Data Sheet

Freescale Semiconductor
Technical Data
Document Number: MPC17533
Rev. 3.0, 12/2013
0.7 A 6.8 V Dual H-Bridge Motor
Driver
17533
The 17533 is a monolithic dual H-Bridge power IC ideal for portable
electronic applications containing bipolar stepper motors and/or brush
DC-motors (e.g., cameras and disk drive head positioners).
The 17533 operates from 2.0 V to 6.8 V, with independent control of
each H-Bridge via parallel MCU interface (3.0 V and 5.0 V compatible
logic). The device features built-in shoot-through current protection
and an undervoltage shutdown function.
The 17533 has four operating modes: forward, reverse, brake, and
tri-stated (high-impedance). The 17533 has a low total RDS(ON) of
1.2 Ω (max at 25 °C).
The 17533’s low output resistance and high slew rate provides
efficient drive for many types of micromotors.
Features
• Low total RDS(ON) 0.8 Ω (typ), 1.2 Ω (max) at 25 °C
• Output current 0.7 A (DC), 1.4 A (peak)
• Shoot-through current protection circuit
• 3.0 V/ 5.0 V CMOS-compatible inputs
• PWM control Input frequency up to 200 kHz
• Built-in 2-channel H-Bridge driver
• Low power consumption
• Undervoltage detection and shutdown circuit
EV SUFFIX (Pb-FREE)
98ASA10614D
16-PIN VMFP
ORDERING INFORMATION
Device
(For Tape and Reel, add
an R2 Suffix)
Temperature
Range (TA)
Package
MPC17533EV/EL
-20 °C to 65 °C
16 VMFP
5.0 V
5.0 V
13 V
H-BRIDGE MOTOR DRIVER
17533
VDD
VG
VM
OUT1A
OUT1B
MCU
IN1A
IN1B
IN2A
IN2B
OE
OUT2A
OUT2B
N
S
Bipolar
Step
Motor
GND
Figure 1. 17533 Simplified Application Diagram
© Freescale Semiconductor, Inc., 2012-2013. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VG
Low
Voltage
Shutdown
VDD
VM1
IN1A
OUT1A
H-Bridge 1
OUT1B
IN1B
VDD
PGND1
OE
Control
Logic
Level Shifter
Pre-driver
VM2
IN2A
OUT2A
H-Bridge 2
OUT2B
IN2B
PGND2
LGND
Figure 2. 17533 Simplified Internal Block Diagram
17533
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Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
OUT1A
1
16
PGND2
VM1
2
15
OUT2A
IN1A
3
14
IN2A
IN1B
4
13
IN2B
VDD
5
12
VG
OE
6
11
VM2
LGND
7
10
OUT2B
OUT1B
8
9
PGND1
Figure 3. 17533 Pin Connections
Table 1. PIN Function Description
Pin
Pin Name
Formal Name
Definition
1
OUT1A
H-Bridge Output 1A
2
VM1
Motor Drive Power Supply 1
3
IN1A
Logic Input Control 1A
Logic input control of OUT1A (refer to Table 5, Truth Table, page 7).
4
IN1B
Logic Input Control 1B
Logic input control of OUT1B (refer to Table 5, Truth Table, page 7).
5
VDD
Logic Supply
6
OE
Output Enable
Logic output Enable control of H-Bridges (Low = True).
7
LGND
Logic Ground
Low-current logic signal ground.
8
OUT1B
H-Bridge Output 1B
Output B of H-Bridge channel 1.
9
PGND1
Power Ground 1
10
OUT2B
H-Bridge Output 2B
11
VM2
Motor Drive Power Supply 2
12
VG
13
IN2B
Logic Input Control 2B
Logic input control of OUT2B (refer to Table 5, Truth Table, page 7).
14
IN2A
Logic Input Control 2A
Logic input control of OUT2A (refer to Table 5, Truth Table, page 7).
15
OUT2A
H-Bridge Output 2A
16
PGND2
Power Ground 2
Output A of H-Bridge channel 1.
Positive power source connection for H-Bridge 1 (Motor Drive Power Supply).
Control circuit power supply pin.
High-current power ground 1.
Output B of H-Bridge channel 2.
Positive power source connection for H-Bridge 2 (Motor Drive Power Supply).
Gate Driver Circuit Voltage Input Input pin for the gate drive voltage.
Output A of H-Bridge channel 2.
High-current power ground 2.
17533
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3
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
Motor Supply Voltage
VM
-0.5 to 8.0
V
Gate Driver Circuit Power Supply Voltage
VG
-0.5 to 14
V
Logic Supply Voltage
VDD
-0.5 to 7.0
V
Signal Input Voltage
VIN
-0.5 to VDD + 0.5
V
IO
0.7
IOPK
1.4
Human Body Model
VESD1
±1500
Machine Model
VESD2
± 200
Operating Junction Temperature
TJ
-55 to 150
°C
Operating Ambient Temperature
TA
-20 to 65
°C
TSTG
-55 to 150
°C
RθJA
150
°C/W
PD
830
mW
TPPRT
Note 6
°C
Driver Output Current
A
Continuous
Peak (1)
ESD Voltage
(2)
V
Storage Temperature Range
Thermal Resistance
Power Dissipation
(3)
(4)
Peak Package Reflow Temperature During Reflow
(5), (6)
Notes
1. TA = 25°C. 10 ms pulse at 200 ms intervals.
2.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
3.
