MICROCHIP TC520ACPD

TC520A
Serial Interface Adapter for TC500 A/D Converter Family
Features
General Description
• Converts TC500/TC500A/TC510/TC514 to Serial
Operation
• Programmable Conversion Rate and Resolution for
Maximum Flexibility
• Supports up to 17-Bits of Accuracy Plus Polarity Bit
• Low Power Operation: Typically 7.5mΩ
• 14-Pin PDIP or 16-Pin SOIC Packages
• Polled or Interrupt Mode Operation
The TC520A serial interface adapter provides logic
control for Microchip's TC500/TC500A/TC510/TC514
family of dual slope, integrating A/D converters. It
directly manages TC500 converter phase control signals A, B and CMPTR, thereby reducing host
processor task loading and software complexity. Communication with the TC520A is accomplished over a 3
wire serial port. Key converter operating parameters
are programmable for complete user flexibility. Data
conversion is initiated when the CE input is brought
low. The converted data (plus overrange and polarity
bits) are held in an 18-bit shift register until read by the
processor or until the next conversion is completed.
Data may be clocked out of the TC520A at any time,
and at any rate, the user prefers. A Data Valid (DV) output is driven active at the start of each conversion
cycle, indicating the 18-bit shift register update has just
been completed. This signal may be polled by the processor or can be used as data ready interrupt. The
TC520A timebase can be derived from an external frequency source of up to 6MHz or can operate from its
own external crystal. It requires a single 5V logic supply
and dissipates less than 7.5mΩ.
Applications
• Computer Peripheral Interface
• Portable Instruments
• Data Acquisition System Interface
Device Selection Table
Part Number
Package
Temperature Range
TC520ACOE 16-Pin SOIC (Wide)
0°C to +70°C
TC520ACPD
0°C to +70°C
14-Pin PDIP
Package Type
14-Pin PDIP
VDD
1
14 CE
DGND
2
13 DV
CMPTR
3
12 LOAD
B
4
A
5
10 DCLK
OSCOUT
6
9
DOUT
OSCIN
7
8
READ
TC520A
11 DIN
16-Pin SOIC
VDD
1
16
CE
DGND
2
15
DV
CMPTR
3
14
LOAD
B
4
13
DIN
TC520A
A
5
12
DCLK
OSCOUT
6
11
DOUT
OSCIN
7
10
READ
N/C
8
9
N/C
 2002 Microchip Technology Inc.
DS21431B-page 1
TC520A
Functional Block Diagram
VDD
GND
1
2
8-Bit Shift Reg.
8
Gate
5
A
4
B
3
CMPTR
14
CE
DV 13
8-Bit Counter
Logic Control
Pinout of 14-Pin
Package
11 D
IN
Gate
÷ 256
Timeout
Force Auto Zero
Polarity Bit
18-Bit Shift Register
Gate
Clear Count
12
LOAD
9
10
DOUT
DCLK
8
READ
16
OSCIN
OSCOUT
7
6
÷4
DS21431B-page 2
SYSCLK
Gate
16-Bit Counter
Overrange
Bit
 2002 Microchip Technology Inc.
TC520A
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at
these or any other conditions above those indicated in the
operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended
periods may affect device reliability.
Absolute Maximum Ratings*
DC Supply Voltage (VDD) .................................... +6.0V
Input Voltage (All Inputs VIN):.... - 0.3V to (VDD + 0.3V)
Operating Temperature Range (TA) .......... 0°C to 70°C
Storage Temperature Range .............. -65°C to +150°C
TC520A ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 5V, FOSC = 1MHz, TA = +25°C, unless otherwise specified.
Symbol
Parameters
Min
Typ
Max
Unit
V DD
Operating Voltage Range
4.5
5
5.5
V
IDD
Supply Current
—
0.8
1.5
mA
V
Test Conditions
Supply
Input Characteristics
VIL
Low Input Voltage
—
—
0.8
VIH
High Input Voltage
2.0
—
—
V
IIL
Input Leakage Current
—
—
10
µA
IPD
Pull-down Current (CE)
—
5
—
µA
IPU
Pull-up Current (READ, LOAD)
—
5
—
µA
0.3
V
Output Characteristics (IOUT = 250 µA, VDD = 5V)
VOL
Low Output Voltage
—
0.2
VOH
High Output Voltage
3.5
4.3
—
V
CL = 10pF, Rise/Fall Times
—
—
250
nsec
T R, T F
Oscillator (OSCIN , OSC OUT)
FXTL
Crystal Frequency
—
1.0
4.0
MHz
FOSC
External Frequency (OSCIN )
