TC1426/TC1427/TC1428 1.2A Dual High-Speed MOSFET Drivers Features: Package Type • Low Cost • Latch-Up Protected: Will Withstand 500 mA Reverse Output Current • ESD Protected ±2kV • High Peak Output Current: 1.2A • Wide Operating Range: - 4.5V to 16V • High Capacitive Load Drive Capability: 1000 pF in 38 nsec • Low Delay Time: 75 nsec Max • Logic Input Threshold Independent of Supply Voltage • Output Voltage Swing to Within 25 mV of Ground or VDD • Low Output Impedance: 8 Power MOSFET Drivers Switched Mode Power Supplies Pulse Transformer Drive Small Motor Controls Print Head Drive Package Temp. Range 8-Pin SOIC 0°C to +70°C TC1426CPA 8-Pin PDIP 0°C to +70°C TC1427COA 8-Pin SOIC 0°C to +70°C TC1427CPA 8-Pin PDIP 0°C to +70°C TC1428COA 8-Pin SOIC 0°C to +70°C TC1428CPA 8-Pin PDIP 0°C to +70°C TC1426COA 8 NC GND 3 7 OUT A TC1426CPA 6 VDD IN B 4 NC 1 GND 3 7 OUT A TC1427CPA 5 OUT B IN B 4 2, 4 7, 5 NC 1 7 OUT A TC1426COA IN B 4 7, 5 Inverting GND 3 7, 5 6 VDD NC 1 8 NC IN A 2 TC1427COA GND 3 7 OUT A 6 VDD 5 OUT B IN B 4 2, 4 8 NC 7 OUT A TC1428CPA 6 VDD 5 OUT B 2 7 4 5 Noninverting 8 NC IN A 2 6 VDD NC 1 IN A 2 5 OUT B IN B 4 2, 4 Inverting GND 3 8 NC IN A 2 NC 1 IN A 2 8 NC TC1428COA GND 3 5 OUT B IN B 4 2, 4 7, 5 7 OUT A 6 VDD 5 OUT B 2 7 4 5 Noninverting NC = No connection General Description: These devices are fabricated using an epitaxial layer to effectively short out the intrinsic parasitic transistor responsible for CMOS latch-up. They incorporate a number of other design and process refinements to increase their long-term reliability. Device Selection Table Part Number NC 1 IN A 2 The TC1426/TC1427/TC1428 are a family of 1.2A dual high-speed drivers. CMOS fabrication is used for lowpower consumption and high efficiency. Applications: • • • • • 8-Pin PDIP/SOIC The TC1426 is compatible with the bipolar DS0026, but only draws 1/5 of the quiescent current. The TC1426/ TC1427/TC1428 are also compatible with the TC426/ TC427/TC428, but with 1.2A peak output current rather than the 1.5A of the TC426/TC427/TC428 devices. Other compatible drivers are the TC4426/TC4427/ TC4428 and the TC4426A/TC4427A/TC4428A. The TC4426/TC4427/TC4428 have the added feature that the inputs can withstand negative voltage up to 5V with diode protection circuits. The TC4426A/TC4427A/ TC4428A have matched input to output leading edge and falling edge delays, tD1 and tD2, for processing short duration pulses in the 25 nanoseconds range. All of the above drivers are pin compatible. The high-input impedance TC1426/TC1427/TC1428 drivers are CMOS/TTL input-compatible, do not require the speed-up needed by the bipolar devices, and can be directly driven by most PWM ICs. This family of devices is available in inverting and noninverting versions. Specifications have been optimized to achieve low-cost and high-performance devices, well-suited for the high-volume manufacturer. 2001-2012 Microchip Technology Inc. DS21393D-page 1 TC1426/TC1427/TC1428 Functional Block Diagram V+ ≈500 μA ≈2.5 μA TC1426 Inverting TC1427 Noninverting TC1428 Inverting/Noninverting Noninverting Output Inverting Output (TC1427) (TC1426) Input GND NOTE: TC1428 has one inverting and one noninverting driver. Ground any unused driver input. DS21393D-page 2 2001-2012 Microchip Technology Inc. TC1426/TC1427/TC1428 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage ..................................................... +18V Input Voltage, Any Terminal ................................... VDD + 0.3V to GND – 0.3V Power Dissipation (TA 70°C) PDIP........................................................ 730 mW SOIC ....................................................... 470 mW Derating Factor PDIP....................................................... 8 mW/C SOIC ...................................................... 4 mW/C Operating Temperature Range C Version ........................................ 