TI SN74LV4052ADR

SCLS429H − MAY 1999 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Support Mixed-Mode Voltage Operation on
2Y0
2Y2
2-COM
2Y3
2Y1
INH
GND
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
1Y2
1Y1
1-COM
1Y0
1Y3
A
B
description/ordering information
These
dual
4-channel
CMOS
analog
multiplexers/demultiplexers are designed for 2-V
to 5.5-V VCC operation.
2Y2
2-COM
2Y3
2Y1
INH
GND
The ’LV4052A devices handle both analog and
digital signals. Each channel permits signals with
amplitudes up to 5.5 V (peak) to be transmitted in
either direction.
VCC
SN74LV4052A . . . RGY PACKAGE
(TOP VIEW)
1
16
15 1Y2
14 1Y1
2
3
5
13 1-COM
12 1Y0
6
11
7
10 A
4
9
GND
8
Applications include signal gating, chopping,
modulation or demodulation (modem), and signal
multiplexing for analog-to-digital and digital-toanalog conversion systems.
1Y3
B
D
All Ports
Fast Switching
High On-Off Output-Voltage Ratio
Low Crosstalk Between Switches
Extremely Low Input Current
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
2Y0
D
D
D
D
D
SN54LV4052A . . . J OR W PACKAGE
SN74LV4052A . . . D, DB, DGV, N, NS, OR PW PACKAGE
(TOP VIEW)
ORDERING INFORMATION
PDIP − N
QFN − RGY
SN74LV4052AN
SN74LV4052AN
SN74LV4052ARGYR
LW052A
SN74LV4052AD
Reel of 2500
SN74LV4052ADR
SOP − NS
Reel of 2000
SN74LV4052ANSR
74LV4052A
SSOP − DB
Reel of 2000
SN74LV4052ADBR
LW052A
Tube of 90
SN74LV4052APW
Reel of 2000
SN74LV4052APWR
Reel of 250
SN74LV4052APWT
TVSOP − DGV
Reel of 2000
SN74LV4052ADGVR
LW052A
CDIP − J
Tube of 25
SNJ54LV4052AJ
SNJ54LV4052AJ
CFP − W
Tube of 150
SNJ54LV4052AW
TSSOP − PW
−55°C to 125°C
Tube of 25
Reel of 1000
TOP-SIDE
MARKING
Tube of 40
SOIC − D
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV4052A
LW052A
SNJ54LV4052AW
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
!"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS429H − MAY 1999 − REVISED APRIL 2005
FUNCTION TABLE
INPUTS
A
ON
CHANNEL
L
L
1Y0, 2Y0
L
H
1Y1, 2Y1
L
H
L
1Y2, 2Y2
L
H
H
1Y3, 2Y3
H
X
X
None
INH
B
L
L
logic diagram (positive logic)
13
12
A
14
9
11
1
5
2
INH
6
4
3
2
1Y0
10
15
B
1-COM
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
2-COM
SCLS429H − MAY 1999 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7.0 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7.0 V
Switch I/O voltage range, VIO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
I/O diode current, IIOK (VIO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Switch through current, IT (VIO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 3): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 5)
SN54LV4052A
VCC
VIH
VIL
VI
VIO
∆t/∆v
MIN
2‡
Supply voltage
High-level input voltage,
control inputs
Low-level input voltage,
control inputs
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
5.5
MIN
2‡
1.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
0.5
0
0
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC × 0.3
5.5
VCC
200
MAX
5.5
UNIT
V
V
0.5
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input/output voltage
MAX
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
Control input voltage
SN74LV4052A
VCC × 0.3
VCC × 0.3
0
0
VCC × 0.3
5.5
V
V
VCC
200
V
100
100
ns/V
20
20
TA
Operating free-air temperature
−55
125
−40
85
°C
‡ With supply voltages at or near 2 V, the analog switch on-state resistance becomes very nonlinear. It is recommended that only digital signals
be transmitted at these low supply voltages.
