SANYO LB11872H

Ordering number : ENN7257A
Monolithic Digital IC
LB11872H
Three-Phase Brushless Motor Driver
for Polygonal Mirror Motors
Overview
Package Dimensions
The LB11872H is a three-phase brushless motor driver
developed for driving the motors used for the polygonal
mirror in laser printers and similar applications. It can
implement, with a single IC chip, all the circuits required
for polygonal mirror drive, including speed control and
driver functions. The LB11872H can implement motor
drive within minimal drive noise due to its use of current
linear drive.
unit: mm
3233A-HSOP28H
[LB11872H]
0.65
15.2
(6.2)
7.9
Functions and Features
1
14
0.8
2.0
0.25
0.3
2.45max
(2.25)
(0.8)
0.1
• Three-phase bipolar current linear drive + midpoint
control circuit
• PLL speed control circuit
• Speed is controlled by an external clock signal.
• Supports Hall FG operation.
• Built-in output saturation prevention circuit
• Phase lock detection output (with masking function)
• Includes current limiter, thermal protection, rotor
constraint protection, and low-voltage protection circuits
on chip.
• On-chip output diodes.
10.5
15
4.9
28
2.7
SANYO: HSOP28H
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Symbol
Supply voltage
VCC max
Output current
IO max
Conditions
Ratings
30
Unit
V
T ≤ 500 ms
1.2
A
0.8
W
Allowable power dissipation 1
Pd max1
Independent IC
Allowable power dissipation 2
Pd max2
Mounted on a PCB (114.3 × 76.1 × 1.6 mm, glass epoxy)
2.0
W
Operating temperature
Topr
–20 to +80
°C
Storage temperature
Tstg
–55 to +150
°C
Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
91002AS (OT) No. 7257 -1/13
LB11872H
Allowable Operating Ranges at Ta = 25°C
Parameter
Symbol
Supply voltage range
Conditions
Ratings
Unit
VCC
10 to 28
V
6.3 V regulator-voltage output current
IREG
0 to –20
mA
LD pin applied voltage
VLD
0 to 28
V
LD pin output current
ILD
0 to 15
mA
FGS pin applied voltage
VFG
0 to 28
V
FGS pin output current
IFG
0 to 10
mA
Electrical Characteristics at Ta = 25°C, VCC = VM = 24 V
Parameter
Symbol
Conditions
Ratings
min
typ
Unit
max
Supply current 1
ICC1
Stop mode
5
7
mA
Supply curren 2
ICC2
Start mode
17
22
mA
[Output Saturation Voltages
VAGC = 3.5 V]
SOURCE (1)
VSAT1-1
IO = 0.5 A, RF = 0 Ω
1.7
2.2
V
SOURCE (2)
VSAT1-2
IO = 1.0 A, RF = 0 Ω
2.0
2.7
V
SINK (1)
VSAT2-1
IO = 0.5 A, RF = 0 Ω
0.4
0.9
V
SINK (2)
VSAT2-2
IO = 1.0 A, RF = 0 Ω
1.0
1.7
V
Output leakage current
IO (LEAK) VCC = 28 V
100
µA
[6.3 V Regulator-Voltage Output]
Output voltage
Voltage regulation
VREG
∆VREG1
6.25
6.60
V
VCC = 9.5 to 28 V
5.90
50
100
mV
10
60
Load regulation
∆VREG2
Iload = –5 to –20 mA
Temperature coefficient
∆VREG3
Design target value
0
mV
mV/°C
[Hall Amplifier Block]
Input bias current
IB (HA)
Differential input voltage range
VHIN
Common-phase input voltage range
VICM
Input offset voltage
VIOH
Differential input: 50 mVp-p
SIN wave input
2
10
50
*600
Differential input: 50 mVp-p
2.0
VCC – 2.5
Design target value
–20
20
µA
mVp-p
V
mV
[FG Amplifier and Schmitt Block (IN1)]
Input amplifier gain
GFG
5
Input hysteresis (high to low)
VSHL
0
mV
Input hysteresis (low to high)
VSLH
–10
mV
Hysteresis width
VFGL
Input conversion
4
7
deg
12
mV
[Low-Voltage Protection Circuit]
Operating voltage
Hysteresis width
VSD
8.4
8.8
9.2
V
∆VSD
0.2
0.4