4.
Mounted on 37 mm x 50 mm x 1.6 mm glass epoxy board mount.
TA = 25 °C.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause a malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
6.
17533
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Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions TA = 25 °C, VDD = VM = 5.0 V, GND = 0 V, unless otherwise noted. Typical values noted
reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
Motor Supply Voltage
VM
2.0
5.0
6.8
V
Logic Supply Voltage
VDD
2.7
5.0
5.7
V
IQM
–
–
1.0
QVDD
I
QVG
–
–
20
–
–
150
Logic Supply Current (8)
IVDD
–
–
3.0
Gate Driver Circuit Power Supply Current (9)
IVG
–
–
0.7
VDDDET
1.5
2.0
2.5
RDS(ON)
–
0.8
1.2
RDS(ON)2
–
–
1.5
VG
12
13
13.5
V
VIN
0
–
VDD
V
High-Level Input Voltage
VIH
VDD x 0.7
–
–
V
Low-Level Input Voltage
VIL
–
–
VDD x 0.3
V
High-Level Input Current
IIH
–
–
1.0
μA
IIL
-1.0
–
–
μA
IIL-OE
–
50
100
μA
POWER
μA
Quiescent Power Supply Current
Driver Circuit Power Supply Current
I
Logic Supply Current (7)
Gate Driver Circuit Power Supply Current
Operating Power Supply Current
Low VDD Detection Voltage (10)
mA
Ω
Driver Output ON Resistance
Source + Sink at IO = 0.7
A(11)
VG = 9.5 V, VM = 5.0 V, TA = 25 °C(12)
V
GATE DRIVE
Gate Drive Circuit Power Supply Voltage
CONTROL LOGIC
Logic Input Voltage
Logic Inputs (2.7 V < VDD < 5.7 V)
Low-Level Input Current
OE Pin Input Current Low
Notes
7. IQVDD includes the current to pre-driver circuit.
8.
IV
9.
At fIN = 20 kHz.
DD includes the current to pre-driver circuit at fIN = 100 kHz.
10.
Detection voltage is defined as when the output becomes high-impedance after VDD drops below the detection threshold. When gate
voltage VG is applied from an external source, VG = 7.5 V.
11.
12.
The total H-Bridge ON resistance when VG is 13 V.
Increased RDS(ON) value as the result of a reduced VG value of 9.5 V.
17533
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions TA = 25 °C, VDD = VM = 5.0 V, GND = 0 V, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
f IN
–
–
200
kHz
tR
–
–
1.0
μs
tF
–
INPUT
Pulse Input Frequency
Input Pulse Rise Time
(13)
Input Pulse Fall Time (15)
(14)
–
1.0
μs
(14)
OUTPUT
Propagation Delay Time (16)
μs
Turn-ON Time
t PLH
–
0.1
0.5
Turn-OFF Time
t PHL
–
0.1
0.5
tVDDDET
–
–
10
Low Voltage Detection
Notes
13.
14.
15.
16.
17.
Time(17)
ms
Time is defined between 10% and 90%.
That is, the input waveform slope must be steeper than this.
Time is defined between 90% and 10%.
Load of Output is 8.0 Ω resistance. see Figure 4
See Figure 5
17533
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
VDDDETon
IN1,
IN2,
OE
50%
2.5 V
VDDDEToff
VDD
50%
1.5 V
tPLH
tPHL
tVDDDET
90%
90%
OUTA,
OUTB
tVDDDET
0%
(<1.0 μA)
IM
10%
Figure 4. tPLH, tPHL, and tPZH Timing
Figure 5. Low-Voltage Detection Timing Diagram
Table 5. Truth Table
INPUT
OUTPUT
OE
IN1A
IN2A
IN1B
IN2B
OUT1A
OUT2A
OUT1B
OUT2B
L
L
L
L
L
L
H
L
H
L
L
L
H
L
H
L
H
H
Z
Z
H
X
X
Z
Z
H = High.
L = Low.
Z = High-impedance.
X = Don’t care.
OE pin is pulled up to VDD with internal resistance.
17533
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 17533 is a monolithic dual H-Bridge ideal for portable
electronic applications to control bipolar stepper motors and
brush DC motors, such as those found in camera len
assemblies, camera shutters, optical disk drives, etc.
The 17533 operates from 2.0 V to 6.8 V, with independent
control of each H-Bridge via parallel MCU interface (3.0 V
and 5.0 V compatible I/O). The device features built-in shootthrough current protection and undervoltage shutdown.
The 17533 has four operating modes: forward, reverse,
brake, and tri-Stated (high-impedance). The MOSFETs
comprising the output bridge have a total source + sink
RDS(ON) ≤ 1.2 Ω.
