STMICROELECTRONICS ESDALC6V1PX_08

ESDALC6V1Px
Low capacitance Transil™ arrays for ESD protection
Features
■
2 to 4 unidirectional Transil functions
■
Breakdown voltage VBR = 6.1 V min.
■
Low leakage current < 100 nA
■
Low capacitance (7.5 pF @ 3 V)
■
Very small PCB area < 2.6 mm2
SOT-663
SOT-665
SOT-666IP
Figure 1.
ESDALC6V1P3 functional diagram
Figure 2.
ESDALC6V1P5 functional diagram
Figure 3.
ESDALC6V1P6 functional diagram
Benefits
■
High ESD protection level
■
High integration
Complies with the following standards
■
■
IEC61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883E-Method 3015-7: class3
– 25 kV HBM (human body model)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
■
Computers
■
Printers
■
Communication systems
■
Cellular phone handsets and acessories
■
Wireline and wireless telephone sets
■
Set-top boxes
Description
The ESDALC6V1Px are monolithic suppressors
designed to protect components connected to
data and transmission lines against ESD.
These devices clamp the voltage just above the
logic level supply for positive transients and to a
diode drop below ground for negative transients.
TM: Transil is a trademark of STMicroelectronics
April 2008
Rev 4
1/9
www.st.com
9
Characteristics
1
ESDALC6V1Px
Characteristics
Table 1.
Absolute ratings (Tamb = 25 °C)
Symbol
Parameter
VPP(1)
Value
Unit
±8
±15
kV
Peak pulse power (8/20 µs)(1) Tj initial = Tamb
30
W
Junction temperature
150
°C
-55 to +150
°C
260
°C
-40 to +150
°C
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air discharge
Peak pulse voltage
PPP
Tj
Storage temperature range
Tstg
TL
Maximum lead temperature for soldering during 10 s
Top
Operating temperature range
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameter
I
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current
IPP
Peak pulse current
αT
Voltage temperature coefficient
VF
Forward voltage drop
C
Capacitance
Rd
Dynamic resistance
IF
VF
VCL VBR
ESDALC6V1P3
ESDALC6V1P5
ESDALC6V1P6
2/9
V
IRM
Slope: 1/Rd
IPP
IRM @ VRM
Rd
αT
C
typ.
max.
typ.
typ.
[email protected] 3V
[email protected] IR
Order code
VRM
min.
max.
V
V
mA
nA
µA
V
Ω
10-4/°C
pF
6.1
7.2
1
10
0.1
3
1.5
4.5
7.5
ESDALC6V1Px
Figure 4.
Characteristics
Peak power dissipation versus
initial junction temperature
Figure 5.
PPP[T j initial] / PPP [T j initial=25°C]
Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
PPP(W)
1.1
1000
1.0
Tj initial = 25°C
0.9
0.8
0.7
0.6
100
0.5
0.4
0.3
0.2
0.1
tp(µs)
Tj(°C)
0.0
10
0
25
Figure 6.
50
75
100
125
150
175
1
Clamping voltage versus peak
pulse current (typical values,
rectangular waveform)
10
Figure 7.
IPP(A)
100
Forward voltage drop versus peak
forward current (typical values)
IFM(A)
1.E+00
100.0
tp = 2.5µs
Tj initial = 25°C
Tj = 125°C
Tj = 25°C
10.0
1.E-01
1.0
1.E-02
VFM(V)
VCL(V)
1.E-03
0.1
0
10
Figure 8.
20
30
40
50
60
70
Junction capacitance versus
reverse applied voltage (typical
values)
0.0
0.2
Figure 9.
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Relative variation of leakage
current versus junction
temperature (typical values)
IR [T j] / IR [T j=25°C]
C(pF)
1.E+04
13
VR =3 V
F=1MHz
VOSC=30mVRMS
Tj=25°C
12
11
1.E+03
10
9
8
7
1.E+02
6
5
4
1.E+01
3
2
VR(V)
1
T j(°C)
1.E+00
0
0
1
2
3
4
5
6
25
50
75
100
125
150
3/9
Ordering information scheme
ESDALC6V1Px
Figure 10. ESD response to IEC 61000-4-2
Figure 11. Analog crosstalk measurement
(air discharge 15 kV positive surge)
10 V per div.
0.00
dB
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
-90.00
F (Hz)
-100.00
100.0k
0.1 µs per division
1.0M
10.0M
Figure 12. Digital crosstalk test measurement
5 V per div.
VG1
β21VG1
0.1 µs per div.
