SST12LF09 2.4 GHz High-Gain, High-Efficiency Front-end Module FEATURES APPLICATIONS • Input/output ports internally matched to 50Ω and DC decoupled • Package available - 16-contact XQFN – 2.5mm x 2.5mmx 0.4mm • All non-Pb (lead-free) devices are RoHS compliant • • • • Transmitter Chain • Gain: - Typically 24 dB gain • Dynamic linear output power: - Meets 802.11g OFDM ACPR requirement up to 21 dBm - 3% EVM up to 17 dBm for 802.11g, 54 Mbps - 1.75% dynamic EVM up to 15 dBm for 256 QAM, 40 MHz bandwidth • Operating current for 802.11g/n applications - 170mA @ POUT = 17 dBm for 802.11g - 130 mA @ POUT = 15 dBm for 802.11n • PA Control current, IPEN:<2mA • Idle current, ICQ:105mA • Low shut-down current: ~2 µA • Power-up/down control - Turn on/off time (10%–90%) <400 ns • Limited variation over temperature - ~1 dB gain/power variation between -40°C to +85°C • Linear on-chip power detection - Load and temperature insensitive - >20 dB dynamic range on-chip power detection Receiver Chain • • • • Gain: Typically 13 dB gain Noise figure: Typically 2.5 dB Receiver input P1dB: Typically -6 dBm LNA bypass loss: Typically 9 dB WLAN (IEEE 802.11b/g/n) Home RF Cordless phones 2.4 GHz ISM wireless equipment 1.0 PRODUCT DESCRIPTION SST12LF09 is a 2.4 GHz Front-end Module (FEM) designed in compliance with IEEE 802.11b/g/n applications. Based on GaAs pHEMT/HBT technology, it combines a high-performance Power Amplifier (PA), a lownoise amplifier (LNA) and an antenna Tx/Rx switch (SW). The input/output RF ports are single-ended and internally matched to 50 Ω. These RF ports are DC decoupled, and require no DC-blocking capacitors or matching components. This helps reduce the system board Bill of Materials (BOM) cost. There are two components to the FEM: the Transmitter (TX) chain and the Receiver (RX) chain. The TX chain includes a high-efficiency PA based on the InGaP/GaAs HBT technology. The transmitter is optimized for high linearity, 802.11n and 256 QAM operation–typically providing 15 dBm with 1.75% dynamic EVM for 256 QAM, 40 MHz operation and 17 dBm at 3% for 802.11g, 54 Mbps operation. SST12LF09 has an excellent transmitter on-chip, single-ended power detector that is stable over temperature and insensitive to output VSWR. It features a wide dynamic-range (20 dB) with dB-wise linear operation. The on-chip power detector provides a reliable solution to board-level power control. The Rx chain provides typically 13 dB gain with 2.5 dB noise figure. With the LNA bypassed, the receiver loss is typically 9 dB. SST12LF09 also features a Bluetooth® path with typically 1.0 dB loss. SST12LF09 is offered in a16-contact X2QFN package. See Figure 3-1 for pin assignments and Table 4-1 for pin descriptions. Bluetooth® Chain • Loss: 1.0 dB • Output P1dB: >25 dBm 2013 Microchip Technology Inc. DS75083A-page 1 SST12LF09 GND CRX CBT FUNCTIONAL BLOCKS ANT 2.0 16 15 14 13 DET 1 12 GND NC 2 11 BT LNA VCC 3 10 VDD PA 5 6 7 8 PEN GND RX 9 LEN TX VCC 4 75083 B1.1 FIGURE 2-1: DS75083A-page 2 FUNCTIONAL BLOCK DIAGRAM 2013 Microchip Technology Inc. SST12LF09 GND CRX CBT PIN ASSIGNMENTS ANT 3.0 16 15 14 13 DET 1 12 GND Top View (Contacts facing down) NC 2 VCC 3 11 BT 10 VDD RF and DC GND 5 6 7 8 PEN GND RX 9 LEN TX VCC 4 75083 P1.0 FIGURE 3-1: 4.0 PIN DESCRIPTIONS TABLE 4-1: Symbol PIN ASSIGNMENTS FOR 16-CONTACT X2QFN PIN DESCRIPTION Pin No. Pin Name Type1 O Function DET 1 NC 2 Detector output voltage ground VCC 3 Power Supply PWR Supply voltage PA VCC 4 Power Supply PWR Supply voltage PA TX 5 I RF transmit input PEN 6 I PA enable GND 7 RX 8 No connect Ground Ground pad O Rx output LEN 9 VDD 10 LNA enable BT 11 GND 12 CBT 13 Bluetooth switch control CRX 14 Receiver switch control voltage GND 15 ANT 16 PWR Supply voltage LNA Bluetooth RF port Ground Ground pad Ground Ground Pad I/O Antenna 1. I=Input, O=Output 2013 Microchip Technology Inc. DS75083A-page 3 SST12LF09 5.0 ELECTRICAL SPECIFICATIONS The DC and RF specifications for the power amplifier are specified below. Refer to Table 5-2 for the DC voltage and current specifications. