ITAxxU1 Transil™ array for data line protection Features ■ High surge capability Transil array: IPP = 40 A (8/20 µs) ■ Peak pulse power : 300 W (8/20 µs) ■ Up to 6 bidirectional Transil functions ■ Low clamping factor (VCL / VBR) at high current level ■ Low leakage current ■ ESD protection up to 15 kV SO-8 Figure 1. Functional diagram I/O1 1 8 I/O6 Complies with the following standards I/O2 2 7 GND ■ I/O3 3 6 GND I/O4 4 5 I/O5 ■ IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883G- Method 3015-7: class 3B – 25 kV (human body model) Applications Data transmission lines protection, such as: ■ Unipolar signal up to 5.5 V ■ Bipolar signal in the ± 2.5 V range Description Transil diode arrays provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS technology and low voltage supplied IC’s. The ITA series allies high surge capability against energetic pulses with high voltage performance against ESD. TM: Transil is a trademark of STMicroelectronics November 2007 Rev 2 1/8 www.st.com 8 Characteristics ITAxxU1 1 Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol PPP IPP Parameter Peak pulse power (8/20 µs)(1) Peak pulse current (8/20 µs) Unit Tj initial = Tamb 300 W Tj initial = Tamb 40 A 2 I t Wire I t value 0.6 A2s Tj Maximum operating junction temperature 125 °C -55 to +150 °C 260 °C Tstg TL 2 (1) Value (1) Storage temperature range Maximum lead temperature for soldering during 10 s 1. For surges greater than the specified maximum value, the I/O will first present a short-circuit and after an open circuit caused by the wire melting. Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameter I VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IF VBR VCL IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop C Capacitance VBR Order code ITA6V1U1 @ IR IPP IRM @ VRM VCL max. max. @ IPP 8/20 µs (1) VCL max. @ IPP 8/20 µs αT C max. max. (1) VF @ IF max. (2) V mA µA V V A V A 10-4/ °C pF V A 6.51 1 10 5 10 10 12 25 4 1500 1.3 1 1. Between I/O pin and ground. 2. Between two input pins at 0 V Bias, F = 1 MHz. 2/8 V IRM min. (1) VF VRM ITAxxU1 Characteristics Figure 2. Pulse waveform Figure 3. Typical peak pulse power versus exponential pulse duration PPP(W) %IPP 1000 Tj initial=25°C 8µs 100 Pulse waveform 8/20µs 100 50 0 t 20µs Figure 4. tP(ms) expo 10 1E-3 Clamping voltage versus peak pulse current (exponential waveform 8/20 µs) Figure 5. VCL(V) 1E-2 1E-1 1E+0 1E+1 Peak current IDC inducing open circuit of the wire for one input/output versus pulse duration (typical values) IDC(A) 1E+03 1E+03 %IPP Tj initial=25°C Exponential waveform 100 50 0 1E+02 tr t tp 1E+02 1E+01 1E+01 IPP(A) 1E+00 1E-01 1E+00 Figure 6. tP(ms) 1E+00 1E+01 1E-02 1E+02 Junction capacitance versus reverse applied voltage for one input/output (typical values) Figure 7. C(pF) 1E-01 1E+00 1E+01 Relative variation of leakage current versus junction temperature IR(Tj) IR(Tj=25°C) 1500 Tj=25°C F=1MHz 5E+3 VR=VRM 1E+3 1250 1E+2 1000 1E+1 750 1E+0 Tj(°C) VR(V) 500 0.0 0.5 1.0 1.5 2.0 2.5 1E-1 3.0 3.5 4.0 4.5 5.0 0 25 50 75 100 125 150 3/8 Application information 2 ITAxxU1 Application information Figure 8. µP I/O lines +5V I/O I/O I/O µP interface I/O I/O I/O GND Figure 9. ± 2.5 V datalines I/O Line driver I/O I/O I/O GND +2.5V -2.5V 4/8 ITAxxU1 3 Ordering information scheme Ordering information scheme Figure 10. Ordering information scheme ITA 6V1 U 1 RL Integrated Transil Array Breakdown Voltage (min) 25 = 25 Volt Type of lines protected U = Unidirectional Package 1 = SO-8 Packaging RL = Tape & reel Blank = Tube 5/8 Package information 4 ITAxxU1 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 3. SO-8 dimensions Dimensions ccc C Ref. A2 e b C (Seating Plane) A Millimeters Min. Typ. A A1 Max. Min. Typ. 1.75 A1 0.1 0.25 A2 1.25 Max. 0.069 0.004 0.010 h x 45° 0.25mm (Gage Plane) C L k L1 D 8 5 E1 E b 0.28 0.48 0.011 0.019 0.17 0.23 0.007 0.009 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 1.27 4 0.050 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 8 0 L1 1 0.049 C e k° 1.04 0 ccc 6.7 0.54 4.03 1.27 1.335 0.041 0.10 Figure 11. SO-8 footprint (dimensions in mm) 6/8 Inches 8 0.004 ITAxxU1 5 Ordering Information Ordering Information Table 4. ordering information Order code Marking ITA6V1U1 6V1U1 ITA6V1U1RL 6 Package Weight SO-8 0.08 g 6V1U1 Base qty Delivery mode 2000 Tube 2500 Tape and reel Revision history Table 5. Document revision history Date Revision Changes 13-Dec-2004 1 Initial release. 07-Nov-2007 2 Reformatted to current standards. SO-8 package dimensions update. 7/8 ITAxxU1 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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