TI SN74LVC139APW

SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005
•
FEATURES
•
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
1A
1B
1Y0
1Y1
1Y2
1Y3
1
16
2
15
3
14
4
13
5
12
6
11
10
7
8
9
2Y3
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
RGY PACKAGE
(TOP VIEW)
VCC
D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
1G
•
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 6.2 ns
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
GND
•
•
•
•
2G
2A
2B
2Y0
2Y1
2Y2
DESCRIPTION/ORDERING INFORMATION
This dual 2-line to 4-line decoder/demultiplexer is designed for 1.65-V to 3.6-V VCC operation.
The device comprises two individual 2-line to 4-line decoders in a single package. The active-low enable (G)
input can be used as a data line in demultiplexing applications. This decoder/demultiplexer features fully buffered
inputs, each of which represents only one normalized load to its driving circuit.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
PACKAGE (1)
TA
QFN – RGY
Tube of 40
SN74LVC139AD
Reel of 2500
SN74LVC139ADR
Reel of 250
SN74LVC139ADT
SOP – NS
Reel of 2000
SN74LVC139ANSR
LVC139A
SSOP – DB
Reel of 2000
SN74LVC139ADBR
LC139A
Tube of 90
SN74LVC139APW
Reel of 2000
SN74LVC139APWR
Reel of 250
SN74LVC139APWT
Reel of 2000
SN74LVC139ADGVR
TSSOP – PW
TVSOP – DGV
VFBGA – GQN
VFBGA – ZQN (Pb-free)
(1)
TOP-SIDE MARKING
SN74LVC139ARGYR
SOIC – D
–40°C to 85°C
ORDERABLE PART NUMBER
Reel of 1000
Reel of 1000
SN74LVC139AGQNR
SN74LVC139AZQNR
LC139A
LVC139A
LC139A
LC139A
LC139A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1994–2005, Texas Instruments Incorporated
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005
GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
TERMINAL ASSIGNMENTS
1
4
2
3
4
A
1A
1G
VCC
2G
A
B
1B
NC (1)
NC (1)
2A
B
C
1Y1
1Y0
2Y0
2B
C
D
1Y2
NC (1)
NC (1)
2Y1
D
E
GND
1Y3
2Y3
2Y2
E
(1)
NC - No internal connection
FUNCTION TABLE
(EACH DECODER/DEMULTIPLEXER)
INPUTS
OUTPUTS
SELECT
G
B
A
Y3
Y2
Y1
Y0
L
L
L
H
H
H
L
L
L
H
H
H
L
H
L
H
L
H
L
H
H
L
H
H
L
H
H
H
H
X
X
H
H
H
H
LOGIC DIAGRAM (POSITIVE LOGIC)
4
1G
5
6
1A
Select
Inputs
1B
1Y0
1
1Y1
1Y2
2
3
7
1Y3
Data
Outputs
12
2G
11
10
2A
Select
Inputs
2B
2Y1
2Y2
14
13
Pin numbers shown are for the D, DB, DGV, NS, PW, and RGY packages.
2
2Y0
15
9
2Y3
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
–0.5
VCC + 0.5
range (2) (3)
UNIT
VO
Output voltage
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
D package (4)
73
DB package (4)
82
DGV package (4)
θJA
Package thermal impedance
120
GQN/ZQN package (4)
78
NS package (4)
64
PW package (4)
108
RGY package (5)
Tstg
(1)
(2)
(3)
(4)
(5)
Storage temperature range
V
°C/W
39
–65
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
Operating
Data retention only
VCC = 1.65 V to 1.95 V
MIN
MAX
1.65
3.6
1.5
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
0
5.5
V
0
VCC
V
VCC = 1.65 V
–4
VCC = 2.3 V
–8
VCC = 2.7 V
–12
VCC = 3 V
–24
VCC = 1.65 V
4
VCC = 2.3 V
8
VCC = 2.7 V
12
VCC = 3 V
24
–40
mA
mA
10
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –100 µA
VOH
1.65 V to 3.6 V
All inputs
1.2
IOH = –8 mA
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = –24 mA
3V
2.2
IOL = 100 µA
1.65 V to 3.6 V
0.2
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.7
IOL = 12 mA
2.7 V
0.4
3V
0.55
VI = VCC or GND,
IO = 0
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
V
µA
3.6 V
10
µA
2.7 V to 3.6 V
500
µA
3.6 V
∆ICC
(1)
V
±5
VI = 5.5 V or GND
ICC
UNIT
VCC – 0.2
1.65 V
IOL = 24 mA
II
TYP (1) MAX
IOH = –4 mA
IOH = –12 mA
VOL
MIN
3.3 V
5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
A or B
G
TO
(OUTPUT)
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 2.7 V
VCC = 3.3 V
± 0.3 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1
20.6
1
9.3
1
7.3
1
6.2
1
19.5
1
7.2
1
5.2
1
4.7
tsk(o)
1
ns
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance
TEST
CONDITIONS
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
f = 10 MHz
28.5
29.5
30.5
UNIT
pF
SN74LVC139A
DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VM
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VOH
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC139AD
ACTIVE
SOIC
D
16
SN74LVC139ADBLE
OBSOLETE
SSOP
DB
16
SN74LVC139ADBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADBRE4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139AGQNR
ACTIVE
GQN
20
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVC139ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWLE
OBSOLETE
TSSOP
PW
16
SN74LVC139APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
40
Green (RoHS &
no Sb/Br)
TBD
TBD
Addendum-Page 1
Lead/Ball Finish
CU NIPDAU
Call TI
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC139APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ARGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVC139ARGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVC139AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC139AD
ACTIVE
SOIC
D
16
SN74LVC139ADBLE
OBSOLETE
SSOP
DB
16
SN74LVC139ADBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADBRE4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ADTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139AGQNR
NRND
GQN
20
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVC139ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWLE
OBSOLETE
TSSOP
PW
16
SN74LVC139APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
40
Green (RoHS &
no Sb/Br)
TBD
TBD
Addendum-Page 1
Lead/Ball Finish
CU NIPDAU
Call TI
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVC139APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC139ARGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVC139ARGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LVC139AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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