0°C to +70°C Storage Temperature Range.............. -65°C to +150°C TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = +25°C, with 4.5V VDD16V, unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions Input VIH Logic 1, High Input Voltage 3 — — V VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -1 — 1 A 0VVINVDD Output VOH High Output Voltage VDD – 0.025 — — V Figure 3-1, Figure 3-2 VOL Low Output Voltage — — 0.025 V Figure 3-1, Figure 3-2 RO Output Resistance — — 12 8 18 12 IOUT = 10 mA, VDD = 16V IPK Peak Output Current — 1.2 — A IREV Latch-Up Current Withstand Reverse Current — >500 — mA Switching Time (Note 1) tR Rise Time — — 35 nsec tF Fall Time — — 25 nsec Figure 3-1, Figure 3-2 tD1 Delay Time — — 75 nsec Figure 3-1, Figure 3-2 tD2 Delay Time — — 75 nsec Figure 3-1, Figure 3-2 — — — — 9 0.5 mA VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Figure 3-1, Figure 3-2 Power Supply Power Supply Current IS Note 1: Switching times ensured by design. 2001-2012 Microchip Technology Inc. DS21393D-page 3 TC1426/TC1427/TC1428 TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Over operating temperature range with 4.5V VDD16V, unless otherwise noted. Symbol Parameter Min Typ Max Units V Test Conditions Input VIH Logic 1, High Input Voltage 3 — — VIL Logic 0, Low Input Voltage — — 0.8 V IIN Input Current -10 — 10 A 0VVINVDD Output VOH High Output Voltage VDD – 0.025 — — V Figure 3-1, Figure 3-2 VOL Low Output Voltage — — 0.025 V Figure 3-1, Figure 3-2 RO Output Resistance — — 15 10 23 18 IOUT = 10 mA, VDD = 16V IREV Latch-Up Current Withstand Reverse Current — >500 — mA Switching Time (Note 1) tR Rise Time — — 60 nsec Figure 3-1, Figure 3-2 tF Fall Time — — 40 nsec Figure 3-1, Figure 3-2 tD1 Delay Time — — 125 nsec Figure 3-1, Figure 3-2 tD2 Delay Time — — 125 nsec Figure 3-1, Figure 3-2 — — — — 13 0.7 mA VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) Power Supply Power Supply Current IS Note 1: Switching times ensured by design. DS21393D-page 4 2001-2012 Microchip Technology Inc. TC1426/TC1427/TC1428 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin PDIP, SOIC) PIN FUNCTION TABLE Symbol Description 1 NC No connection. 2 IN A Control input A, TTL/CMOS compatible logic input. 3 GND Ground. 4 IN B Control input B, TTL/CMOS compatible logic input. 5 OUT B 6 VDD 7 OUT A 8 NC 2001-2012 Microchip Technology Inc. Output B, CMOS totem-pole output. Supply input, 4.5V to 16V. Output A, CMOS totem-pole output. No connection. DS21393D-page 5 TC1426/TC1427/TC1428 3.0 APPLICATIONS INFORMATION 3.1 SUPPLY BYPASSING Large currents are required to charge and discharge capacitive loads quickly. For example, charging a 1000 pF load to 16V in 25 nsec requires a 0.8A current from the device's power supply. To ensure low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low-inductance ceramic MLC capacitors with short lead lengths (<0.5-in.) should be used. A 1.0 F film capacitor in parallel with one or two 0.1 F ceramic MLC capacitors normally provides adequate bypassing. 3.2 GROUNDING The TC1426 and TC1428 contain inverting drivers. Individual ground returns for the input and output circuits or a ground plane should be used. This will reduce negative feedback that causes degradation in switching speed characteristics. VDD = 16V Test Circuit 3.3 INPUT STAGE The input voltage level changes the no-load or quiescent supply current. The N-channel MOSFET input stage transistor drives a 2.5 mA current source load. With a logic ‘1’ input, the maximum quiescent supply current is 9 mA. Logic ‘0’ input level signals reduce quiescent current to 500 A maximum. Unused driver inputs must be connected to VDD or GND. Minimum power dissipation occurs for logic ‘0’ inputs for the TC1426/TC1427/TC1428. The drivers are designed with 100 mV of hysteresis. This provides clean transitions and minimizes output stage current spiking when changing states. Input voltage thresholds are approximately 1.5V, making a logic ‘1’ input any voltage greater than 1.5V up to