Ordering number : ENN6201A Monolithic Digital IC LB1876 Three-Phase Brushless Motor Driver for Polygon Mirror Motors Overview Package Dimensions The LB1876 is a driver for polygon mirror motors such as used in laser printers and similar equipment. It incorporates all necessary circuitry (speed control + driver) on a single chip. Direct PWM drive enables drive with low power loss. unit: mm 3235A-HSOP36 [LB1876] Functions and Features 0.65 17.8 (6.2) 2.7 10.5 7.9 1 0.25 0.8 2.0 0.3 (2.25) (0.5) 2.45max Three-phase bipolar drive Direct PWM drive technique Built-in lower side output diode Output current limiter Reference clock input circuit (FG frequency equivalent) PLL speed control circuit Phase lock detector output (with masking function) Built-in protection circuitry includes current limiter, restraint protection, overheat protection, low-voltage protection, etc. • Brake method switching circuit (free-run or reverse torque) • 5V regulator output • Power save function 0.1 • • • • • • • • (4.9) 36 SANYO: HSOP36 Specifications Maximum Ratings at Ta = 25°C Parameter Maximum supply voltage 1 Maximum output current Symbol Conditions Ratings VCC max IO max 30 Unit V T ≤ 500 ms 2.5 A 0.9 W Allowable power dissipation 1 Pd max1 IC only Allowable power dissipation 2 Pd max2 *With substrate 2.1 W Operating temperature Topr –20 to +80 °C Storage temperature Tstg –55 to +150 °C * Substrate: 114.3 × 76.1 × 1.6 mm3, glass epoxy Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications. SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO products described or contained herein. SANYO Electric Co.,Ltd. Semiconductor Company TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN 61202RM (OT)/62599RM (KI) No. 6201-1/14 LB1876 Allowable Operating Ranges at Ta = 25°C Parameter Symbol Conditions Ratings Unit Power supply voltage range VCC 9.5 to 28 V 5 V regulated output current IREG 0 to –20 mA LD pin voltage VLD 0 to 28 V LD pin output current ILD 0 to 15 mA FGS pin voltage VFGS 0 to 28 V FGS pin output current IFGS 0 to 10 mA Electrical Characteristics at Ta = 25°C, VCC = VM = 24 V Parameter Symbol Power supply current 1 ICC 1 Power supply current 2 ICC 2 Conditions Ratings min typ Quiescent Current max Unit 17 22 mA 3.6 5.0 mA [5V regulated output] 5.0 5.35 V Voltage fluctuation Output voltage ∆VREG1 VREG VCC = 9.5 to 28 V 4.65 50 100 mV Load fluctuation ∆VREG2 IO = –5 to –20 mA 30 100 Temperature coefficcient ∆VREG3 Design target value 0 mV mV/°C [Output block] Output saturation voltage 1 VOsat1 IO = 1.0 A, VO(SINK)+VO(SOURCE) 2.0 2.5 Output saturation voltage 2 VOsat2 IO = 2.0 A, VO(SINK)+VO(SOURCE) 2.6 3.2 V Output leak current IOleak 100 µA V Lower side diode forward voltage 1 VD1 ID = –1.0 A 1.2 1.5 V Lower side diode forward voltage 2 VD2 ID = –2.0 A 1.5 1.9 V [Hall amplifier block] Input bias current Common mode input voltage range IHB –2 VICM 0 Hall input sensitivity Hysteresis width –0.5 µA VREG – 2.0 80 ∆VIN(HA) 15 V mVp–p 24 42 mV Input voltage L → H VSLH 12 mV Input voltage H → L VSHL –12 mV [FG/Schmitt block] Input bias current IB(FGS) –2 Common mode input voltage range VICM(FGS) 0 Input sensitivity VIN(FGS) 80 15 –0.5 µA VREG – 2.0 V mVp–p Hysteresis width ∆VIN(FGS) Input voltage L → H VSLH(FGS) 12 mV Input voltage H → L VSHL(FGS) –12 mV 24 42 mV [PWM oscillator] Output High level voltage VOH(PWM) 2.5 2.8 3.1 Output Low level voltage VOL(PWM) 1.2 1.5 1.8 V –125 –95 –75 µA 1.05 1.27 1.50 Vp-p 0.15 0.5 V 10 µA V External capacitor charge current ICHG VPWM = 2 V Oscillator frequency f(PWM) C = 3000 pF Amplitude V(PWM) 22 V kHz [FGS output] Output saturation voltage Output leak current VOL(FGS) IFGS = 7 mA IL(FGS) [CSD oscillator] Output High level voltage VOH(CSD) 2.65 3.0 3.3 Output Low level voltage VOL(CSD) 0.75 0.9 1.1 V Amplitude V(CSD) 1.75 2.1 2.3 Vp–p External capacitor charge current ICHG1 –13.5 –9 –5.5 µA External capacitor discharge current ICHG2 5.5 9 13.5 µA Oscillator frequency f(CSD) C = 0.068 µF 30 Hz Continued on next page. No. 6201-2/14 LB1876 Continued from preceding page. Parameter Symbol Conditions Ratings min typ max