0.6
V
150
180
°C
40
°C
[Thermal Protection Circuit]
Thermal shutdown operating temperature
Hysteresis width
TSD
Design target value (junction temperature)
∆TSD
Design target value (junction temperature)
[Current Limiter Operation]
Acceleration limit voltage
VRF1
0.53
0.59
0.65
V
Deceleration limit voltage
VRF2
0.32
0.37
0.42
V
[Error Amplifier]
Input offset voltage
Input bias current
VIO (ER)
Design target value
IB (ER)
High-level output voltage
VOH (ER) IOH = –500 µA
Low-level output voltage
VOL (ER)
DC bias level
VB (ER)
–10
10
mV
–1
1
µA
VREG – 1.2
IOL = 500 µA
VREG – 0.9
V
0.9
1.2
V
–5%
1/2VREG
5%
V
VREG – 0.2
VREG – 0.1
[Phase Comparator Output]
High-level output voltage
VPDH
IOH = –100 µA
Low-level output voltage
VPDL
IOL = 100 µA
Output source current
IPD+
VPD = VREG/2
Output sink current
IPD–
VPD = VREG/2
Note*: Since kickback can occur in the output waveform if the Hall input amplitude is too large, the Hall input
amplitudes should be held to under 350 mVp-p.
0.2
1.5
V
0.3
V
–500
µA
mA
Continued on next page.
No. 7257 -2/13
LB11872H
Continued from preceding page.
Parameter
Symbol
Conditions
Ratings
min
typ
Unit
max
[Lock Detection Output]
Output saturation voltage
VLD (SAT) ILD = 10 mA
Output leakage current
ILD (LEAK) VLD = 28 V
0.15
0.5
V
10
µA
[FG Output]
Output saturation voltage
VFG (SAT) IFG = 5 mA
Output leakage current
IFG (LEAK) VFG = 28 V
0.15
0.5
V
10
µA
300
mV
[Drive Block]
Dead zone width
VDZ
Output idling voltage
VID
Forward gain 1
GDF+1
With the phase is locked
With phase locked
50
0.4
100
0.5
6
mV
0.6
deg
Forward gain 2
GDF+2
With phase unlocked
0.8
1.0
1.2
deg
Reverse gain 1
GDF–1
With phase locked
–0.6
–0.5
–0.4
deg
Reverse gain 2
GDF–2
With phase unlocked
–0.8
–1.0
–1.2
deg
5.0
5.6
Acceleration command voltage
VSTA
Deceleration command voltage
VSTO
V
0.8
1.5
V
Forward limiter voltage
VL1
Rf = 22 Ω
0.53
0.59
0.65
V
Reverse limiter voltage
VL2
Rf = 22 Ω
0.32
0.37
0.42
V
Oscillation frequency
fOSC
C = 0.022 µF
High-level pin voltage
VCSDH
4.3
4.8
5.3
V
Low-level pin voltage
VCSDL
0.75
1.15
1.55
V
3
5
7
µA
0.80
V
Hz
[CSD Oscillator Circuit]
External capacitor charge and discharge current
ICHG
31
Lock detection delay count
CSDCT1
Clock cutoff protection operating count
CSDCT2
2
Lock protection count
CSDCT3
31
Initial reset voltage
Hz
7
VRES
0.60
[Clock Input Block]
External input frequency
fCLK
400
10000
High-level input voltage
VIH (CLK) Design target value
2.0
VREG
V
Low-level input voltage
VIL (CLK) Design target value
0
1.0
V
Input open voltage
VIO (CLK)
2.7
3.0
3.3
V
Hysteresis width
VIS (CLK) Design target value
0.1
0.2
0.3
V
High-level input current
IIH (CLK)
V (CLK) = VREG
140
185
Low-level input current
IIL (CLK)
V (CLK) = 0 V
–185
–140
µA
µA
[S/S Pin]
High-level input voltage
VIH (S/S)
2.0
VREG
V
Low-level input voltage
VIL (S/S)
0
1.0
V
Input open voltage
VIO (S/S)
2.7
3.0
3.3
V
Hysteresis width
VIS (S/S)
0.1
0.2
0.3
V
High-level input current
IIH (S/S)
V (S/S) = VREG
140
185
Low-level input current
IIL (S/S)
V (S/S) = 0 V
–185
–140
µA
µA
Three-Phase Logic
OUT1 to OUT3 (H: Source, L: Sink)
IN1
IN2
IN3
OUT1
OUT2
OUT3
H
L
H
L
H
M
H
L
L
L
M
H
H
H
L
M
L
H
L
H
L
H
L
M
L
H
H
H
M
L
L
L
H
M
H
L
For IN1 to IN3, “H” means that IN+ is greater than IN–, and “L” means IN– is greater than IN+.