VDD. Input current is less than 1 A over this range. The TC1426/TC1427/TC1428 may be directly driven by the TL494, SG1526/27, TC38C42, TC170 and similar switch-mode power supply integrated circuits. VDD = 16V Test Circuit 1 μF WIMA MKS-2 1 μF WIMA MKS-2 0.1 μF MLC Input Input Output 1 Output 1 0.1 μF MLC CL = 1000 pF CL = 1000 pF 2 2 TC1427 (1/2 TC1428) TC1426 (1/2 TC1428) +5V +5V Input Input 0V 90% 90% 0V 10% VDD tD1 tF tD2 VDD tR 90% 90% FIGURE 3-1: Time DS21393D-page 6 10% tD1 90% 90% tD2 tR Output 0V Output 0V 10% 10% tF 10% 10% Inverting Driver Switching FIGURE 3-2: Switching Time Noninverting Driver 2001-2012 Microchip Technology Inc. TC1426/TC1427/TC1428 4.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Rise Time vs. Supply Voltage 550 Fall Time vs. Supply Voltage 330 TA = +25°C TA = +25°C 264 220 4700 pF 110 CL = 1000 pF TA = +25°C 70 198 TIME (nsec) 10,000 pF 330 TIME (nsec) TIME (nsec) 440 Delay Time vs. Supply Voltage 80 10,000 pF 132 60 50 tD1 4700 pF 66 2200 pF 40 2200 pF tD2 0 5 7 9 11 VDD (V) 13 0 15 Rise and Fall Times vs. Temperature 13 15 8 tD2 48 tD1 42 36 125 25 Rise Time vs. Capacitive Load 1000 45 65 85 105 TEMPERATURE (°C) CL = 1000 pF VDD = +15V TA = +25°C 24 200 kHz 12 20 kHz 6 100 Fall Time vs. Capacitive Load 5 VDD 100 10 VDD 15VDD 15 VDD 2200 Supply Current vs. Frequency SUPPLY CURRENT (mA) TIME (nsec) 10 VDD 520 940 1360 1780 CAPACITIVE LOAD (pF) 100 CL = 1000 pF TA = +25°C TA = +25°C TA = +25°C 5 VDD 500 kHz 18 125 1000 100 15 0 0 45 65 85 105 TEMPERATURE (°C) 13 Supply Current vs. Capacitive Load SUPPLY CURRENT (mA) 16 11 9 VDD (V) 7 30 54 tFALL 0 25 5 CL = 1000 pF VDD = +15V CL = 1000 pF VDD = +15V tRISE 24 TIME (nsec) 9 11 VDD (V) 60 TIME (nsec) TIME (nsec) 7 Delay Time vs. Temperature 40 32 5 30 80 VDD = 15V VDD = 10V 60 40 20 VDD = 5V 10 100 1000 CAPACITIVE LOAD (pF) 10,000 2001-2012 Microchip Technology Inc. 10 100 10,000 1000 CAPACITIVE LOAD (pF) 0 10 100 1000 FREQUENCY (kHz) 10,000 DS21393D-page 7 TC1426/TC1427/TC1428 TYPICAL CHARACTERISTICS (CONTINUED) Low-State Output Resistance High-State Output Resistance 15 50 42 R OUT (Ω) 50 mA 11 9 100 mA 34 26 A (sec) 13 ROUT (Ω) TA = +25°C TA = +25°C 100 mA Crossover Energy Loss 10-8 50 mA 10-9 10 mA 18 7 10 mA 10 5 5 7 9 11 VDD (V) 13 15 5 7 Quiescent Power Supply Current vs. Supply Voltage 20 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) BOTH INPUTS LOGIC ‘0’ 10 5 13 15 10-10 4 6 8 10 12 VDD (V) 14 16 18 Quiescent Power Supply Current vs. Supply Voltage 20 15 9 11 VDD (V) 0 BOTH INPUTS LOGIC ‘1’ 15 10 5 0 0 50 100 150 200 300 1 400 SUPPLY CURRENT (μA) 2 3 4 5 6 SUPPLY CURRENT (mA) Thermal Derating Curves 1600 MAX. POWER (mW) 1400 8 Pin DIP 1200 1000 800 8 Pin SOIC 600 400 200 0 0 10 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) DS21393D-page 8 2001-2012 Microchip Technology Inc. TC1426/TC1427/TC1428 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form 2001-2012 Microchip Technology Inc. DS21393D-page 9 TC1426/TC1427/TC1428 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .015 (0.38) .008 (0.20) 3° Min. .400 (10.16) .310 (7.87) Dimensions: inches (mm) DS21393D-page 10 2001-2012 Microchip Technology Inc. TC1426/TC1427/TC1428 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° Max. .050 (1.27) .016 (0.40) Dimensions: inches (mm) 2001-2012 Microchip Technology Inc. DS21393D-page 11 TC1426/TC1427/TC1428 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing. DS21393D-page 12 2001-2012 Microchip Technology Inc. TC1426/TC1427/TC1428 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2001-2012 Microchip Technology Inc. DS21393D-page 13 TC1426/TC1427/TC1428 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC1426/TC1427/TC1428 Literature Number: DS21393D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21393D-page 14 2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767887 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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