VREG-0.2 VREG-0.1 Unit [Phase comparator output] Output High level voltage VPDH IOH = –100 µA Output Low level voltage VPDL IOH = 100 µA Output source current IPD+ VPD = VREG/2 Output sink current IPD– VPD = VREG/2 0.2 V 0.3 V –0.5 mA 1.5 mA [Phase lock detector output] Output saturation voltage Output leak current VOL(LD) IL(LD) ILD = 10 mA 0.15 0.5 V 10 µA –10 +10 mV –1 +1 µA VO = VCC [ERR amplifier] Input offset voltage Input bias current VIO(ER) Design target value IB(ER) Ouput High level voltage VOH(ER) IOH = –500 µA Ouput Low level voltage VOL(ER) IOL = 500 µA DC bias level VB(ER) VREG–1.2 VREG-0.9 V 0.9 1.2 V –5% VREG/2 +5% V [Current limiter] Drive gain 1 GDF1 in phase lock mode 0.4 0.5 0.6 times Drive gain 2 GDF2 in unlock mode 0.8 1.0 1.2 times 0.55 V Limiter voltage VRF VCC - VM 0.45 0.5 TSD Design target value (junction temperature) 150 180 °C ∆TSD Design target value (junction temperature) 40 °C [Thermal shutdown operation] Termal shutdown operating temperature Hysteresis width [Low voltage protection] Operating voltage Hysteresis VSD 8.1 8.5 8.9 V ∆VSD 0.2 0.35 0.5 V [CLD circuit] External capacitor charge current –6 –4.3 –3 V VH(CLD) 3.25 3.5 3.75 V External input frequency fI(CKIN) 0.1 10 High level input voltage VIH(CKIN) 3.5 VREG V Low level input voltage VIL(CKIN) 0 1.5 V Input open voltage VIO(CKIN) VREG-0.5 Hysteresis width VIS(CKIN) 0.35 High level input current IIH(CKIN) VCKIN = VREG Low level input current IIL(CKIN) VCKIN = 0 V Operating voltage ICLD [CLK pin] kHz VREG V 0.5 0.65 V –10 0 +10 –280 –210 µA µA [S/S pin] High level input voltage VIH(SS) 3.5 VREG V Low level input voltage VIL(SS) 0 1.5 V Input open voltage VIO(SS) VREG-0.5 Hysteresis width VIS(SS) 0.35 High level input current IIH(SS) VS/S = VREG Low level input current IIL(SS) VS/S = 0 V VREG V 0.5 0.65 V –10 0 +10 –280 –210 µA µA [LDSEL pin] High level input voltage VIH(LDSEL) 3.5 VREG V Low level input voltage VIL(LDSEL) 0 1.5 V Input open voltage VIO(LDSEL) VREG-0.5 High level input current IIH(LDSEL) VLDSEL = VREG Low level input current IIL(LDSEL) VLDSEL = 0 V –10 0 –280 –210 VREG V 10 µA µA [BRSEL pin] High level input voltage VIH(BRSEL) 3.5 VREG V Low level input voltage VIL(BRSEL) 0 1.5 V Input open voltage VIO(BRSEL) VREG-0.5 High level input current IIH(BRSEL) VLDSEL = VREG Low level input current IIL(BRSEL) VLDSEL = 0 V –10 0 –280 –210 VREG V 10 µA µA No. 6201-3/14 LB1876 Three-phase logic truth table (IN = "H" indicates the IN+ > IN– condition) IN1 IN2 IN3 OUT1 OUT2 OUT3 H L H L H M H L L L M H H H L M L H L H L H L M L H H H M L L L H M H L PD EI EO TOC 27 26 25 24 23 22 21 20 19 10 11 12 13 14 15 16 17 18 FGFIL CSD PH 28 FC VM1 29 CLD VM2 30 FGS VCC 31 LD VREG 32 S/S LDSEL 33 FGIN- BRSEL 34 CLK GND3 35 FGIN+ NC 36 FRAME OUT3 Pin Assignment LB1876 6 7 8 9 OUT1 NC IN3+ IN3- IN2+ IN2- IN1+ IN1- PWM 5 GND2 4 GND1 3 FRAME 2 OUT2 Top view 1 Pd max — Ta 2.4 Power dissipation, Pd max — W With substrate (114.3 × 76.1 × 1.6 mm3, glass epoxy) 2.1 2.0 1.6 1.18 1.2 IC independent 0.9 0.8 0.4 0 –20 0 20 40 60 80 100 Ambient temperature, Ta — ºC No. 6201-4/14 LB1876 Pin Description Pin name Pin number OUT1 2 OUT2 1 Function Output pins. PWM controls duty cycle ratio by lower transistors. Connect Schottky diode between these pins and VCC. OUT3 36 IN1+, IN1– 8, 9 IN2+, IN2– 6, 7 IN3+, IN3– 4, 5 FG IN+ 10 FG comparator non-inverting input. FG IN– 11 FG comparator inverting input. GND1 12 Control circuit ground. GND2 13 Sub-ground. PWM 14 PWM oscillation frequency setting pin. Connect to ground via capacitor. FC 15 Current control circuit frequency characteristics compensation pin. Connect to ground via capacitor. FGFIL 16 FG filter pin. Connect to ground via capacitor if noise in FG signal is a problem. CSD 17 Restraint protection circuit operating time setting pin/reset pulse setting pin. Connect to ground via capacitor. If the protection circuit is not to be used, connect a resistor in parallel with capacitor. PH 18 RF waveform smoothing pin. Connect to ground via capacitor. TOC 19 Torque specifying input pin. Normally connected to EO pin. When TOC potential falls, ON duty cycle ratio of lower side output transistors changes and torque increases. EO 20 Error amplifier output. EI 21 Error amplifier input. PD 22 Phase comparator output pin. Phase deviation is output as a duty cycle change of the pulse. CLD 23 Phase lock signal masking time setting pin. Connect to ground via capacitor. Leave open if masking is not required. FGS 24 FG Schmitt output (open collector output). LD 25 Phase lock detector output (open collector output). Goes ON when PLL is locked. S/S 26 Start/stop input. Low: Start; High or Open: Stop. CLK 27 Clock input. 