For OUT1 to OUT3, “H” means the output is a source, and “L” means that it is a sink.
No. 7257 -3/13
LB11872H
LD
CLK
S/S
21
20
19
18
17
16
15
8
9
10
11
12
13
14
CSD
NC
FG
HSOP28H
PD
22
NC
VREG
23
EI
VCC
24
EO
SUB
25
MN
RF
26
FC
OUT1
27
AGC
OUT2
28
GND
OUT3
Pin Arrangement
7
NC
6
GND
IN2–
5
IN3–
IN2+
4
IN3+
3
IN1–
2
IN1+
1
NC
LB11872H
Pd max – Ta
Allowable Power Dissipation, Pdmax – W
2.4
Mounted on a specified board.
(114mm × 71.1mm × 1.6mmt, glass epoxy)
2
1.6
1.2
1.12
Independent IC
0.8
0.45
0.4
0
–20
0
20
40
60
80
100
Ambient temprature, Ta – °C
No. 7257 -4/13
LB11872H
Pin Functions
Pin No.
Symbol
FRAME
GND
1
NC
2 to 7
IN1+ to IN3+
IN1– to IN3–
8
AGC
9
MN
10
NC
11
NC
12
CSD
13
NC
14
FG
Pin
GND pin
NC (No connection) pin
Hall sensor input pins
These pins input the Hall effect sensor signal for each
phase.
The logic of these inputs is that the input is “high” when
VIN+ is greater than VIN–.
Frequency characteristics correction pin
Insert a capacitor between pin 8 and ground.
Test pin
This pin must be left open.
Phase lock detection chattering prevention pin
Insert a capacitor between pin 12 and ground.
FG output pin
This is an open-collector output
Low: start mode
15
S/S
Start/stop switching pin
16
CLK
Clock signal input pin
17
LD
Phase lock detection output pin
18
PD
Phase comparator output pin
19
EI
Error amplifier input pin
20
EO
Error amplifier output pin
21
FC
Frequency characteristics correction pin
Insert a capacitor between pin 21 and ground.
22
VREG
Stabilized power supply output pin
Insert a capacitor between pin 22 and ground.
This pin goes to the on state when the phase is locked. It is
an open-collector output.
23
VCC
Power supply pin
24
SUB
SUBGND pin
Connect this pin to ground.
Output current detection pin
Insert a resistor between pin 25 and ground.
25
Rf
26 to 28
OUT1 to 3
Output pins
No. 7257 -5/13
FG
LD
12
CSD
MN 9
FG 14
LD 17
22
Vreg
×5
RESET
OSC
6.3VREG
LD
FILTER
FG
4
5
IN1
2
3
IN2
6
7
IN3
HALL AMP & MATRIX
RESTRICT DET
LOCK DET
PD
PLL
18
16
CLOCK DET
PD
CLK
CLK
EI
19
8
AGC
AGC
V - AMP
EO
20
24
SUB
OUTPUT
OCL
LVSD
TSD
FREAM
GND
OUT1
OUT2
OUT3
26
27
28
25 RF
21 FC
15 S/S
23 Vcc
S/S
Vcc
LB11872H
LB11872H Equivalent Circuit Block Diagram
No. 7257 -6/13
LB11872H
Pin Circuits and Functions
Pin No.
Pin
Function
Equivalent circuit
Vcc
Hall effect sensor signal inputs
2
IN2+
3
IN2–
4
IN1+
5
IN1–
6
IN3+
7
IN3–
These inputs are high when IN+ is greater than IN- and
low when IN- is greater than IN+.
