EPCOS B69812N1897K320

Microwave Ceramics and Modules
2-Pole Filter for DECT
Filter
B69812N1897K320
Data Sheet
Features
z SMD filter consisting of coupled resonators with stepped impedances
z (NdBa)TiO3 (εr = 88 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
z Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
• Component drawing
• Recommended footprint
Page 3
• Characteristics
• Maximum ratings
• Typical passband characteristic
Page 4
• Processing information
• Soldering requirements
• Delivery mode
ISSUE DATE
02.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
1/4
Microwave Ceramics and Modules
2-Pole Filter for DECT
Filter
B69812N1897K320
Data Sheet
Component drawing
View from below onto the solder terminals and view from beside
Recommended footprint
I/O G I/O
G
G
FPS2D231.DOC
ISSUE DATE
02.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
2/4
Microwave Ceramics and Modules
2-Pole Filter for DECT
Filter
B69812N1897K320
Data Sheet
Characteristics
min.
Center frequency
typ.
fc -
1890
αIL
Insertion loss
Passband
max.
MHz
0.8
1.0
dB
B 20
∆α
0.3
0.5
SWR
1.5
2.0
Z
50
Ω
7
8
24
dB
dB
dB
Amplitude ripple (peak - peak)
Standing wave ratio
Impedance
MHz
dB
α
Attenuation
at 1780 MHz
at 2000 MHz
at 2400 to 2600 MHz
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
Operating temperature
Top 0 / + 55
°C
2,375
2,335
2,295
2,255
2,215
2,175
2,135
2,095
2,055
2,015
1,975
1,935
1,895
1,855
1,815
1,775
1,735
1,695
1,655
1,615
1,575
Typical Passband Characteristics
0
-5
-10
-15
Attenuation [dB]
-20
-25
S11[dB]
S21[dB]
-30
-35
-40
-45
-50
-55
-60
Frequency[GHz]
ISSUE DATE
02.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
3/4
Microwave Ceramics and Modules
2-Pole Filter for DECT
Filter
B69812N1897K320
Data Sheet
Processing information
z Wettability acc. to IEC 68-2-58: ≥ 75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type
reflow
Maximum soldering temperature
235 (max. 2 sec.)
(measuring point on top surface of the component) 225 (max. 10 sec.)
reflow
260 (max. 2 sec.) °C
250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
within 10 sec.
Temp. [°C]
within 10 sec.
Temp. [°C]
245°C±5°C
215°C±10°C
20-40 sec.
30 sec.
Time [sec.]
2.5 °C/s
40-80 sec.
2-3 min.
Time [sec.]
> - 5 °C/s
Delivery mode
z Blister tape acc. to IEC 286-3, polyester, grey
z Pieces/tape: 3000
Reel: diameter - 330 mm
Profile B-B:
Profile A-A:
A
B
B
A
direction of unreeling
 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
ISSUE DATE
02.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
4/4