminal 1 16 T2 NTC thermistor terminal 2 17 NW Negative DC input for W phase 18 W W phase output 19 P Positive DC input 20 NV Negative DC input for V phase 21 V V phase output 22 P Positive DC input 23 NU Negative DC input for U phase 24 U U phase output 25 P Positive DC input Figure 2. 4/17 STGIPS10K60A Description Pin layout (bottom view) Doc ID 15587 Rev 5 STGIPS10K60A Electrical ratings 2 Electrical ratings 2.1 Absolute maximum ratings Table 3. Inverter part Symbol Parameter Value Unit VPN Supply voltage applied between P - NU, NV, NW 450 V VPN(surge) Supply voltage (surge) applied between P - NU, NV, NW 500 V VCES Collector emitter voltage (VIN(1) = 0) 600 V ± IC(2) Each IGBT continuous collector current at TC = 25°C 10 A Each IGBT pulsed collector current 20 A PTOT Each IGBT total dissipation at TC = 25°C 26 W tscw Short-circuit withstand time, VCE = 0.5 V(BR)CES Tj = 125 °C, VCC = Vboot= 15 V, VIN (1)= 5 V 5 µs Value Unit -3 to Vboot -18 V -0.3 to +18 V -1 to 618 V -0.3 to VCC+0.3 V 50 V/ns ± ICP (3) 1. Applied between HINi, LINi and GND for i = U, V, W. 2. Calculated according to the iterative formula: T j ( max ) – T C I C ( T C ) = --------------------------------------------------------------------------------------------------------R thj – c × V CE ( sat ) ( max ) ( T j ( max ), I C ( T C ) ) 3. Pulse width limited by max junction temperature. Table 4. Symbol Control part Parameter VOUT Output voltage applied between OUTU, OUTV, OUTW - GND (VCC = 15 V) VCC Low voltage power supply Vboot Bootstrap voltage applied between Vboot i - OUTi for i = U, V, W VIN dVout/dt Logic input voltage applied between HINi, LINi and GND for i = U, V, W Allowed output slew rate Doc ID 15587 Rev 5 5/17 Electrical ratings STGIPS10K60A Table 5. Total system Symbol VISO Tj 2.2 Value Unit 2500 V -40 to 125 °C Parameter Value Unit Thermal resistance junction-case single IGBT max. 3.8 °C/W Thermal resistance junction-case single diode max. 5.5 °C/W Isolation withstand voltage applied between each pin and heatsink plate (AC voltage, t = 60sec.) Operating junction temperature Thermal data Table 6. Symbol Rthj-c 6/17 Parameter Thermal data Doc ID 15587 Rev 5 STGIPS10K60A 3 Electrical characteristics Electrical characteristics (Tj = 25°C unless otherwise specified). Table 7. Inverter part Value Symbol VCE(sat) ICES VF Parameter Test conditions Unit Min. Typ. Max. VCC = Vboot = 15 V, VIN(1)= 5 V, IC = 5 A - 2.1 2.5 VCC = Vboot = 15 V, VIN(1)= 5 V, IC = 5 A, Tj = 125 °C - Collector-cut off current (VIN(1)=0) VCE = 600 V VCC = Vboot = 15 V - 100 µA Diode forward voltage VIN(1) = 0, IC = 5 A - 1.9 V Collector-emitter saturation voltage V 1.8 Inductive load switching time and energy ton tc(on) toff tc(off) trr Turn-on time Crossover time (on) Turn-off time Crossover time (off) Reverse recovery time VDD = 300 V, VCC = Vboot = 15 V, VIN(1)= 0 ÷ 5 V, IC = 5 A (see Figure 4) - 320 - - 70 - - 430 - - 135 - - 130 - Eon Turn-on switching losses - 65 - Eoff Turn-off switching losses - 75 - ns µJ 1. Applied between HINi, LINi and GND for i = U, V, W. Note: tON and tOFF include the propagation delay time of the internal drive. tC(ON) and tC(OFF) are the switching time of IGBT itself under the internally given gate driving condition. Doc ID 15587 Rev 5 7/17 Electrical characteristics 8/17 STGIPS10K60A Figure 3. Switching time test circuit Figure 4. Switching time definition Doc ID 15587 Rev 5 STGIPS10K60A 3.1 Electrical characteristics Control part Table 8. Symbol Low supply voltage Parameter Test conditions Min. Typ. Max. Unit VCCth1 Under voltage turn on threshold 9.1 9.6 10.1 V VCCth2 Under voltage turn off threshold 7.9 8.3 8.8 V VCChys Under voltage hystereses 0.9 V Iqccu Under voltage quiescent supply current VCC < 9 V 0.75 1.2 mA Iqcc Quiescent current VCC = 15 V 1 1.5 mA VCC > 12.5 V 125 RDS(on) Table 9. Symbol Bootstrap driver on resistance Ω Bootstrap supply Parameter Test conditions Min. Typ. Max. Unit Vbooth1 Under voltage turn on threshold - 8.5 9.5 10.5 V Vbooth2 Under voltage turn off threshold - 7.2 8.3 9.2 V Vboothys Under voltage hystereses - 0.9 Quiescent current - Iqboot Table 10. Symbol V 250 µA Logic input (1) Parameter Test conditions Vil Low level logic input voltage Vih High level logic input voltage Iil Low level logic input current VIN(2) = 0 Iih High level logic input current VIN(1) = 15 V Min. Typ. Max. Unit 1.1 V 1.8 V -1 µA 20 70 µA 1. See Figure 8: Dead time and interlocking definition. 