EPCOS B69842N5507A700

Microwave Ceramics and Modules
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz
Filter
B69842N5507A700
Preliminary Datasheet
Features
! SMD filter consisting of coupled resonators with stepped impedances
! MgTiO3 - CaTiO3 (εr = 21 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
! Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
! Component drawing
! Recommended footprint
Page 3
! Characteristics
! Maximum ratings
! Typical passband characteristic
Page 4
! Processing information
! Soldering requirements
! Delivery mode
ISSUE DATE
18.09.03
ISSUE
P2
PUBLISHER
SAW MWC PD F
PAGE
1/4
Microwave Ceramics and Modules
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz
Filter
B69842N5507A700
Preliminary Datasheet
Component drawing
Recommended footprint
I/O
I/O
G
G
G
FOOTPRINT_010601.DWG"WMF
ISSUE DATE
18.09.03
ISSUE
P2
PUBLISHER
SAW MWC PD F
PAGE
2/4
Microwave Ceramics and Modules
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz
Filter
B69842N5507A700
Preliminary Datasheet
Characteristics
min.
Center frequency
typ.
max.
5.5
fc
αIL
Insertion loss [5150 – 5850] MHz
Passband [5150 – 5850] MHz
1.0
GHz
1.4
dB
B 700
MHz
∆α
Amplitude ripple (peak - peak) [5150 – 5850] MHz
Standing wave ratio [5150 – 5850] MHz
Impedance
Power
SWR
1.8
Z
P
50
α
Attenuation
at DC to 1990 MHz
at 1990 to 2170 MHz
at 2400 to 2500 MHz
dB
2.0
Ω
W
1.0
dB
dB
dB
50
45
43
45
42
40
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
Operating temperature
Top -40 / +85
°C
Typical passband characteristic
0
-10
[dB]
-20
S11 [dB]
S21 [dB]
-30
-40
-50
6,0
5,5
5,0
4,5
4,0
3,5
3,0
2,5
2,0
1,5
1,0
-60
G
ISSUE DATE
18.09.03
ISSUE
P2
PUBLISHER
SAW MWC PD F
PAGE
3/4
Microwave Ceramics and Modules
2 – Pole Filter for WLAN 5GHz / [5150 - 5850] MHz
Filter
B69842N5507A700
Preliminary Datasheet
Processing information
ZNr.: 577 (FILT95_2)
! Wettability to IEC 68-2-58: ≥ 75% (after aging)
Soldering requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type
reflow
Maximum soldering temperature
235 (max. 2 sec.)
(measuring point on top surface of the component) 225 (max. 10 sec.)
reflow
260 (max. 2 sec.) °C
250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
within 10 sec.
Temp. [°C]
within 10 sec.
Temp. [°C]
245°C±5°C
215°C±10°C
20-40 sec.
30 sec.
Time [sec.]
2.5 °C/s
40-80 sec.
eutectic SnPb solder paste profile
2-3 min.
Time [sec.]
> - 5 °C/s
leadfree solder paste profile
Delivery mode
! Blister tape acc. to IEC 286-3, PS, grey
! Pieces/tape: t.b.d.
t.b.d.
 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers'
Association), unless otherwise agreed.
ISSUE DATE
18.09.03
ISSUE
P2
PUBLISHER
SAW MWC PD F
PAGE
4/4