The 17533 can simultaneously drive two brush DC motors
or, as shown in Figure 1, 17533 Simplified Application
Diagram on page 1, one bipolar stepper motor. The drivers
are designed to be PWM’ed at frequencies up to 200 kHz.
FUNCTIONAL PIN DESCRIPTION
LOGIC SUPPLY (VDD)
The VDD pin carries the logic supply voltage and current
into the logic sections of the IC. VDD has an undervoltage
threshold. If the supply voltage drops below the undervoltage
threshold, the output power stage switches to a tri-state
condition. When the supply voltage returns to a level that is
above the threshold, the power stage automatically resumes
normal operation according to the established condition of
the input control pins.
LOGIC INPUT CONTROL (IN1A, IN1B, IN2A, AND
IN2B)
These logic input pins control each H-Bridge output (e.g.,
IN1A logic HIGH = OUT1A HIGH, etc.). However, if all inputs
are taken HIGH, the outputs bridges are both tri-stated (refer
to Table 5, Truth Table, page 7).
OUTPUT ENABLE (OE)
The OE pin is a LOW = TRUE enable input. When
OE = HIGH, all H-Bridge outputs (OUT1A, OUT1B, OUT2A,
and OUT2B) are tri-stated (high-impedance), regardless of
logic inputs (IN1A, IN1B, IN2A, and IN2B) states.
OUTPUT A AND B OF H-BRIDGE CHANNEL 1 AND
2 (OUT1A, OUT1B, OUT2A, AND OUT2B)
These pins provide connection to the outputs of each of
the internal H-Bridges (see Figure 2, 17533 Simplified
Internal Block Diagram, page 2).
MOTOR DRIVE POWER SUPPLY (VM1 AND VM2)
The VM pins carry the main supply voltage and current into
the power sections of the IC. This supply then becomes
controlled and/or modulated by the IC as it delivers the power
to the loads attached between the output pins. All VM pins
must be connected together on the printed circuit board.
GATE DRIVER CIRCUIT VOLTAGE INPUT (VG)
The VG pin is the input pin for the gate drive voltage.
POWER GROUND (PGND)
Power ground pins. They must be tied together on the
PCB.
LOGIC GROUND (LGND)
Logic ground pin.
17533
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Analog Integrated Circuit Device Data
Freescale Semiconductor
TYPICAL APPLICATIONS
INTRODUCTION
TYPICAL APPLICATIONS
INTRODUCTION
Figure 6 shows a typical application for the 17533. When
applying the gate voltage to the VG pin from an external
source, be sure to connect it via a resistor equal to, or greater
than, RG = VG / 0.02 Ω.
Care must be taken to provide sufficient gate-source
voltage for the high-side MOSFETs when VM >> VDD (e.g.,
VM = 5.0 V, VDD = 3.0 V), in order to ensure full enhancement
of the high-side MOSFET channels.
5.0 V
17533
VDD
VG < 14 V
VM
OUT1A
RG > VG /0.02 Ω
VG
RG
0.01 μF
OUT1B
IN1A
IN1B
IN2A
IN2B
MCU
OE
OUT2A
OUT2B
GND
Figure 6. 17533 Typical Application Diagram
CEMF SNUBBING TECHNIQUES
PCB LAYOUT
Care must be taken to protect the IC from potentially
damaging CEMF spikes induced when commuting currents
in inductive loads. Typical practice is to provide snubbing of
voltage transients by placing a zener or a capacitor at the
supply pin (VM) (see Figure 7).
When designing the printed circuit board (PCB), connect
sufficient capacitance between power supply and ground
pins to ensure proper filtering from transients. For all highcurrent paths, use wide copper traces and shortest possible
distances.
5.0 V
5.0 V
17533
VDD
VM
5.0 V
5.0 V
17533
VDD
VM
OUT
OUT
OUT
OUT
OUT
OUT
OUT
GND
OUT
GND
Figure 7. CEMF Snubbing Techniques
17533
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to
www.freescale.com and perform a keyword search for the drawing’s document number.
Table 6.
Package
16-PIN VMFP
Suffix
EV
Package Outline Drawing Number
98ASA10614D
17533
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Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
EV (Pb-FREE) SUFFIX
16-LEAD VMFP
98ASA10614D
ISSUE B
17533
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Freescale Semiconductor
11
PACKAGING
PACKAGE DIMENSIONS
EV (Pb-FREE) SUFFIX
16-LEAD VMFP
98ASA10614D
ISSUE B
17533
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Analog Integrated Circuit Device Data
Freescale Semiconductor
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
2.0
5/2006
•
•
Converted to Freescale format
Added Revision History page
3.0
7/2006
•
•
•
Updated to the prevailing form and style
Corrected device isometric drawing on page 1
Added RoHS compliance
12/2013
•
•
•
No technical changes
Revised back page
Updated document properties
17533
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
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© 2013 Freescale Semiconductor, Inc.
Document Number: MPC17533
Rev. 3.0
12/2013