2. Applied between HINi, LINi and GND for i = U, V, W Doc ID 15587 Rev 5 9/17 Electrical characteristics 3.1.1 STGIPS10K60A NTC thermistor Table 11. NTC thermistor Symbol Parameter Test conditions Typ. Max. Unit. R25 Resistance TC = 25°C 5 kΩ R125 Resistance TC = 125°C 300 Ω B B-constant TC = 25°C 3435 k T Operating temperature -40 Equation 1: resistance variation vs temperature R ( T ) = R 25 ⋅ e Figure 5. 10/17 Min. 1 -⎞ B ⎛ --1- – -----------⎝ T 298k⎠ Typical NTC resistance vs temperature Doc ID 15587 Rev 5 125 °C STGIPS10K60A Figure 6. Electrical characteristics Maximum IC(RMS) current vs. switching frequency (1) AM03801v1 IC (RMS) (A) VPN = 300 V, Modulation index = 0.8 PF = 0.6, TJ = 125 °C, f SINE = 60 Hz Figure 7. Maximum IC(RMS) current vs. fSINE (1) AM03802v1 IC (RMS) (A) VPN = 300 V, modulation index = 0.8, PF = 0.6, TJ = 125 °C, TC = 100 °C 6 10 TC = 80 °C 5 8 f SW = 12 kHz 6 4 TC = 100 °C 2 0 8 4 12 16 2 fsw(kHz) f SW = 20 kHz f SW = 16 kHz 3 4 10 1 fSINE(Hz) 1. Simulated curves refer to typical IGBT parameters and maximum Rthj-c. Figure 8. Dead time and interlocking definition H IN DT DT LVG DT Interlocking function LIN HVG AM03794v1 Minimum recommended dead time (DT) between low and high side logic input: 1 µs. Doc ID 15587 Rev 5 11/17 12/17 6,INE #/.42/,,%2 Doc ID 15587 Rev 5 4 (6' () . 6## 70HASE#URRENT 60HASE#URRENT 50HASE#URRENT ,6' '.$ .4# 2 2 2 4 4 4 4 4 4 $ $ $ $ $ $ .7 7 .6 6 .5 5 - 6$# !-V Typical application circuit /54 6BOOT ,). ,6' '.$ 2 2 2 Figure 9. 4 # (6' () . 6## /54 6BOOT ,). ,6' '.$ /54 (6' 6BOOT Applications information ().7 # # () . 6## ,). 0 4 ,).7 6 BOOT7 /547 ().6 ,).6 '.$ 6 BOOT6 /546 6 ## ().5 ,).5 6 BOOT5 /545 Applications information STGIPS10K60A STGIPS10K60A 4.1 Applications information Recommendations ● To prevent the input signals oscillation, the wiring of each input should be as short as possible. ● By integrating an application specific type HVIC inside the module, direct coupling to MCU terminals without any opto-coupler is possible. ● Each capacitor should be located as nearby the pins of IPM as possible. ● Low inductance shunt resistors should be used for phase leg current sensing. ● Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible. Additional high frequency ceramic capacitor mounted close to the module pins will further improve performance. Table 12. Recommended operating conditions Value Symbol Parameter Conditions Unit Min. VPN Supply Voltage Applied between P-Nu,Nv,Nw VCC Control supply voltage Applied between VCC-GND VBS High side bias voltage tdead Blanking time to prevent Arm-short For each input signal fPWM PWM input signal -40°C < Tc < 100°C -40°C < Tj < 125°C 13.5 Applied between VBOOTi-OUTi for i=U,V,W Doc ID 15587 Rev 5 Typ. Max. 300 400 V 15 16 V 16 V 1 µs 20 kHz 13/17 Package mechanical data 5 STGIPS10K60A Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Please refer to dedicated technical note TN0107 for mounting instructions. Table 13. SDIP-25L package mechanical data (mm.) Dim. Min. 14/17 Typ. Max. A 44 44.8 A1 0.95 1.75 A2 1.2 2 A3 39 39.8 B 21.6 22.4 B1 11.45 12.25 B2 24.83 C 5 5.8 C1 6.4 7.4 C2 11.1 12.1 e 1.95 2.35 2.75 e1 3.2 3.6 4 e2 4.3 4.7 5.1 e3 6.1 6.5 6.9 F 0.8 1.0 1.2 F1 0.3 0.5 0.7 R 1.35 T 0.4 Doc ID 15587 Rev 5 25.22 25.63 2.15 0.55 0.7 STGIPS10K60A Package mechanical data ' & ( Figure 10. SDIP-25L package mechanical data 8154676_F Doc ID 15587 Rev 5 15/17 Revision history 6 STGIPS10K60A Revision history Table 14. 16/17 Document revision history Date Revision Changes 16-Apr-2009 1 Initial release. 11-May-2009 2 Added Figure 6 and Figure 7. 17-Jul-2009 3 Reduced VCE(sat) value on Table 7. 06-Apr-2010 4 Document promoted from preliminary data to datasheet. Inserted Figure 3: Switching time test circuit and Table 12: Recommended operating conditions. Updated Table 5: Total system, Table 6: Thermal data, Table 7: Inverter part, Figure 5: Typical NTC resistance vs temperature, Figure 6: Maximum IC(RMS) current vs. switching frequency, Figure 7: Maximum IC(RMS) current vs. fSINE (1) and Section 5: Package mechanical data. 15-Jun-2010 5 Updated Table 7: Inverter part. Minor text changes to improve readability. Doc ID 15587 Rev 5 STGIPS10K60A Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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