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS429H − MAY 1999 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TA = 25°C
TYP
MAX
MIN
MAX
SN74LV4052A
MIN
MAX
UNIT
IT = 2 mA,
VI = VCC or GND,
VINH = VIL
(see Figure 1)
2.3 V
43
180
225
225
3V
34
150
190
190
4.5 V
25
75
100
100
IT = 2 mA,
VI = VCC to GND,
VINH = VIL
2.3 V
133
500
600
600
3V
63
180
225
225
4.5 V
35
100
125
125
Difference in
on-state resistance
between switches
IT = 2 mA,
VI = VCC to GND,
VINH = VIL
2.3 V
1.5
30
40
40
3V
1.1
20
30
30
4.5 V
0.7
15
20
20
II
Control input current
VI = 5.5 V or GND
0 to
5.5 V
±0.1
±1
±1
µA
IS(off)
Off-state switch
leakage current
VI = VCC and VO = GND, or
VI = GND and VO = VCC,
VINH = VIH
(see Figure 2)
5.5 V
±0.1
±1
±1
µA
IS(on)
On-state switch
leakage current
VI = VCC or GND,
VINH = VIL
(see Figure 3)
5.5 V
±0.1
±1
±1
µA
ICC
Supply current
VI = VCC or GND
5.5 V
20
20
µA
CIC
Control input
capacitance
f = 10 MHz
3.3 V
2.1
pF
CIS
Common terminal
capacitance
3.3 V
13.1
pF
COS
Switch terminal
capacitance
3.3 V
5.6
pF
CF
Feedthrough
capacitance
3.3 V
0.5
pF
ron
ron(p)
∆ron
On-state
switch resistance
Peak
on-state resistance
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
4
SN54LV4052A
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Ω
Ω
Ω
SCLS429H − MAY 1999 − REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
TA = 25°C
TYP
MAX
SN54LV4052A
SN74LV4052A
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
COM or Y
Y or COM
CL = 15 pF,
(see Figure 4)
1.9
10
16
16
ns
MIN
MIN
MAX
MIN
MAX
UNIT
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Y
CL = 15 pF,
(see Figure 5)
8
18
23
23
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Y
CL = 15 pF,
(see Figure 5)
8.3
18
23
23
ns
tPLH
tPHL
Propagation
delay time
COM or Y
Y or COM
CL = 50 pF,
(see Figure 4)
3.8
12
18
18
ns
tPZH
tPZL
Enable
delay time
INH
COM or Y
CL = 50 pF,
(see Figure 5)
9.4
28
35
35
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Y
CL = 50 pF,
(see Figure 5)
12.4
28
35
35
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
TA = 25°C
TYP
MAX
SN54LV4052A
SN74LV4052A
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
COM or Y
Y or COM
CL = 15 pF,
(see Figure 4)
1.2
6
10
10
ns
MIN
MIN
MAX
MIN
MAX
UNIT
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Y
CL = 15 pF,
(see Figure 5)
5.7
12
15
15
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Y
CL = 15 pF,
(see Figure 5)
6.6
12
15
15
ns
tPLH
tPHL
Propagation
delay time
COM or Y
Y or COM
CL = 50 pF,
(see Figure 4)
2.5
9
12
12
ns
tPZH
tPZL
Enable
delay time
INH
COM or Y
CL = 50 pF,
(see Figure 5)
6.7
20
25
25
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Y
CL = 50 pF,
(see Figure 5)
9.5
20
25
25
ns
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCLS429H − MAY 1999 − REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted)
PARAMETER
TA = 25°C
TYP
MAX
SN54LV4052A
SN74LV4052A
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
COM or Y
Y or COM
CL = 15 pF,
(see Figure 4)
0.7
4
7
7
ns
MIN
MIN
MAX
MIN
MAX
UNIT
tPLH
tPHL
Propagation
delay time
tPZH
tPZL
Enable
delay time
INH
COM or Y
CL = 15 pF,
(see Figure 5)
4
8
10
10
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Y
CL = 15 pF,
(see Figure 5)
5
8
10
10
ns
tPLH
tPHL
Propagation
delay time
COM or Y
Y or COM
CL = 50 pF,
(see Figure 4)
1.5
6
8
8
ns
tPZH
tPZL
Enable
delay time
INH
COM or Y
CL = 50 pF,
(see Figure 5)
4.7
14
18
18
ns
tPHZ
tPLZ
Disable
delay time
INH
COM or Y
CL = 50 pF,
(see Figure 5)
6.9
14
18
18
ns
analog switch characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
Frequency response
(switch on)
Crosstalk
(between any switches)
Crosstalk
(control input to signal output)
Feedthrough attenuation
(switch off)
Sine-wave distortion
FROM
(INPUT)
TO
(OUTPUT)
COM or Y
Y or COM
COM or Y
INH
COM or Y
COM or Y
Y or COM
COM or Y
Y or COM
Y or COM
TEST
CONDITIONS
VCC
MIN
TA = 25°C
TYP
MAX
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz (sine wave)
(see Note 6 and Figure 6)
2.3 V
30
3V
35
4.5 V
50
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz (sine wave)
(see Note 7 and Figure 7)
2.3 V
−45
3V
−45
4.5 V
−45
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz (square wave)
(see Figure 8)
2.3 V
20
3V
35
4.5 V
65
CL = 50 pF,
RL = 600 Ω,,
fin = 1 MHz (sine wave)
(see Note 7 and Figure 9)
2.3 V
−45
3V
−45
4.5 V
−45
CL = 50 pF,
RL = 10 kΩ,
fin = 1 kHz
(sine wave)
(see Figure 10)
2.3 V
0.1
3V
0.1
4.5 V
0.1
VI = 2 Vp-p
VI = 2.5 Vp-p
VI = 4 Vp-p
UNIT
MHz
dB
mV
dB
%
NOTES: 6. Adjust fin voltage to obtain 0 dBm at output. Increase fin frequency until dB meter reads −3 dB.