Insert capacitors between the IN+ and IN– pins to
reduce noise.
An amplitude of over 50 mA p-p and under 350 mVp-p is
desirable for the Hall input signals.
3
5
300Ω
7
300Ω
2
4
6
Kickback can occur in the output waveform if the Hall
input amplitude is over 350 mVp-p.
VREG
AGC amplifier frequency characteristics correction.
8
AGC
9
MN
300Ω
Insert a capacitor (about 0.022 µF) between this pin and
ground.
8
Monitor pin
This pin should be left open in normal operation.
VREG
12
CSD
Used for both initial reset pulse generation and as the
reference time for constraint protection circuits.
300Ω
12
Insert a capacitor between this pin and ground.
VREG
14
14
FG
FG pulse output.
This is an open-collector output.
VREG
33kΩ
Start/stop control.
15
S/S
Low: Start 0 to 1.0 V
5kΩ
15
High: Stop 2.0 V to VREG
This pin goes to the high level when open.
30kΩ
Continued on next page.
No. 7257 -7/13
LB11872H
Continued from preceding page.
Pin No.
Pin
Function
Equivalent circuit
VREG
33kΩ
Clock input.
16
CLK
Low: 0 to 1.0 V
5kΩ
16
High: 2.0 V to VREG
This pin goes to the high level when open.
30kΩ
VREG
Phase locked state detection output
17
LD
17
This output goes to the on state when the PLL locked
state is detected.
This is an open-collector output.
VREG
Phase comparator output (PLL output)
18
PD
18
This pin output the phase error as a pulse signal with
varying duty.The output current increases as the duty
becomes smaller.
VREG
19
EI
Error amplifier in put pin.
300Ω
19
VREG
20
EO
Error amplifier output pin.
300Ω
20
The output current increases when this output is high.
40kΩ
Continued on next page.
No. 7257 -8/13
LB11872H
Continued from preceding page.
Pin No.
Pin
Function
Equivalent circuit
VREG
Control amplifier frequency correction.
21
FC
21
Inserting a capacitor (about 5600 pF) between this pin
and ground will stop closed loop oscillation in the current
control system. The output current response
characteristics will be degraded if the capacitor is too
large.
Vcc
Stabilized power supply (6.3 V)
22
VREG
23
VCC
24
SUB
22
Insert a capacitor (about 0.1 µF) between this pin and
ground for stabilization.
Power supply
SUB pin.
Connect this pin to ground.
Output current detection.
25
RF
Vcc
Insert low-valued resistors (Rf) between these pins and
ground. The output current will be limited to the value
set by the equation IOUT = VL/RF.
VREG
26 27 28
26
OUT1
Motor drive outputs.
27
OUT2
28
OUT3
If the output oscillates, insert a capacitor (about 0.1 µF)
between this pin and ground.
300Ω
25
1
10
11
NC
No connection (NC) pins.
These pins may be used for wiring connections.
13
FRAME
GND
Ground
No. 7257 -9/13
LB11872H
Overview of the LB11872H
1. Speed Control Circuit
This IC adopts a PLL speed control technique and provides stable motor operation with high precision and low jitter.
This PLL circuit compares the phase error at the edges of the CLK signal (falling edges) and FG signal (rising edges
(low to high transitions) on the IN1 input), and the IC uses the detected error to control the motor speed.
During this control operation, the FG servo frequency will be the same as the CLK frequency.
fFG (servo) = fCLK
2. Output Drive Circuit
To minimize motor noise, this IC adopts three-phase full-wave current linear drive. This IC also adopts a midpoint
control technique to prevent ASO destruction of the output transistors.
Reverse torque braking is used during motor deceleration during speed switching and lock pull-in. In stop mode, the
drive is cut and the motor is left in the free-running state.
Since the output block may oscillate depending on the motor actually used, capacitors (about 0.1 µF) must be inserted
between the OUT pins and ground.
3. Hall Input Signals
This IC includes an AGC circuit that minimizes the influence on the output of changes in the Hall signal input
amplitudes due to the motor used. However, note that if there are discrepancies in the input amplitudes between the
individual phases, discrepancies in the output phase switching timing may occur.
