ONSEMI 2N5657

ON Semiconductor 2N5655
2N5657
Plastic NPN Silicon
High-Voltage Power Transistor
. . . designed for use in line–operated equipment such as audio
output amplifiers; low–current, high–voltage converters; and AC line
relays.
0.5 AMPERE
POWER TRANSISTORS
NPN SILICON
250–350 VOLTS
20 WATTS
• Excellent DC Current Gain –
•
hFE = 30–250 @ IC = 100 mAdc
Current–Gain – Bandwidth Product –
fT = 10 MHz (Min) @ IC = 50 mAdc
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MAXIMUM RATINGS (1)
Rating
Symbol
2N5655
2N5657
Unit
VCEO
250
350
Vdc
Collector–Base Voltage
VCB
275
375
Vdc
Emitter–Base Voltage
VEB
6.0
Vdc
Collector Current – Continuous
Peak
IC
0.5
1.0
Adc
Base Current
IB
0.25
Adc
Total Power Dissipation @ TC = 25C
Derate above 25C
PD
20
0.16
Watts
W/C
TJ, Tstg
–65 to +150
C
Symbol
Max
Unit
θJC
6.25
C/W
Collector–Emitter Voltage
Operating and Storage Junction
Temperature Range
3 2
1
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
CASE 77–09
TO–225AA TYPE
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
(1) Indicates JEDEC Registered Data.
PD, POWER DISSIPATION (WATTS)
40
30
50 mH
X
20
200
Hg RELAY
10
0
+
TO SCOPE
6.0 V
Y
300
25
50 V
50
75
100
TC, CASE TEMPERATURE (°C)
125
+
-
1.0
150
Figure 2. Sustaining Voltage Test Circuit
Figure 1. Power Derating
Safe Area Limits are indicated by Figures 3 and 4. Both limits are applicable and must be observed.
 Semiconductor Components Industries, LLC, 2002
April, 2002 – Rev. 7
1
Publication Order Number:
2N5655/D
2N5655 2N5657
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*ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
2N5655
2N5657
VCEO(sus)
250
350
–
–
Vdc
2N5655
2N5657
V(BR)CEO
250
350
–
–
Vdc
–
–
0.1
0.1
–
–
–
–
0.1
0.1
1.0
1.0
–
–
10
10
–
10
25
30
15
5.0
–
250
–
–
–
–
–
1.0
2.5
10
VBE
–
1.0
Vdc
fT
Cob
10
–
MHz
–
25
pF
hfe
20
–
–
OFF CHARACTERISTICS
Collector–Emitter Sustaining Voltage
(IC = 100 mAdc (inductive), L = 50 mH)
Collector–Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
Collector Cutoff Current
(VCE = 150 Vdc, IB = 0)
(VCE = 250 Vdc, IB = 0)
ICEO
2N5655
2N5657
Collector Cutoff Current
(VCE = 250 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 350 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 150 Vdc, VEB(off) = 1.5 Vdc, TC = 100C)
(VCE = 250 Vdc, VEB(off) = 1.5 Vdc, TC = 100C)
2N5655
2N5657
2N5655
2N5657
Collector Cutoff Current
(VCB = 275 Vdc, IE = 0)
(VCB = 375 Vdc, IE = 0)
2N5655
2N5657
mAdc
ICEX
mAdc
µAdc
ICBO
Emitter Cutoff Current (VEB = 6.0 Vdc, IC = 0)
IEBO
µAdc
ON CHARACTERISTICS
DC Current Gain (1)
(IC = 50 mAdc, VCE = 10 Vdc)
(IC = 100 mAdc, VCE = 10 Vdc)
(IC = 250 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)
hFE
Collector–Emitter Saturation Voltage (1)
(IC = 100 mAdc, IB = 10 mAdc)
(IC = 250 mAdc, IB = 25 mAdc)
(IC = 500 mAdc, IB = 100 mAdc)
VCE(sat)
Base–Emitter Voltage (1) (IC = 100 mAdc, VCE = 10 Vdc)
DYNAMIC CHARACTERISTICS
Current–Gain – Bandwidth Product (2) (IC = 50 mAdc, VCE = 10 Vdc, f = 10 MHz)
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 100 kHz)
Small–Signal Current Gain (IC = 100 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
*Indicates JEDEC Registered Data for 2N5655 Series.