—
—
6.0
MHz
250
—
—
nsec
1
—
—
µsec
450
—
—
nsec
1
—
—
µsec
Timing Characteristics
TRD
READ Delay Time
TRS
Data Read Setup Time
TDRS
DCLK to DOUT Delay
TLS
LOAD Setup Time
TDLS
Data Load Setup Time
50
—
—
nsec
TPWL
DCLK Pulse Width Low Time
150
—
—
nsec
TPWH
DCLK Pulse Width High Time
150
—
—
nsec
TLDL
Load Default Low Time
250
—
—
nsec
TLDS
Load Default Setup Time
250
—
—
nsec
Parameter
TIZ
Integrator ZERO Time
—
0.5
—
msec
TAZI
Auto zero (RESET) Time at Power-Up
—
100
—
msec
 2002 Microchip Technology Inc.
DS21431B-page 3
TC520A
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1
TABLE 2-1:
Pin Number
14-Pin PDIP
PIN FUNCTION TABLE
Pin Number
16-Pin SOIC
Symbol
Description
1
1
VDD
2
2
DGND
3
3
CMPTR
4
4
B
Output, active high. The A and B outputs of the TC520A connect directly to the A and B
inputs of the TC5XX A/D converter connected to the TC520A. The binary code on A, B
determines the conversion phase of the TC5XX A/D converter: (A, B) = 01 places the
TC5XX A/D converter into the Auto Zero phase; (A, B) =10 for Integrate phase (INT);
(A, B) =11 for De-integrate phase (DINI) and (A, B) = 00 for Integrator Zero phase (IZ).
Please see the TC500/TC500A/TC510/TC514 family data sheets for a complete
description of these phases of operation.
5
5
A
Output, active high. See pin 4 description above.
6
6
OSCOUT
Input. This pin connects to one side of an AT-cut crystal having a effective series resistance of 100Ω (typ.) and a parallel capacitance of 20pF (typ.). If an external frequency
source is used to clock the TC520A, this pin must be left floating.
7
7
OSCIN
Input. This pin connects to the other side of the crystal described in pin 6 above. The
TC520A may also be clocked from an external frequency source connected to this pin.
The external frequency source must be a pulse train having a duty cycle of 30% (minimum); rise and fall times of 15nsec and a min/max amplitude of 0 to VIH. If an external
frequency source is used, pin 6 must be left floating. A maximum operating frequency
of 4MHz (crystal) or 6MHz (external clock source) is permitted.
8
N/C
No connection on 16 pin package version.
No connection on 16 pin package version.
Input. +5V ±10% power supply input with respect to DGND.
Input. Digital Ground.
Input, active high or low (depending on polarity of the voltage input to A/D converter).
This pin connects directly to the zero crossing comparator output (CMPTR) of the
TC5XX A/D converter. A high-to-low state change on this pin causes the TC520A to
terminate the de-integrate phase of conversion.
9
N/C
8
10
READ
Input, active low, level and negative edge triggered. A high-to-low transition on READ
loads serial port output shift register with the most recent converted data. Data is
loaded such that the first bit transmitted from the TC520A to the processor is the
OVERRANGE bit (OVR), followed by the POLARITY bit (POL) (high = input positive;
low = input negative). This is followed by a 16-bit data word (MSB first). OVR is available at the DOUT as soon as READ is brought low. This bit may be used as the 17th
data bit, if so desired. The DOUT pin of the serial port is enabled only when READ is
held low. Otherwise, DOUT remains in a high impedance state. A serial port read access
cycle is terminated at any time by bringing READ high.
9
11
DOUT
Output, logic level. Serial port output pin. This pin is enabled only when READ is low
(see READ pin description).
10
12
DCLK
Input, positive and negative edge triggered. Serial port clock. With READ low, serial
data is clocked into the TC520A at each low-to-high transition of DCLK, and clocked out
of the TC520A on each high-to-low transition of D CLK. A maximum serial port DCLK
frequency of 3MHz is permitted.
11
13
DIN
Input, logic level. Serial port input pin. The TC5XX A/D converter integration time (TINT )
and Auto Zero time (TAZ) values are determined by the LOAD VALUE byte clocked into
this pin. This initialization must take place at power up and can be rewritten (or modified
and rewritten) at any time. The LOAD VALUE is clocked into D IN MSB first.
