Microwave Ceramics and Modules 2-Pole Filter for W-LAN Filter B69812N2457A301 Data Sheet Features • SMD filter consisting of coupled resonators with stepped impedances • extreme low losses • high attenuations at GSM (900, 1800, 1900) bands • stable performance over wide temperature range • excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 z Component drawing z Recommended footprint Page 3 z Characteristics z Maximum ratings z Typical passband characteristic Page 4 z Processing information z Soldering requirements z Delivery mode ISSUE DATE 03.03.04 ISSUE A PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 2-Pole Filter for W-LAN Filter B69812N2457A301 Data Sheet Component drawing View from below onto the solder terminals and view from beside Recommended footprint Top view and marking I/O Pads must be terminated with 50 Ω characteristic impedance soldered areas ISSUE DATE 03.03.04 ISSUE A PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 2-Pole Filter for W-LAN Filter B69812N2457A301 Data Sheet Characteristics over whole temperature range min. typ. max. 2.4415 - GHz 0.8 1.2 dB Passband αIL B 83 Amplitude ripple (peak - peak) ∆α 0.4 0.8 SWR 1.5 2.0 Impedance (2400 – 2483MHz) Z 50 Ω Attenuation α 46 35 23 dB dB dB Center frequency fc - Insertion loss (2400 – 2483MHz) Standing wave ratio at DC to 960 MHz at 960 to 1990 MHz at 2100 to 2170 MHz MHz 42 32 20 dB Maximum ratings IEC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top - 40 / + 85 °C Typical passband characteristic 0 -10 [dB] -20 S11 [dB] S21 [dB] -30 -40 -50 2,8 2,7 2,6 2,5 2,4 2,3 2,2 2,1 2,0 1,9 1,8 -60 Frequency [GHz] ISSUE DATE 03.03.04 ISSUE A PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 2-Pole Filter for W-LAN Filter B69812N2457A301 Data Sheet Processing information ZNr.: 527 (FILT95_2) z Wettability acc. to IEC 68-2-58: ≥ 75% (after aging) Soldering requirements Profile for eutectic SnPb solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) Profile for leadfree solder paste reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C Recommended soldering conditions (infrared): within 10 sec. Temp. [°C] within 10 sec. Temp. [°C] 245°C±5°C 215°C±10°C 20-40 sec. 30 sec. Time [sec.] 2.5 °C/s 40-80 sec. eutectic SnPb solder paste profile 2-3 min. Time [sec.] > - 5 °C/s leadfree solder paste profile Delivery mode z Blister tape acc. to IEC 286-3, polystyrol, grey z Pieces/tape: 3000 Reel: diamerter - 330mm Profile B-B: Profile A-A: A B B A EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 03.03.04 ISSUE A PUBLISHER SAW MWC PD PAGE 4/4