Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Filter B69843N3507A160 Data Sheet Application z RF filter for WLL (Wireless Local Loop) Features z SMD filter consisting of coupled resonators with stepped impedances z MgTiO3-CaTiO3 (εr = 21 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm) z Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 z Component drawing z Footprint Page 3 z Characteristics z Maximum ratings z Typical passband characteristic Page 4 z Processing information z Soldering requirements z Delivery mode ISSUE DATE 08.04.04 ISSUE A PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Filter B69843N3507A160 Data Sheet Component drawing 1.60.2 0.10.05 I/O I/O G 0.70.3 0.80.2 G G 3.50.3 G 8.00.1 3.00.1 View from below onto the solder terminals and view from beside Footprint recommended 4.6 I/O compatible footprint G 1.2 I/O 2.0 G ISSUE DATE 6.6 }4.0 1.9 1.5 I/O ≥1. I/O G 1.4 G 1.4 08.04.04 1.4 G G ISSUE 1.0 A PUBLISHER G 1.4 SAW MWC PD G PAGE 2/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Filter B69843N3507A160 Data Sheet Characteristics min. Center frequency typ. fc - max. 3500.0 - 1.2 Passband αIL B 160 Amplitude ripple (peak - peak) ∆α 0.5 1.0 SWR 1.5 2.0 Z 50 Insertion loss Standing wave ratio Impedance Power Attenuation P α at DC to 2800 MHz at 2800 to 3240 MHz at 3900 to 5000 MHz at 5000 to 7200 MHz MHz 1.8 dB MHz dB Ω 1.0 40 26 25 20 W 45 dB dB dB dB Maximum ratings IEC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top -40 / + 85 °C 4,000 3,950 3,900 3,850 3,800 3,750 3,700 3,650 3,600 3,550 3,500 3,450 3,400 3,350 3,300 3,250 3,200 3,150 3,100 3,050 3,000 Typical passband characteristic 0 -5 -10 Attenuation [dB] -15 -20 S11 [dB] S21 [dB] -25 -30 -35 -40 -45 -50 Frequency [GHz] ISSUE DATE 08.04.04 ISSUE A PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Filter B69843N3507A160 Data Sheet Processing information z Wettability acc to IEC 68-2-58: ≥ 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C Recommended soldering conditions (infrared): within 10 sec. Temp. [°C] within 10 sec. Temp. [°C] 245°C±5°C 215°C±10°C 20-40 sec. 30 sec. Time [sec.] 2.5 °C/s 40-80 sec. 2-3 min. Time [sec.] > - 5 °C/s Delivery mode z Blister tape acc. to IEC 286-3, PS, grey z Pieces/tape: 2000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 08.04.04 ISSUE A PUBLISHER SAW MWC PD PAGE 4/4