2
Ordering information scheme
Figure 13. Ordering information scheme
ESDA
ESD Array
Low Capacitance
Breakdown Voltage (min)
6V1 = 6.1 Volt
Package
P3 = SOT-663 (SC89-3L)
P5 = SOT-665
P6 = SOT-666IP (internal pad)
4/9
LC
6V1
Px
100.0M
1.0G
ESDALC6V1Px
3
Package information
Package information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3.
SOT-663 dimensions
Dimensions
Ref.
A
D
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.60
0.70
0.80
0.024 0.028 0.031
D
1.40
1.60
1.80
0.055 0.063 0.071
E
0.75
0.85
0.95
0.030 0.033 0.037
HE
1.50
1.60
1.70
0.059 0.063 0.067
b
HE
alpha
E
L
L2
L
e
c
2xe
0.39
0.015
L2
0.40
0.47
0.50
0.016 0.018 0.020
c
0.08
0.13
0.18
0.003 0.005 0.007
b
0.22
0.27
0.37
0.009 0.011 0.015
e
0.50
2xe
0.90
α
4°
1.00
0.020
1.10
7°
0.035 0.040 0.043
4°
7°
Figure 14. SOT-663 footprint (dimensions in mm)
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Package information
ESDALC6V1Px
Table 4.
SOT-665 dimensions
Dimensions
Ref.
bp
D
E
A
Lp
He
C
Millimeters
Inches
Min.
Max.
Min.
Max.
A
0.50
0.60
0.020
0.024
BP
0.17
0.27
0.007
0.011
C
0.08
0.18
0.003
0.007
D
1.50
1.70
0.060
0.067
E
1.10
1.30
0.043
0.051
e
1.00
0.040
e1
0.50
0.020
He
1.50
1.70
0.059
0.067
Lp
0.10
0.30
0.004
0.012
e1
e
Figure 15. SOT-665 footprint (dimensions in mm)
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ESDALC6V1Px
Package information
Table 5.
SOT-666IP dimensions
Dimensions
Ref.
b1
L1
Millimeters
Min.
Typ.
Max.
Inches
Min.
Typ.
Max.
L4
L3
b
D
E1
A
L2
E
A3
A
0.45
0.60 0.018
0.024
A3
0.08
0.18 0.003
0.007
b
0.17
0.34 0.007
0.013
b1
0.19
D
1.50
1.70 0.059
0.067
E
1.50
1.70 0.059
0.067
E1
1.10
1.30 0.043
0.051
0.34 0.007 0.011 0.013
e
0.50
0.020
L1
0.19
0.007
L2
e
0.27
0.10
0.30 0.004
0.012
L3
0.10
0.004
L4
0.60
0.024
Figure 16. SOT-666IP footprint (dimensions in mm)
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Ordering information
4
Ordering information
Table 6.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
ESDALC6V1P3
A2
SOT-663
2.9 mg
3000
Tape and reel
ESDALC6V1P5
A1
SOT-665
2.9 mg
3000
Tape and reel
ESDALC6V1P6
D
SOT-666IP
2.9 mg
3000
Tape and reel
Revision history
Table 7.
8/9
ESDALC6V1Px
Document revision history
Date
Revision
Description of changes
16-Aug-2006
1
ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6
merged and reformatted to current standards.
23-Aug-2006
2
Table 1 on page 2:
Temperature range upgraded to Tj max = 150 °C
11-Oct-2006
3
Added values for VPP in Table 1.
23-Apr-2008
4
Reformatted to current standards. Added IRM typical
value in Table 2. Update minimum dimension for L2 of
SOT-663 in Table 3.
ESDALC6V1Px
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