10 kHz max. VM1 28 Output block power supply. Short to VM2 for use. VM2 29 Output current detector pin. Connect to VCC via low resistor. Set to maximum output current IOUT = 0.5/Rf. Hall input pins for each phase. Logic High indicates VIN+ > VIN–. VCC 30 Power supply pin. Connect to ground via capacitor to prevent noise. VREG 31 5V regulator output pin (control circuit power supply). Connect to ground via capacitor to stabilize operation. LDSEL 32 Phase lock signal masking switching pin. When "Low", the unlock signal (short "High" signal of LD output) is masked. When "High" or Open, the lock signal (short "Low" signal of LD output) is masked. BRSEL 33 Braking method select pin. "Low" selects reverse torque control and "High" or Open selects free-run. When reverse torque is controlled, lower side output transistors require external SBD. GND3 34 Output circuit ground. FRAME — The FRAME pin is connected internally to the metal frame at the base of the IC. Electrically, both the FRAME pin and the metal frame are left open. To improve thermal dissipation, provide a corresponding land on the PCB and solder the FRAME pin to that land. NC 3, 35 Not connected internally. Can be used for wiring. No. 6201-5/14 LB1876 Equivalent Circuit Block Diagram and Sample Application Circuit VREG FGFIL VREG LD FGS LDSEL CLD PD LDSEL FGI N- – FGI N+ + FG FI LTER LD EI VREG – EO + CLK CLK TOC PLL TSD PWM PWM OSC S/S BRSEL CONT AMP COMP S/S BRSEL VREG PEAK HOLD CURR LIM LOGIC VREG FC PH VCC VCC VM2 Rf VM1 CSD SD OSC COUNT OUT1 HALL LOGIC DRI VER OUT2 HA LL OUT3 HYS AMP IN1+ IN1- IN2+ IN2- IN3+ IN3- GND1 GND2 GND3 VREG Top view No. 6201-6/14 LB1876 Pin Descriptions Pin No. Symbol Description 2 OUT1 Motor drive output. 1 OUT2 36 OUT3 Connect Schottky diodes between the outputs and VCC. 34 GND3 Equivalent circuit VCC VM2 300Ω VM1 29 28 Output block ground 1 Output block power supply and output current detection 28 VM1 29 VM2 3 NC NC 36 Connect low-resistance resistors Rf between these pins and VCC. The output current is limited to the current value set by IOUT = VREF/Rf. 35 2 34 Since these are not connected internally, they can be used for wiring. VREG 8 IN1+ Hall device inputs 9 IN1– 6 IN2+ These inputs return a high level when IN+ > IN- and a low level when IN– > IN+. 7 IN2– 4 IN3+ 5 IN3– A Hall signal amplitude of at least 100 mV p-p (differential) is desirable. Insert a capacitor between IN+ and IN- if noise on the Hall signal is a problem. 4 6 8 300Ω 300Ω 5 7 9 VREG FG inputs 10 FGIN1+ 11 FGIN1– 12 GND1 Control circuit block ground 13 GND2 Sub-ground If noise on the FG signal is a problem, insert either a capacitor or a filter consisting of a capacitor and a resistor. 10 300Ω 300Ω 11 Continued on next page. No. 6201-7/14 LB1876 Continued from preceding page. Pin No. Symbol Description Equivalent circuit VREG Sets the PWM oscillator frequency. 14 PWM Connect a capacitor between this pin and ground. 200Ω A capacitance of 1800 pF for C sets the frequency to approximately 37 kHz. 14 2KΩ VREG Current control circuit frequency characteristics correction. 15 FC Insert a capacitor (on the order of 0.01 to 0.1 µF) between this pin and ground. 300Ω The output duty is determined by the ratio of the voltage on this pin and the PWM oscillator waveform. 15 VREG FG filter connection 16 FGFIL 16 If noise on the FG signal is a problem, insert a capacitor (under about 2200 pF) between this pin and ground. VREG Sets the operating time of the constraint protection circuit and also sets the initial reset pulse. 