7. Adjust fin voltage to obtain 0 dBm at input.
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
TYP
UNIT
11.8
pF
SCLS429H − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = VIL
VCC
VI = VCC or GND
VO
(ON)
GND
r on +
VI – VO
2
10 –3
W
2 mA
V
VI − VO
Figure 1. On-State Resistance Test Circuit
VCC
VINH = VIH
VCC
VI
A
(OFF)
VO
GND
Condition 1: VI = 0, VO = VCC
Condition 2: VI = VCC, VO = 0
Figure 2. Off-State Switch Leakage-Current Test Circuit
VCC
VINH = VIL
VCC
VI
A
(ON)
Open
GND
VI = VCC or GND
Figure 3. On-State Switch Leakage-Current Test Circuit
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SCLS429H − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = VIL
VCC
Input
Output
(ON)
50 Ω
CL
GND
Figure 4. Propagation Delay Time, Signal Input to Signal Output
VCC
50 Ω
VINH
VCC
VO
VI
S1
RL = 1 kΩ
S2
TEST
S1
S2
tPLZ/tPZL
tPHZ/tPZH
GND
VCC
VCC
GND
CL
GND
TEST CIRCUIT
VCC
VCC
VINH
VINH
50%
0V
50%
0V
tPZL
tPZH
≈VCC
VOH
VO
VO
50%
VOL
(tPZL, tPZH)
VCC
VCC
VINH
50%
≈0 V
VINH
50%
0V
50%
0V
tPLZ
tPHZ
≈VCC
VO
VOL
VOH
VO
VOL + 0.3 V
(tPLZ, tPHZ)
VOH − 0.3 V
≈0 V
VOLTAGE WAVEFORMS
Figure 5. Switching Time (tPZL, tPLZ, tPZH, tPHZ), Control to Signal Output
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS429H − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = GND
0.1 µF
VCC
(ON)
VI
fin
VO
GND
50 Ω
RL = 600 Ω
CL = 50 pF
VCC/2
NOTE A: fin is a sine wave.
Figure 6. Frequency Response (Switch On)
VCC
VINH = GND
0.1 µF
VI
fin
600 Ω
VCC
(ON)
VO1
GND
50 Ω
RL = 600 Ω
CL = 50 pF
VCC/2
VCC
VINH = VCC
VCC
(OFF)
VO2
GND
600 Ω
RL = 600 Ω
CL = 50 pF
VCC/2
Figure 7. Crosstalk Between Any Two Switches
VCC
50 Ω
VINH
VCC
fin
VO
600 Ω
VCC/2
GND
RL = 600 Ω
CL = 50 pF
VCC/2
Figure 8. Crosstalk Between Control Input and Switch Output
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SCLS429H − MAY 1999 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
VINH = VCC
0.1 µF
VI
fin
50 Ω
VCC
(OFF)
GND
600 Ω
VO
RL = 600 Ω
CL = 50 pF
VCC/2
VCC/2
Figure 9. Feedthrough Attenuation (Switch Off)
VCC
VINH = GND
10 µF
fin
600 Ω
VI
VCC
(ON)
GND
VO
RL = 10 kΩ
VCC/2
Figure 10. Sine-Wave Distortion
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CL = 50 pF
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV4052AD
ACTIVE
SOIC
D
16
SN74LV4052ADBR
ACTIVE
SSOP
DB
SN74LV4052ADBRE4
ACTIVE
SSOP
SN74LV4052ADBRG4
ACTIVE
SN74LV4052ADE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ADGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ADGVRG4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ADRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052AN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV4052ANE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV4052ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ANSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ANSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052APWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV4052APWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4052ARGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LV4052ARGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LV4052ADBR
DB
16
SITE 41
330
16
8.2
6.6
2.5
12
16
Q1
SN74LV4052ADGVR
DGV
16
SITE 41
330
12
6.8
4.0
1.6
8
16
Q1
SN74LV4052ADR
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
SN74LV4052ANSR
NS
16
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
SN74LV4052APWR
PW
16
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
SN74LV4052ARGYR
RGY
16
SITE 41
180
12
3.8
4.3
1.5
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
4-Oct-2007
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LV4052ADBR
DB
16
SITE 41
346.0
346.0
33.0
SN74LV4052ADGVR
DGV
16
SITE 41
346.0
346.0
29.0
SN74LV4052ADR
D
16
SITE 27
342.9
336.6
28.58
SN74LV4052ANSR
NS
16
SITE 41
346.0
346.0
33.0
SN74LV4052APWR
PW
16
SITE 41
346.0
346.0
29.0
SN74LV4052ARGYR
RGY
16
SITE 41
190.0
212.7
31.75
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated