ESDALC6V1Px Low capacitance Transil™ arrays for ESD protection Features ■ 2 to 4 unidirectional Transil functions ■ Breakdown voltage VBR = 6.1 V min. ■ Low leakage current < 100 nA ■ Low capacitance (7.5 pF @ 3 V) ■ Very small PCB area < 2.6 mm2 SOT-663 SOT-665 SOT-666IP Figure 1. ESDALC6V1P3 functional diagram Figure 2. ESDALC6V1P5 functional diagram Figure 3. ESDALC6V1P6 functional diagram Benefits ■ High ESD protection level ■ High integration Complies with the following standards ■ ■ IEC61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883E-Method 3015-7: class3 – 25 kV HBM (human body model) Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and acessories ■ Wireline and wireless telephone sets ■ Set-top boxes Description The ESDALC6V1Px are monolithic suppressors designed to protect components connected to data and transmission lines against ESD. These devices clamp the voltage just above the logic level supply for positive transients and to a diode drop below ground for negative transients. TM: Transil is a trademark of STMicroelectronics April 2008 Rev 4 1/9 www.st.com 9 Characteristics 1 ESDALC6V1Px Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol Parameter VPP(1) Value Unit ±8 ±15 kV Peak pulse power (8/20 µs)(1) Tj initial = Tamb 30 W Junction temperature 150 °C -55 to +150 °C 260 °C -40 to +150 °C IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge Peak pulse voltage PPP Tj Storage temperature range Tstg TL Maximum lead temperature for soldering during 10 s Top Operating temperature range 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameter I VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop C Capacitance Rd Dynamic resistance IF VF VCL VBR ESDALC6V1P3 ESDALC6V1P5 ESDALC6V1P6 2/9 V IRM Slope: 1/Rd IPP IRM @ VRM Rd αT C typ. max. typ. typ. typ.@ 3V VBR@ IR Order code VRM min. max. V V mA nA µA V Ω 10-4/°C pF 6.1 7.2 1 10 0.1 3 1.5 4.5 7.5 ESDALC6V1Px Figure 4. Characteristics Peak power dissipation versus initial junction temperature Figure 5. PPP[T j initial] / PPP [T j initial=25°C] Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) PPP(W) 1.1 1000 1.0 Tj initial = 25°C 0.9 0.8 0.7 0.6 100 0.5 0.4 0.3 0.2 0.1 tp(µs) Tj(°C) 0.0 10 0 25 Figure 6. 50 75 100 125 150 175 1 Clamping voltage versus peak pulse current (typical values, rectangular waveform) 10 Figure 7. IPP(A) 100 Forward voltage drop versus peak forward current (typical values) IFM(A) 1.E+00 100.0 tp = 2.5µs Tj initial = 25°C Tj = 125°C Tj = 25°C 10.0 1.E-01 1.0 1.E-02 VFM(V) VCL(V) 1.E-03 0.1 0 10 Figure 8. 20 30 40 50 60 70 Junction capacitance versus reverse applied voltage (typical values) 0.0 0.2 Figure 9. 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Relative variation of leakage current versus junction temperature (typical values) IR [T j] / IR [T j=25°C] C(pF) 1.E+04 13 VR =3 V F=1MHz VOSC=30mVRMS Tj=25°C 12 11 1.E+03 10 9 8 7 1.E+02 6 5 4 1.E+01 3 2 VR(V) 1 T j(°C) 1.E+00 0 0 1 2 3 4 5 6 25 50 75 100 125 150 3/9 Ordering information scheme ESDALC6V1Px Figure 10. ESD response to IEC 61000-4-2 Figure 11. Analog crosstalk measurement (air discharge 15 kV positive surge) 10 V per div. 0.00 dB -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 F (Hz) -100.00 100.0k 0.1 µs per division 1.0M 10.0M Figure 12. Digital crosstalk test measurement 5 V per div. VG1 β21VG1 0.1 µs per div. 2 Ordering information scheme Figure 13. Ordering information scheme ESDA ESD Array Low Capacitance Breakdown Voltage (min) 6V1 = 6.1 Volt Package P3 = SOT-663 (SC89-3L) P5 = SOT-665 P6 = SOT-666IP (internal pad) 4/9 LC 6V1 Px 100.0M 1.0G ESDALC6V1Px 3 Package information Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 3. SOT-663 dimensions Dimensions Ref. A D Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.60 0.70 0.80 0.024 0.028 0.031 D 1.40 1.60 1.80 0.055 0.063 0.071 E 0.75 0.85 0.95 0.030 0.033 0.037 HE 1.50 1.60 1.70 0.059 0.063 0.067 b HE alpha E L L2 L e c 2xe 0.39 0.015 L2 0.40 0.47 0.50 0.016 0.018 0.020 c 0.08 0.13 0.18 0.003 0.005 0.007 b 0.22 0.27 0.37 0.009 0.011 0.015 e 0.50 2xe 0.90 α 4° 1.00 0.020 1.10 7° 0.035 0.040 0.043 4° 7° Figure 14. SOT-663 footprint (dimensions in mm) 5/9 Package information ESDALC6V1Px Table 4. SOT-665 dimensions Dimensions Ref. bp D E A Lp He C Millimeters Inches Min. Max. Min. Max. A 0.50 0.60 0.020 0.024 BP 0.17 0.27 0.007 0.011 C 0.08 0.18 0.003 0.007 D 1.50 1.70 0.060 0.067 E 1.10 1.30 0.043 0.051 e 1.00 0.040 e1 0.50 0.020 He 1.50 1.70 0.059 0.067 Lp 0.10 0.30 0.004 0.012 e1 e Figure 15. SOT-665 footprint (dimensions in mm) 6/9 ESDALC6V1Px Package information Table 5. SOT-666IP dimensions Dimensions Ref. b1 L1 Millimeters Min. Typ. Max. Inches Min. Typ. Max. L4 L3 b D E1 A L2 E A3 A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 0.34 0.007 0.011 0.013 e 0.50 0.020 L1 0.19 0.007 L2 e 0.27 0.10 0.30 0.004 0.012 L3 0.10 0.004 L4 0.60 0.024 Figure 16. SOT-666IP footprint (dimensions in mm) 7/9 Ordering information 4 Ordering information Table 6. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode ESDALC6V1P3 A2 SOT-663 2.9 mg 3000 Tape and reel ESDALC6V1P5 A1 SOT-665 2.9 mg 3000 Tape and reel ESDALC6V1P6 D SOT-666IP 2.9 mg 3000 Tape and reel Revision history Table 7. 8/9 ESDALC6V1Px Document revision history Date Revision Description of changes 16-Aug-2006 1 ESDALC6V1P3, ESDALC6V1P5, and ESDALC6V1P6 merged and reformatted to current standards. 23-Aug-2006 2 Table 1 on page 2: Temperature range upgraded to Tj max = 150 °C 11-Oct-2006 3 Added values for VPP in Table 1. 23-Apr-2008 4 Reformatted to current standards. Added IRM typical value in Table 2. Update minimum dimension for L2 of SOT-663 in Table 3. ESDALC6V1Px Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9