Freescale Semiconductor Technical Data Document Number: MPC17511 Rev. 3.0, 10/2013 1.0 A 6.8 V H-Bridge Motor Driver IC The 17511 is a monolithic H-Bridge designed to be used in portable electronic applications to control small DC motors or bipolar step motors. End applications include head positioners (CDROM or disk drive), camera focus motors, and camera shutter solenoids. The 17511 can operate efficiently with supply voltages as low as 2.0 V to as high as 6.8 V. Its low RDS(ON) H-Bridge output MOSFETs (0.46 Ω typical) can provide continuos motor drive currents of 1.0 A and handle peak currents up to 3.0 A. It is easily interfaced to low-cost MCUs via parallel 3.0 V or 5.0 V compatible logic. The device can be pulse width modulated (PWMed) at up to 200 kHz. This device contains an integrated charge pump and level shifter (for gate drive voltages), integrated shoot-through current protection (cross-conduction suppression logic and timing), and undervoltage detection and shutdown circuitry. The 17511 has four operating modes: Forward, Reverse, Brake, and Tri-state (high-impedance). Features • 2.0 to 6.8 V continuous operation • Output current 1.0 A(DC), 3.0 A (peak) • MOSFETs < 600 mΩ RDS(ON) @ 25 °C guaranteed • 3.0 V/ 5.0 V TTL/ CMOS compatible logic inputs • PWM frequencies up to 200 kHz • Undervoltage shutdown • Low power consumption • Integrated charge pump • Shoot-through current protection • External MOSFET control circuit 17511 H-BRIDGE MOTOR DRIVER IC ORDERING INFORMATION Device © Freescale Semiconductor, Inc., 2013. All rights reserved. Temperature Range (TA) MPC17511EP/R2 Package 24 QFN -20 to 65 °C MPC17511EV/EL Figure 1. 17511 Simplified Application Diagram Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. EP SUFFIX 98ARL10577D 24-PIN QFN EV SUFFIX) 98ASA10614D 16-Pin VMFP 16 VMFP INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM Charge Pump C2L C2H C1H C1L CRES GOUT Low-voltage Shutdown VDD VM IN1 OUT1 Level Shifter Predriver IN2 VDD OUT2 Control Logic GIN VDD PGND LGND EN Figure 2. 17511 Simplified Internal Block Diagram 17511 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS C2L 1 16 C2H C1H 2 15 CRES C1L 3 14 GOUT VM 4 13 OUT2 VDD 5 12 PGND IN1 6 11 OUT1 IN2 7 10 GIN EN 8 9 LGND Figure 3. VMFP Pin Connections Table 1. 17511 VMFP Pin Function Description Pin Number Pin Name Formal Name 1 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole). 2 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole). 3 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole). 4 VM Motor Drive Power Supply 5 VDD Logic Supply 6 IN1 Input Control 1 Control signal input 1 7 IN2 Input Control 2 Control signal input 2. 8 EN Enable Control Enable control signal input pin. 9 LGND Logic Ground 10 GIN Gate Driver Input LOW True control signal for GOUT pin. 11 OUT1 H-Bridge Output 1 Driver output 1 (right half of H-Bridge). 12 PGND Power Ground 13 OUT2 H-Bridge Output 2 Driver output 2 (left half of H-Bridge). 14 GOUT Gate Driver Output Output gate driver signal to external MOSFET switch. 15 CRES Charge Pump Output Capacitor Connection 16 C2H Charge Pump 2H Definition Driver power supply voltage input pin. Control circuit power supply pin. Logic ground pin. Driver ground pin. Charge pump reservoir capacitor pin. Charge pump bucket capacitor 2 (positive pole). 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 3 GOUT CRES C2H C2L C1H C1L PIN CONNECTIONS 24 23 22 21 20 19 NC VM 2 17 OUT2 VM 3 16 PGND VM 4 15 PGND NC 5 14 OUT1 NC 6 13 NC GIN 9 10 11 12 LGND 8 EN 7 IN2 18 IN1 1 VDD VM Figure 4. QFN Pin Connections Table 2. 17511 QFN Pin Function Description Pin Number Pin Name Formal Name 1, 2, 3, 4 VM Motor Drive Power Supply 5, 6, 13, 18 NC No Connect This pin is not used. 7 VDD Logic Supply Control circuit power supply pin. 8 IN1 Logic Input Control 1 Control signal input 1. 9 IN2 Logic Input Control 2 Control signal input 2. 