An amplitude (differential) of at least 50 mVp-p is required in the Hall input signals. However, if the input amplitude
exceeds 350 mVp-p, the AGC circuit control range will be exceeded and kickback may occur in the output.
If Hall signal input frequencies in excess of 1 kHz (the frequency in a single Hall input phase) are used, internal IC
heating during startup and certain other times (that is, when the output transistors are saturated) may increase.
Reducing the number of magnetic poles can be effective in dealing with problem.
The IN1 Hall signal is used as the FG signal for speed control internally to the IC. Since noise can easily become a
problem, a capacitor must be inserted across this input. However, since this could result in differences between the
signal amplitudes of the three phases, capacitors must be inserted across all of the three input phases.
Although VCC can be used as the Hall element bias power supply, using VREG can reduce the chances of problems
occurring during noise testing and at other times. If VREG is used, since there is no longer any need to be concerned
with the upper limit of the Hall amplifier common-mode input voltage range, bias setting resistors may be used only
on the low side.
4. Power Saving Circuit
This IC goes into a power saving state that reduces the current drain in the stop state. The power saving state is
implemented by removing the bias current from most of the circuits in the IC. However, the 6.3 V regulator output is
provided in the power saving state.
5. Reference Clock
Care must be taken to assure that no chattering or other noise is present on the externally input clock signal. Although
the input circuit does have hysteresis, if problems do occur, the noise must be excluded with a capacitor.
This IC includes an internal clock cutoff protection circuit. If a signal with a frequency below that given by the
formula below is input, the IC will not perform normal control, but rather will operate in intermittent drive mode.
f (Hz) .=. 0.64 ÷ CCSD CCSD (µF): The capacitor inserted between the CSD pin and ground.
When a capacitor of 0.022 µF is used, the frequency will be about 29 Hz.
If the IC is set to the start state when the reference clock signal is completely absent, the motor will turn somewhat
and then motor drive will be shut off. After the motor stops and the rotor constraint protection time elapses, drive will
not be restarted, even if the clock signal is then reapplied. However, drive will restart if the clock signal is reapplied
before the rotor constraint protection time elapses.
No. 7257 -10/13
LB11872H
6. Rotor Constraint Protection Circuit
This IC provides a rotor constraint protection circuit to protect the IC itself and the motor when the motor is
constrained physically, i.e. prevented from turning. If the FG signal (edges of one type (rising or falling edges) on the
IN1 signal) does not switch within a fixed time, output drive will be turned off. The time constant is determined by
the capacitor connected to the CSD pin.
<time constant (in seconds)> .=. 30.5 × 1.57 × CCSD (µF)
If a 0.02 µF capacitor is used, the protection time will be about 1.05 seconds.
To clear the rotor constraint protection state, the IC must be set to the stopped state or the power must be turned off
and reapplied. If there is noise present on the FG signal during the constraint time, the rotor constraint protection
circuit may not operate normally.
7. Phase Lock Signal
(1) Phase lock range
Since this IC does not include a counter or similar functionality in the speed control system, the speed error range
in the phase locked state cannot be determined solely by IC characteristics. (This is because the acceleration of the
changes in the FG frequency influences the range.) When it is necessary to stipulate this characteristic for the
motor, the designer must determine this by measuring the actual motor state. Since speed errors occur easily in
states where the FG acceleration is large, it is thought that the speed errors will be the largest during lock pull-in at
startup and when unlocked due to switching clock frequencies.
(2) Masking function for the phase lock state signal
A stable lock signal can be provided by masking the short-term low-level signals due to hunting during lock pullin. However, this results in the lock state signal output being delayed by the masking time.
The masking time is determined by the capacitor inserted between the CSD pin and ground.
<masking time (seconds)> .=. 6.5 × 1.57 × CCSD (µF)
When a 0.022 µF capacitor is used, the masking time will be about 225 ms. In cases where complete masking is
required, a masking time with fully adequate margin must be used.
8. Initial Reset
To initially reset the logic circuits in start mode, the IC goes to the reset state when the CSD pin voltage goes to zero
until it reaches 0.63 V. Drive output starts after the reset state is cleared. The reset time can be calculated to a good
approximation using the following formula.