(1) Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%.
(2) fT is defined as the frequency at which |hfe| extrapolates to unity.
IC, COLLECTOR CURRENT (AMP)
1.0
0.2
1.0 ms
d
c
Second Breakdown Limit
Thermal Limit @ TC = 25°C
Bonding Wire Limit
Curves apply below rated VCEO
2N5655
0.1
0.05
0.02
0.01
500
µs
TJ = 150°C
2N5657
20
30 40
60
100
200 300 400
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Vdc
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I C – V CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 3 is based on T J(pk) = 150C; TC is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T J(pk)
150C. At high case temperatures, thermal limitations
will reduce the power that can be handled to values less than
the limitations imposed by second breakdown.
10
µs
0.5
–
600
Figure 3. Active–Region Safe Operating Area
http://onsemi.com
2
2N5655 2N5657
300
hFE , DC CURRENT GAIN
200
VCE = 10 V
VCE = 2.0 V
TJ = +150°C
100
70
+100°C
50
+25°C
30
20
-55°C
10
1.0
2.0
3.0
5.0
7.0
10
20
30
50
IC, COLLECTOR CURRENT (mA)
70
100
200
300
500
Figure 4. Current Gain
1.0
300
200
VBE(sat) @ IC/IB = 10
C, CAPACITANCE (pF)
V, VOLTAGE (VOLTS)
0.8
VBE @ VCE = 10 V
0.6
0.4
VCE(sat) @ IC/IB = 10
0.2
0
10
20
30
50
100
200 300
IC, COLLECTOR CURRENT (mA)
100
70
50
30
20
TJ = +25°C
IC/IB = 5.0
10
0.1
500
Cob
0.2
Figure 5. “On” Voltages
10
2.0
t, TIME (s)
µ
1.0
50
100
10
IC/IB = 10
VCC = 300 V, VBE(off) = 2.0 V
(2N5657, only)
VCC = 100 V, VBE(off) = 0 V
IC/IB = 10
5.0
0.5
0.2
0.5
1.0 2.0
5.0
10 20
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Capacitance
t, TIME (s)
µ
tr
5.0
TJ = +25°C
Cib
td
0.1
ts
2.0
tf
1.0
VCC = 100 V
0.5
0.05
0.01
1.0
VCC = 300 V
(Type 2N5657, only)
0.2
0.02
2.0
5.0
10
20
50
100
IC, COLLECTOR CURRENT (mA)
200
0.1
1.0
500
Figure 7. Turn–On Time
2.0
5.0
10
20
50
100
IC, COLLECTOR CURRENT (mA)
Figure 8. Turn–Off Time
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3
200
500
2N5655 2N5657
PACKAGE DIMENSIONS
TO–225AA
CASE 77–09
ISSUE W
–B–
U
F
Q
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
M
DIM
A
B
C
D
F
G
H
J
K
M
Q
R
S
U
V
1 2 3
H
K
J
V
G
S
R
0.25 (0.010)
A
M
M
B
M
D 2 PL
0.25 (0.010)
M
A
M
B
INCHES
MIN
MAX
0.425
0.435
0.295
0.305
0.095
0.105
0.020
0.026
0.115
0.130
0.094 BSC
0.050
0.095
0.015
0.025
0.575
0.655
5 TYP
0.148
0.158
0.045
0.065
0.025
0.035
0.145
0.155
0.040
---
MILLIMETERS
MIN
MAX
10.80
11.04
7.50
7.74
2.42
2.66
0.51
0.66
2.93
3.30
2.39 BSC
1.27
2.41
0.39
0.63
14.61
16.63
5 TYP
3.76
4.01
1.15
1.65
0.64
0.88
3.69
3.93
1.02
---
M
STYLE 1:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
ON Semiconductor and
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4
2N5655/D