10 EN Enable Control 11 LGND Logic Ground 12 GIN Gate Driver Input 14 OUT1 Output 1 15, 16 PGND Power Ground 17 OUT2 Output 2 19 GOUT Gate Driver Output 20 CRES Pre-Driver Power Supply 21 C2H Charge Pump 2H Charge pump bucket capacitor 2 (positive pole). 22 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole). 23 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole). 24 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole). Definition Driver power supply voltage input pin. Enable control signal input pin. Logic ground pin. LOW = True control signal for GOUT pin. Driver output 1 (right half of H-Bridge). Driver ground pin. Driver output 2 (left half of H-Bridge). Output gate driver signal to external MOSFET switch. Pre-driver circuit power supply pin. 17511 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit VM -0.5 to 8.0 V -0.5 to 14.0 V Motor Supply Voltage V Charge Pump Output Voltage CRES Logic Supply Voltage VDD -0.5 to 7.0 V Signal Input Voltage (EN, IN1, IN2, GIN) VIN -0.5 to VDD + 0.5 V IO 1.0 IOPK 3.0 Human Body Model VESD1 ±1800 Machine Model VESD2 ± 100 TSTG -55 to 150 °C TJ -20 to 150 °C Driver Output Current A Continuous Peak (1) ESD Voltage (2) V Storage Temperature Range Operating Junction Temperature Thermal Resistance (3) °C/W RθJA 24 Pin QFN 50 16 Pin VMFP 150 Power Dissipation (4) PD 24 Pin QFN 16 Pin VMFP Soldering Temperature mW 2500 830 (5) Peak Package Reflow Temperature During Reflow (6), (7) TSOLDER 245 °C TPPRT Note 7 °C Notes 1. TA = 25 °C, 10 ms pulse width at 200 ms intervals. 2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 3. QFN24: 45 x 30 x 1 [mm] glass EPOXY board mount. (See: recommended heat pattern) VMFP16: 37 x 50 x 1.6 [mm] glass EPOXY board mount. When the exposed pad is bonded, Rsj is not performed. Maximum at TA = 25 °C. When the exposed pad is bonded, Rsj is not performed. 4. 5. 6. 7. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics Characteristics noted under conditions TA = 25 °C, VM = VDD = 5.0 V, GND = 0 V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit Driver Circuit Power Supply Voltage VM 2.0 5.0 6.8 V Logic Supply Voltage VDD 2.7 5.0 5.7 V C1, C2, C3 0.01 0.1 1.0 μF VMSTBY – – 1.0 μA VDDSTBY – – 1.0 mA DD – – 3.0 mA RES – – 0.7 mA VDDDET 1.5 2.0 2.5 V RDS(ON) – 0.46 0.60 Ω 12 13 13.5 10 11.2 – POWER Capacitor for Charge Pump Standby Power Supply Current I Motor Supply Standby Current Logic Supply Standby Current (8) I Operating Power Supply Current IV Logic Supply Current (9) IC Charge Pump Circuit Supply Current Low VDD Detection Voltage (10) Driver Output ON Resistance (11) GATE DRIVE Gate Drive Voltage (12) V V CRES No Current Load Gate Drive Ability (Internally Supplied) V V CRESLOAD IC RES = -1.0 mA Gate Drive Output V V V IOUT = -50 μA VGOUTHIGH lIN = 50 μA VGOUTLOW LGND VIN 0 – High-level Input Voltage VIH VDD x 0.7 Low-level Input Voltage VIL – High-level Input Current IIH Low-level Input Current IIL Pull-Up Resistance (EN, GIN) RPU 50 CRES- 0.5 CRES- 0.1 V CRES LGND + 0.1 LGND + 0.5 CONTROL LOGIC Logic Input Voltage VDD V – – V – VDD x 0.3 V – – 1.0 μA -1.0 – – μA 100 200 kΩ Logic Input Function (2.7 V < VDD < 5.7 V) Notes 8. 9. 10. I I VDDSTBY includes current to the predriver circuit. VDD includes current to the predriver circuit. Detection voltage is defined as when the output becomes high-impedance after VDD drops below the detection threshold. When the gate voltage VCRES is applied from an external source, VCRES = 7.5 V. 11. IO = 1.0 A source + sink. 12. Input logic signal not present. 17511 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics Characteristics noted under conditions TA = 25 °C, VM = VDD = 5.0 V, GND = 0 V, unless otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit fIN – – 200 kHz INPUT (EN, IN1, IN2, GIN) Pulse Input Frequency Input Pulse Rise Time (13) tR Input Pulse Fall Time (15) – – 1.0 (14) μs 1.0 (14) μs tF – – Turn-ON Time tPLH – 0.55 1.0 Turn-OFF Time tPHL – 0.55 1.0 OUTPUT μs Propagation Delay Time μs GOUT Propagation Delay Time Turn-ON Time tSON – 0.15 0.5 Turn-OFF Time tSOFF – 0.15 0.5 – 0.1 3.0 – – 10 Charge Pump Circuit (16) tV CRESON ms Rise Time (17) t Low-Voltage Detection Time Notes 13. 