17 CSD A protection operating time of about 8 seconds can be set by connecting a capacitor (about 0.068 µF) between this pin and ground. If the protection circuit is not used, connect a capacitor and resistor (about 4700 pF, 220 kΩ) in parallel between this pin and ground. 300Ω 17 VREG RF smoothing 18 PH If noise on the RF signal is a problem, insert a capacitor between this pin and ground. 500Ω 18 Continued on next page. No. 6201-8/14 LB1876 Continued from preceding page. Pin No. Symbol Description Equivalent circuit VREG Torque command voltage input 19 TOC 300Ω 19 Normally, this pin is connected to the EO pin. When the TOC voltage falls, the on duty of the lower side transistor increases. VREG 20 EO 20 Error amplifier output 40kΩ VREG 21 EI Error amplifier input 300Ω 21 VREG Phase comparator output 22 PD 300Ω The phase error is converted to a pulse duty and output from this pin. 22 VREG Phase lock signal mask time setting 23 CLD A mask time of about 90 ms can be set by inserting a capacitor (about 0.1 µF) between this pin and ground. Leave this pin open if there is no need to mask. 300Ω 23 Continued on next page. No. 6201-9/14 LB1876 Continued from preceding page. Pin No. Symbol Description Equivalent circuit VREG 24 24 FGS FG Schmitt output VREG 25 Phase lock detection output 25 LD Turns on (goes low) when phase lock is detected. VREG Start/stop control Low: 0 to 1.5 V 26 S/S High: 3.5 V to VREG 22kΩ Hysteresis: About 0.5 V 2kΩ Apply a low level to start; this pin goes high when open. 26 VREG Clock input Low: 0 to 1.5 V High: 3.5 V to VREG 27 CLK 22 kΩ Hysteresis: About 0.5 V fCLK = 10 kHz maximum 2kΩ If there is noise on the clock signal, remove that noise with a capacitor. 27 Power supply 30 VCC Insert a capacitor between this pin and ground to prevent noise from entering the IC. (Use a value of 20 or 30 µF or higher.) VCC Stabilized power supply output (5 V output) 31 VREG 31 Insert a capacitor between this pin and ground for stabilization. (About 0.1 µF.) Continued on next page. No. 6201-10/14 LB1876 Continued from preceding page. Pin No. Symbol Description Equivalent circuit VREG Phase lock signal mask switching Low: 0 to 1.5 V High: 3.5 V to VREG 32 LDSEL When open, this pin goes to the high level. 30 kΩ When low, transient unlock signals (short high-level periods on the LD output) are masked, and when high, transient lock signals (short low-level periods on the LD output) are masked. 2kΩ 32 VREG Braking control Low: 0 to 1.5 V High: 3.5 V to VREG 33 BRSEL FREME When open, this pin goes to the high level. When low, reverse torque control is applied and when high, the circuit operates in freerunning mode. An external Schottky barrier diode is required on the low side output when reverse torque control is applied. 30 kΩ 2kΩ 33 This pin must be left open. No. 6201-11/14 LB1876 LB1876 Overview 1. Speed control circuit This IC provides high-precision, low-jitter, and stable motor rotation since it adopts a PLL speed control technique. This PLL circuit compares the phases of the edges on the CLK signal (falling edges) and the FG signal (falling edges on the FGIN+.FGS output) and controls the speed using that error output. The FG servo frequency during control operation is the same as the clock frequency. fFG(servo) = fCLK 2. Output drive circuit To reduce power loss in the output, this IC adopts a direct PWM drive technique. The output transistors are always saturated when on, and the motor drive power is controlled by changing the output on duty. Since the lower side transistor is used for the output PWM switching, Schottky diodes must be inserted between the outputs and VCC. (This is because if the diodes used do not have a short reverse recovery time, instantaneous through currents will flow when the lower side transistor turns on.) The diodes between the outputs and ground are built in. However, if problems (such as waveform disruption during lower side kickback) occur for large output currents, attach external rectifying diodes or Schottky diodes. If reverse control mode is selected for braking and problems such as incorrect operation or excess heat generation due to the reverse recovery time of the lower side diode causes a problem, add an external Schottky diode. 