DS21431B-page 4
 2002 Microchip Technology Inc.
TC520A
TABLE 2-1:
PIN FUNCTION TABLE (CONTINUED)
Pin Number
14-Pin PDIP
Pin Number
16-Pin SOIC
Symbol
Description
12
14
LOAD
Input, active low; level and edge triggered. The LOAD VALUE is clocked into the 8-bit
shift register on board the TC520A while LOAD is held low. The LOAD VALUE is then
transferred into the TC520A internal timebase counter (and becomes effective) when
LOAD is returned high. If so desired, LOAD can be momentarily pulsed low, eliminating
the need to clock a LOAD VALUE into DIN . In this case, the current state of DIN is
clocked into the TC520A timebase counter selecting either a count of 65536
(DIN = High), or count of 32768, (DIN = Low).
13
15
DV
Output, active low. DV is brought low any time the TC520A is in the AZ phase of conversion. This occurs when, either the TC520A initiates a normal AZ phase by setting A,
B, equal to 01, or when CE is pulled high, which overrides the normal A, B sequencing
and forces an AZ state. DV is returned high when the TC520A exits AZ.
14
16
CE
Input, active low, level triggered. Conversion will be continuously performed as long as
CE remains low. Pulling CE high causes the conversion process to be halted and
forces the TC520A into the AZ mode for as long as CE remains high. CE should be
taken high whenever it is necessary to momentarily suspend conversion (for example:
to change the address lines of an input multiplexer). CE should be pulled high only
when the TC520A enters an AZ phase (i.e. when DV is low). This is necessary to avoid
excessively long integrator discharge times, which could result in erroneous conversion. This pin should be grounded if unused. It should be left floating if a 0.01µF
RESET capacitor is connected to it (see Section 4.0, Typical Applications).
 2002 Microchip Technology Inc.
DS21431B-page 5
TC520A
3.0
DETAILED DESCRIPTION
3.1
TC520A Timing
The TC520A consists of a serial port and state
machine. The state machine provides control timing to
the TC5xx A/D converter connected to the TC520A as
well as providing sequential timing for TC520A internal
operation. All timing is derived from the frequency
source at OSCIN and OSCOUT. This frequency source
can be either an externally provided clock signal or
external crystal. If an external clock is used, it must be
connected to the OSC IN pin and OSCOUT must remain
floating. If a crystal is used, it must be connected
between the OSCIN and OSC OUT and be physically
located as close to the OSCIN and OSC OUT pins as
possible. The incoming frequency is internally divided
by 4 and the resulting clock (SYSCLK) controls all
timing functions.
3.2
TC5XX A/D Converter Control
Signals
The TC520A control outputs (A, B) and control input
(CMPTR) connect directly to the corresponding pins of
the TC5XX A/D converter. A conversion is consummated when A, B have been sequenced through the
required 4 phases of conversion: Auto Zero (AZ), Integrate (INT), De-integrate (D INT) and Integrator Zero (IZ)
(see Figure 4-1). The Auto Zero phase compensates
for offset errors in the TC5XX A/D converter. The
Integrate phase connects the voltage to be converted
to the TC5XX A/D converter input, resulting in an integrator output dv/dt directly proportional to the magnitude of the applied input voltage. Actual A/D conversion
(counting) is initiated at the start of the DINT phase and
terminates when the integrator output crosses 0V. The
integrator output is then forced to 0V during the IZ
phase and the converter is ready for another cycle.
Please see the TC500/TC500A/TC510/TC514 data
sheet for a complete description of these phases.
The time period required for the DINT phase is a function of the amount of voltage stored on the integrator
during the INT phase and the value of VREF. The DINT
phase is initiated by the TC520A immediately after the
INT phase and terminated when the TC5XX A/D converter changes the state of the CMPTR input of the
TC520A, indicating a zero crossing. In general, the
maximum number of counts chosen for DINT is twice
that of INT (with VREF chosen at VININ(MAX)/2). Choosing these values guarantees a full count (maximum resolution) during DINT when VIN = VIN(MAX).
The IZ phase is initiated immediately following the DINT
phase and is maintained until the CMPTR input transitions high. This indicates the integrator is initialized and
ready for another conversion cycle. This phase
typically takes 2msec.
3.3
Serial Port Control Signals
Communication to and from the TC520A is accomplished over a 3 wire serial port. Data is clocked into
D IN on the rising edge of DCLK and clocked out of DOUT
on the falling edge of DCLK. READ must be low to read
from the serial port and can be taken high at any time,
which terminates the read cycle and releases D OUT to
a high impedance state. Conversion data is shifted to
the processor from DOUT in the following order:
OVERRANGE (which can also be used as the 17th
data bit), POLARITY, conversion data (MSB first).
The number of SYSCLK periods (counts) for the AZ
and INT phases is determined by the LOAD VALUE.
