Microwave Ceramics and Modules 2 – Pole Filter for W - LAN Filter B69812N2457B111 Preliminary Data Sheet Features • Low Profile (maximum height 1.2 mm) • SMD filter consisting of coupled resonators with stepped impedances • Low losses • High attenuations at GSM (900, 1800, 1900) and UMTS bands • High attenuation at 2 times center frequency • Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 • Dimension Limits , Marking • Recommended footprint Page 3 • Characteristics • Maximum ratings • Typical passband characteristic Page 4 • Processing information • Soldering requirements • Delivery mode ISSUE DATE 20.05.03 ISSUE P1 PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 2 – Pole Filter for W - LAN Filter B69812N2457B111 Preliminary Data Sheet Dimension Limits , Marking View from below onto the solder terminals and view from beside Recommended footprint (Same Footprint as for „X“101 and „X“201 WLan-Series ) I/O G G ISSUE DATE Solder Pads: I/O Pads must be connected to lines with 50 Ω impedance. In the application a termination of 50 Ω must be realized. I/O Ground, covered with solder resist, connected to lower ground plane by vias with maximum diameter of 0.3mm and max. distance of 1mm G 20.05.03 ISSUE P1 PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 2 – Pole Filter for W - LAN Filter B69812N2457B111 Preliminary Data Sheet Characteristics (over whole temperature range) Center frequency Insertion loss in Passband Passband (2400- 2500) Amplitude ripple (peak - peak) Return Loss in dB / Standing wave ratio Impedance Attenuation at DC to 1580 MHz at 1805 to 1990 MHz at 2110 to 2170 MHz at 3200 to 4600 MHz at 4800 to 5000 MHz min. typ. max. fc αIL B 100 2.450 2.2 2.5 ∆α 0.5 -11 / 1.8 50 Z α 40 38 35 20 25 MHz 0.8 dB -9.5 / 2.0 Ω dB dB dB dB dB 43 41 37 25 30 dBm 30 (2400 – 2500 MHz) RF input power GHz dB Maximum ratings IEC climatic category (IEC 68-1) - 40 /+ 90/56 Operating temperature Top - 40 / + 85 °C Typical passband characteristics 0 -5 -10 -15 S21 [dB] -20 -25 -30 -35 -40 -45 -50 2.00 2.10 2.20 2.30 2.40 2.50 2.60 F [GHz] ISSUE DATE 20.05.03 ISSUE P1 PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 2 – Pole Filter for W - LAN Filter B69812N2457B111 Preliminary Data Sheet Processing information Wettability acc. to IEC 68-2-58: ≥ 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C Recommended soldering conditions (infrared): within 10 sec. Temp. [°C] within 10 sec. Temp. [°C] 245°C±5°C 215°C±10°C 20-40 sec. 30 sec. Time [sec.] 2.5 °C/s 40-80 sec. 2-3 min. Time [sec.] > - 5 °C/s Delivery mode • Blister tape acc. to IEC 286-3, grey • Pieces/tape: 4000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 20.05.03 ISSUE P1 PUBLISHER SAW MWC PD PAGE 4/4