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Tx input power to pin 5 (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Rx input power to pin 16 (ANT with LNA ON). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Average Tx output power from pin 16 (ANT)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +26 dBm Supply Voltage at pins 3 and 4 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +5.5V Supply Voltage at pin 10 (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +5.5V PA Enable Voltage to pin 6 (PEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V DC supply current (ICC)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA DC supply current (IDD)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC Storage Temperature (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds 1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the maximum rating of average output power could cause permanent damage to the device. 2. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal TABLE 5-1: OPERATING RANGE Range Ambient Temp VCC Extended -40°C to +85°C 3.0-5.0V TABLE 5-2: DC ELECTRICAL CHARACTERISTICS AT 25°C FOR TX CHAIN Symbol Parameter Min. Typ Max. Unit VCC Supply Voltage at pins 3 and 4 3.0 3.6 5.0 V VDD Supply Voltage at pin 10 3.0 3.6 5.0 V 3.05 3.10 ICQ Tx Idle current for 802.11g to meet EVM ~3% @ 17 dBm VPEN Tx Enable Voltage ICC Tx Supply Current for 11g OFDM 54 Mbps signal, POUT = 17 dBm IDD Rx Supply Current (with LNA ON) DS75083A-page 4 105 mA 3.15 V 170 mA 9 mA 2013 Microchip Technology Inc. SST12LF09 TABLE 5-3: Symbol FL-U Linearity, TX CHAIN RF CHARACTERISTICS AT 25°C Parameter Min. Frequency range Typ 2.4 2.5 dBm Output Power level 1.75% Dynamic EVM, 256 QAM, 40 MHz 15 dBm 16 dBm 24 dB 14 dB Gain RLIN Input return loss at TX port TABLE 5-4: GHz 17 Output Power level 2.5% Dynamic EVM, 802.11n, HT40 2f, 3f, 4f, 5f Unit Output Power with <3% EVM, 802.11g @ 54 Mbps OFDM G VDET Max. 22 Power detector output voltage 5<POUT<22 dBm 0.4 Harmonics at 17 dBm 0.95 V -30 dBm/ MHz Max. Unit 2.5 GHz RX CHAIN RF CHARACTERISTICS AT 25°C Symbol Parameter FL-U Frequency range G Gain, with LNA ON 13 NF Noise figure, with LNA ON 2.5 dB IP1dB Input P1dB, with LNA ON -6 dBm Loss LNA bypassed 9 dB RLIN Input return loss at Antenna port with LNA 12 dB TABLE 5-5: Min. Typ 2.4 dB BLUETOOTH CHAIN RF CHARACTERISTICS AT 25°C Symbol Parameter FL-U Frequency range L Loss 1.0 dB RL Return Loss 12 dB TABLE 5-6: Min. Typ 2.4 Max. Unit 2.5 GHz CONTROL VOLTAGES1 Function PEN Transmit mode CRX LEN CBT 3.1V 0 0 0 Bluetooth 0 0 0 3 Receive mode, LNA on 0 3 3 0 Receive mode, LNA bypass 0 3 0 0 OFF 0 0 0 0 1. No other operating modes are allowed 2013 Microchip Technology Inc. DS75083A-page 5 SST12LF09 6.0 TYPICAL PERFORMANCE CHARACTERISTICS Transmitter Test Conditions: VCC = 3.6V, PEN = 3.10V, LEN = 0V, CRX = 0V, CBT = 0V, TA = 25°C, unless otherwise specified 30 S11 S-Parameter, dB 20 S21 S12 10 S21 0 - 10 - 20 - 30 - 40 - 50 0 1 2 3 4 5 6 Frequency, GHz FIGURE 6-1: 7 8 9 10 75083 