3. Current control circuit The current control circuit controls the current (limits the peak current) to the current determined by I = VRF/Rf (VRF = 0.5 V typ., Rf: current detection resistor). The limiting operation consists of reducing the output on duty to suppress the current. The current control circuit detects the diode reverse recovery current due to the PWM operation, and has an operating delay (about 3 µs) to prevent incorrect current limiting operation. If the motor coils have a relatively low resistance, or relatively low inductance, the changes in current flow at startup (the state where the motor presents no back electromotive force) will be rapid. As a result, the current limiter may operate at currents in excess of the set current due to this delay. In such cases, the current limit value must be set so as to take the current increase due to the delay into account. 4. Power saving circuit This IC goes to the power saving state, which reduces power consumption, in the stopped state. Power is reduced in the power saving state by cutting the bias current to most of the circuit blocks in the IC. However, the 5 V regulator circuit does operate and provide its output in the power saving state. 5. Reference clock The externally input clock signal must be free of chattering and other noise. The input circuit does have hysteresis, but if problems occur, the clock signal must be input through a capacitor or other noise reduction circuit. If the IC is set to the start state with no reference clock input, and if the constraint protection circuit is operated, after the motor rotates a certain amount, the drive will be turned off. However, if the constraint protection circuit is not operated, and furthermore, if reverse control mode is selected during braking, the motor will run backwards at increasing speed. A workaround will be required in this case. (This problem occurs because the constraint protection circuit oscillator signal is used for clock cutoff protection.) 6. PWM frequency The PWM frequency is determined by the capacitor C (F) connected to the PWM pin. fPW ≈ 1/(15000 × C) If an 1800 pF capacitor is used, the frequency will be about 37 kHz. If the PWM frequency is too low, the motor will emit audible switching noise, and if it is too high, the power loss will increase. A frequency in the range 15 to 50 kHz is desirable. The capacitor ground must be connected as close as possible to the IC control block ground (the GND1 pin) to minimize the influence of the output on this circuit. No. 6201-12/14 LB1876 7. Hall sensor input signals Input signals with amplitudes greater than the input circuit hysteresis (42 mV maximum) must be provided to the Hall inputs. Input amplitudes of over 100 mV are desirable to minimize the influence of noise. If the output waveform is disturbed by noise (at phase switching), insert capacitors across the input to prevent this. 8. FG input signal Normally, one of the Hall sensor signals is input as an FG signal. If noise on the FG input is a problem, insert either a capacitor or a filter consisting of a capacitor and a resistor. Although it is possible to exclude noise from the FG signal by inserting a capacitor between the FGFIL pin and ground, if this pin's waveform is smoothed excessively, the circuit may not be able to operate normally. Therefore, if a capacitor is used here, its value must be held to under 2200 pF. If the position of the capacitor's ground lead is inappropriate, problems due to noise may become more likely to occur. Select the position carefully. 