The LOAD VALUE is a single byte that must be loaded
into the most significant byte of 16-bit counter on board
the TC520A during initialization. The lower byte of this
counter is pre-loaded to a value of 0FFH (25610) and
cannot be changed.
The LOAD VALUE (upper 8 bits of the counter) can be
programmed over a range of 0FFH to 00H (corresponding to a range of AZ = INT = 256 counts to 65536
counts). (See Figure 3-2). The LOAD VALUE sets the
number of counts for both the AZ and INT phases and
directly affects resolution and speed of conversion. The
greater the number of counts allowed for AZ and INT,
the greater the A/D resolution (but the slower the conversion speed).
DS21431B-page 6
 2002 Microchip Technology Inc.
TC520A
4.0
TYPICAL APPLICATIONS
4.4.2
4.1
TC500 Series A/D Converter
Component Selection
The TC520A counter length is 16-bits (65536), allowing
the full 65536 counts for TDEINT results in a maximum
TINT = 65536/2 or 32768.
The TC500/TC500A/TC510/TC514 data sheet details
the equations necessary to calculate values for integration resistor (RINT) and capacitor (CINT), auto zero
(CAZ) and reference capacitors (CREF) and voltage reference (V REF). All equations apply when using the
TC520A, except Integration time (TINT) and Auto zero
time (TAZ), which are functions of the SYSCLK period
(timebase frequency and LOAD VALUE). Microchip
offers a ready-to-use TC5XX A/D converter design tool.
The TC500 Design Spreadsheet is an Excel-based
spreadsheet that calculates values for all components
as well as the TC520A LOAD VALUE. It also calculates
overall converter performance such as noise rejection,
converter speed, etc.
4.2
TC520A Initialization
4.4.3
CALCULATE TINT
SELECT SYSCLK FREQUENCY
SYSCLK frequency directly affects conversion time.
The faster the SYSCLK, the faster the conversion time.
The upper limit SYSCLK frequency is determined by
the worst case delay of the TC500 comparator (which
for the TC500 and TC500A is 3.2µsec). While a faster
value for SYSCLK can be used, operation is optimized
(error minimized) by choosing a SYSCLK period (1/
SYSCLK frequency) that is greater than 3.2µsec.
Choosing TSYSCLK = 4µsec makes the SYSCLK frequency equal to 250kHz. This makes the external
crystal (or frequency source) equal to 1.0MHz, since
SYSCLK = crystal frequency/4). Calculating integration
time (in msec) using TSYSCLK = 4µsec, TINT = 4µsec x
32768 = 131msec.
Initialization of the TC520A consists of:
4.4.4
1.
Plug the TINT and TSYSCLK values into the equation and
convert the resulting value to hexadecimal:
2.
Power-On RESET of the TC500/TC520A (forcing the TC520A into an AZ phase).
Initializing the TC520A LOAD VALUE.
4.3
Power-On RESET
The TC520A powers up with A,B = 00 (IZ Phase),
awaiting a high logic state on CMPTR, which must be
initiated by forcing the TC520A into the AZ phase. This
can be accomplished in one of two ways:
1.
2.
External hardware (processor or logic) can
momentarily pull LOAD or CE low for a minimum
of 100msec (TAZI) or;
A .01µF RESET capacitor can be connected
from CE to VCC to generate a power-on pulse on
CE.
4.4
LOAD VALUE Initialization
The LOAD VALUE is the preset value (high byte of the
SYSCLK timing counter) which determines the number
of counts allocated to the AZ and INT phases of
conversion. This value can be calculated using either
the TC520A spreadsheet within the TC500 Design
Spreadsheet software or can be setup as shown in the
following sections.
4.4.1
SELECT VREF, TDEINT
Choose the TC5XX A/D converter reference voltage
(VREF) to be half of the maximum A/D converter input
voltage. For example, if VIN(MAX) = 2.5V, choose VREF =
1.25V. This forces the maximum de-integration time
(TDEINT) to be equal to twice the maximum integration
time (TINT), ensuring a full count (maximum resolution)
during DINT.
 2002 Microchip Technology Inc.
CALCULATE LOAD VALUE
EQUATION 4-1:
LOAD VALUE =
[(65536 - (TINT/TSYSCLK)]
256
In this example, LOAD VALUE = 128(10) = 10H. Therefore, a LOAD VALUE of 10H is loaded into the TC520A.
If the desired TINT was 100msec instead of 131msec,
the LOAD VALUE would be 9EH, and so on. The
TC520A LOAD VALUE must be initialized on power-up,
and can be re-initialized as often as desired thereafter.
This is accomplished by bringing the LOAD input low
while transmitting the appropriate LOAD VALUE to the
TC520A as shown in Figure 4-1 and Figure 4-2.