F6.0 S-PARAMETERS 10 9 EVM (%) 8 7 2412 6 2442 5 2472 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Output Power (dBm) 75083 F1.1 FIGURE 6-2: DS75083A-page 6 TRANSMITTER EVM VERSUS OUTPUT POWER MEASURED USING 802.11G WITH EQUALIZER TRAINING USING SEQUENCE ONLY 2013 Microchip Technology Inc. SST12LF09 10 EVM (%) 9 8 2412 7 2442 6 2472 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Output Power (dBm) 75083 F8.0 FIGURE 6-3: TRANSMITTER DYNAMIC EVM VERSUS OUTPUT POWER MEASURED USING 256 QAM, 40 MHZ BANDWIDTH WITH EQUALIZER TRAINING USING SEQUENCE ONLY 25 24 Power Gain (dB) 23 22 21 20 19 18 2412 17 2442 16 2472 15 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Output Power (dBm) 75083 F2.1 FIGURE 6-4: GAIN VERSUS OUTPUT POWER 2013 Microchip Technology Inc. DS75083A-page 7 SST12LF09 190 180 170 Supply Current (mA) 160 150 140 130 120 110 2412 100 90 2442 80 2472 70 60 50 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Output Power (dBm) FIGURE 6-5: 75083 F3.1 TRANSMITTER DC CURRENT VERSUS OUTPUT POWER 0.90 Detector Voltage (V) 0.80 0.70 0.60 0.50 2412 0.40 2472 0.30 2472 0.20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Output Power (dBm) 75083 F4.1 FIGURE 6-6: DS75083A-page 8 DETECTOR VOLTAGE VERSUS OUTPUT POWER 2013 Microchip Technology Inc. SST12LF09 Receiver Test Conditions: VCC = 3.6V, LEN = 3.3V, CRX = 3.3V, PEN = 0V, CBT = 0V, TA = 25°C, unless otherwise specified 20 S11 S21 10 S-Parameter, dB S12 S21 0 -10 -20 -30 -40 0 1 2 3 4 5 6 Frequency, GHz FIGURE 6-7: 7 8 9 10 75083 F7.0 RECEIVER S-PARAMETER 4.0 3.5 Noise Figure, dB 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2.4 2.45 2.5 Frequency, GHz 75083 F5.1 FIGURE 6-8: RECEIVER NOISE FIGURE 2013 Microchip Technology Inc. DS75083A-page 9 SST12LF09 ANT CRX CBT 14 13 50Ω 16 15 DET 1 12 NC 2 11 BT 50Ω 12LF09 3 VCC 2.2µF 10 0.1µF 4 VCC VDD 0.1µF 9 LEN 0.1µF 5 6 7 8 50Ω 50Ω 75083 Schematic 1.2 TX FIGURE 6-9: DS75083A-page 10 PEN RX TYPICAL SCHEMATIC 2013 Microchip Technology Inc. SST12LF09 7.0 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XXX Valid Combinations: Device Package SST12LF09-Q3CE SST12LF09-Q3CE-K Device: SST12LF09 = 2.4 GHz High-Gain, High-Efficiency Front-end Module Package: Q3CE = X2QFN (2.5mm x 2.5mm), 0.4 max thickness 16-contact Evaluation Kit K Flag 2013 Microchip Technology Inc. = Evaluation Kit DS75083A-page 11 SST12LF09 8.0 PACKAGING DIAGRAMS TOP VIEW SIDE VIEW BOTTOM VIEW See notes 2 and 3 0.127 Pin #1 (laser engraved see note 2) Pin #1 2.50 ± 0.05 1.35 0.075 0.05 Max 2.50 ± 0.05 1.35 0.25 0.15 0.5 BSC 0.275 0.175 0.40 0.34 1 mm Note: 1. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch. 2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown. 3. The external paddle is electrically connected to the die back-side and to VSS. This paddle must be soldered to the PC board; it is required to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device. 4. Untoleranced dimensions are nominal target dimensions. 5. All linear dimensions are in millimeters (max/min). 16-x2qfn-2.5x2.5-Q3C-2.0 FIGURE 8-1: TABLE 8-1: 16-CONTACT SUPER-THIN QUAL FLAT NO-LEAD (XQFN) PACKAGE CODE: Q3C REVISION HISTORY Revision A Description • Initial release of data sheet DS75083A-page 12 Date May 2013 2013 Microchip Technology Inc. SST12LF09 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2013 Microchip Technology Inc. DS75083A-page 13 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-241-6 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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