9. Constraint protection circuit This IC includes a built-in constraint protection circuit to protect the IC and the motor during motor constraint. In the start state, when the LD output is high for a fixed period (the unlocked state), the lower side transistor turns off. The time is set by the capacitor connected to the CSD pin. Set time (seconds) ≈ 120 × C (µF) If a 0.068 µF capacitor is used, the protection time will be about 8 seconds. The set time must have a value that provides an adequate margin relative to the motor start time. The protection circuit does not operate during braking implemented by switching the clock frequency. Either switch to the stop state or turn off the power and restart to clear the constraint protection state. Since the CSD pin also functions as the initial reset pulse generation pin, if connected to ground the logic circuits will be reset and speed control operation will not be possible. Therefore, if constraint protection is not used, connect CSD to ground through a resistor of about 220 kΩ and a capacitor of about 4700 pF in parallel. 10. Phase lock signal (1) Phase lock range Since this IC does not have a counter in the speed control system, the speed error range in the phase locked state cannot be determined solely by the IC's characteristics. (This is because of the influence of the acceleration of the changes in the FG frequency.) If it is necessary to stipulate this for the motor, it will be necessary to measure this with the actual motor. Since it is easier for speed errors to occur in the state where the FG acceleration is large, the largest speed errors are thought to occur during lock pull-in at startup and when unlocked due to clock frequency switching. (2) Phase lock signal mask function When the LDSEL pin is set high or left open, transient lock signals (short low-level periods on the LD output) is masked. This function masks short low-level periods due to hunting during pull-in and allows a stable lock signal to be output. However, the lock signal is delayed by amount of masking time. When the LDSEL pin is set low, transient unlock signals (short high-level periods on the LD output) is masked. This function prevents short period high-level signals from being output. The mask time is set with the capacitor connected between the CLD pin and ground. Mask time (seconds) ≈ 0.9 × C (µF) A mask time of about 90 ms can be set by using a capacitor of about 0.1 µF. If complete masking is required, the mask time must be set large enough to provide ample margin. If masking is not required, leave the CLD pin open. No. 6201-13/14 LB1876 11. Power supply stabilization Since this IC provides a large output current and adopts a switching drive technique, it can easily disrupt the power supply line voltage. Therefore, capacitors with ample capacitance must be inserted between the VCC pins and ground. If reverse control mode is selected during braking, the circuit will return current to the power supply. This means that the power supply lines are even more susceptible to disruption. Since the power supply is most easily influenced during lock pull-in at high motor speeds, this case requires particular care. Select capacitor values that are fully adequate for this case. If diodes are inserted in the power supply lines to prevent damage if the power supply is connected with reverse polarity, the power supply voltage will be even more susceptible to disruption, and even larger capacitors must be used. 12. VREG stabilization Insert a capacitor of at least 0.1 µF to stabilize VREG, which is the control circuit power supply. The capacitor ground must be connected as close as possible to the IC control block ground (the GND1 pin). 13. Error amplifier circuit components Locate the error amplifier components as close to the IC as possible to minimize the influence of noise on this circuit. Locate this circuit as far from the motor as possible. Specifications of any and all SANYO products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment. SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all SANYO products (including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of SANYO Electric Co., Ltd. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the “Delivery Specification” for the SANYO product that you intend to use. Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. This catalog provides information as of June, 2002. Specifications and information herein are subject to change without notice. PS No. 6201-14/14