4.4.5
POLLED VS. INTERRUPT
OPERATION
The TC520A can be accessed at any time by the host
processor. This makes operation in a polled environment especially easy since the most recently converted
data is available to the processor as needed. The
TC520A can also be used in an interrupt environment
by connecting DV to the IRQ line of the processor.
Since AZ is the first phase of a new conversion cycle,
the most recently converted data will be available as
soon as DV goes low. If so desired, the interrupt service
routine can also modify the LOAD VALUE during the
DV = low interval.
DS21431B-page 7
TC520A
FIGURE 4-1:
TC520 initialization & startup conversion timing relatioNships
TC520A Conversion State
AZ
INT
DINT
IZ
AZ
INT
LOAD
DINT
AZ
IZ
AZ
INT
CE is pulled
high only during
AZ (DV = Low)
CE
LOAD VALUE updated
and conversion started
New LOAD VALUE
can be loaded
(if so desired)
LOAD VALUE
shifted into
DIN
DIN, DCLK
Load
Value
DV
TC520A held in
AZ phase
as long as CE = HIGH
FIGURE 4-2:
lOad value modify cycle
TC520A Conversion State
AZ
INT
DINT
IZ
AZ
INT
DINT
IZ
AZ
INT
LOAD
CE
LOAD VALUE updated
and conversion started
LOAD VALUE
shift into
DIN
DIN, DCLK
DV
4.4.6
OPTO-ISOLATED APPLICATIONS
The 3 wire serial port of the TC520A can be optoisolated for applications requiring isolated data acquisition. The additional control lines (LOAD, DV, READ)
are normally not needed in such applications, but can
also be brought across the isolation barrier with the
addition of a second isolator.
DS21431B-page 8
 2002 Microchip Technology Inc.
TC520A
FIGURE 4-3:
Typical System Application
+5V
CINT
10k
CAZ
100k
RINT
VIN+
.01µ
1 INT
V+
MCP1525
.01µ
1µF
V+
LOAD
CMPTR
TC500
B
A
10
IN–
9
REF+
VIN-
OSCOUT
Crystal
3
CAZ
4 BUF
11
IN+
6
16
14
13
12
CR–
CR+
8
REF–
5
COM
6
7
CREF
1
12
8
LD
7 OSCIN
READ
3 CMPTR
10
DCLK
4 B
11
D
TC520A
5 A
IN
13
DOUT 9
DV
14
CE
15
GND
2
V
RD
SK
SO
SI
2 GND
-5V
Analog Ground
CE
DGND
FIGURE 4-4:
DV
TC520A timing diagram
Read Timing
Load Timing
TRS
READ
Load Default Timing
LOAD
LOAD
TLS
TRD
DOUT
DIN
TDRS
TPWL
DCLK
TDLS
TLDL
TPWH
DIN
TLDS
DCLK
READ
Read Format
DOUT
LSB
OVR POL MSB
DCLK
LOAD
Load Format
DIN
MSB
LSB
DCLK
 2002 Microchip Technology Inc.
DS21431B-page 9
TC520A
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking information not available at this time.
5.2
Taping Forms
Component Taping Orientation for 16-Pin SOIC (Wide) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
16-Pin SOIC (W)
DS21431B-page 10
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
16 mm
12 mm
1000
13 in
 2002 Microchip Technology Inc.
TC520A
5.3
Package Dimensions
14-Pin PDIP (Narrow)
PIN 1
.260 (6.60)
.240 (6.10)
.310 (7.87)
.290 (7.37)
.770 (19.56)
.745 (18.92)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.015 (0.38)
.008 (0.20)
3˚MIN.
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.070 (1.78)
.045 (1.14)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
16-Pin SOIC (Wide)
PIN 1
.299 (7.59) .419 (10.65)
.291 (7.40) .398 (10.10)
.413 (10.49)
.398 (10.10)
.104 (2.64)
.097 (2.46)
.050 (1.27) TYP. .019 (0.48)
.014 (0.36)
.012 (0.30)
.004 (0.10)
8°
MAX.
.013 (0.33)
.009 (0.23)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21431B-page 11
TC520A
DS21431B-page 12
 2002 Microchip Technology Inc.
TC520A
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21431B-page 13
TC520A
NOTES:
DS21431B-page 14
 2002 Microchip Technology Inc.
TC520A
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
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certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro ® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21431B-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Japan
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain
China - Beijing
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, Indiana 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
China - Hong Kong SAR
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
New York
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
04/20/02
*DS21431B*
DS21431B-page 16
 2002 Microchip Technology Inc.