ONSEMI MJ11015

ON Semiconductor
PNP
High-Current Complementary
Silicon Transistors
MJ11015
. . . for use as output devices in complementary general purpose
amplifier applications.
MJ11016 *
NPN
MJ11012
• High DC Current Gain —
•
•
hFE = 1000 (Min) @ IC – 20 Adc
Monolithic Construction with Built–in Base Emitter Shunt
Resistor
Junction Temperature to +200C
*ON Semiconductor Preferred Device
30 AMPERE
DARLINGTON
POWER TRANSISTORS
COMPLEMENTARY
SILICON
60–120 VOLTS
200 WATTS
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MAXIMUM RATINGS
Rating
Collector–Emitter Voltage
Symbol
MJ11012
MJ11015
MJ11016
Unit
VCEO
60
120
Vdc
Collector–Base Voltage
VCB
60
120
Vdc
Emitter–Base Voltage
VEB
5
Vdc
Collector Current
IC
30
Adc
Base Current
IB
1
Adc
Total Device Dissipation @TC = 25C
Derate above 25C @ TC = 100C
PD
200
1.15
Watts
W/C
TJ, Tstg
–55 to +200
C
Operating Storage Junction
Temperature Range
CASE 1–07
TO–204AA
(TO–3)
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
RθJC
0.87
C/W
TL
275
C
COLLECTOR
NPN
MJ11012
MJ11016
Thermal Resistance, Junction to Case
Maximum Lead Temperature for
Soldering Purposes for 10 Seconds.
PNP
MJ11015
BASE
COLLECTOR
BASE
≈ 8.0 k
≈ 40
≈ 8.0 k
EMITTER
≈ 40
EMITTER
Figure 1. Darlington Circuit Schematic
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
 Semiconductor Components Industries, LLC, 2001
May, 2001 – Rev. 4
1
Publication Order Number:
MJ11012/D
MJ11015 MJ11012 MJ11016
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ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted.)
Characteristics
Symbol
Min
Max
60
120
—
—
—
—
—
—
1
1
5
5
Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage(1)
(IC = 100 mAdc, IB = 0)
Collector–Emitter Leakage Current
(VCE = 60 Vdc, RBE = 1k ohm)
(VCE = 120 Vdc, RBE = 1k ohm)
(VCE = 60 Vdc, RBE = 1k ohm, TC = 150C)
(VCE = 120 Vdc, RBE = 1k ohm, TC = 150C)
V(BR)CEO
MJ11012
MJ11015, MJ11016
Vdc
ICER
MJ11012
MJ11015, MJ11016
MJ11012
MJ11015, MJ11016
mAdc
Emitter Cutoff Current
(VBE = 5 Vdc, IC = 0)
IEBO
—
5
mAdc
Collector–Emitter Leakage Current
(VCE = 50 Vdc, IB = 0)
ICEO
—
1
mAdc
1000
200
—
—
—
—
3
4
—
—
3.5
5
4
—
ON CHARACTERISTICS(1)
DC Current Gain
(IC = 20 Adc,VCE = 5 Vdc)
(IC = 30 Adc, VCE = 5 Vdc)
hFE
Collector–Emitter Saturation Voltage
(IC = 20 Adc, IB = 200 mAdc)
(IC = 30 Adc, IB = 300 mAdc)
VCE(sat)
Base–Emitter Saturation Voltage
(IC = 20 A, IB = 200 mAdc)
(IC = 30 A, IB = 300 mAdc)
VBE(sat)
—
Vdc
Vdc
DYNAMIC CHARACTERISTICS
Current–Gain Bandwidth Product
(IC = 10 A, VCE = 3 Vdc, f = 1 MHz)
hfe
(1) Pulse Test: Pulse Width = 300 µs, Duty Cycle 2.0%.
http://onsemi.com
2
MHz
hFE, DC CURRENT GAIN
30 k
20 k
PNP MJ11015
NPN MJ11012, MJ11016
10 k
7k
5k
3k
2k
700
500
VCE = 5 Vdc
TJ = 25°C
300
0.3
0.5 0.7
hFE , SMALL-SIGNAL CURRENT GAIN (NORMALIZED
MJ11015 MJ11012 MJ11016
2
1
0.5
0.2
0.1
0.05
PNP MJ11015
NPN MJ11012, MJ11016
0.02
0.01
VCE = 3 Vdc
IC = 10 mAdc
TJ = 25°C
0.005
5 7 10
1
2
3
IC, COLLECTOR CURRENT (AMP)
20
30
10
20
Figure 2. DC Current Gain (1)
5
TJ = 25°C
IC/IB = 100
2
VBE(sat)
VCE(sat)
1
0
0.1
50
IC, COLLECTOR CURRENT (AMP)
V, VOLTAGE (VOLTS)
3
0.2
0.5
1
2
500 700 1.0 k
Figure 3. Small–Signal Current Gain
PNP MJ11015
NPN MJ11012, MJ11016
4
50 70 100
200 300
f, FREQUENCY (kHz)
30
5
10
20
50
100
20
10
5
2
1
0.5
0.2
0.1
0.05
BONDING WIRE LIMITATION
THERMAL LIMITATION @ TC = 25°C
SECOND BREAKDOWN LIMITATION
MJ11012
0.02
0.01
MJ11015, MJ11016
2
IC, COLLECTOR CURRENT (AMP)
3
5
7
10
20
30
50
70 100
200
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 4. “On” Voltages (1)
Figure 5. Active Region DC Safe Operating Area
At high case temperatures, thermal limitations will reduce
the power that can be handled to values less than the
limitations imposed by secondary breakdown.
There are two limitations on the power handling ability of
a transistor average junction temperature and secondary
breakdown. Safe operating area curves indicate IC – VCE
limits of the transistor that must be observed for reliable
operations e.g., the transistor must not be subjected to
greater dissipation than the curves indicate.
http://onsemi.com
3
MJ11015 MJ11012 MJ11016
PACKAGE DIMENSIONS
CASE 1–07
TO–204AA (TO–3)
ISSUE Z
A
N
C
–T–
E
D
SEATING
PLANE
K
2 PL
0.13 (0.005)
U
T Q
M
M
Y
M
DIM
A
B
C
D
E
G
H
K
L
N
Q
U
V
–Y–
L
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. ALL RULES AND NOTES ASSOCIATED WITH
REFERENCED TO-204AA OUTLINE SHALL APPLY.
2
H
G
B
M
T Y
1
–Q–
0.13 (0.005)
M
INCHES
MIN
MAX
1.550 REF
--1.050
0.250
0.335
0.038
0.043
0.055
0.070
0.430 BSC
0.215 BSC
0.440
0.480
0.665 BSC
--0.830
0.151
0.165
1.187 BSC
0.131
0.188
MILLIMETERS
MIN
MAX
39.37 REF
--26.67
6.35
8.51
0.97
1.09
1.40
1.77
10.92 BSC
5.46 BSC
11.18
12.19
16.89 BSC
--21.08
3.84
4.19
30.15 BSC
3.33
4.77
STYLE 1:
PIN 1. BASE
2. EMITTER
CASE: COLLECTOR
ON Semiconductor and
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MJ11012/D