Freescale Semiconductor Advance Information Document Number: MPC17517 Rev. 2.0, 7/2006 1.0 A 6.8 V Dual Motor Driver IC The 17517 is a monolithic triple totem-pole-output power IC designed to be used in portable electronic applications to control small DC motors and solenoids. The 17517 can operate efficiently with supply voltages as low as 2.0 V to as high as 6.8 V. Its low RDS(ON) totem-pole output MOSFETs (0.46 Ω typical) can provide continuous drive currents of 1.0 A and handle peak currents up to 3.0 A. It is easily interfaced to low-cost MCUs via parallel 3.0 V- or 5.0 V-compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. The 17517 can drive two motors in two directions one at a time or drive one motor in two directions and one solenoid with synchronous rectification of freewheeling currents one at a time. Two-motor operation is accomplished by hooking one motor between OUTA and OUTB and hooking the other motor between OUTB and OUTC. Motor plus solenoid operation is accomplished by hooking a motor between OUTA and OUTB and a solenoid between OUTC and GND. This device contains an integrated charge pump and level shifter (for gate drive voltages), integrated shoot-through current protection (cross-conduction suppression logic and timing), and undervoltage detection and shutdown circuitry. The 17517 has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance). 17517 DUAL MOTOR DRIVER DTB SUFFIX 98ASH70247A 16-PIN TSSOP ORDERING INFORMATION Device Temperature Range (TA) Package MPC17517DTB/R2 -20°C to 65°C 16 TSSOP Features • 2.0 V to 6.8 V Continuous Operation • Output Current 1.0 A (DC), 3.0 A (Peak) • MOSFETs < 600 mΩ RDS(ON) @ 25°C Guaranteed • 3.0 V/ 5.0 V TTL- / CMOS-Compatible Inputs • PWM Frequencies up to 200 kHz • Undervoltage Shutdown 5.0 V 5.0 V 17517 VDD C1L C1H C2L C2H Cres VM OUTC OUTA Solenoid MCU EN1 EN2 IN1 IN2 MOTOR OUTB GND Figure 1. 17517 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2006. All rights reserved. INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM C2L C2H OSC, Charge Pump C1H C1L Low Voltage Detector VMAB VC VMC IN2 Control Logic IN1 Level Shifter Predriver VG OUTC OUTB EN1 OUTA EN2 GND Figure 2. 17517 Simplified Internal Block Diagram 17517 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS VDD 1 16 OUTC VM 2 15 GND OUTA 3 14 OUTB CRES 4 13 VM C2H 5 12 C1H C2L 6 11 C1L IN1 7 10 EN2 IN2 8 9 EN1 Figure 3. 17517 Pin Connections Table 1. 17517 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 9. Pin Number Pin Name Formal Name Definition 1 VDD Control Circuit Power Supply 2, 13 VM Motor Drive Power Supply 3 OUTA Output A 4 CRES Charge Pump Output Capacitor Connection 5 C2H Charge Pump 2H Charge pump bucket capacitor 2 (positive pole). 6 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole). 7 IN1 Input Control 1 Control signal input 1 pin. 8 IN2 Input Control 2 Control signal input 2 pin. 9 EN1 Enable Control Signal Input 1 Enable control signal input 1 pin. 10 EN2 Enable Control Signal Input 2 Enable control signal input 2 pin. 11 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole). 12 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole). 14 OUTB Output B Driver output B pin. 15 GND Ground Ground connection. 16 OUTC Output C Driver output C pin. Positive power source connection for control circuit. Motor power supply voltage input pins. Driver output A pin. Charge pump reservoir capacitor pin. 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit VM -0.5 to 8.0 V CRES -0.5 to 14 V Logic Supply Voltage VDD -0.5 to 7.0 V Signal Input Voltage VIN -0.5 to VDD + 0.5 V ELECTRICAL RATINGS Motor Supply Voltage Charge Pump Output Voltage V Driver Output Current A Continuous IO 1.0 IOPK 3.0 Human Body Model VESD1 ± 2000 Machine Model VESD2 ± 100 TSTG -65 to 150 °C Operating Junction Temperature TJ -20 to 150 °C Operating Ambient Temperature TA -20 to 65 °C RθJA 190 °C/W PD 657 mW TSOLDER 245 °C Peak (1) ESD Voltage (2) V THERMAL RATINGS Storage Temperature Range Thermal Resistance Power Dissipation (3) (4) Soldering Temperature (5) Notes 1. TA = 25°C, 10 ms pulse width at 200 ms intervals. 2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 3. 4. 37 mm x 50 mm Cu area (1.6 mm FR-4 PCB). Maximum at TA = 25°C. 5. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 17517 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions TA = 25°C, VDD = VM = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit Motor Supply Voltage VM 2.0 5.0 6.8 V Logic Supply Voltage VDD 2.7 5.0 5.7 V C1, C2, C3 0.01 0.1 1.0 µF VMSTBY – – 1.0 µA VDDSTBY – – 1.0 mA POWER Capacitor for Charge Pump Standby Power Supply Current I Motor Supply Standby Current Logic Supply Standby Current (6) I Operating Power Supply Current I mA VDD – – 3.0 RES – – 0.7 1.5 2.0 2.5 – 0.46 0.60 12 13 13.5 10 11.2 – VIN 0 – VDD V High-Level Input Voltage VIH VDD x 0.7 – – V Low-Level Input Voltage VIL – – VDD x 0.3 V High-Level Input Current IIH – – 1.0 µA Low-Level Input Current IIL -1.0 – – µA Logic Supply Current (7) IC Charge Pump Circuit Supply Current Low-Voltage Detection Circuit Detection Voltage (VDD) VDDDET (8) Driver Output ON Resistance (9) RDS(ON) V W GATE DRIVE VC RES Gate Drive Voltage (10) No Current Load Gate Drive Ability (Internally Supplied) I V V CRESLOAD CRES = -1.0 mA V CONTROL LOGIC Logic Input Voltage Logic Input Function (2.7 V < VDD < 5.7 V) Notes 6. 7. 8. 9. 10. IV I DDSTBY includes current to the predriver circuit. VDD includes current to the predriver circuit. Detection voltage is defined as when the output becomes high-impedance after VDD drops below the detection threshold. When the gate V V voltage CRES is applied from an external source, CRES = 7.5 V. IO = 1.0 A source + sink. Input logic signal not present. 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions TA = 25°C, VDD = VM = 5.0 V, GND = 0 V unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit fIN – – 200 kHz INPUT (IN1, IN2, EN1, EN2) Pulse Input Frequency Input Pulse Rise Time Input Pulse Fall Time (11) (13) tR – – 1.0 (12) µs 1.0 (12) µs tF – – Turn-ON Time tPLH – 0.1 0.5 Turn-OFF Time tPHL – 0.1 0.5 tVGON tV DET – 0.1 3.0 ms – – 10 ms OUTPUT µs Propagation Delay Time Charge Pump Wake-Up Time (14) Low-Voltage Detection Time Notes 11. 12. 13. 14. DD Time is defined between 10% and 90%. That is, the input waveform slope must be steeper than this. Time is defined between 90% and 10%. When C1 = C2 = C3 = 0.1 µF. 17517 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS IN1, IN2, EN1, EN2 VDDDETon 50% tPHL tPLH OUTA, OUTB, OUTC 2.5 V/3.5 V VDD 0.8 V/ 1.5 V VDDDEToff 50% tV tV DDDET DDDET 90% 90% 10% Figure 4. tPLH, tPHL, and tPZH Timing 0% (<1.0 µA) IM Figure 5. Low-Voltage Detection Timing VDD t VGON V 11 V CRES Figure 6. Charge Pump Timing 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS Table 5. Truth Table INPUT IN1 IN2 OUTPUT EN1 EN2 OUTA OUTB OUTC L L Z Z Z SHUTDOWN MODE X X CHANNEL 1 (A–B) DRIVING MODE H H H L L L Z H L H L H L Z L H H L L H Z L L H L Z Z Z CHANNEL 2 (B–C) DRIVING MODE H H L H Z L L H L L H Z H L L H L H Z L H L L L H Z Z Z HALF-BRIDGE (C) DRIVING MODE H H H H Z Z Z H L H H Z Z H L H H H Z Z L L L H H Z Z Z H = High. L = Low. Z = High impedance. X = Don’t care. 17517 8 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 17517 is a triple totem-pole output H-Bridge power IC designed to drive small dc motors used in portable electronics. The 17517 can operate efficiently with supply voltages as low as 2.0 V to as high as 6.8 V, and provide continuos motor drive currents of 1.0 A while handling peak currents up to 3.0 A. It is easily interfaced to low cost MCUs via parallel 3.0 V- or 5.0 V-compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. The 17517 can drive two motors in two directions one at a time; or it can drive one motor in two directions and one solenoid with synchronous rectification of freewheeling currents one at a time. Two-motor operation is accomplished by hooking one motor between OUTA and OUTB, and the other motor between OUTB and OUTC. Motor + solenoid operation is accomplished by hooking a motor between OUTA and OUTB and placing a solenoid between OUTC and GND. Table 5, Truth Table, page 8, describes the operating states versus the input conditions. As shown in Figure 2, 17517 Simplified Internal Block Diagram, page 2, the 17517 is a monolithic triple totem-pole output bridge with built-in charge pump circuitry. Each of the six MOSFETs forming the triple totem-pole output has an RDS(ON) of ≤ 0.6 Ω (guaranteed by design). The IC has an integrated charge pump and level shifter (for gate drive voltages). Additionally, the IC has a built-in shoot-through current protection circuit and undervoltage lockout function. This IC has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance). FUNCTIONAL PIN DESCRIPTION DRIVER OUTPUT (OUTA, OUTB, OUTC) These pins provide the connection to the internal power MOSFET triple-totem-pole H-bridge of the IC. GROUND (GND) Power and signal ground pin. CHARGE PUMP OUTPUT CAPACITOR (CRES) This pin provides the connection for the external reservoir capacitor (output of the charge pump). Alternatively, this pin can also be used as an input to supply gate-drive voltage from an external source via a series current-limiting resistor. The voltage at the CRES pin will be approximately three times the VDD voltage, as the internal charge pump utilizes a voltage tripler circuit. The VDDRES voltage is used by the IC to supply gate drive for the internal power MOSFETs. MOTOR DRIVE POWER SUPPLY (VM) The two VM pins carry the main supply voltage and current into the power sections of the IC. This supply then becomes controlled and /or modulated by the IC as it delivers the power to the load attached between OUTA and OUTB. The VM pins must be connected together on the printed circuit board with as short as possible traces offering as low impedance as possible between pins. CONTROL SIGNAL INPUT AND ENABLE CONTROL SIGNAL INPUT (IN1, IN1, EN1, EN2) These pins are input control pins used to control the outputs. These pins are 3.0 V/ 5.0 V CMOS-compatible inputs with hysteresis. These pins work together to control OUTA, OUTB, and OUTC (refer to Table 5, Truth Table). CHARGE PUMP BUCKET CAPACITOR (C1L, C1H, C2L, C2H) These two pairs of pins, the C1L and C1H and the C2L and C2H, connect to the external bucket capacitors required by the internal charge pump. The typical value for the bucket capacitors is 0.1 µF. CONTROL CIRCUIT POWER SUPPLY (VDD) This pin carries the logic supply voltage and current into the logic sections of the IC. VDD has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins. 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 9 TYPICAL APPLICATIONS INTRODUCTION TYPICAL APPLICATIONS INTRODUCTION Figure 7 shows a typical application for the 17517. When applying the gate voltage to the CRES pin from an external source, be sure to connect it via a resistor equal to, or greater than, RG = VCRES / 0.02 Ω. 5.0 V 17517 VC RES < 14 V RG > VCRES /0.02 Ω NC NC NC NC C1L C1H C2L C2H VDD VM OUTA CRES RG 0.01 µF OUTB EN1 EN2 MCU OUTC IN1 IN1 GND NC = No Connect Figure 7. 17517 Typical Application Diagram CEMF SNUBBING TECHNIQUES PCB LAYOUT Care must be taken to protect the IC from potentially damaging CEMF spikes induced when commutating currents in inductive loads. Typical practice is to provide snubbing of voltage transients by placing a capacitor or zener at the supply pin (VM) (see Figure 8). When designing the printed circuit board (pcb), connect sufficient capacitance between power supply and ground pins to ensure proper filtering from transients. For all highcurrent paths, use wide copper traces and shortest possible distances. 5.0 V 5.0 V 17517 VDD VM 5.0 V 5.0 V 17517 VDD VM C1L C1L C1H C1H C2L C2H OUT C2L C2H CRES CRES OUT OUT GND OUT GND Figure 8. CEMF Snubbing Techniques 17517 10 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. DTB SUFFIX 16-PIN PLASTIC PACKAGE 98ASH70247A ISSUE B 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 11 PACKAGING PACKAGE DIMENSIONS DTB SUFFIX 16-PIN PLASTIC PACKAGE 98ASH70247A ISSUE B 17517 12 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION 2.0 DATE 7/2006 DESCRIPTION OF CHANGES • Implemented Revision History page • Converted to Freescale format and updated to the prevailing form and style 17517 Analog Integrated Circuit Device Data Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. 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