FREESCALE MPX4105A

Freescale Semiconductor
Technical Data
Document Number: MPX4105A
Rev 6, 07/2006
Integrated Silicon Pressure Sensor
for Manifold Absolute Pressure
Applications On-Chip Signal
Conditioned, Temperature
Compensated and Calibrated
The Freescale MPX4105A series Manifold Absolute Pressure (MAP) sensor
for engine control is designed to sense absolute air pressure within the intake
manifold. This measurement can be used to compute the amount of fuel required
for each cylinder.
Freescale’s MAP sensor integrates on-chip, bipolar op amp circuitry and thin
film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration
make the Freescale MAP sensor a logical and economical choice for the
automotive system designer.
The MPX4105A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
MPX4105A
SERIES
INTEGRATED
PRESSURE SENSOR
15 TO 105 kPA (2.2 TO 15.2 psi)
0.3 TO 4.9 V OUTPUT
UNIBODY PACKAGE
Features
•
•
•
•
MPX4105A
CASE 867-08
1.8% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute
Pressure Sensing in Engine Control Systems
Temperature Compensated Over –40 to +125°C
Durable Epoxy Unibody Element
PIN NUMBERS(1)
1
Vout
4
N/C
Typical Applications
2
GND
5
N/C
•
•
•
3
VS
6
N/C
Manifold Sensing for Automotive Systems
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Also Ideal for Non-Automotive Applications
ORDERING INFORMATION
Device Type
Options
Case No.
MPX Series
Order No.
Device Marking
UNIBODY PACKAGE (MPX4105A SERIES)
Basic Element
Absolute,
Element
867
MPX4105A
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MPX4105A
1. Pins 4, 5, and 6 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 4, 5, and 6 are NO CONNECTS for
unibody devices.
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
400
kPa
Storage Temperature
TSTG
-40 to +125
°C
TA
-40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4105A
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic
Pressure Range
Symbol
Min
Typ
Max
Unit
POP
15
—
105
kPa
VS
4.85
5.1
5.35
Vdc
Io
—
7.0
10
mAdc
(0 to 85°C)
Voff
0.184
0.306
0.428
Vdc
(0 to 85°C)
VFSO
4.804
4.896
4.988
Vdc
(0 to 85°C)
VFSS
—
4.590
—
Vdc
(0 to 85°C)
—
—
—
±1.8
%VFSS
(1)
(2)
Supply Voltage
Supply Current
Minimum Pressure Offset
Full Scale Output
Full Scale Span
(3)
(4)
(5)
Accuracy(6)
∆V/∆P
—
51
—-
mV/kPa
Response Time(7)
Sensitivity
tR
—
1.0
—-
ms
Output Source Current at Full Scale Output
Io+
—
0.1
—-
mAdc
Warm-Up Time(8)
—
—
15
—-
ms
Offset Stability(9)
—
—
±0.65
—-
%VFSS
1.
2.
3.
4.
5.
6.
7.
8.
9.
1.0 kPa (kiloPascal) equals 0.145 psi.
Device is ratiometric within this specified excitation range.
Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
Characteristics
Weight, Basic Element (Case 867)
Typ
Unit
4.0
grams
MPX4105A
Sensors
Freescale Semiconductor
3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Fluoro Silicone
Gel Die Coat
Stainless
Steel Cap
Die
P1
Wire Bond
Epoxy Plastic Case
Die Bond
Lead Frame
Absolute Element
P2
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram (not to scale)
(For additional output filtering, please refer to
Application Note AN1646)
+5 V
Vout
5.0
4.5
Output
4.0
IPS
1.0 µF
0.01 µF
GND
470 pF
Output (Volts)
Vs
3.5
3.0
2.5
2.0
1.5
Transfer Function:
Vout = Vs* (0.01*P-0.09) ± Error
VS = 5.1 Vdc
Temperature = 0 to 85°C
20 kPa to 105 kPa
MPX4105A
TYP
MAX
MIN
1.0
0.5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
Figure 3. Recommended Power Supply
Decoupling and Output Filtering
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 2 illustrates an absolute sensing chip in the basic
chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. The MPX4105A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over a temperature range of
0° to 85°C. The output will saturate outside of the specified
pressure range.
MPX4105A
4
Sensors
Freescale Semiconductor
Transfer Function (MPX4105A)
Nominal Transfer Value: Vout = VS (P x 0.01 - 0.09)
± (Pressure Error x Temp. Factor x 0.01 x VS)
VS = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPX4105A Series
4.0
Break Points
Temp
3.0
Temperature
Error
Factor
Multiplier
–40
–20
0 to 85
125
2.0
3.0
1.5
1.0
2.5
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from –40°C to –20°C, –20°C to 0°C, and from 85°C to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
–1.0
20
40
60
80
100
120
Pressure (in kPa)
–2.0
–3.0
Pressure
40 to 94 (kPa)
15 (kPa)
105 (kPa)
Error (Max)
±1.5 (kPa)
±2.4 (kPa)
±1.8 (kPa)
MPX4105A
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.027
0.033
0.68
0.84
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
MPX4105A
6
Sensors
Freescale Semiconductor
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MPX4105A
Rev. 6
07/2006
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