14. 15. 16. 17. VDDDET ms Time is defined between 10% and 90%. That is, the input waveform slope must be steeper than this. Time is defined between 90% and 10%. When C1 = C2 = C3 = 0.1 μF. Time to charge CRES to 11 V after application of VDD. TIMING DIAGRAMS VDDDETON EN, IN1, IN2 (GIN) 50% tPLH (tSON) OUT1, OUT2 (GOUT) tPHL VDD 0.8 V/ 1.5 V Figure 5. tPLH, tPHL, and tPZH Timing t VDDDET 90% VDDDETOFF 50% t (tSOFF) 10% 2.5 V/3.5 V VDDDET 90% 0% (<1.0 μA) IM Figure 6. Low-Voltage Detection 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS Table 6. Truth Table INPUT OUTPUT EN IN1 IN2 GIN OUT1 OUT2 GOUT H H H X L L X H H L X H L X H L H X L H X H L L X Z Z X L X X X L L L H X X H X X L H X X L X X H H = High. L = Low. Z = High-impedance. X = Don’t care. 17511 8 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 17511 is a monolithic H-Bridge power IC applicable to small DC motors used in portable electronics. The 17511 can operate efficiently with supply voltages as low as 2.0 V to as high as 6.8 V, and it can provide continuos motor drive currents of 1.0 A while handling peak currents up to 3.0 A. It is easily interfaced to low-cost MCUs via parallel 3.0 V or 5.0 V compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. The 17511 has four operating modes: Forward, Reverse, Brake, and Tri-State (high-impedance). Basic protection and operational features (direction, dynamic braking, PWM control of speed and torque, main power supply undervoltage detection and shutdown, logic power supply undervoltage detection and shutdown), in addition to the 1.0 A rms output current capability, make the 17511 a very attractive, cost-effective solution for controlling a broad range of small DC motors. In addition, a pair of 17511 devices can be used to control bipolar step motors. The 17511 can also be used to excite transformer primary windings with a switched square wave to produce secondary winding AC currents. As shown in Figure 2, the 17511 is a monolithic H-Bridge with built-in charge pump circuitry. For a DC motor to run, the input conditions need to be set as follows: enable input logic HIGH, one Input logic LOW, and the other input logic HIGH (to define output polarity). The 17511 can execute dynamic braking by setting both IN1 and IN2 logic HIGH, causing both low side MOSFETs in the output H-Bridge to turn ON. Dynamic braking can also implemented by taking the enable logic LOW. The output of the H-Bridge can be set to an opencircuit high-impedance (Z) condition by taking both IN1 and IN2 logic LOW. (refer to Table 6). The 17511 outputs are capable of providing a continuous DC load current of up to 1.2 A. An internal charge pump supports PWM frequencies to 200 kHz. The EN pin also controls the charge pump, turning it off when EN = LOW, thus placing the 17511 in a power-conserving sleep mode. FUNCTIONAL PIN DESCRIPTION OUT1 AND OUT2 The OUT1 and OUT2 pins provide the connection to the internal power MOSFET H-Bridge of the IC. A typical load connected between these pins would be a small DC motor. These outputs connect to either VM or PGND, depending on the states of the control inputs (refer to Table 6). VM has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins. PGND AND LGND IN1, IN2, AND EN The power and logic ground pins (PGND and LGND) should be connected together with a very low-impedance connection. The IN1, IN2, and EN pins are input control pins used to control the outputs. These pins are 5.0 V CMOS-compatible inputs with hysteresis. The IN1, IN2, and EN work together to control OUT1 and OUT2 (refer to Table 6). CRES The CRES pin provides the connection for the external reservoir capacitor (output of the charge pump). Alternatively this pin can also be used