<reset time (seconds)> .=. 0.13 × CCSD (µF)
A reset time of over 100 µs is required.
9. Current Limiter Circuit
The current limit value is determined by the resistor Rf inserted between the RF pin and ground.
ILIM = VL/Rf VL = 0.59 V (typical) (during acceleration) and 0.37 V (typical) (during deceleration)
10. Power Supply Stabilization
An adequately large capacitor must be inserted between the VCC pin and ground for power supply stabilization. If
diodes are inserted in the power supply lines to prevent destruction of the device if the power supply is connected
with reverse polarity, the power supply line levels will be even more easily disrupted, and even larger capacitors must
be used.
If high-frequency noise is a problem, a ceramic capacitor of about 0.1 µF must also be inserted in parallel.
No. 7257 -11/13
LB11872H
11. VREG Stabilization
A capacitor of at least 0.1 µF must be used to stabilize the VREG voltage, which is the control circuit power supply.
The capacitor must be connected as close as possible to the pins.
12. Error Amplifier External Component Values
To prevent adverse influence from noise, the error amplifier external components must be located as close to the IC
as possible.
13. FRAME Pin and Heat sink Area
The FRAME pin and the heat sink area function as the control circuit ground terminal. It is desirable that this ground
line and the Rf resistor ground line be grounded at a single point at the ground for the electrolytic capacitor.
Thermal dissipation can be improved significantly by tightly bonding the metallic surface of the back of the IC
package to the PCB with, for example, a solder with good thermal conductivity.
14. CSD Pin
The capacitor connected to the CSD pin influences several operational aspects of this IC, including the rotor
constraint protection time and the phase lock signal mask time. The following are possible ways of determining the
value of this capacitor.
(1) If removing chattering from the phase lock state signal is most important:
Select a capacitance that can assure an adequate mask time.
(2) If startup time is more important than chattering:
Select a capacitance such that the rotor constraint protection circuit does not operate at startup time and verify that
there are no problems with the clock cutoff protection circuit and initial reset time.
Operation of the rotor constraint protection circuit may hinder the study of motor characteristics in the
uncontrolled state. It is possible to only operate the initial reset function and not operate the rotor constraint
protection circuit by inserting a resistor (about 390 kΩ) in parallel with the capacitor between the CSD pin and
ground.
15. FC Pin
The capacitor connected to the FC pin is required for current limiter loop phase compensation. If the value is too low,
the output will oscillate. If the value is too large, it will be easier for currents in excess of the limit value to flow
during the current limit time (time before the circuit operates) in states where the output is saturated. (This is because
the control response characteristics become worse.)
16. AGC Pin
A capacitance that allows a certain amount of smoothing of the AGC pin voltage in the motor speed range used must
be selected for the capacitor connected to the AGC pin. It is also desirable to use a capacitance that allows the AGC
voltage to reach an essentially stabilized voltage before the initial reset is cleared. (If the capacitance is too large, the
rate of change of the AGC voltage will become slower.)
No. 7257 -12/13
LB11872H
Specifications of any and all SANYO products described or contained herein stipulate the performance,
characteristics, and functions of the described products in the independent state, and are not guarantees
of the performance, characteristics, and functions of the described products as mounted in the customer’s
products or equipment. To verify symptoms and states that cannot be evaluated in an independent device,
the customer should always evaluate and test devices mounted in the customer’s products or equipment.
SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire,
or that could cause damage to other property. When designing equipment, adopt safety measures so
that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective
circuits and error prevention circuits for safe design, redundant design, and structural design.
In the event that any or all SANYO products (including technical data, services) described or contained
herein are controlled under any of applicable local export control laws and regulations, such products must
not be exported without obtaining the export license from the authorities concerned in accordance with the
above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system,
or otherwise, without the prior written permission of SANYO Electric Co., Ltd.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the “Delivery Specification”
for the SANYO product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not
guaranteed for volume production. SANYO believes information herein is accurate and reliable, but
no guarantees are made or implied regarding its use or any infringements of intellectual property rights
or other rights of third parties.
This catalog provides information as of September 2002. Specifications and information herein are
subject to change without notice.
PS No. 7257 -13/13