as an input to supply gate-drive voltage from an external source via a series current-limiting resistor. The voltage at the CRES pin is approximately three times the VDD voltage, as the internal charge pump utilizes a voltage tripler circuit. The VCRES voltage is used by the IC to supply gate drive for the internal power MOSFET H-Bridge. VM The VM pins carry the main supply voltage and current into the power sections of the IC. This supply then becomes controlled and/or modulated by the IC as it delivers the power to the load attached between OUT1 and OUT2. All VM pins must be connected together on the printed circuit board with as short as possible traces offering as low-impedance as possible between pins. GIN The GIN input controls the GOUT pin. When GIN is set logic LOW, GOUT supplies a level-shifted high side gate drive signal to an external MOSFET. When GIN is set logic HIGH, GOUT is set to GND potential. C1L AND C1H, C2L AND C2H These two pairs of pins, the C1L and C1H and the C2L and C2H, connect to the external bucket capacitors required by the internal charge pump. The typical value for the bucket capacitors is 0.1 μF. GOUT The GOUT output pin provides a level-shifted, high side gate drive signal to an external MOSFET with CISS up to 500 pF. 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 9 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION VDD The VDD pin carries the 5.0 V supply voltage and current into the logic sections of the IC. VDD has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins. 17511 10 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS FUNCTIONAL PIN DESCRIPTION TYPICAL APPLICATIONS Figure 7 shows a typical application for the 17511. When applying the gate voltage to the CRES pin from an external source, be sure to connect it via a resistor equal to, or greater than, RG = VCRES / 0.02 Ω. 5.0 V 17511 VDD VCRES < 14 V RG > VCRES /0.02 Ω RG NC NC NC NC 0.01 μF MCU C1L C1H C2L C2H CRES VM GOUT OUT1 Motor EN GIN IN1 IN2 Solenoid OUT2 GND NC = No Connect Figure 7. 17511 Typical Application Diagram CEMF SNUBBING TECHNIQUES Care must be taken to protect the IC from potentially damaging CEMF spikes induced when commutating currents in inductive loads. Typical practice is to provide snubbing of voltage transients via placing a capacitor or zener at the supply pin (VM) (see Figure 8). 5.0 V 5.0 V 17511 VM VDD 5.0 V 5.0 V 17511 VM VDD C1L C1H OUT1 C2L C2H CRES C1L C1H OUT1 C2L C2H CRES GND GND OUT2 OUT2 Figure 8. CEMF Snubbing Techniques 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 11 PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. EV (PB-FREE) SUFFIX 16-PIN VMFP 98ASA10614D ISSUE B 17511 12 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS EV (PB-FREE) SUFFIX 16-PIN VMFP 98ASA10614D ISSUE B 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 13 PACKAGING PACKAGE DIMENSIONS PACKAGE DIMENSIONS (CONTINUED) EP (PB-FREE) SUFFIX 24-PIN QFN 98ARL10577D ISSUE B 17511 14 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS EP (PB-FREE) SUFFIX 24-PIN QFN 98ARL10577D ISSUE B 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 15 PACKAGING PACKAGE DIMENSIONS EP (PB-FREE) SUFFIX 24-PIN QFN 98ARL10577D ISSUE B 17511 16 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 1.0 7/2006 • Implemented Revision History page • Converted to Freescale format 2.0 5/2010 • Updated Figures 1 and 2 to reflect correct pin names 3.0 10/2013 • • • • • Corrected Ordering information to MPC17511EP and MPC17511EV/EL Corrected packaging drawings to 98ASA10614D and 98ARL10577D Corrected Figure 1 and some text for GIN Corrected page footers to 17511 Corrected Table 6 - now on 1 page. 17511 Analog Integrated Circuit Device Data Freescale Semiconductor 17 REVISION HISTORY 17511 18 Analog Integrated Circuit Device Data Freescale Semiconductor How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. 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